HM56XXBPR [HMSEMI]
High PSRR linear regulator;
| 型号： | HM56XXBPR |
| 厂家： | 
H&M Semiconductor |
| 描述： | High PSRR linear regulator |
| 文件： | 总10页 (文件大小：2621K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HM56XXB
Description
Features
Low Quiescent Current：2uA
High Input Voltage Rating：Up to 80V
Output Current：150mA
High PSRR：70dB at 1Khz
Dropout Voltage：
The HM56XXB series is a high input voltage (60V),
low quiescent current, High PSRR linear regulator
(LDO) able to provide 150mA load current.
The LDO features very fast response against line
voltage transient and load current transient, and
ensures no overshoot voltage during the LDO start
up and short circuit recovery.
70mV@10mA
700mV@100mA
The device features integrated short-circuit and
thermal shutdown protection.
Fixed Output Voltages：
3.0V, 3.3V, 3.6V and 5.0V
High-accuracy Output Voltage: ±2%
The device is available with fixed output voltages
of 3.0V, 3.3V, 3.6V and 5.0V, and available in
SOT23 and SOT89 packages.
Good Transient Response
Integrated Short-Circuit Protection
Integrated Thermal Protection
Available Packages：
Application
Battery-powered equipment
Smoke detector and sensor
Micro controller Applications
Home Appliance
HM56XXBMR
HM56XXBMR-A
HM56XXBMR-B
HM56XXBMR-C
HM56XXBPR
HM56XXBPR-A
HM56XXBPR-B
HM56XXBPR-C
HM56XXBM5
SOT23-3
SOT89-3
SOT23-5
Application Circuits
HM56XXB
- 1 -
HM56XXB
Packages And Pin Assignment
GND
VIN
VIN
GND
VOUT
NC
3
3
3
3
5
4
SOT23-3
SOT23-3
SOT23-3
SOT23-3
SOT23-5
2
1
2
1
2
1
2
1
2
1
3
GND
VOUT
VOUT
GND
VIN
VOUT
VOUT
VIN
NC
VIN GND
HM56XXBMR
HM56XXBMR-A
HM56XXBMR-B
HM56XXBMR-C
HM56XXBM5
SOT89-3
SOT89-3
SOT89-3
SOT89-3
1
3
1
3
2
2
1
3
2
1
3
2
VOUT VIN GND
VIN GND VOUT
VIN GND VOUT
VOUT VIN GND
HM56XXBPR
HM56XXBPR-A
HM56XXBPR-B
HM56XXBPR-C
Pin Descriptions
SOT23-3
PIN
NAME
DESCRIPTION
-
HM56XXBMR
HM56XXBM-A HM56XXBM-B
HM56XXBM-C
1
2
3
2
1
3
3
2
1
3
1
2
GND
VOUT
VIN
Ground Pin
Output Pin
Input Pin
SOT89-3
PIN
NAME
DESCRIPTION
HM56XXBPR
HM56XXBPR-A HM56XXBPR-B
HM56XXBPR-C
1
3
2
3
1
2
2
3
1
2
1
3
GND
VOUT
VIN
Ground Pin
Output Pin
Input Pin
SOT23-5
PIN
NAME
DESCRIPTION
HM56XXBM5
1
2
3
4
5
VIN
GND
NC
Input Pin
Ground Pin
No Connection
No Connection
Output Pin
NC
VOUT
- 2 -
HM56XXB
Functional Block Diagram
Absolute Maximum Ratings
Item
Description
Min
-0.3
-0.3
-35
Max
Unit
V
VIN to GND
80
Voltage
Current
VOUT to GND
6
V
VOUT to VIN
0.3
V
Peak output current
Operating Ambient Temperature
Storage Temperature
Internally limited
-40
-40
85
℃
℃
150
Temperature
Operating virtual junction
Temperature
-
150
℃
SOT89
SOT23
180
380
600
300
℃/W
℃/W
mW
mW
kV
Thermal Resistance
(Junction to Ambient)
SOT89
Power Dissipation
SOT23
4
Human Body Model（HBM）
Charged Device Model（MM）
Electrostatic
discharge rating
100
V
- 3 -
HM56XXB
Electrical Characteristics
（At TA=25°C, CIN=1uF, VIN=VOUTNOM+1.0V, COUT=10uF, unless otherwise noted）
Symbol
VIN
Parameter
Input Voltage
Test Conditions
MIN
5
TYP
—
2
MAX
60
UNIT
V
IGND
Quiescent Current
VIN=12V, No load
—
—
uA
VOUTNOM
* 0.98
V
OUTNOM
VOUT
Output Voltage
Output Current
VIN=12V, IOUT=10mA
V
OUTNOM
V
* 1.02
IOUT_MAX
—
—
150
70
—
—
mA
mV
IOUT=10mA ,
VIN=VOUTNOM-0.1V
IOUT=100mA ,
VIN=VOUTNOM-0.1V
VIN=12V,
VDROP
Dropout Voltage(1)
Load Regulation
—
—
700
—
—
mV
ΔVOUT(ΔIOUT)
0.02
%/mA
1mA≤IOUT≤100mA
IOUT=1mA,
VOUTNOM+0.5V≤VIN≤60V
ΔVOUT(ΔVIN)
ILIMIT
Line Regulation
Current Limit
—
—
—
0.01
250
150
—
—
—
%/V
mA
Shutdown, temperature
increasing
Reset, temperature
decreasing
Vin=12V , Iout=10mA
F=1Khz,Vout=3.3V
Thermal Shutdown
Temperature
TSHDN
℃
—
—
140
70
—
—
PSRR
dB
Note：(1) Dropout Voltage is the voltage difference between the input and the output at which the
output voltage drops 2% below its nominal value.
- 4 -
HM56XXB
Typical Performance Characteristics
Test Condition: TA=25°C,IOUT=1mA, COUT=10uF, unless otherwise noted
Input Voltage(V)
Frequency(Hz)
- 5 -
HM56XXB
Line Transient Response
Line Transient Response
3.3V
24V
VOUT
VIN
3.3V
24V
VOUT
0V
0V
5V
0V
5V
0V
VIN
VIN=5 to24V
VOUT=3.3V
VIN=24 to5V
VOUT=3.3V
Time(10us/div)
Time(4us/div)
Load Transient Response
Load Transient Response
90mA
IOUT
90mA
0mA
IOUT
0mA
0V
180mV
VOUT
VIN
VOUT
0V
-220mV
5V
5V
0V
VIN
VIN=5V
VOUT=0V
VIN=5V
VOUT=0V
0V
IOUT=90mA to 0mA
IOUT=0mA to90mA
Time(20us/div)
Start Up
Time(200us/div)
Start Up
3.3V
VOUT
100mA
IOUT
VOUT
3.3V
0mA
0V
24V
0V
24V
VIN
VIN
VIN=24V
VOUT=3.3V
IOUT=100mA
VIN=24V
VOUT=3.3V
0V
0V
Time(100us/div)
Time(100us/div)
Short Circuit Protection
Short Circuit Protection
3.3V
0V
3.3V
VOUT
VOUT
0V
80mA
IOUT 80mA
0mA
5V
0mA
IOUT
VIN
VIN
5V
VIN=5V
VOUT=short to3.3V
VIN=5V
VOUT=3.3V to short
0V
0V
Time(10ms/div)
Time(10ms/div)
- 6 -
HM56XXB
Functional Description
Input Capacitor
A 1μF ceramic capacitor is recommended to connect between VIN and GND pins to decouple input
power supply glitch and noise. The amount of the capacitance may be increased without limit. This
input capacitor must be located as close as possible to the device to assure input stability and less
noise. For PCB layout, a wide copper trace is required for both VIN and GND.
Output Capacitor
An output capacitor is required for the stability of the LDO. The recommended minimum output
capacitance is 1μF, ceramic capacitor is recommended, and temperature characteristics are X7R or
X5R. Higher capacitance values help to improve load/line transient response. The output capacitance
may be increased to keep low undershoot/overshoot. Place output capacitor as close as possible to
VOUT and GND pins.
Current Limit and Short Circuit Protection
When output current at VOUT pin is higher than current limit threshold or the VOUT pin is direct
short to GND, the current limit protection will be triggered and clamp the output current at a
pre-designed level to prevent over-current and thermal damage.
Thermal Protection
The HM56XXB has internal thermal sense and protection circuits. When excessive power dissipation
happens on the device, such as short circuit at the output pin or very heavy load current with a large
voltage drop across the device, the internal thermal protection circuit will be triggered, and it will
shut down the power MOSFET to prevent the LDO from damage. As soon as excessive thermal
condition is removed and the temperature of the device drops down, the thermal protection circuit
will lease the control of the power MOSFET, and the LDO device goes to normal operation.
- 7 -
HM56XXB
Ordering And Marking Information
Package Outline Dimensions
SOT23-3
- 8 -
HM56XXB
SOT89-3
SOT23-5
- 9 -
HM56XXB
Packing Information
P
D
Type
W(mm)
P(mm)
D(mm)
Qty (pcs)
SOT23-3
8.0±0.1 mm
4.0±0.1 mm
180±1 mm
3000pcs
SOT23-5
SOT89-3
8.0±0.1 mm
4.0±0.1 mm
4.0±0.1 mm
180±1 mm
180±1 mm
3000pcs
1000pcs
12.0±0.1 mm
- 10 -
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