560JY8C [HB]
5.0 mm DIA LED LAMP; 5.0毫米DIA LED灯
| 型号： | 560JY8C |
| 厂家： | 
HB ELECTRONIC COMPONENTS |
| 描述： | 5.0 mm DIA LED LAMP |
| 文件： | 总8页 (文件大小：413K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
5.0 mm DIA LED LAMP
560JY8C
REV:A / 0
PACKAGE DIMENSIONS
Note:
1.All Dimensions are in millimeters.
2.Tolerance is ±0.25mm(0.010 ")
Unless otherwise specified.
3.Protruded resin under flange
is 1.5mm(0.059 ") max.
4.Lead spacing is measured where
the leads emerge from the package.
5.Specification are subject to change
without notice
DRAWING NO. : DS-35-03-0393
DATE : 2003-06-26
Page : 1
HD-R/RD013
5.0 mm DIA LED LAMP
560JY8C
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FEATURES
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5.0mm DIA LED LAMP
HIGH LUMINOUS INTENSITY OUTPUT.
LOW POWER CONSUMPTION.
HIGH EFFICIENCY.
VERSATILE MOUNTING ON P.C. BOARD OR PANEL.
I.C. COMPATIBLE.
CHIP MATERIALS
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Dice Material : AlGaInP/GaAs
Light Color : ULTRA YELLOW
Lens Color : WATER CLEAR
ABSOLUTE MAXIMUM RATING : ( Ta = 25°C )
ULTRA
YELLOW
SYMBOL
PARAMETER
Power Dissipation Per Chip
UNIT
PAD
VR
80
5
mW
V
Reverse Voltage Per Chip
IAF
IPF
－
Continuous Forward Current Per Chip
Peak Forward Current Per Chip (Duty－0.1,1KHz)
Derating Linear From 25°C Per Chip
Operating Temperature Range
30
80
mA
mA
mA/°C
0.40
-25°C to 85°C
-40°C to 85°C
Topr
Tstg
Storage Temperature Range
Lead Soldering Temperature｛1.6mm(0.063 inch) From Body｝260°C ± 5°C for 5 Seconds
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C )
SYMBOL
PARAMETER
Forward Voltage
Reverse Current
TEST CONDITION MIN. TYP. MAX. UNIT
VF
IR
IF = 20mA
VR = 5V
1.8
2.1
2.6
100
V
µA
λD
Dominant Wavelength
Spectral Line Half-Width
IF = 20mA
IF = 20mA
IF = 20mA
IF = 20mA
585 588 590 nm
∆λ
15
nm
2θ1/2 Half Intensity Angle
IV Luminous Intensity
50
55
60
deg
1500 1900 2400 mcd
DRAWING NO. : DS-35-03-0393
DATE : 2003-06-26
Page : 2
HD-R/RD014
5.0 mm DIA LED LAMP
560JY8C
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DRAWING NO. : DS-35-03-0393
DATE : 2003-06-26
Page : 3
5.0 mm DIA LED LAMP
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560JY8C
ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
base of the package
DIP
Bath temperature: 260±5℃
SOLDERING
Immersion time: with 5 sec
y Using soldering flux,” RESIN FLUX”
is recommended.
y During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
emperature at tip of iron: 260℃ or lower (To prevent heat from being
Soldering time: within 5 sec. transferred directly to the lead, hold
IRON
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
ꢀ
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
ꢀ
Lead wries
Leave a slight
clearance
(Fig.2)
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
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5.0 mm DIA LED LAMP
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560JY8C
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid steering the leads (See Fig.3).
ꢀ
PC board
（Fig.）3
jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
yLED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective
components including the LED should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the
shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
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5.0 mm DIA LED LAMP
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560JY8C
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.6
Fig.5
yFORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending
should be performed with base fixed means of a jig or pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
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560JY8C
yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK！
1Kg
Fig.10
yHANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care
when handling.
yCHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be sued.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
Freon TE
Chlorothene
Isopropyl Alcohol
Thinner
ADAPTABILITY
⊙
╳
⊙
╳
╳
╳
NOTE: Influences of ultrasonic cleaning of the LED
resin body differ depending on such factors
as the oscillator output, size of the PC board
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed after confirming there is no problem by
conducting a test under practical.
Acetone
Trichloroethylene
⊙--Usable
╳--Do not use.
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
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Experiment Item:
Test Condition
Item
Reference Standard
Lamp & IR
Ta： 25±5℃
IF= 20mA RH：＜=60%RH
DYNAMIC:100mA 1ms 1/10 duty
①
MIL-STD-750：1026
MIL-STD-883：1005
JIS C 7021：B-1
OPERATION LIFE
STATIC STATE: IF＝20mA
②
TEST TIME:
168HRS（-24HRS，+24HRS）
500HRS（-24HRS，+24HRS）
1000HRS（-24HRS，+72HRS）
HIGH
TEMPERATURE
HIGH HUMIDITY
STORAGE
Ta： 65℃±5℃
RH： 90〜95%RH
TEST TIME：240HRS±2HRS
MIL-STD-202：103B
JIS C 7021 ：B-1
MIL-STD-202：107D
MIL-STD-750：1051
MIL-STD-883：1010
JIS C 7021 ：A-4
105℃〜25℃〜-55℃〜25℃
TEMPERATURE
CYCLING
30min 5min
30min 5min
10CYCLES
105℃±5℃〜-55℃±5℃
10min 10min
10CYCLES
MIL-STD-202：107D
MIL-STD-750：1051
MIL-SYD-883：1011
THERMAL SHOCK
MIL-STD-202：210A
MIL-STD-750-2031
JIS C 7021：A-1
MIL-STD-202：208D
MIL-STD-750：2026
MIL-STD-883：2003
JIS C 7021 ：A-2
SOLDER
RESISTANCE
T，sol：260℃±5℃
DWELL TIME：10±lsec
SOLDERABILITY
T，sol：230℃±5℃
DWELL TIME：5±lsec
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 8
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