HMC913 [HITTITE]

SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz; 连续检波对数视频放大器( SDLVA ) , 0.6 - 20 GHz的
HMC913
型号: HMC913
厂家: HITTITE MICROWAVE CORPORATION    HITTITE MICROWAVE CORPORATION
描述:

SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz
连续检波对数视频放大器( SDLVA ) , 0.6 - 20 GHz的

视频放大器
文件: 总10页 (文件大小:719K)
中文:  中文翻译
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HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
Typical Applications  
The HMC913 is ideal for:  
• EW, ELINT & IFM Receivers  
• DF Radar Systems  
Features  
High Logging Range: 59 dB  
(-54 to +5 dBm) @ 18 GHz  
Output Frequency Flatness: 1.5 dB  
Log Linearity: 1 dB  
• ECM Systems  
Fast Rise/Fall Times: 5/10 ns  
Single Positive Supply: +3.3V  
ESD Sensitivity (HBM): Class 1A  
• Broadband Test & Measurement  
• Power Measurement & Control Circuits  
• Military & Space Applications  
5
Functional Diagram  
General Description  
The HMC913 is a Successive Detection Log Video  
Amplifier (SDLVA) which operates from 0.6 to 20 GHz.  
The HMC913 provides a logging range of 59 dB. This  
device offers typical fast rise/fall times of 5/10 ns and  
a superior delay time of only 14 ns. The HMC913 log  
video output slope is typically 14 mV/dB. Maximum  
recovery times are less than 30 ns. Ideal for high  
speed channelized receiver applications, the HMC913  
operates from a single +3.3 V supply, and consumes  
only 80 mA. All data shown herein is measured with  
the chip in a 50 Ohm environment and contacted with  
RF probes.  
Electrical Specifications, TA = +25 °C, Vcc1 = Vcc2 = 3.3V [1]  
Parameter  
Conditions  
Typ.  
Units  
GHz  
dB  
Input Frequency Range [1]  
Frequency Flatness  
Log Linearity  
0.6 - 20  
Pin = -25 dBm  
Pin = -50 to +3 dBm  
Pin = -25 dBm  
1.5  
1
dB  
Log Linearity over Temperature (-55 °C to +85 °C)  
Minimum Logging Range  
1.5  
dB  
to 3 dB error @ 18 GHz  
to 3 dB error @ 18 GHz  
-54 @ 18 GHz  
dBm  
dBm  
dB  
Maximum Logging Range  
+5 @ 18 GHz  
Input Return Loss  
5.5  
1
Log Video Minimum Output Voltage  
Log Video Maximum Output Voltage  
Log Video Output Rise Time  
V
1.8  
5
V
10% to 90%  
90% to 10%  
ns  
Log Video Output Fall Time  
10  
25  
14  
5
ns  
Log Video Recovery Time  
ns  
Log Video Output Slope  
mV/dB  
µV/dB°C  
ns  
Log Video Output Slope Variation over Temperature  
Log Video Propagation Delay  
@ 10 GHz  
14  
80  
Supply Current (Icc1 + Icc2)  
@ Pin = -30 dBm  
mA  
[1] Electrical specs and performance plots are given for single-ended operation  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 1  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
VIDEO OUT & Error  
Error Flatness vs.  
vs. Input Power, Fin = 500 MHz [1]  
Input Power Over Frequency [1][2]  
3
6
2
1.5  
1
5
2 GHz  
ERR +25C  
ERR +85C  
ERR -55C  
6 GHz  
2
4
10 GHz  
14 GHz  
3
18 GHz  
20 GHz  
1
2
1
0
0
-1  
-2  
-3  
-4  
-5  
-6  
-1  
-2  
-3  
Ideal  
Video Out +25C  
Video Out +85C  
Video Out -55C  
0.5  
5
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
20  
20  
20  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
20  
20  
20  
INPUT POWER (dBm)  
INPUT POWER (dBm)  
VIDEO OUT & Error  
VIDEO OUT & Error  
vs. Input Power, Fin = 1 GHz [1]  
vs. Input Power, Fin = 2 GHz [1]  
3
3
2
2
ERR +25C  
ERR +85C  
ERR -55C  
ERR +25C  
ERR +85C  
ERR -55C  
2
2
1
1
1.5  
1
1.5  
1
0
0
-1  
-2  
-3  
-1  
-2  
-3  
Ideal  
Ideal  
Video Out +25C  
Video Out +85C  
Video Out -55C  
Video Out +25C  
Video Out +85C  
Video Out -55C  
0.5  
-70  
0.5  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
INPUT POWER (dBm)  
INPUT POWER (dBm)  
VIDEO OUT & Error  
VIDEO OUT & Error  
vs. Input Power, Fin = 6 GHz [1]  
vs. Input Power, Fin = 10 GHz [1]  
3
3
2
2
ERR +25C  
ERR +85C  
ERR -55C  
ERR +25C  
ERR +85C  
ERR -55C  
2
2
1
1
1.5  
1
1.5  
0
0
-1  
-2  
-3  
-1  
-2  
-3  
1
Ideal  
Ideal  
Video Out +25C  
Video Out +85C  
Video Out -55C  
Video Out +25C  
Video Out +85C  
Video Out -55C  
0.5  
-70  
0.5  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
INPUT POWER (dBm)  
INPUT POWER (dBm)  
[1] Electrical specs and performance plots are given for single-ended operation  
[2] An average ideal line is used to calculate error curves.  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 2  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
VIDEO OUT vs. Error  
VIDEO OUT & Error  
vs. Input Power, Fin = 18 GHz [1]  
vs. Input Power, Fin = 14 GHz [1]  
3
2
1.5  
1
3
2
ERR +25C  
ERR +85C  
ERR -55C  
ERR +25C  
ERR +85C  
ERR -55C  
2
2
1
1
1.5  
0
0
-1  
-2  
-3  
-1  
-2  
-3  
1
Ideal  
Ideal  
Video Out +25C  
Video Out +25C  
Video Out +85C  
Video Out -55C  
Video Out +85C  
Video Out -55C  
0.5  
0.5  
-70  
5
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
20  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
20  
INPUT POWER (dBm)  
INPUT POWER (dBm)  
VIDEO OUT & Error  
vs. Input Power, Fin = 20 GHz [1]  
3
2
1.5  
1
ERR +25C  
ERR +85C  
ERR -55C  
2
1
0
-1  
-2  
-3  
Ideal  
Video Out +25C  
Video Out +85C  
Video Out -55C  
0.5  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
10  
20  
INPUT POWER (dBm)  
VIDEO OUT vs. Frequency  
VIDEO OUT vs. Frequency  
Over Input Power & Bias Voltage [1]  
Over Input Power & Temperature [1]  
1.8  
1.8  
3.15V  
3.30V  
3.45V  
+25C  
+85C  
-55C  
1.7  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1
-10 dBm  
1.6  
-10 dBm  
1.5  
-25 dBm  
1.4  
-25 dBm  
-40 dBm  
1.3  
1.2  
-40 dBm  
1.1  
1
0
2
4
6
8
10 12 14 16 18 20 22  
0
2
4
6
8
10 12 14 16 18 20 22  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
[1] Electrical specs and performance plots are given for single-ended operation  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 3  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
Rise Time for Various Frequencies  
Fall Time for Various Frequencies  
@ 0 dBm [1]  
@ 0 dBm [1]  
1.8  
1.8  
1.6  
1.4  
1.6  
1.4  
2 GHz  
1.2  
1.2  
10 GHz  
18 GHz  
2 GHz  
1
1
10 GHz  
18 GHz  
0.8  
0.8  
5
0
20  
40  
60  
TIME (ns)  
80  
100  
0
20  
40  
60  
TIME (ns)  
80  
100  
Input Return Loss vs. Frequency [1]  
0
-5  
-10  
-15  
-20  
0
5
10  
15  
20  
25  
30  
FREQUENCY (GHz)  
[1] Electrical specs and performance plots are given for single-ended operation  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 4  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
Die Packaging Information [1]  
Absolute Maximum Ratings  
Vcc  
+3.6V  
Standard  
Alternate  
ENBL  
+3.6V  
WP-3 (Waffle Pack)  
[2]  
RF Input Power  
Channel Temperature  
+15 dBm  
125 °C  
[1] Refer to the “Packaging Information” section for die  
packaging dimensions.  
Continuous Pdiss (T=85°C)  
Derate 12.63 mW/°C above 85°C  
[2] For alternate packaging information contact Hittite  
Microwave Corporation.  
0.51 W  
Thermal Resistance Rth  
(Junction to die bottom)  
79.2 °C/W  
NOTES:  
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]  
2. DIE THICKNESS IS 0.011 (0.279)  
3. TYPICAL BOND PAD IS 0.0024 SQUARE  
4. BOND PAD METALLIZATION: ALUMINUM  
5. NO BACKSIDE METAL  
Storage Temperature  
Operating Temperature  
ESD Sensitivity (HBM)  
-65 to +150 °C  
-55 to +85 °C  
Class 1A  
5
6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS  
7. OVERALL DIE SIZE IS .002  
ELECTROSTATIC SENSITIVE DEVICE  
OBSERVE HANDLING PRECAUTIONS  
Outline Drawing  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 5  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
Pad Descriptions  
Pad Number  
Function  
Description  
Interface Schematic  
Bias Supply. Connect Supply Voltage to these pins with  
appropriate filtering.  
1 - 5  
VCC1  
5
Bias Supply. Connect supply voltage to these pins with  
appropriate filtering.  
6
VCC2  
Enable pin connected to VCC1 or VCC2 for normal  
operation. Total supply current reduced to less than 3mA  
when EN is set to 0V.  
7
EN  
8, 11 - 18, 21, 22  
Die Bottom  
These pins and the die bottom must be connected to a high  
quality RF/DC ground.  
GND  
VIDEO OUT,  
VIDEO FB  
9, 10  
Video out and feedback.  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 6  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
Pad Descriptions (Continued)  
Pad Number  
Function  
Description  
Interface Schematic  
RF Input pins Connect RF to RFINP and AC  
couple RFINN to ground via 50 Ohm for single ended  
operation.  
19, 20  
RFINN, RFINP  
5
Application Circuit  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 7  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
Assembly Diagram  
5
List of Materials for Assembly Diagram  
ELECTROSTATIC SENSITIVE DEVICE  
OBSERVE HANDLING PRECAUTIONS  
Item  
Description  
C1, C2  
C3 - C6  
C7 - C8  
R1  
33 pF Capacitor, 0402 Pkg.  
100 pF SLC Capacitor, SA1212BX101M16VHXF  
10 nF SLC Capacitor, MVB3030X103ZGH5N  
50 Ohm Resistor, 0402 Pkg.  
HMC913 Die  
U1  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 8  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
Mounting & Bonding Techniques for MMICs  
The die should be attached directly to the ground plane with epoxy (see HMC gen-  
eral Handling, Mounting , Bonding Note).  
0.279mm (0.011”) Thick MMIC  
50 Ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina thin film  
substrates are recommended for bringing RF to and from the chip (Figure 1).  
Wire Bond  
0.076mm  
(0.003”)  
Microstrip substrates should be placed as close to the die as possible in order to  
minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152  
mm (3 to 6 mils).  
RF Ground Plane  
Handling Precautions  
Follow these precautions to avoid permanent damage.  
Storage: All bare die are placed in either Waffle or Gel based ESD protective con-  
tainers, and then sealed in an ESD protective bag for shipment. Once the sealed  
ESD protective bag has been opened, all die should be stored in a dry nitrogen  
environment.  
5
0.254mm (0.010”) Thick Alumina  
Thin Film Substrate  
Figure 1.  
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean  
the chip using liquid cleaning systems.  
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.  
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize  
inductive pick-up.  
General Handling: The chip may be handled by a vacuum collet or with a sharp pair of tweezers.  
Mounting  
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the  
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.  
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343  
Fax: 978-250-3373  
Order On-line at www.hittite.com  
5 - 9  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
HMC913  
v01.0810  
SUCCESSIVE DETECTION LOG VIDEO  
AMPLIFIER (SDLVA), 0.6 - 20 GHz  
Notes:  
5
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824  
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com  
Application Support: Phone: 978-250-3343 or apps@hittite.com  
5 - 10  

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