G1332E [GTM]

N-CHANNEL ENHANCEMENT MODE POWER MOSFET; N沟道增强型功率MOSFET
G1332E
型号: G1332E
厂家: GTM CORPORATION    GTM CORPORATION
描述:

N-CHANNEL ENHANCEMENT MODE POWER MOSFET
N沟道增强型功率MOSFET

文件: 总4页 (文件大小:263K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Pb Free Plating Product  
ISSUED DATE :2005/03/10  
REVISED DATE :2006/11/24C  
GTM  
CORPORATION  
BVDSS  
DS(ON)  
20V  
600m  
600mA  
G1332E  
R
I
D
N - C H A N N E L E N H A N C E M E N T M O D E P O W E R M O S F E T  
Description  
The G1332E provide the designer with best combination of fast switching, low on-resistance and  
cost-effectiveness.  
Features  
*Simple Gate Drive  
*Small Package Outline  
*2KV ESD Rating (Per MIL-STD-883D)  
Package Dimensions  
TPU.34)QBDLBHF*  
Millimeter  
Millimeter  
REF.  
REF.  
Min.  
2.70  
2.40  
1.40  
0.35  
0
Max.  
3.10  
2.80  
1.60  
0.50  
0.10  
0.55  
Min.  
Max.  
A
B
C
D
E
F
G
H
K
J
L
M
1.90 REF.  
1.00  
0.10  
0.40  
0.85  
0°  
1.30  
0.20  
-
1.15  
10°  
0.45  
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Symbol  
VDS  
Ratings  
20  
Unit  
V
Gate-Source Voltage  
VGS  
±5  
V
Continuous Drain Current3  
Continuous Drain Current3  
Pulsed Drain Current1,2  
Total Power Dissipation  
Linear Derating Factor  
ID @T  
ID @T  
A
=25к  
=70к  
600  
470  
2.5  
mA  
mA  
A
A
IDM  
PD @T  
A
=25к  
1.0  
W
0.008  
W/к  
к
Operating Junction and Storage Temperature Range  
Tj, Tstg  
-55 ~ +150  
Thermal Data  
Parameter  
Symbol  
Rthj-a  
Value  
125  
Unit  
к/W  
Thermal Resistance Junction-ambient3 Max.  
G1332E  
Page: 1/4  
ISSUED DATE :2005/03/10  
REVISED DATE :2006/11/24C  
GTM  
CORPORATION  
Electrical Characteristics (Tj = 25к unless otherwise specified)  
Parameter  
Symbol Min.  
Typ.  
Max.  
Unit  
Test Conditions  
Drain-Source Breakdown Voltage  
Breakdown Voltage Temperature Coefficient  
Gate Threshold Voltage  
20  
-
-
V
BVDSS  
Tj  
VGS=0, ID=250uA  
Ϧ
BVDSS  
/Ϧ  
-
0.5  
-
0.02  
-
-
V/к  
V
Reference to 25к, ID=1mA  
VDS=VGS, ID=250uA  
VDS=5V, ID=600mA  
VGS= ±5V  
1.2  
VGS(th)  
gfs  
Forward Transconductance  
1
-
S
Gate-Source Leakage Current  
Drain-Source Leakage Current(Tj=25к)  
-
-
±10  
uA  
uA  
uA  
IGSS  
-
-
1
VDS=20V, VGS=0  
IDSS  
Drain-Source Leakage Current(Tj=70к)  
-
-
10  
VDS=16V, VGS=0  
-
-
600  
VGS=4.5V, ID=600mA  
VGS=2.5V, ID=400mA  
Static Drain-Source On-Resistance  
mꢀ  
RDS(ON)  
-
-
1200  
Total Gate Charge2  
Gate-Source Charge  
Gate-Drain (“Miller”) Change  
Turn-on Delay Time2  
Rise Time  
-
1.3  
0.3  
0.5  
4
2
-
Qg  
Qgs  
Qgd  
Td(on)  
Tr  
ID=600mA  
VDS=16V  
VGS=4.5V  
nC  
-
-
-
-
-
VDS=10V  
ID=600mA  
-
10  
15  
2
-
ns  
VGS=10V  
Turn-off Delay Time  
Fall Time  
-
-
Td(off)  
Tf  
RG=3.3ꢀ  
RD=16.7ꢀ  
-
-
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
-
38  
17  
12  
60  
-
Ciss  
Coss  
Crss  
VGS=0V  
pF  
-
VDS=10V  
f=1.0MHz  
-
-
Source-Drain Diode  
Parameter  
Forward On Voltage2  
Symbol Min.  
Typ.  
Max.  
Unit  
Test Conditions  
IS=300mA, VGS=0V  
-
-
1.2  
V
VSD  
Notes: 1. Pulse width limited by Max. junction temperature.  
2. Pulse widthЉ300us, duty cycleЉ2%.  
3. Surface mounted on FR4 board, tЉ10sec.  
G1332E  
Page: 2/4  
ISSUED DATE :2005/03/10  
REVISED DATE :2006/11/24C  
GTM  
CORPORATION  
Characteristics Curve  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
Fig 3. On-Resistance v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
Fig 5. Forward Characteristics of  
Reverse Diode  
Fig 6. Gate Threshold Voltage v.s.  
Junction Temperature  
G1332E  
Page: 3/4  
ISSUED DATE :2005/03/10  
REVISED DATE :2006/11/24C  
GTM  
CORPORATION  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance  
Fig 11. Switching Time Waveform  
Fig 12. Gate Charge Waveform  
Important Notice:  
ó
ó
ó
ó
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM.  
GTM reserves the right to make changes to its products without notice.  
GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems.  
GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory:  
ó
ó
Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C.  
TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785  
China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China  
TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165  
G1332E  
Page: 4/4  

相关型号:

G1333

P-CHANNEL ENHANCEMENT MODE POWER MOSFET
GTM

G1335

Rail-to-Rail CMOS Comparator with Open-Drain Output
GMT

G1336B

Rail-to-Rail CMOS Comparator Adjustable Different Charge/Discharge Time
GMT

G1337

Dual Rail-to-Rail CMOS Comparators with Open- Drain Output
GMT

G1338

UL94V-0 PBT impeller & frame
MECHATRONICS

G1338H

UL94V-0 PBT impeller & frame
MECHATRONICS

G1338L

UL94V-0 PBT impeller & frame
MECHATRONICS

G1338M

UL94V-0 PBT impeller & frame
MECHATRONICS

G1338S

UL94V-0 PBT impeller & frame
MECHATRONICS

G13393-0808W

CMOS Sensor, 228fps, Rectangular, Through Hole Mount, PACKAGE-28
HAMAMATSU

G133I1-L02

TFT LCD Approval Specification
AZDISPLAYS

G133IGE-L03

13.3” TFT Liquid Crystal Display module
AZDISPLAYS