HMC494LP3_08 [HITTITE]
SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz; SMT砷化镓HBT MMIC除以8 ， DC - 18 GHz的
| 型号： | HMC494LP3_08 |
| 厂家： | 
HITTITE MICROWAVE CORPORATION |
| 描述： | SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz |
| 文件： | 总6页 (文件大小：228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HMC494LP3 / 494LP3E
v04.0507
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
6
Typical Applications
Features
Ultra Low SSB Phase Noise: -150 dBc/Hz
Prescaler for DC to 18 GHz PLL Applications:
• Point-to-Point / Multi-Point Radios
• VSAT Radios
Very Wide Bandwidth
Output Power: -4 dBm
Single DC Supply: +5V
3x3 mm QFN Package
• Fiber Optic
• Test Equipment
• Military
Functional Diagram
General Description
The HMC494LP3 & HMC494LP3E are low noise
Divide-by-8 Static Dividers utilizing InGaP GaAs HBT
technology packaged in leadless 3x3 mm QFN sur-
face mount plastic packages. This device operates
from DC (with a square wave input) to 18 GHz input
frequency from a single +5V DC supply. The low addi-
tive SSB phase noise of -150 dBc/Hz at 100 kHz offset
helps the user maintain excellent system noise per-
formance.
Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= +5V
Parameter
Maximum Input Frequency
Conditions
Min.
18
Typ.
19
Max.
Units
GHz
GHz
dBm
dBm
dBm
dBm
dB
Minimum Input Frequency
Input Power Range
Sine Wave Input. [1]
Fin = 2 to 12 GHz
0.2
-15
-15
-10
-4
0.5
+10
+3
0
-20
-20
-15
-7
Fin = 12 to 16 GHz
Fin = 16 to 18 GHz
Output Power
Fin = 0.5 to 18 GHz
Reverse Leakage
Both RF Outputs Terminated
Pin = 0 dBm, Fin = 6 GHz
Pin = 0 dBm, Fout = 882 MHz
55
SSB Phase Noise (100 kHz offset)
Output Transition Time
Supply Current (Icc1 + Icc2)
-150
100
103
dBc/Hz
ps
mA
1. Divider will operate down to DC for square-wave input signal
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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HMC494LP3 / 494LP3E
v04.0507
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
6
Input Sensitivity Window, T= 25 °C
Input Sensitivity Window vs. Temperature
20
20
10
10
Min Pin +25C
Max Pin +25C
Min Pin +85C
Max Pin +85C
Min Pin -40C
Max Pin -40C
0
0
-10
-20
-30
Recommended
Operating Window
-10
-20
-30
0
2
4
6
8
10
12
14
16
16
16
18
20
20
20
0
2
4
6
8
10
12
14
16
18
20
107
20
INPUT FREQUENCY (GHz)
INPUT FREQUENCY (GHz)
SSB Phase Noise Performance,
Pin= 0 dBm, T= 25 °C
Output Power vs. Temperature
0
0
-20
-2
-4
-40
-60
-80
-6
-100
-120
-140
-160
+25C
+85C
-40C
-8
-10
102
103
104
OFFSET FREQUENCY (Hz)
105
106
0
4
8
12
INPUT FREQUENCY (GHz)
Output Harmonic Content,
Pin= 0 dBm, T= 25 °C
Reverse Leakage, Pin= 0 dBm, T= 25 °C
0
0
Both Output Ports Terminated
One Output Port Terminated
-10
-20
-40
-60
-80
Pfeedthru
-20
2nd Harmonic
3rd Harmonic
-30
-40
-50
0
2
4
6
8
10
12
14
18
0
4
8
12
16
INPUT FREQUENCY (GHz)
INPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 131
HMC494LP3 / 494LP3E
v04.0507
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
6
Absolute Maximum Ratings
500
RF Input (Vcc = +5V)
+13 dBm
Supply Voltage (Vcc1, Vcc2)
Channel Temperature (Tc)
+5.5V
300
100
135 °C
Continuous Pdiss (T = 85 °C)
(derate 11.9 mW/° C above 85 °C)
593 mW
84 °C/W
Thermal Resistance (RTH
)
-100
-300
-500
(junction to ground paddle)
Storage Temperature
-65 to +150 °C
-40 to +85 °C
Class 1A
Operating Temperature
ESD Sensitivity (HBM)
22.7
23.1
23.5
23.9
24.3
24.7
Typical Supply Current vs. Vcc
TIME (nS)
Vcc1, Vcc2 (V)
Icc (mA)
4.75
5.0
90
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
103
5.25
115
Note: Divider will operate over full voltage range shown above
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
MSL1 [1]
Package Marking [3]
494
XXXX
HMC494LP3
Low Stress Injection Molded Plastic
Sn/Pb Solder
494
XXXX
MSL1 [2]
HMC494LP3E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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HMC494LP3 / 494LP3E
v04.0507
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
6
Pin Description
Pin Number
Function
Description
Interface Schematic
1, 4-9,
12, 13, 16
N/C
No connection.
2
IN
RF Input must be DC blocked.
RF Input 180° out of phase with pin 2 for differential operation.
AC ground for single ended operation.
3
IN
10
OUT
Divided Output.
11
OUT
Divided output 180° out of phase with pin 10.
14, 15
Vcc1, Vcc2
GND
Supply voltage 5V 0.25V. Connect both pins to +5V supply.
Ground: Backside of package has exposed metal ground slug which
must be connected to RF/DC ground.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 133
HMC494LP3 / 494LP3E
v04.0507
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
6
Evaluation PCB
List of Materials for Evaluation PCB 107384 [1]
The circuit board used in the final application should
use RF circuit design techniques. Signal lines
should have 50 ohm impedance while the package
ground leads and backside ground slug should be
connected directly to the ground plane similar to that
shown. A sufficient number of via holes should be
used to connect the top and bottom ground planes.
The evaluation circuit board shown is available
from Hittite upon request. This evaluation board is
designed for single ended input testing. J2 and J3
provide differential output signals.
Item
J1 - J3
J4, J5
C2 - C5
C6
Description
PCB Mount SMA RF Connector
DC Pin
100 pF Capacitor, 0402 Pkg.
1000 pF Capacitor, 0603 Pkg.
2.2 uF Tantalum Capacitor
HMC494LP3 / HMC494LP3E Divide-by-2
107197 Eval Board
C1
U1
[2]
PCB
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 134
HMC494LP3 / 494LP3E
v04.0507
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
6
Application Circuit
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 135
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