365S8GE [HITTITE]
SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz; SMT砷化镓HBT MMIC除以4 ， DC - 13.0 GHz的
| 型号： | 365S8GE |
| 厂家： | 
HITTITE MICROWAVE CORPORATION |
| 描述： | SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz |
| 文件： | 总6页 (文件大小：360K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HMC365S8G / 365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Typical Applications
Features
Prescaler for DC to Ku Band PLL Applications:
• Satellite Communication Systems
• Fiber Optic
Ultra Low SSB Phase Noise: -151 dBc/Hz
Wide Bandwidth
6
Output Power: 5 dBm
Single DC Supply: +5V
S8G SMT Package
• Point-to-Point and Point-to-Multi-Point Radios
• VSAT
Functional Diagram
General Description
The HMC365S8G & HMC365S8GE are low noise
Divide-by-4 Static Dividers with InGaP GaAs HBT
technology in 8 lead surface mount plastic packages.
This device operates from DC (with a square wave
input) to 13.0 GHz input frequency with a single +5.0V
DC supply. The low additive SSB phase noise of -151
dBc/Hz at 100 kHz offset helps the user maintain good
system noise performance.
Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc = 5V
Parameter
Maximum Input Frequency
Minimum Input Frequency
Input Power Range
Conditions
Min.
13
Typ.
14
Max.
Units
GHz
GHz
dBm
dBm
dBm
dBm
dB
Sine Wave Input. [1}
Fin = 1 to 8 GHz
0.2
>-20
>-15
>-8
5
0.5
+10
+3
-15
-10
-5
Fin = 8 to 11 GHz
Fin = 11 to 13 GHz
+3
Output Power
Fin = 13 GHz
2
Reverse Leakage
Both RF Outputs Terminated
Pin = 0 dBm, Fin = 6 GHz
Pin = 0 dBm, Fout = 882 MHz
45
SSB Phase Noise (100 kHz offset)
Output Transition Time
Supply Current (Icc)
-151
100
110
dBc/Hz
ps
mA
1. Divider will operate down to DC for square-wave input signal.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 44
HMC365S8G / 365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Input Sensitivity Window, T= 25 °C
Input Sensitivity Window vs. Temperature
20
20
6
10
10
Min Pin +25 C
Max Pin +25 C
Min Pin +85 C
Max Pin +85 C
Min Pin -40 C
Max Pin -40 C
0
0
-10
-20
-30
Recommended
Operating Window
-10
-20
-30
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
INPUT FREQUENCY (GHz)
INPUT FREQUENCY (GHz)
SSB Phase Noise
Performance, Pin= 0 dBm, T= 25 °C
Output Power vs. Temperature
10
9
8
0
-20
7
6
-40
5
4
-60
3
2
1
0
-1
-2
-3
-4
-5
-80
+25 C
+85 C
-40 C
-100
-120
-140
-160
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
102
103
104
105
106
107
INPUT FREQUENCY (GHz)
OFFSET FREQUENCY (Hz)
Output Harmonic
Content, Pin= 0 dBm, T= 25 °C
Reverse Leakage, Pin= 0 dBm, T= 25 °C
0
0
Both Output Ports Terminated
One Output Port Terminated
-10
-10
Pfeedthru
2nd Harmonic
3rd Harmonic
-20
-30
-40
-50
-60
-20
-30
-40
-50
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
INPUT FREQUENCY (GHz)
INPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 45
HMC365S8G / 365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
Absolute Maximum Ratings
700
600
RF Input (Vcc = +5V)
+13 dBm
6
Vcc
+5.5V
500
400
300
200
Junction Temperature
135 °C
Continuous Pdiss (T= 85°C)
(derate 15 mW/°C above 85°C)
760 mW
100
0
-100
-200
Thermal Resistance (RTH)
(junction to ground paddle)
65.8 °C/W
-300
-400
-500
Storage Temperature
Operating Temperature
-65 to +150 °C
-40 to to +85 °C
-600
-700
22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7
TIME (nS)
Typical Supply Current vs. Vcc
Vcc (V)
4.75
5.0
Icc (mA)
94
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
110
5.25
118
Note: Divider will operate over full voltage range shown above
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
MSL1 [1]
Package Marking [3]
HMC365
XXXX
HMC365S8G
Low Stress Injection Molded Plastic
Sn/Pb Solder
HMC365
XXXX
MSL1 [2]
HMC365S8GE
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 46
HMC365S8G / 365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Pin Description
Pin Number
Function
Description
Interface Schematic
6
1
OUT
N/C
Divided output 180° out of phase with pin 3.
No connection. These pins must not be grounded.
Divided Output.
2, 6
3
OUT
4
5
Vcc
Supply voltage 5V 0.25V.
IN
RF Input must be DC blocked.
RF Input 180° out of phase with pin 5 for differential operation.
A/C ground for single ended operation
7
8
IN
Ground Backside of package has exposed metal ground paddle which
must be connected to ground.
GND
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 47
HMC365S8G / 365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Evaluation PCB
6
List of Materials for Evaluation PCB 104631 [1]
The circuit board used in the final application
should use RF circuit design techniques. Signal
lines should have 50 ohm impedance while the
package ground leads and backside ground slug
should be connected directly to the ground plane
similar to that shown. A sufficient number of via
holes should be used to connect the top and bottom
ground planes. The evaluation circuit board shown
is available from Hittite upon request. This evalua-
tion board is designed for single ended input test-
ing. J2 and J3 provide differential output signals.
Item
J1 - J3
C1 - C4
C5
Description
PCB Mount SMA RF Connector
100 pF Capacitor, 0402 Pkg.
1000 pF Capacitor, 0603 Pkg.
10 μF Tantalum Capacitor
HMC365S8G / HMC365S8GE Divide-by-4
104627 Eval Board
C6
U1
[2]
PCB
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 48
HMC365S8G / 365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Application Circuit
6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 49
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