3SK186FI-TR [HITACHI]

RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, MPAK-4;
3SK186FI-TR
型号: 3SK186FI-TR
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, MPAK-4

晶体 小信号场效应晶体管 射频小信号场效应晶体管 光电二极管 栅 放大器
文件: 总6页 (文件大小:34K)
中文:  中文翻译
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3SK186  
Silicon N-Channel Dual Gate MOS FET  
Application  
UHF TV tuner RF amplifier  
Outline  
MPAK-4  
2
3
1
1. Source  
2. Gate1  
3. Gate2  
4. Drain  
4
3SK186  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VDS  
Ratings  
12  
Unit  
V
Drain to source voltage  
Gate 1 to source voltage  
Gate 2 to source voltage  
Drain current  
VG1S  
VG2S  
ID  
±10  
V
±10  
V
35  
mA  
mW  
°C  
°C  
Channel power dissipation  
Channel temperature  
Storage temperature  
Pch  
Tch  
150  
125  
Tstg  
–55 to +125  
Electrical Characteristics (Ta = 25°C)  
Item  
Symbol Min  
V(BR)DSX 12  
Typ  
Max  
Unit  
Test conditions  
Drain to source breakdown  
voltage  
V
VG1S = VG2S = –5 V,  
ID = 200 µA  
Gate 1 to source breakdown  
voltage  
V(BR)G1SS ±10  
V(BR) G2SS ±10  
V
V
IG1 = ±10 µA, VG2S = VDS = 0  
Gate 2 to source breakdown  
voltage  
IG2 = ±10 µA, VG1S = VDS = 0  
Gate 1 cutoff current  
Gate 2 cutoff current  
IG1SS  
IG2SS  
±100  
±100  
–0.8  
nA  
nA  
V
VG1S = ±8 V, VG2S = VDS = 0  
VG2S = ±8 V, VG1S = VDS = 0  
Gate 1 to source cutoff voltage VG1S(off)  
+0.5  
VDS = 6 V, VG2S = 3V,  
ID = 100 µA  
Gate 2 to source cutoff voltage VG2S(off)  
+0.5  
–0.8  
V
VDS = 6 V, VG1S = 3V,  
ID = 100 µA  
Drain current  
IDSS  
|yfs|  
0
4
mA  
mS  
VDS = 6 V, VG2S = 3V, VG1S = 0  
Forward transfer admittance  
15  
VDS = 6 V, VG2S = 3V,  
ID = 10 mA, f = 1 kHz  
Input capacitance  
Output capacitance  
Ciss  
1.7  
1.0  
2.2  
1.4  
pF  
VDS = 6 V, VG2S = 3V,  
ID = 10 mA, f = 1 MHz  
Coss  
16  
pF  
pF  
dB  
Reverse transfer capacitance Crss  
0.017 0.03  
Power gain  
PG  
19  
VDS = 4 V, VG2S = 3V,  
ID = 10 mA, f = 900 MHz  
Noise figure  
NF  
3.0  
4.5  
dB  
Note: Marking is “FI–”.  
2
3SK186  
Maximum Channel Power  
Dissipation Curve  
Typical Output Characteristics  
1.2  
20  
16  
12  
8
300  
200  
100  
1.6  
1.4  
VG2S = 3 V  
4
VG1S = 0 V  
0
2
4
6
8
10  
0
50  
100  
150  
Drain to Source Voltage VDS (V)  
Ambient Temperature Ta (°C)  
Drain Current vs. Gate 2  
to Source Voltage  
Drain Current vs. Gate 1  
to Source Voltage  
20  
16  
12  
8
20  
16  
12  
8
1.75  
VDS = 4 V  
1.5  
2.5  
3
1.25  
VDS = 4 V  
2
1.5  
1.0  
1.0  
0.75  
0.5  
VG2S = 0.5 V  
4
4
0.25  
VG1S = 0  
0
–0.8  
0
0.8  
1.6  
2.4  
3.2  
4.0  
0
0.8  
1.6  
2.4  
3.2  
Gate 2 to Source Voltage VG2S (V)  
Gate 1 to Source Voltage VG1S (V)  
3
3SK186  
Forward Transfer Admittance vs.  
Gate 1 to Source Voltage  
Power Gain vs. Drain Current  
20  
16  
12  
8
20  
16  
12  
8
2.5  
2.0  
3
VDS = 6 V  
1.5  
VDS = 4 V  
G2S = 3 V  
f = 900 MHz  
1.0  
VG2S = 0.5 V  
V
4
4
0
–0.4  
0
0.4  
0.8  
1.2  
1.6  
0
2
4
6
8
10  
Gate 1 to Source Voltage VG1S (V)  
Drain Current ID (mA)  
Noise Figure vs. Drain Current  
VDS = 4 V  
10  
8
V
G2S = 3 V  
f = 900 MHz  
6
4
2
0
2
4
6
8
10  
Drain Current ID (mA)  
4
Unit: mm  
2.95 ± 0.2  
1.9 ± 0.2  
0.95 0.95  
+ 0.1  
– 0.06  
+ 0.1  
– 0.05  
+ 0.1  
– 0.05  
0.16  
0.4  
0.4  
0 – 0.1  
+ 0.1  
– 0.05  
+ 0.1  
– 0.05  
0.4  
0.6  
0.85  
0.95  
1.8 ± 0.2  
Hitachi Code  
JEDEC  
MPAK-4  
EIAJ  
Conforms  
Weight (reference value) 0.013 g  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

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