L-C150KGCT [HB]
SURFACE MOUNT DEVICE LED; 表面安装器件LED
| 型号： | L-C150KGCT |
| 厂家： | 
HB ELECTRONIC COMPONENTS |
| 描述： | SURFACE MOUNT DEVICE LED |
| 文件： | 总10页 (文件大小：805K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
ꢀPACKAGE OUTLINE DIMENSIONS
1.20
1.10
R0.10
0.55
2.10
0.55
5.00°
1.10
0.48 ~ 0.50
0.50
Notes:
1. All dimensions are in millimeters.
±
2. Tolerance is
0.1mm (.004") unless otherwise noted.
ꢀ Features
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Top view, wide view angle, single color Chip LED.
Package in 8mm tape on 7" diameter reels.
Compatible with automatic Pick & Place equipment.
Compatible with Infrared and Wave soldering reflow solder processes.
EIA STD package.
I.C. compatible.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 1
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
ꢀChip Materials
ꢀ
ꢀ
ꢀ
Dice Material : AlInGaP
Light Color : Super Green
Lens Color : Water Clear
ꢀAbsolute Maximum Ratings(Ta=25℃)
Symbol
PD
Parameter
Rating
60
Unit
Power Dissipation
mW
mA
mA
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
IPF
60
IF
-
30
0.25
℃
℃
De-rating Linear From 25
mA/
VR
ESD
Topr
Tstg
-
Reverse Voltage
5
2000
-40 ~ +85
-40 ~ +85
260 (for 5 seconds)
V
V
℃
℃
℃
℃
Electrostatic Discharge Threshold(HBM)Note A
Operating Temperature Range
Storage Temperature Range
Wave Soldering Condition (Two times Max.)
Infrared Soldering Condition (Two times MAX.) 240 (for 10 seconds)
-
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
ꢀElectro-Optical Characteristics(Ta=25℃)
Parameter
Luminous Intensity
Viewing Angle
Peak Emission
Wavelength
Dominant Wavelength
Spectral Line
Half-Width
Symbol
IV
2θ1/2
Min.
16.0
Typ.
30.0
130
Max.
60.0
Unit
mcd
deg
Test Condition
IF=20mA
Note 2
λp
λd
571
570
15
nm
nm
nm
Measurement @Peak
IF=20mA
Δλ
Forward Voltage
Reverse Current
VF
IR
2.05
2.4
100
V
μA
IF =20mA
VR = 5V
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 2
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. The dominant wavelength λd is derived from the CIE chromaticity diagram and
represents the single wavelength which defines the color of the device.
4. Caution in ESD :
Static Electricity and surge damages the LED. It is recommend use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
ꢀTypical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 3
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
ꢀTypical Electro-Optical Characteristics Curves
(25℃Ambient Temperature Unless Otherwise Noted)
Fig.2 Forward Current vs.Forward Voltage
Fig.3 Luminous Intensity vs.Forward Current
1000
100
10
1
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta(℃)
Fig.5 Luminous Intensity vs.Ambient Temperature
Fig.4Relative Luminous Intensity vs.Forward Current
0° 10° 20°
30°
50
40
30
20
40°
1.0
0.9
50°
0.8
60°
70°
80°
10
0
0.7
90°
0
20
40
60
80 100
0.5 0.3 0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃)
Fig.6 Forward Current Derating Curve
Fig.7 Relative Intensity vs.Angle
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 4
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
ꢀLabel Explanation
BATCH: L1 B9 AC
L1: Luminous Intensity Code
B9: Forward Voltage Code
AC: Dom Wavelength Code
ꢀReel Dimensions
Notes:
1. Taping Quantity : 3000PCS
2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 5
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
ꢀPackage Dimensions Of Tape And Reel
Progressive direction
Polarity
Notes:All dimensions are in millimeters.
Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
0
4
2
2
1
0
5
5
2
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 6
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
ꢀCleaning
ꢀ
ꢀ
ꢀ
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
the oscillator output, size of PCB and LED mounting method. The use of ultrasonic
cleaning should be enforced at proper output after confirming there is no problem.
ꢀSuggest Soldering Pad Dimensions
Direction of PWB camber
and go to reflow furnace
ꢀSuggest IR Reflow Soldering Profile Condition:
240° C(MAX)
Rising
+5℃/sec
(MAX)
Cooling
-5℃/sec
(MAX)
C
C
+5℃/sec
(MAX)
Time
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 7
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
ꢀ Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Forward Voltage(VF), Unit:V@20mA
Bin Code
Min
16.0
25.0
40.0
Max
32.0
50.0
80.0
Bin Code
Min
1.85
1.95
2.05
2.15
Max
2.05
2.15
2.25
2.35
M
N
P
4
5
6
7
Including test tolerance
Including test tolerance
Dominant Wavelength (Hue),Unit: nm@20mA
Bin Code
GA
GB
Min
566.0
569.0
Max
571.0
574.0
Including±1nm test tolerance
ꢀCAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household application).Consult HB’s sales in advance for information on
application in which exceptional quality and reliability are required, particularly when the failure or malfunction of
the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life
support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used within a year.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168
hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use
SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 8
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed
consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
、
℃
1 Pre-Heat Temp:150-180 ,120sec.Max.
、
℃
2 Soldering Temp:Temperature Of Soldering Pot Over 230 ,40sec.Max.
、
℃，
3 Peak Temperature:260
5sec.
、
4 Reflow Repetition:2 Times Max.
、
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 B /0.5 Cu
For Soldering Iron (Not Recommended) :
、
℃
1 Iron Tip Temp:350
Max.
、
2 Soldering Iron:30w Max.
、
3 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
、
℃
1 Pre-Heat Temp:150 Max. 120 Sec. Max.
、
℃
2 Bath Temp:265 Max.
3、Dip Time:5 Sec. Max.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 9
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6.Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data
Sheet Maximum Rating
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
Operation Life
*Test Time= 1000HRS
(-24HRS,+72HRS)*@20mA.
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 1000HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
Endurance Test
High Temperature
Storage
Ta= 105±5℃
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Test Time= 1000HRS (-24HRS,72HRS)
Low Temperature
Storage
Ta= -55±5℃
JIS C 7021:B-12 (1982)
*Test Time=1000HRS (-24HRS,72H RS)
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Temperature
Cycling
105±5℃
-55±5℃
10mins
10mins
100 Cycles
100 Cycles
IR-Reflow In-Board, 2 Times
105±5℃
10mins
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Thermal
Shock
-55℃±5℃
10mins
Environmental
Test
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
Solder
Resistance
Tsol= 260 ± 5℃
Dwell Time= 10 ± 1sec
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
Tsol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Solder ability
Coverage ≧95% of the dipped surface
JIS C 7021:A-2(1982)
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE
10
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