TF09 [HRS]
0.5mmPitch, 2.0mm Height, Single contact, Non ZIP type FFC FPC Connectors;
| 型号： | TF09 |
| 厂家： | 
HRS |
| 描述： | 0.5mmPitch, 2.0mm Height, Single contact, Non ZIP type FFC FPC Connectors PC |
| 文件： | 总6页 (文件大小：130K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IC 기술팀
Hirose Korea TCP/FFC Connector
TF09-Series
목 차
1. 제품 특징------------------------------------------page 1
2. 제품 규격 및 구성-----------------------------page 1
3. 제품 상세 내용----------------------------------page 2~3
No.
1
제 품 명
Pin
수
관련page
2~3
사양
TF09-6S-0.5SH
16
0.5 Pitch ,2mm 높이,FFC 사양
4.Reflow profile (Lead-free)---------------------------page 6
HIROSE KOREA
Page1
TF09 - S-0.5SH
0.5mmPitch, 2.0mm Height, Single contact, Non ZIP type FFC/FPC Connectors
■ Feature
1. PITCH 0.5mm, HEIGHT 2mm FPC 커넥터
2. Non-ZIP Type
3. On-Board Type
4. FPC 삽입 및 발거 작업성 용이
5. FPC의 충분한 삽입길이 확보로 접촉신뢰성 확보
6. RoHS 및 Halogen Free 대응 원재료 사용
■ Part Number의 구성
TF09
0.5
④
-
S -
③
SH
⑤
**
②
①
Serieal Name
Contact 수
고유ID
①
②
③
④
⑤
Pin : 6
S : socket
0.5mm
Contact 분류
Contact Pitch
Solder 방식
SH : SMT horizontal mounting type
HIROSE KOREA
Page2
■ 제품 규격
Current 0.5A
Voltage 50V
Operating temperature range
Storage temperature range
Rating
- 55 ℃ ∼ ＋ 85 ℃
- 10 ℃ ∼ ＋ 50 ℃
Item
Specification
Conditions
1.Insulation Resistance
2.Withstand voltage
Measureed at 100V DC
500MΩ Min
Neither shot or insulation beakdown 150V AC for 1 minute
3.Contact Resistance
4.FFC Retention Force
5.Mechanical operation
100mΩ Max
Measured at 1mA(or 1,000㎐)
Measure at 0.3±0.03mm FFC
20 Time insertions and extractions.
Ver:1.2kgf MIN/Hor:1.8kgf MIN
Contact Resistance : 100mΩ Max
Temperature : 40±2℃
Contact Resistance : 100mΩ Max
Insulation Resistance : 500MΩ Min
6.Moisture Resistance
Relative Humidity : 90∼95%
Duration : 96Hr
Reflow : 150~200℃ 60~180Sec ,
217℃ 60~150sec, Peak 255 ± 5℃ ,
Peak 5℃
7.Resistance to
Soldering heat
No deformation of
components affecting performance.
■ 부품별 적용 원재료
Part
Material
LCP
Finish
Remarks
UL94V-0
Ni Barrier
-
CASE
NATURAL
SIGNAL CONTACT
METAL FITTING
Phosphor Bronze
Phosphor Bronze
Gold plating over Ni
Sn over Ni plating
※ Reflow최대 온도 250℃를 만족시킴으로 Lead-free Soldering의 요구조건에 적합한 제품임.
※ RoHS지침 및 유해 물질 관리 기준에 적합한 제품임.
HIROSE KOREA
Page3
■ TF09 -
S - 0.5SH
6S
A
B
C
D
2.5
7.88
3.55
5.66
■ PCB LAYOUT
6
A
B
5.2
2.5
HIROSE KOREA
Page4
■ Packaging Specification
◆ 포장 방법 : Embossed Carrier tape(Anti-static)
◆ 포장 수량 : 3,000pcs/Reel
HIROSE KOREA
Page5
■ Reflow Profile
Using Lead-free Solder Paste
300
250
200
250℃ Max
220℃
B'
A'
150
100
50
Preheating time
Soldering time
0
50
100
150
200
250
300
Time (Seconds)
Recommended Application Conditions
Reflow System: IR reflow
Solder: Cream type Sn / 3 Ag / 0.5 Cu
Flux content 11%wt
Metal mask thickness: 0.15mm
Preheating time: 150℃~190℃, 90±30seconds
A'=150℃~170℃ , B'=170℃~190℃
Soldering time: 260℃ Max
220℃ Min, 30~60 seconds
HIROSE KOREA
Page6
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