HMC575LP4ETR [HITTITE]
Frequency Doubler,;
| 型号： | HMC575LP4ETR |
| 厂家： | 
HITTITE MICROWAVE CORPORATION |
| 描述： | Frequency Doubler, 射频和微波 射频倍频器 微波倍频器 输出元件 |
| 文件： | 总6页 (文件大小：254K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HMC575LP4 / 575LP4E
v00.0506
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 6 - 9 GHz OUTPUT
Typical Applications
Features
The HMC575LP4 / HMC575LP4E is suitable for:
High Output Power: +17 dBm
Low Input Power Drive: -2 to +6 dBm
Fo, 3Fo Isolation: 15 dBc
• Wireless Local Loop
• Point-to-Point & VSAT Radios
• Test Instrumentation
7
100 KHz SSB Phase Noise: -140 dBc/Hz
Single Supply: +5V@ 90 mA
RoHS Compliant 4x4 mm SMT Package
• Military & Space
Functional Diagram
General Description
The HMC575LP4 & HMC575LP4E are x2 active
broadband frequency multipliers utilizing GaAs
PHEMT technology in a leadless RoHS compliant
SMT package. When driven by a 3 dBm signal, the
multiplier provides +17 dBm typical output power from
6 to 9 GHz. The Fo and 3Fo isolations are 15 dBc with
respect to output signal level. This frequency multiplier
features DC blocked I/O’s, and is ideal for use in LO
multiplier chains for Pt to Pt & VSAT Radios yielding
reducedpartscountvs.traditionalapproaches.Thelow
additive SSB Phase Noise of -140 dBc/Hz at 100 kHz
offset helps maintain good system noise performance.
The HMC575LP4 & HMC575LP4E are compatible with
surface mount manufacturing techniques.
Electrical Specifications, TA = +25° C, Vdd1, Vdd2 = +5V, 3 dBm Drive Level
Parameter
Min.
Typ.
3 - 4.5
6 - 9
17
Max.
Units
GHz
GHz
dBm
dBc
Frequency Range, Input
Frequency Range, Output
Output Power
14
Fo Isolation (with respect to output level)
3Fo Isolation (with respect to output level)
Input Return Loss
15
15
dBc
15
dB
Output Return Loss
12
dB
SSB Phase Noise (100 kHz Offset)
Supply Current (Idd1 & Idd2)
-140
90
dBc/Hz
mA
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 82
HMC575LP4 / 575LP4E
v00.0506
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 6 - 9 GHz OUTPUT
Output Power vs.
Temperature @ 3 dBm Drive Level
Output Power vs. Drive Level
25
25
20
15
10
20
7
15
+25C
+85C
-40C
-2dBm
5
0
-5
10
5
0dBm
2dBm
4dBm
6dBm
0
-10
5.5
6
6.5
7
7.5
8
8.5
9
9.5
6
6.5
7
7.5
8
8.5
9
OUTPUT FREQUENCY (GHz)
FREQUENCY (GHz)
Output Power vs.
Supply Voltage @ 3 dBm Drive Level
Isolation @ 3 dBm Drive Level
25
25
20
15
20
10
5
15
Fo
2Fo
3Fo
Vdd=4.5V
Vdd=5.0V
Vdd=5.5V
10
5
0
-5
-10
-15
0
6
6.5
7
7.5
8
8.5
9
6
6.5
7
7.5
8
8.5
9
OUTPUT FREQUENCY (GHz)
OUTPUT FREQUENCY (GHz)
Output Power vs. Input Power
25
20
15
10
5
0
6 GHz
7.5GHz
9 GHz
-5
-10
-15
-10
-8
-6
-4
-2
0
2
4
6
8
10
INPUT POWER (dBm)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 83
HMC575LP4 / 575LP4E
v00.0506
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 6 - 9 GHz OUTPUT
Input Return Loss vs. Temperature
Output Return Loss vs. Temperature
0
0
-2
-4
-5
-6
-8
+25C
+85C
-40C
+25C
7
-10
+85C
-40C
-10
-12
-14
-16
-18
-20
-15
-20
-25
3
3.25
3.5
3.75
4
4.25
4.5
6
6.5
7
7.5
8
8.5
9
FREQUENCY (GHz)
FREQUENCY (GHz)
Absolute Maximum Ratings
Typical Supply Current vs. Vdd
RF Input (Vdd = +5V)
Supply Voltage (Vdd)
Channel Temperature
+13 dBm
+6.0 Vdc
150 °C
Vdd (Vdc)
Idd (mA)
4.5
89
90
91
5.0
Continuous Pdiss (T= 85 °C)
(derate 7.9 mW/°C above 85 °C)
5.5
512 mW
Note:
Thermal Resistance
(channel to ground paddle)
127 °C/W
Multiplier will operate over full voltage range shown above.
Storage Temperature
Operating Temperature
-65 to +150 °C
-40 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 84
HMC575LP4 / 575LP4E
v00.0506
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 6 - 9 GHz OUTPUT
Outline Drawing
7
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOT FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
MSL1 [1]
Package Marking [3]
H575
XXXX
HMC575LP4
Low Stress Injection Molded Plastic
Sn/Pb Solder
H575
XXXX
MSL1 [2]
HMC575LP4E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 85
HMC575LP4 / 575LP4E
v00.0506
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 6 - 9 GHz OUTPUT
Pin Description
Pin Number
Function
Description
Interface Schematic
These pins are internally not connected; however,
this product was specified with these pins connected
to RF/ DC ground.
1, 5 - 14, 18,
19, 21, 23, 24
N/C
GND
7
Package bottom must also be connected
to RF/DC ground.
2, 4, 15, 17
Pin is AC coupled and matched
to 50 Ohms from 3 - 4.5 GHz.
3
RFIN
Pin is AC coupled and matched
to 50 Ohms from 6 - 9 GHz.
16
RFOUT
Supply voltage 5V 0.5V. External bypass capacitors
of 100 pF and 2.2 μF are required.
20, 22
Vdd2, Vdd1
Application Circuit
Component
C1, C2
Value
100 pF
2.2 μF
C3, C4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 86
HMC575LP4 / 575LP4E
v00.0506
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 6 - 9 GHz OUTPUT
Evaluation PCB
7
List of Materials for Evaluation PCB 112405 [1]
The circuit board used in the final application should
be generated with proper RF circuit design tech-
niques. Signal lines should have 50 ohm imped-
ance while the package ground leads and exposed
paddle should be connected directly to the ground
plane similar to that shown. The evaluation circuit
board shown is available from Hittite upon request.
Item
Description
J1, J2
J3 - J5
C1, C2
C3, C4
PCB Mount SRI SMA Connector
DC Pin
100 pF Capacitor, 0402 Pkg.
2.2 μF Tantalum Capacitor
HMC575LP4 / HMC575LP4E
x2 Active Multiplier
U1
[2]
PCB
115270 Eval Board
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 87
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