HD74HC573 [HITACHI]

Octal Transparent Latches (with 3-state outputs); 八路透明锁存器(带3态输出)
HD74HC573
型号: HD74HC573
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

Octal Transparent Latches (with 3-state outputs)
八路透明锁存器(带3态输出)

锁存器
文件: 总12页 (文件大小:73K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HD74HC563/HD74HC573  
Octal Transparent Latches (with 3-state outputs)  
Description  
When the latch enable (LE) input is high, the Q outputs of HD74HC563 will follow the inversion of the D  
inputs and the Q outputs of HD74HC573 will follow the D inputs. When the latch enable goes low, data at  
the D inputs will be retained at the outputs until latch enable returns high again. When a high logic level is  
applied to the output control input, all outputs go to a high impedance state, regardless of what signals are  
present at the other inputs and the state of the storage elements.  
Features  
High Speed Operation: tpd (Data to Q, Q) = 11 ns typ (CL = 50 pF)  
High Output Current: Fanout of 15 LSTTL Loads  
Wide Operating Voltage: VCC = 2 to 6 V  
Low Input Current: 1 µA max  
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)  
Function Table  
Outputs  
Output Control  
Latch Enable  
Data  
H
HD74HC563  
HD74HD573  
L
L
L
H
H
H
L
L
H
L
L
H
Q0  
Z
X
Q0  
Z
X
X
Q0 :  
Q0 :  
level of Q before the indicated Steady-sate input conditions were established.  
complement of Q0 or level of Q before the indicated Steady-state input conditions were established.  
HD74HC563/HD74HC573  
Pin Arrangement  
HD74HC563  
Output  
Control  
1
20 VCC  
19 1Q  
18 2Q  
17 3Q  
16 4Q  
OE  
1D  
2
D
Q
Q
Q
Q
OE  
2D 3  
D
Q
Q
Q
Q
OE  
D
3D  
4D  
5D  
4
5
6
OE  
D
OE  
D
15  
5Q  
OE  
D
6D 7  
7D 8  
8D 9  
14 6Q  
13 7Q  
12 8Q  
OE  
D
OE  
D
Latch  
Enable  
10  
11  
GND  
(Top view)  
2
HD74HC563/HD74HC573  
HD74HC573  
Output  
Control  
1
2
20 VCC  
OE  
1D  
19 1Q  
18 2Q  
17 3Q  
16 4Q  
D
Q
Q
Q
Q
OE  
2D 3  
D
Q
Q
Q
Q
OE  
D
3D  
4D  
5D  
4
5
6
OE  
D
OE  
D
15  
5Q  
OE  
D
6D 7  
7D 8  
8D 9  
14 6Q  
13 7Q  
12 8Q  
OE  
D
OE  
D
Latch  
Enable  
10  
11  
GND  
(Top view)  
Absolute Maximum Ratings  
Item  
Symbol  
VCC  
Rating  
–0.5 to +7.0  
Unit  
V
Supply voltage range  
Input voltage  
VIN  
–0.5 to VCC + 0.5  
V
Output voltage  
VOUT  
IOUT  
ICC, IGND  
IIK  
–0.5 to VCC + 0.5  
V
Output current  
±35  
mA  
mA  
mA  
mA  
mW  
°C  
DC current drain per VCC , GND  
DC input diode current  
DC output diode current  
Power Dissipation per package  
Storage temperature  
±75  
±20  
IOK  
±20  
PT  
500  
Tstg  
–65 to +150  
3
HD74HC563/HD74HC573  
Block Diagram  
HD74HC563  
D
C
C
1D  
Q
Q
1Q  
2Q  
3Q  
4Q  
5Q  
6Q  
7Q  
8Q  
D
C
C
2D  
3D  
D
C
C
Q
Q
Q
Q
Q
Q
D
C
C
4D  
5D  
D
C
C
D
C
C
6D  
7D  
8D  
D
C
C
D
C
C
LE  
OC  
4
HD74HC563/HD74HC573  
HD74HC573  
D
C
C
1D  
Q
Q
1Q  
2Q  
3Q  
4Q  
5Q  
6Q  
7Q  
8Q  
D
C
C
2D  
3D  
D
C
C
Q
Q
Q
Q
Q
Q
D
C
C
4D  
5D  
D
C
C
D
C
C
6D  
7D  
8D  
D
C
C
D
C
C
LE  
OC  
5
HD74HC563/HD74HC573  
DC Characteristics  
Ta = –40 to  
Ta = 25°C  
+85°C  
Item  
Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions  
Input voltage  
VIH  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
4.5  
6.0  
2.0  
4.5  
6.0  
4.5  
6.0  
6.0  
1.5  
0.5  
1.5  
3.15  
4.2  
V
V
V
3.15 —  
4.2  
VIL  
0.5  
1.35  
1.8  
1.35 —  
1.8  
Output voltage  
VOH  
1.9 2.0  
4.4 4.5  
5.9 6.0  
4.18 —  
5.68 —  
1.9  
4.4  
5.9  
4.13  
5.63  
Vin = VIH or VIL IOH = –20 µA  
IOH = –6 mA  
IOH = –7.8 mA  
VOL  
0.0 0.1  
0.0 0.1  
0.0 0.1  
0.1  
0.1  
0.1  
0.33  
0.33  
V
Vin = VIH or VIL IOL = 20 µA  
0.26 —  
0.26 —  
IOL = 6 mA  
IOL = 7.8 mA  
Off-state output  
current  
IOZ  
Iin  
±0.5 —  
±5.0 µA  
Vin = VIH or VIL,  
Vout = VCC or GND  
Input current  
6.0  
6.0  
±0.1 —  
±1.0 µA  
Vin = VCC or GND  
Quiescent supply ICC  
current  
4.0  
40  
µA  
Vin = VCC or GND, Iout = 0 µA  
6
HD74HC563/HD74HC573  
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)  
Ta = –40 to  
+85°C  
Ta = 25°C  
Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions  
Item  
Propagation delay tPLH  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
75  
15  
13  
5
110 —  
140 ns  
Data to Q  
time  
tPHL  
11 22  
28  
19  
24  
tPLH  
tPHL  
115 —  
145 ns  
Clock to Q  
13 23  
29  
20  
25  
Output enable  
time  
tZH  
tZL  
150 —  
190 ns  
14 30  
38  
26  
33  
Output disable  
time  
tHZ  
tLZ  
150 —  
190 ns  
15 30  
90  
19  
16  
5
38  
33  
2
26  
60  
12  
10  
10  
Setup time  
Hold time  
tsu  
75  
15  
13  
10  
ns  
ns  
ns  
ns  
pF  
–1  
4
th  
5
5
5
5
Pulse width  
tw  
80  
16  
14  
100  
20  
17  
4
Output rise/fall  
time  
tTLH  
tTHL  
5
Input capacitance Cin  
7
Unit: mm  
24.50  
25.40 Max  
20  
11  
10  
1
1.30  
0.89  
7.62  
1.27 Max  
+ 0.11  
– 0.05  
0.25  
2.54 ± 0.25  
0.48 ± 0.10  
0° – 15°  
Hitachi Code  
JEDEC  
EIAJ  
DP-20N  
Conforms  
Weight (reference value) 1.26 g  
Unit: mm  
12.6  
13 Max  
11  
10  
20  
1
+ 0.20  
7.80  
– 0.30  
0.80 Max  
1.15  
0° – 8°  
1.27  
0.70 ± 0.20  
*0.42 ± 0.08  
0.40 ± 0.06  
0.15  
0.12 M  
Hitachi Code  
JEDEC  
FP-20DA  
EIAJ  
Conforms  
*Dimension including the plating thickness  
Base material dimension  
Weight (reference value) 0.31 g  
Unit: mm  
12.8  
13.2 Max  
11  
10  
20  
1
+ 0.25  
– 0.40  
10.40  
0.935 Max  
1.45  
0° – 8°  
+ 0.57  
– 0.30  
1.27  
0.70  
*0.42 ± 0.08  
0.40 ± 0.06  
0.15  
M
0.12  
Hitachi Code  
JEDEC  
EIAJ  
FP-20DB  
Conforms  
*Dimension including the plating thickness  
Base material dimension  
Weight (reference value) 0.52 g  
Unit: mm  
6.50  
6.80 Max  
20  
11  
1
10  
0.65  
1.0  
+0.08  
*0.22  
0.20 ± 0.06  
–0.07  
0.13  
M
6.40 ± 0.20  
0.65 Max  
0° – 8°  
0.50 ± 0.10  
0.10  
Hitachi Code  
TTP-20DA  
JEDEC  
EIAJ  
*Dimension including the plating thickness  
Base material dimension  
Weight (reference value) 0.07 g  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

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