G301K [GTM]

N-CHANNEL ENHANCEMENT MODE POWER MOSFET; N沟道增强型功率MOSFET
G301K
型号: G301K
厂家: GTM CORPORATION    GTM CORPORATION
描述:

N-CHANNEL ENHANCEMENT MODE POWER MOSFET
N沟道增强型功率MOSFET

文件: 总4页 (文件大小:296K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Pb Free Plating Product  
ISSUED DATE :2006/01/19  
REVISED DATE :  
GTM  
CORPORATION  
BVDSS  
DS(ON)  
30V  
1  
G301K  
R
I
D
640mA  
N - C H A N N E L E N H A N C E M E N T M O D E P O W E R M O S F E T  
Description  
The G301K utilized advanced processing techniques to achieve the lowest possible on-resistance, extremely  
efficient and cost-effectiveness device.  
The G301K is universally used for all commercial-industrial applications.  
Features  
*Simple Drive Requirement  
*Small Package Outline  
*RoHS Compliant  
Package Dimensions  
TPU.34)QBDLBHF*  
Millimeter  
Millimeter  
Min. Max.  
1.90 REF.  
REF.  
REF.  
Min.  
Max.  
3.10  
2.80  
1.60  
0.50  
0.10  
0.55  
A
B
C
D
E
F
2.70  
2.40  
1.40  
0.35  
0
G
H
K
J
L
M
1.00  
1.30  
0.20  
-
0.10  
0.40  
0.85  
0°  
1.15  
10°  
0.45  
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Symbol  
VDS  
Ratings  
30  
Unit  
V
Gate-Source Voltage  
VGS  
±16  
V
Continuous Drain Current3, VGS@10V  
Continuous Drain Current3, VGS@10V  
Pulsed Drain Current1,2  
ID @T  
ID @T  
A
=25к  
=70к  
640  
mA  
mA  
mA  
W
A
500  
IDM  
950  
Power Dissipation  
PD @T  
A
=25к  
1.38  
0.01  
Linear Derating Factor  
Operating Junction and Storage Temperature Range  
W/к  
к
Tj, Tstg  
-55 ~ +150  
Thermal Data  
Parameter  
Symbol  
Rthj-a  
Value  
90  
Unit  
к/W  
Thermal Resistance Junction-ambient3 Max.  
G301K  
Page: 1/4  
ISSUED DATE :2006/01/19  
REVISED DATE :  
GTM  
CORPORATION  
Electrical Characteristics (Tj = 25к unless otherwise specified)  
Parameter  
Symbol Min.  
Typ.  
Max.  
Unit  
Test Conditions  
Drain-Source Breakdown Voltage  
Breakdown Voltage Temperature Coefficient  
Gate Threshold Voltage  
30  
-
-
V
BVDSS  
Tj  
VGS=0, ID=250uA  
Ϧ
BVDSS  
/Ϧ  
-
0.5  
-
0.06  
-
-
V/к  
V
Reference to 25к, ID=1mA  
VDS=VGS, ID=250uA  
VDS=10V, ID=600mA  
VGS= ±16V  
1.5  
VGS(th)  
gfs  
Forward Transconductance  
600  
-
-
mS  
uA  
uA  
uA  
Gate-Source Leakage Current  
Drain-Source Leakage Current(Tj=25к)  
-
±10  
IGSS  
-
-
1
VDS=30V, VGS=0  
IDSS  
Drain-Source Leakage Current(Tj=70к)  
-
-
100  
VDS=24V, VGS=0  
-
-
1
2
3
1.6  
-
VGS=10V, ID=500mA  
VGS=4.5V, ID=400mA  
VGS=2.7V, ID=200mA  
Static Drain-Source On-Resistance  
-
-
RDS(ON)  
-
-
Total Gate Charge2  
Gate-Source Charge  
Gate-Drain (“Miller”) Change  
Turn-on Delay Time2  
Rise Time  
-
1
Qg  
Qgs  
Qgd  
Td(on)  
Tr  
ID=600mA  
VDS=50V  
VGS=4.5V  
nC  
-
0.5  
0.5  
12  
10  
56  
29  
32  
8
-
-
-
-
VDS=30V  
ID=600mA  
VGS=10V  
RG=3.3ꢀ  
RD=52ꢀ  
-
-
ns  
Turn-off Delay Time  
Fall Time  
-
-
Td(off)  
Tf  
-
-
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
-
50  
-
Ciss  
Coss  
Crss  
VGS=0V  
pF  
-
VDS=25V  
f=1.0MHz  
-
6
-
Source-Drain Diode  
Parameter  
Forward On Voltage2  
Symbol Min.  
Typ.  
Max.  
Unit  
Test Conditions  
IS=1.2A, VGS=0V  
-
-
1.2  
V
VSD  
Notes: 1. Pulse width limited by Max. junction temperature.  
2. Pulse widthЉ300us, duty cycleЉ2%.  
3. Surface mounted on 1 in2 copper pad of FR4 board; 270к/W when mounted on Min. copper pad.  
G301K  
Page: 2/4  
ISSUED DATE :2006/01/19  
REVISED DATE :  
GTM  
CORPORATION  
Characteristics Curve  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
Fig 3. On-Resistance v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
Fig 5. Forward Characteristics of  
Reverse Diode  
Fig 6. Gate Threshold Voltage v.s.  
Junction Temperature  
G301K  
Page: 3/4  
ISSUED DATE :2006/01/19  
REVISED DATE :  
GTM  
CORPORATION  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance  
Fig 11. Transfer Characteristics  
Fig 12. Gate Charge Waveform  
Important Notice:  
ó
ó
ó
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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM.  
GTM reserves the right to make changes to its products without notice.  
GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems.  
GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory:  
ó
ó
Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C.  
TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785  
China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China  
TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165  
G301K  
Page: 4/4  

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