HMF2M64F8VS-90

更新时间:2024-09-18 07:27:14
品牌:HANBIT
描述:FLASH-ROM MODULE 16MByte (2M x 64-Bit) ,120PIN SMM,3.3V

HMF2M64F8VS-90 概述

FLASH-ROM MODULE 16MByte (2M x 64-Bit) ,120PIN SMM,3.3V FLASH- ROM模块16兆字节( 2M ×64位) , 120PIN SMM , 3.3V

HMF2M64F8VS-90 数据手册

通过下载HMF2M64F8VS-90数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

PDF下载
HANBit  
HMF2M64F8VS  
FLASH-ROM MODULE 16MByte (2M x 64-Bit) ,120PIN SMM,3.3V  
Part No. HMF2M64F8VS  
GENERAL DESCRIPTION  
The HMF2M64F8VS is a high-speed flash read only memory (FROM) module containing 2,048,000 words organized in an  
x64bit configuration. The module consists of eight 2M x 8 FROM mounted on a 120-pin, MMC connector FR4-printed circuit  
board.  
Commands are written to the command register using standard microprocessor write timings.  
Register contents serve as input to an internal state-machine, which controls the erase and programming circuitry. Write  
cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the  
device is similar to reading from 12.0V flash or EPROM devices.  
Output enable (/OE) and write enable (/WE) can set the memory input and output. The host system can detect a program or  
erase operation is complete by observing the Ready Pin, or reading the DQ7(Data # Polling) and DQ6(Toggle) status bits.  
When FROM module is disable condition the module is becoming power standby mode, system designer can get low -power  
design. All module components may be powered from a single + 3.0V DC power supply and all inputs and outputs are LVTTL-  
compatible  
FEATURES  
w Access time : 80, 90 and 120ns  
w High-density 16MByte design  
w High-reliability, low-power design  
w Single + 3V ± 0.3V power supply  
w Easy memory expansion  
w Hardware reset pin(RESET#)  
w FR4-PCB design  
w 100-Pin Designed 50-Pin Fine Pitch SMM Connector P1,P2  
w Minimum 1,000,000 write cycle guarantee per sector  
o
w 20-year data retention at 125  
w Flexible sector architecture  
w Embedded algorithms  
C
w Erase suspend / Erase resume  
w The used device is 2Mx8bit , K8D1616UBM from SEC  
OPTIONS  
w Timing  
MARKING  
90ns access  
100ns access  
120ns access  
w Packages  
120-pin SMM  
-90  
-100  
-120  
F
1
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
PIN ASSIGNMENT  
P1  
P2  
PIN  
1
Symbol  
VCC  
PIN  
31  
32  
33  
34  
35  
36  
37  
38  
Symbol  
VSS  
PIN  
1
Symbol  
VCC  
PIN  
31  
32  
33  
34  
35  
36  
37  
38  
Symbol  
VSS  
2
DQ32  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
2
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ48  
DQ49  
DQ50  
DQ51  
DQ52  
DQ53  
DQ54  
3
3
4
4
5
5
6
6
7
7
8
8
9
DQ39  
VCC  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
VCC  
A1  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
DQ7  
VSS  
DQ8  
DQ9  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
VSS  
A10  
9
DQ23  
VCC  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
DQ55  
VSS  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ31  
VCC  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
VSS  
A20  
NC  
A2  
A11  
A0  
BANK0*  
VSS  
A3  
A12  
A16  
A4  
A13  
WE1*  
WE2*  
VCC  
VSS  
A5  
A14  
WE3*  
VSS  
VCC  
A6  
VSS  
A15  
OE*  
WE4*  
WE5*  
WE6*  
A7  
A17  
RESET*  
WE0*  
RY_BY*  
A8  
A18  
A9  
A19  
WE7*  
VSS  
30  
VCC  
60  
VSS  
30  
VCC  
60  
Note: To stack PCB, the pin number 51 will be used for the upper second PCB.  
2
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
FUNCTIONAL BLOCK DIAGRAM  
64  
DQ0 DQ63  
21  
A0 A20  
DQ15/A-1  
A0  
DQ15/A-1  
A0-19  
A0  
A0-19  
A1-20  
DQ 32-39  
/WE  
A1-20  
/WE0  
/WE  
DQ 0-7  
/WE4  
/OE  
/OE  
U5  
U1  
/CE  
/CE  
RY-BY  
/Reset  
RY-BY  
/Reset  
DQ15/A-1  
DQ15/A-1  
A0-19  
A0-19  
DQ40-47  
/WE  
DQ 8-15  
/WE  
/WE1  
/WE5  
U2  
/OE  
/OE  
U6  
/CE  
/CE  
RY-BY  
/Reset  
RY-BY  
/Reset  
DQ15/A-1  
A0-19  
DQ15/A-1  
A0-19  
DQ48-55  
DQ16-23  
/WE2  
/WE  
/WE  
U3  
/WE6  
/OE  
/OE  
U7  
/CE  
/CE  
RY-BY  
/Reset  
RY-BY  
/Reset  
DQ15/A-1  
DQ15/A-1  
A0-19  
A0-19  
DQ56-63  
/WE  
DQ24-31  
/WE  
/WE3  
/OE  
U4  
/WE7  
/OE  
/CE  
/OE  
U8  
/CE  
/BANK0  
RY_/BY  
/Reset  
RY-BY  
/Reset  
RY-BY  
/Reset  
3
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
TRUTH TABLE  
MODE  
STANDBY  
/OE  
X
/CE  
H
/WE  
X
/RESET  
DQ ( /BYTE=L )  
POWER  
Vcc±0.3V  
HIGH-Z  
HIGH-Z  
DOUT  
STANDBY  
ACTIVE  
ACTIVE  
ACTIVE  
NOT SELECTED  
READ  
H
L
H
H
H
H
L
L
H
WRITE or ERASE  
NOTE: X means dont care  
X
L
L
DIN  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
Voltage with respect to ground all other pins  
Voltage with respect to ground Vcc  
Storage Temperature  
SYMBOL  
RATING  
VIN,OUT  
VCC  
-0.5V to Vcc+0.5V  
-0.5V to +4.0V  
o o  
-65 C to +150 C  
TSTG  
o o  
-40 C to +85 C  
Operating Temperature  
TA  
w Stresses greater than those listed under " Absolute Maximum Ratings" may cause permanent damage to the device.  
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated  
in the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended  
periods may affect reliability.  
RECOMMENDED DC OPERATING CONDITIONS  
PARAMETER  
Vcc for ± 10% device Supply Voltages  
Ground  
SYMBOL  
Vcc  
MIN  
2.7V  
0
TYP.  
3.0  
0
MAX  
3.6V  
0
VSS  
o
o
DC AND OPERATING CHARACTERISTICS ( 0 C £ T £ 70 C )  
A
PARAMETER  
TEST CONDITIONS  
SYMBOL  
MIN  
MAX  
UNIT  
Input Leakage Current  
Output Leakage Current  
Output High Voltage  
Output Low Voltage  
Vcc=Vcc max, VIN= GND to Vcc  
Vcc=Vcc max, VOUT= GND to Vcc  
IOH = -2.0mA, Vcc = Vcc min  
IOL = 4.0mA, Vcc =Vcc min  
IL1  
IL0  
-1.0  
1.0  
1.0  
-
mA  
mA  
V
-10  
VOH  
VOL  
0.85x Vcc  
-
0.4  
128  
32  
240  
240  
-
V
/CE = VIL,  
/OE = VIH,  
5MHZ  
1MHZ  
-
Vcc Active Read Current (1)  
ICC1  
mA  
-
-
Vcc Active Write Current (2)  
Vcc Standby Current  
/CE = VIL, /OE=VIH  
ICC2  
ICC3  
mA  
mA  
V
/CE, /RESET=Vcc±0.3V  
-
Low Vcc Lock-Out Voltage  
VLKO  
1.5  
Notes  
:
1. The Icc current listed includes both the DC operating current and the frequent component (at 5MHz).  
2. Icc active while embedded algorithm (program or erase) is in progress  
3. Not 100% tested  
4
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
ERASE AND PROGRAMMING PERFORMANCE  
LIMITS  
PARAMETER  
UNIT  
COMMENTS  
MIN.  
TYP.  
0.7  
27  
MAX.  
Block Erase Time  
-
15  
sec  
sec  
ms  
Excludes 00H programming  
prior to erasure  
Chip Erase Time  
Word Programming Time  
Chip Programming Time  
-
-
11  
330  
36  
Excludes system-level  
overhead  
12  
sec  
TSOP CAPACITANCE  
PARAMETER  
SYMBOL  
PARAMETER  
DESCRIPTION  
TEST SETUP  
MIN  
MAX  
UNIT  
CIN  
COUT  
CIN2  
Input Capacitance  
VIN = 0  
VOUT = 0  
VIN = 0  
-
-
-
10  
10  
10  
pF  
pF  
pF  
Output Capacitance  
Control Pin Capacitance  
Notes  
: Capacitance is periodically sampled and not 100% tested.  
TEST SPECIFICATIONS  
TEST CONDITION  
VALUE  
UNIT  
Output load  
1TTL gate  
Input rise and full times  
5
0 to 3  
1.5  
ns  
V
Input pulse levels  
Input timing measurement reference levels  
Output timing measurement reference levels  
V
1.5  
V
5.0V  
2.7kW  
IN3064  
or Equivalent  
Device  
Under  
Test  
CL  
6.2k  
W
Diodes = IN3064  
or Equivalent  
Note : CL = 100pF including jig capacitance  
5
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
AC CHARACTERISTICS  
Read Only Operations Characteristics  
u
SPEED  
-100  
PARAMETER  
DESCRIPTION  
UNIT  
- 90  
-120  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
tRC  
tACC  
tCE  
Read Cycle Time  
90  
100  
120  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Access time  
90  
90  
35  
30  
100  
100  
40  
120  
120  
50  
Chip Enable to Access time  
Output Enable time  
tOE  
tDF  
Chip Enable to Output High-Z  
30  
30  
tOEH  
tQH  
Output Enable Hold Time  
Output Hold Time From Addresses,  
/CE or /OE  
0
0
0
0
0
0
Erase/Program Operations  
u
Alternate /WE Controlled Writes  
- 90  
-100  
-120  
PARAMETER  
DESCRIPTION  
MIN  
90  
0
MAX  
MIN  
100  
0
MAX  
MIN  
120  
0
MAX  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
tWC  
tAS  
Write Cycle Time (1)  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Setup Time  
Address Hold Time  
45  
45  
0
45  
45  
0
50  
50  
0
tAH  
tDS  
Data Setup Time  
tDH  
Data Hold Time  
0
0
0
tOES  
tGHWL  
tCS  
Output Enable Setup Time  
Read Recover Time Before Write  
/CE Setup Time  
0
0
0
0
0
0
0
0
0
tCH  
/CE Hold Time  
tWP  
Write Pulse Width  
45  
30  
-
-
45  
30  
-
-
50  
30  
-
-
tWPH  
tPGM  
tBERS  
tVCS  
tRB  
Write Pulse Width High  
Programming Operation  
Block Erase Operation (2)  
Vcc set up time  
11  
11  
11  
0.7  
50  
-
-
0.7  
50  
-
-
0.7  
50  
-
-
0
-
-
-
-
-
0
-
-
-
-
-
0
-
-
-
-
-
Write Recover Time Before RY_/BY  
/RESRT High Before Read  
/RESRT to Power Down Time  
/RESRT Pulse Width  
/RESRT Setup Time  
50  
50  
50  
tRH  
20  
20  
20  
tRPD  
tRP  
500  
500  
500  
500  
500  
500  
tRSTS  
Notes  
: : 1. Not 100% tested  
2 . The duration of the program or erase operation varies and is calculated in the internal algorithms.  
6
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
Erase/Program Operations  
u
Alternate /CE Controlled Writes  
- 90  
-100  
-120  
PARAMETER  
DESCRIPTION  
MIN  
90  
0
MAX  
MIN  
100  
0
MAX  
MIN  
120  
0
MAX  
tWC  
tAS  
Write Cycle Time(1)  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Setup Time  
Address Hold Time  
tAH  
45  
45  
0
45  
45  
0
50  
50  
0
tDS  
Data Setup Time  
tDH  
Data Hold Time  
tOES  
tGHWL  
tCS  
Output Enable Setup Time  
Read Recover Time Before Write  
/CE Setup Time  
0
0
0
0
0
0
0
0
0
tCH  
/CE Hold Time  
0
0
0
tWP  
Write Pulse Width  
45  
30  
45  
30  
50  
30  
tWPH  
tPGM  
tBERS  
Write Pulse Width High  
Programming Operation  
Block Erase Operation (2)  
11  
11  
11  
0.7  
-
0.7  
-
0.7  
-
Notes  
:
1. Not 100% tested  
2 . This does not include the preprogramming time  
u READ OPERATIONS TIMING  
7
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
RESET TIMING  
u
u PROGRAM OPERATIONS TIMING  
Alternate /WE Controlled Writes  
8
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
Alternate /CE Controlled Writes  
CHIP/BLOCK ERASE OPERATION TIMINGS  
u
9
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
DATA# POLLING TIMES DURING INTERNAL ROUTINE OPERATION  
u
RY_ /BY TIMEING DURING ERASE / PROGRAM OPERATION  
u
10  
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
TOGGLE# BIT DURING INTERNAL ROUTINE OPERATION  
u
11  
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
PACKAGE DIMMENSIONS  
Unit :  
mm  
FRONT SIDE  
REAR SIDE  
PCB Thickness: 1.3 ± 0.1mm  
12  
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  
HANBit  
HMF2M64F8VS  
ORDERING INFORMATION  
Component  
Part Number  
Density  
Org.  
Package  
Vcc  
SPEED  
Number  
HMF2M64F8VS-90  
HMF2M64F8VS-100  
HMF2M64F8VS-120  
16MByte  
16MByte  
16MByte  
X 64  
120 Pin-SMM  
120 Pin-SMM  
120 Pin-SMM  
8EA  
3.3V  
3.3V  
3.3V  
90ns  
100ns  
120ns  
8EA  
8EA  
X 64  
X 64  
13  
URL :www.hbe.co.kr  
REV.02(August,2002)  
HANbit Electronics Co., Ltd.  

HMF2M64F8VS-90 相关器件

型号 制造商 描述 价格 文档
HMF316B7102KFHT TAIYO YUDEN High Reliability (Automotive) Application Medium-High Voltage Multilayer Ceramic Capacitors 获取价格
HMF316B7102MFHT TAIYO YUDEN High Reliability (Automotive) Application Medium-High Voltage Multilayer Ceramic Capacitors 获取价格
HMF316B7103KFHT TAIYO YUDEN High Reliability (Automotive) Application Medium-High Voltage Multilayer Ceramic Capacitors 获取价格
HMF316B7103MFHT TAIYO YUDEN High Reliability (Automotive) Application Medium-High Voltage Multilayer Ceramic Capacitors 获取价格
HMF316B7104KLHT TAIYO YUDEN High Reliability (Automotive) Application Medium-High Voltage Multilayer Ceramic Capacitors 获取价格
HMF316B7104MLHT TAIYO YUDEN High Reliability (Automotive) Application Medium-High Voltage Multilayer Ceramic Capacitors 获取价格
HMF316B7222KFHT TAIYO YUDEN High Reliability (Automotive) Application Medium-High Voltage Multilayer Ceramic Capacitors 获取价格
HMF316B7222MFHT TAIYO YUDEN High Reliability (Automotive) Application Medium-High Voltage Multilayer Ceramic Capacitors 获取价格
HMF316B7224KLHT TAIYO YUDEN Automotive (POWERTRAIN, SAFETY) Application Multilayer Ceramic Capacitors 获取价格
HMF316B7224MLHT TAIYO YUDEN Automotive (POWERTRAIN, SAFETY) Application Multilayer Ceramic Capacitors 获取价格

HMF2M64F8VS-90 相关文章

  • Bourns 密封通孔金属陶瓷微调电位计产品选型手册(英文版)
    2024-09-20
    6
  • Bourns 精密环境传感器产品选型手册(英文版)
    2024-09-20
    9
  • Bourns POWrTher 负温度系数(NTC)热敏电阻手册 (英文版)
    2024-09-20
    8
  • Bourns GMOV 混合过压保护组件产品选型手册(英文版)
    2024-09-20
    6