HD74ALVCH16500T-EL [HITACHI]

Registered Bus Transceiver, ALVC/VCX/A Series, 1-Func, 18-Bit, True Output, CMOS, PDSO56, TTP-56D;
HD74ALVCH16500T-EL
型号: HD74ALVCH16500T-EL
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

Registered Bus Transceiver, ALVC/VCX/A Series, 1-Func, 18-Bit, True Output, CMOS, PDSO56, TTP-56D

总线驱动器 总线收发器 逻辑集成电路 光电二极管
文件: 总13页 (文件大小:57K)
中文:  中文翻译
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HD74ALVCH16500  
18-bit Universal Bus Transceivers with 3-state Outputs  
ADE-205-167A (Z)  
2nd. Edition  
December 1999  
Description  
Data flow in each direction is controlled by output enable (OEAB and OEBA), latch enable (LEAB and  
LEBA), and clock (CLKAB and CLKBA) inputs. For A to B data flow, the device operates in the  
transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a  
high or low logic level. If LEAB is low, the A bus data is stored in the latch flip flop on the high to low  
transition of CLKAB. Output enable OEAB is active high. When OEAB is high, the B port outputs are  
active. When OEAB is low, the B port outputs are in the high impedance state. Data flow for B to A is  
similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary  
(OEAB is active high, and OEBA is active low). Active bus hold circuitry is provided to hold unused or  
floating data inputs at a valid logic level.  
Features  
VCC = 2.3 V to 3.6 V  
Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)  
Typical VOH undershoot > 2.0 V (@VCC = 3.3 V, Ta = 25°C)  
High output current ±24 mA (@VCC = 3.0 V)  
Bus hold on data inputs eliminates the need for external pullup / pulldown resistors  
HD74ALVCH16500  
Function Table *3  
Inputs  
Output B  
OEAB  
LEAB  
CLKAB  
A
X
L
L
X
H
H
L
X
X
X
Z
L
H
H
H
H
H
H
H
L
H
L
L
H
X
X
H
*1  
L
H
L
B0  
*2  
L
B0  
H : High level  
L : Low level  
X : Immaterial  
Z : High impedance  
: High to low transition  
Notes: 1. Output level before the indicated steady state input conditions were established.  
2. Output level before the indicated steady state input conditions were established, provided that  
CLKAB was low before LEAB went low.  
3. A to B data flow is show; B to A flow is similar but uses OEBA, LEBA, and CLKBA.  
2
HD74ALVCH16500  
Pin Arrangement  
GND  
OEAB 1  
LEAB 2  
56  
55 CLKAB  
54  
53  
52  
51  
50  
B1  
A1  
GND  
A2  
3
4
GND  
B2  
5
6
B3  
A3  
7
VCC  
VCC  
8
A4  
A5  
49 B4  
B5  
9
48  
47  
46  
10  
11  
12  
A6  
B6  
GND  
GND  
A7  
45 B7  
B8  
44  
43  
42  
A8 13  
A9 14  
B9  
A10  
15  
B10  
41 B11  
B12  
A11  
A12  
16  
17  
40  
39 GND  
38 B13  
37 B14  
GND  
A13  
18  
19  
20  
A14  
A15 21  
B15  
36  
35  
34  
33  
32  
31  
30  
29  
VCC  
A16  
22  
23  
24  
25  
26  
27  
28  
VCC  
B16  
A17  
B17  
GND  
A18  
GND  
B18  
OEBA  
LEBA  
CLKBA  
GND  
(Top view)  
3
HD74ALVCH16500  
Absolute Maximum Ratings  
Item  
Symbol  
Ratings  
–0.5 to 4.6  
–0.5 to 4.6  
–0.5 to VCC +0.5  
–0.5 to VCC +0.5  
–50  
Unit  
V
Conditions  
Supply voltage  
Input voltage *1, 2  
VCC  
VI  
V
Except I/O ports  
I/O ports  
Output voltage *1, 2  
VO  
IIK  
V
Input clamp current  
Output clamp current  
Continuous output current  
mA  
mA  
mA  
IOK  
IO  
±50  
VO < 0 or VO > VCC  
VO = 0 to VCC  
±50  
±100  
Maximum power dissipation  
PT  
1
W
TSSOP  
at Ta = 55°C (in still air) *3  
Storage temperature  
Tstg  
–65 to 150  
°C  
Notes:  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage  
to the device. These are stress ratings only, and functional operation of the device at these or  
any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute maximum rated conditions for extended periods may affect device  
reliability.  
1. The input and output negative voltage ratings may be exceeded if the input and output clamp  
current ratings are observed.  
2. This value is limited to 4.6 V maximum.  
3. The maximum package power dissipation is calculated using a junction temperature of 150°C  
and a board trace length of 750 mils.  
Recommended Operating Conditions  
Item  
Symbol  
VCC  
Min  
2.3  
0
Max  
3.6  
VCC  
VCC  
–12  
–12  
–24  
12  
Unit  
V
Conditions  
Supply voltage  
Input voltage  
VI  
V
Output voltage  
High level output current  
VO  
0
V
IOH  
0
mA  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 3.0 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 3.0 V  
Low level output current  
IOL  
mA  
12  
24  
Input transition rise or fall rate  
Operating temperature  
t / v  
10  
ns / V  
Ta  
–40  
85  
°C  
Note: Unused control inputs must be held high or low to prevent them from floating.  
4
HD74ALVCH16500  
Logic Diagram  
1
55  
2
OEAB  
CLKAB  
LEAB  
LEBA  
CLKBA  
OEBA  
A1  
28  
30  
27  
3
54  
1D  
C1  
B1  
CLK  
1D  
C1  
CLK  
To seventeen other channels  
5
HD74ALVCH16500  
Electrical Characteristics (Ta = –40 to 85°C)  
Item  
Symbol VCC (V) *1  
Min  
Max  
Unit Test Conditions  
Input voltage  
VIH  
2.3 to 2.7 1.7  
2.7 to 3.6 2.0  
V
VIL  
2.3 to 2.7  
2.7 to 3.6  
0.7  
0.8  
Output voltage  
VOH  
Min to Max VCC–0.2  
V
IOH = –100 µA  
2.3  
2.3  
2.7  
3.0  
3.0  
2.0  
1.7  
2.2  
2.4  
2.0  
IOH = –6 mA, VIH = 1.7 V  
IOH = –12 mA, VIH = 1.7 V  
IOH = –12 mA, VIH = 2.0 V  
IOH = –12 mA, VIH = 2.0 V  
IOH = –24 mA, VIH = 2.0 V  
IOL = 100 µA  
VOL  
Min to Max —  
0.2  
0.4  
0.7  
0.4  
0.55  
±5  
2.3  
IOL = 6 mA, VIL = 0.7 V  
IOL = 12 mA, VIL = 0.7 V  
IOL = 12 mA, VIL = 0.8 V  
IOL = 24 mA, VIL = 0.8 V  
VIN = VCC or GND  
VIN = 0.7 V  
2.3  
2.7  
3.0  
Input current  
IIN  
3.6  
µA  
IIN (hold)  
2.3  
45  
–45  
75  
–75  
2.3  
VIN = 1.7 V  
3.0  
VIN = 0.8 V  
3.0  
VIN = 2.0 V  
3.6  
±500  
±10  
40  
VIN = 0 to 3.6 V  
Off state output current *2 IOZ  
Quiescent supply current ICC  
3.6  
µA  
µA  
µA  
VOUT = VCC or GND  
VIN = VCC or GND  
3.6  
ICC  
3.0 to 3.6  
750  
VIN = one input at (VCC–0.6) V,  
other inputs at VCC or GND  
Notes: 1. For conditions shown as Min or Max, use the appropriate values under recommended operating  
conditions.  
2. For I/O ports, the parameter IOZ includes the input leakage current.  
6
HD74ALVCH16500  
Switching Characteristics (Ta = –40 to 85°C)  
Item  
Symbol VCC (V) Min  
Typ  
Max  
Unit FROM  
(Input)  
TO  
(Output)  
Maximum clock frequency fmax  
2.5±0.2 150  
2.7 150  
4.0  
8.0  
MHz  
3.3±0.3 150  
2.5±0.2 1.0  
Propagation delay time  
tPLH  
tPHL  
5.1  
4.7  
3.9  
5.9  
5.5  
4.7  
6.1  
6.6  
5.5  
5.7  
5.4  
4.6  
6.1  
6.2  
5.2  
6.2  
5.7  
5.0  
5.4  
4.6  
4.3  
ns  
A or B  
B or A  
2.7  
3.3±0.3 1.0  
2.5±0.2 1.0  
LEAB or A or B  
LEBA  
2.7  
3.3±0.3 1.0  
2.5±0.2 1.0  
CLKAB or A or B  
2.7  
CLKBA  
3.3±0.3 1.1  
2.5±0.2 1.0  
Output enable time  
tZH  
tZL  
ns  
OEAB  
OEBA  
OEAB  
OEBA  
B
A
B
A
2.7  
3.3±0.3 1.0  
2.5±0.2 1.0  
2.7  
3.3±0.3 1.0  
2.5±0.2 1.7  
Output disable time  
tHZ  
tLZ  
ns  
2.7  
3.3±0.3 1.5  
2.5±0.2 1.0  
2.7  
3.3±0.3 1.0  
Input capacitance  
Output capacitance  
CIN  
3.3  
3.3  
pF  
pF  
Control inputs  
A or B ports  
CIN / O  
7
HD74ALVCH16500  
Switching Characteristics (Ta = –40 to 85°C) (Cont)  
Item  
Symbol VCC (V)  
tsu 2.5±0.2 1.7  
2.7 1.4  
Min  
Typ  
Max  
Unit  
FROM (Input)  
Setup time  
ns  
Data before CLK↓  
3.3±0.3 1.3  
2.5±0.2 1.1  
Data before LE↓  
CLK “H”  
2.7  
1.0  
3.3±0.3 1.0  
2.5±0.2 1.9  
Data before LE↓  
CLK “L”  
2.7  
1.6  
3.3±0.3 1.4  
2.5±0.2 1.7  
Hold time  
th  
ns  
Data after CLK↓  
2.7  
1.6  
3.3±0.3 1.3  
2.5±0.2 2.0  
Data after LE↓  
CLK “H”  
2.7  
1.8  
3.3±0.3 1.5  
2.5±0.2 1.6  
Data after LE↓  
CLK “L”  
2.7  
1.5  
3.3±0.3 1.2  
2.5±0.2 3.3  
Pulse width  
tw  
ns  
LE “H”  
2.7  
3.3  
3.3±0.3 3.3  
2.5±0.2 3.3  
CLK “H” or “L”  
2.7  
3.3  
3.3±0.3 3.3  
8
HD74ALVCH16500  
• Test Circuit  
See under table  
500  
S1  
OPEN  
GND  
*1  
CL= 50 pF  
500 Ω  
Load Circuit for Outputs  
Vcc=2.7V,  
Vcc=2.5±0.2V  
Symbol  
3.3±0.3V  
tPLH/ tPHL  
tsu / th / tw  
OPEN  
OPEN  
tZH/ tHZ  
tZL / tLZ  
GND  
4.6 V  
GND  
6.0 V  
Note: 1. CL includes probe and jig capacitance.  
9
HD74ALVCH16500  
• Waveforms – 1  
tr  
tf  
V
IH  
90 %  
Vref  
90 %  
Vref  
Input  
10 %  
10 %  
GND  
tPHL  
tPLH  
VOH  
Output  
Vref  
Vref  
VOL  
• Waveforms – 2  
tr  
V
IH  
90 %  
Vref  
Timing Input  
10 %  
tsu  
GND  
th  
V
IH  
Vref  
Vref  
Data Input  
GND  
tw  
V
IH  
Vref  
Vref  
Input  
GND  
10  
HD74ALVCH16500  
• Waveforms – 3  
tf  
tr  
V
IH  
90 %  
Vref  
90 %  
Vref  
Output  
Control  
10 %  
tZL  
10 %  
GND  
tLZ  
VOH1  
Vref  
Waveform - A  
Waveform - B  
VOL + 0.3 V  
VOH– 0.3 V  
VOL  
VOH  
tZH  
tHZ  
Vref  
VOL1  
Vcc=2.7V,  
Vcc=2.5±0.2V  
2.3 V  
TEST  
3.3±0.3V  
VIH  
2.7 V  
Vref  
1.2 V  
1.5 V  
3.0 V  
GND  
VOH1  
VOL1  
2.3 V  
GND  
Notes: 1. All input pulses are supplied by generators having the following characteristics:  
PRR 10 MHz, Zo = 50 , tr 2.5 ns, tf 2.5 ns.  
2. Waveform – A is for an output with internal conditions such that the output is low  
except when disabled by the output control.  
3. Waveform – B is for an output with internal conditions such that the output is high  
except when disabled by the output control.  
4. The output are measured one at a time with one transition per measurement.  
11  
HD74ALVCH16500  
Package Dimensions  
Unit : mm  
+0.3  
–0.1  
14.00  
56  
29  
28  
1
0.50  
+0.1  
–0.05  
M
0.08  
0.20  
8.10 ± 0.3  
0.40 Max  
10° Max  
0.50 ± 0.1  
0.10  
Hitachi code  
EIAJ code  
JEDEC code  
TTP-56D  
12  
HD74ALVCH16500  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/index.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  
13  

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