HI-4850CRMF [HOLTIC]
LINE TRANSCEIVER;
| 型号： | HI-4850CRMF |
| 厂家： | 
HOLT INTEGRATED CIRCUITS |
| 描述： | LINE TRANSCEIVER |
| 文件： | 总14页 (文件大小：1275K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
March 2013
FEATURES
GENERAL DESCRIPTION
The HI-485x devices are slew-rated controlled TIA-485/TIA-422-B
and ISO 8482:1993 compliant transceivers with extended power-
supply, temperature and receiver common-mode range for avionic
and industrial control applications. The devices can operate over an
extended supply (3.0V to 5.5V) and temperature (-55˚C to 125˚C)
range. The receiver input common-mode range of [-15, 20]V, and
±24V for the half and full duplex configurations respectively is valid
over the full supply and temperature specification. The HI-4850 has
a half-duplex configuration, and the HI-4851 and HI-4852 are full-
duplex. Slew rates are optimized for data rates below 5 Mbps. The
drivers slew-rate control and pre-emphasis reduces high-frequency
components in the output signal transitions and also compensates
for impedance mismatch. These features provide optimum EMI and
jitter performance, essential in EMI sensitive environments and
high-integrity data link applications such as in aerospace and
industrial controls.
Slew Rate Control and Pre-Emphasis for superior EMI
Extended Power Supply Operating Range 3.0V to 5.5V
Extended Receiver Common-Mode Range:
-15.0V to 20.0V Half-Duplex
±24V Full-Duplex
ESD Protection
16KV HBM (Bus Pins)
8KV HBM (Logic Pins)
5 Mbps Date Rate up to 100 ft. CAT-5 UTP
2 Mbps Data Rate up to 1000 ft. CAT-5 UTP
Current Limiting Protection
Extended Temperature Range -55°C to 125°C
Industry Standard 75176 Pin-out
PIN CONFIGURATIONS (Top Views)
RO - 1
8 - VDD
The devices deliver at least ± 1.50V (VDD=3.0V), and ± 2.45V
(VDD= 4.5V) output levels at an extended temperature range of
-55°C to +125°C into a differential load of 54Ω and 50pF.
RE - 2
DE - 3
DI - 4
7 - B
HI-4850PSx
6 - A
5 - GND
The receiver offers true Fail-Safe operation, providing a
guaranteed logic high on RO when the bus is open-circuit, short-
circuit, or idle (terminated but not driven). The receiver’s worst
case minimum input resistance is at least 90KΩ, supporting up to
224 nodes
VDD - 1
8 - A
RO - 2
DI - 3
7 - B
6 - Z
5 - Y
HI-4851PSx
GND - 4
8-Pin Plastic SOIC package (Narrow Body)
APPLICATIONS
Extended Temperature Range RS-485/422 Networks
Process Control and Factory Automation
EMI Emission Sensitive Avionics
Industrial Field Bus Networks
Networks requiring extended common-mode range
RO
RE
1
2
12 A
11 B
10 Z
DE
DI
3
4
9
Y
Device Selection Table
HI-4852PCx
16- pin 4mm x 4mm Chip-scale package
Part
Number
Half/Full
Duplex
Data Rate
(Mbps)*
Package
- 1
RO 2
RE 3
14 VDD
13 -
8-pin SOIC
8-pin SOIC
HI-4850
HI-4851
≤ 5.0
≤ 5.0
≤ 5.0
Half
Full
12 A
DE 4
11 B
14-pin SOIC
16-pin QFN
HI-4852PSx
Full
HI-4852
DI 5
10 Z
GND 6
GND 7
9
8
Y
-
* For RS-485 Transceivers optimized for data rates up
to 20Mbps please refer to the HI-4853 data sheet.
14-Pin Plastic SOIC package (Narrow Body)
HOLT INTEGRATED CIRCUITS
www.holtic.com
(DS4850 Rev. C)
03/13
HI-4850
PIN DESCRIPTIONS
SIGNAL
FUNCTION
DESCRIPTION
Receiver Output. If VID ≥ -50mV, then RO is high. If VID < -150mV then RO is low. If the
RO
OUTPUT
bus is shorted, open or terminated but not driven by another terminal, RO will be high.
__
__
__
RE
Receiver Enable. RE= Low enables the receiver. RE High forces the receiver output
INPUT
INPUT
(RO) into a high impedance state. Internal 450KΩ pull-down resistor
Driver Enable. DE = high enables the driver. DE = low will force the driver output into
__
a high impedance state and the device will function as a line receiver if RE is also low.
DE
Internal 450KΩ pull-up resistor
Driver Input. Forces the logic state of the Driver’s output, if Driver is enabled. Internal
450KΩ pull-up resistor
DI
INPUT
GND
A, Y
B, Z
Chip ground, 0V Supply
POWER
ANALOG I/O
ANALOG I/O
Non-inverting Receiver Input / Driver Output.
Inverting Receiver Input / Driver Output.
POWER
VDD
Positive Supply: 3.0V ≤ VDD ≤ 5.5V
RX FUNCTION TABLE
TX FUNCTION TABLE
TRANSMITTING
RECEIVING
LINE
CONDITION
BUS PINS
VID = VA - VB
INPUTS
RE
OUTPUTS
OUTPUT
RO
INPUTS
__
OPERATION
DE DI
B
A
1
0
Hi-Z
Hi-Z
DE
0
RE
0
-150mV < VID < -50mV
X
1
0
1
1
Hi-Z
Hi-Z
Undefined Input
Receiver logic high
Receiver logic low
0
Transmit logic high
Transmit logic low
Disable
1
1
0
0
1
0
X
X
X
X
0
1
Hi-Z
-50mV ≤ VID
0
X
VID ≤ -150mV
0
0
0
1
1
X
0
0
1
0
Shutdown
Hi-Z
1
Open or Shorted
Idle and terminated
Default
Default
Disabled
Shutdown
X
X
Typical Operating Circuit
RX
VDD
RO
RE
DE
DI
RO
RE
DE
DI
VDD
RX
B
A
B
A
RT
RT
GND
A
GND
TX
HI-4850
TX
B
B
A
HI-4850
HI-4850
HI-4850
Short unterminated stubs
Figure 1 - Typical half-duplex configuration
A
B
Y
Z
B
A
GND
DI
VDD
RO
RT
RT
RT
RT
RX
TX
Z
Y
RO
DI
RX
TX
VDD
GND
HI-4851
HI-4851
Figure 2 - Typical full-duplex 8-pin configuration
HOLT INTEGRATED CIRCUITS
2
HI-4850
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND = 0V)
Operating Temperature Range:(Industrial).........................-40°C to +85°C
(Hi-Temp)........................-55°C to +125°C
Supply Voltage, VDD:...............................................................................7 V
Control Input Currents: ...................................................-100mA to 100mA
Control Input Voltages:..................................................-0.5V to VDD + 0.5V
__
Digital Input Voltages (DI, DE, RE):...............................-.0. .5V to VDD + 0.5V
Bus Voltage (AY, BZ):............................................................................±25V
Digital Output Voltage (RO):...............................................-0.5V to V + 0.5V
Internal Power Dissipation:..............................................................900mW
Storage Temperature Range: .........................................-65°C to +150°C
Short-Circuit Duration, Driver (V: ±15V).....................................................∞
ESD (Human Body Model):
Solder Temperature:
(Reflow)......................................... +260°C
AY, BZ,VDD,GND pins:.......................................................±16KV
__
DI, DE, RE, RO pins:.............................................................±8KV
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
SPECIFIED OPERATING CONDITIONS
LIMITS
UNIT
PARAMETERS
SYMBOL
CONDITIONS
MIN
TYP
MAX
VDD
V
˚C
V
Supply Voltage
Temperature
3.0 3.3 / 5.0 5.5
-55
125
12
T
VOCM
-7
-16
54
See Figure 4
Half-Duplex
TX Common-Mode Bus Loading
V
VICM
RL
RX Input Common-Mode Voltage
Differential Load Resistance
20
60
Ω
∞
pF
CL
100
Differential Load Capacitance
Digital Input High Voltage
__
%VDD
70
VIH
VIL
IIH
DE, DI, RE
__
30
1
%VDD
μA
Digital Input Low Voltage
Digital Input Current high
Digital Input Pull-Down Current
DE, DI, RE
DE, DI, VIH = VDD
__
6
μA
μA
μA
IPD
18
RE, VIH = VDD
__
RE, VIH = 0
DE, DI, VIH = 0V
Digital Input Current low
-1
IIL
-18
-6
Digital Input Pull-Up Current
IPU
DRIVER DC ELECTRICAL CHARACTERISTICS
VDD = 3.0V to 3.6V or 4.5V to 5.5V; T = -55˚C to 125˚C; MIN and MAX values are at range boundaries
VDD = 3.3V ± 10%
SYMBOL
VDD = 5.0V ± 10%
UNIT
CONDITIONS
FIGURE
PARAMETER
MIN
TYP
MIN
TYP
MAX
MAX
Differential Output Voltage with
no load
VDD -0.1
|VOD1
|VOD2
|VOD3
|
|
|
3
3
4
V
DD -0.1
VDD
VDD
V
V
V
RL = ∞
Differential Output Voltage into load
with no common-mode voltage
RL = 54Ω, CL = 50pF
1.5
1.5
3.0
3.0
2.45
2.45
4.0
-7V ≤ VOCM ≤ 12V
TA = 25ºC
Differential Output Voltage into load
with applied common-mode voltage
4.0
3.2
Differential Output Over/Under Shoot
5.5
125
2.0
%VOD
mV
V
Change in Differential Output
Voltage between logic states
∆VOD
VOCM
3
4
4
-125
2.15
-150
125
3.0
RL = 54Ω, CL = 50pF
RL = 54Ω, CL = 50pF
RL = 54Ω, CL = 50pF
-125
1.40
-125
Output Common-Mode Voltage
1.60
2.45
Change in output Common-Mode
Voltage between logic states
Bus Pin Leakage Current
(High-Z Power On)
125
∆VOCM
mV
150
DE=0, -15V≤ VOCM ≤ 15V
DE=0, -12V≤ VOCM ≤ 15V
-200
200
-200
μA
IOHZ1
200
Bus Pin Leakage Current (Power Off)
200
230
-200
-250
0
200
250
50
IOHZ2
ISCPK
ISC
V
OCM = ±15V
μA
mA
μA
pF
-200
-230
0
Peak Short Circuit Current
DE = VDD, Bus Pin = ±15
DE = VDD, Bus Pin = ±15
DE = 0
Steady State Short Circuit Current
Differential Output Capacitance
Static Supply Current
50
16
10
COD
16
8
10
12
mA
DE=VDD, RE=0, RL=∞
IDD
Supply Current (Shutdown)
90
110
100
DE=0, RE=VDD, RL=∞
400
μA
IDDQ
HOLT INTEGRATED CIRCUITS
3
HI-4850
DRIVER SWITCHING CHARACTERISTICS
VDD = 3.0V - 3.6V or 4.5V - 5.5V as noted , Operating temperature range.
VDD = 3.3V ± 10%
VDD = 5.0V ± 10%
PARAMETER
SYMBOL
CONDITIONS
FIGURE
UNIT
MIN
110
110
90
TYP
145
145
105
MAX
200
200
120
MIN
108
108
115
115
TYP
150
150
135
MAX
205
205
155
Propagation Delay Low - to - High
Propagation Delay High - to - Low
Differential Rise Time
tPDR
tPDF
tr
R
L = 54
L = 54
L = 54
L = 54
L = 54
. C
L
=50pF
=50pF
=50pF
5 & 6
5 & 6
5 & 6
ns
ns
ns
R
R
,
C
C
L
,
L
Differential Fall Time
Output Pulse Skew
tf
R
,
C
L
L
=50pF
=50pF
5 & 6
5 & 6
90
105
2
120
8
135
2
125
8
ns
ns
tMSK
R
,
C
Driver Enable to Output High
tZH
RL = 500
,
CL
=50pF
7
95
120
90
117
ns
Driver Enable to output Low
Driver Disable from Output High
Driver Disable from Output Low
Shutdown to Active Output Delay
Shutdown Delay
tZL
tHZ
tLZ
RL = 500
RL = 500
RL = 500
RL = 500
,
,
,
,
C
L
=50pF
=50pF
=50pF
=50pF
7
7
7
7
8
95
20
20
120
33
90
18
18
117
30
30
10
10
ns
ns
ns
µs
µs
CL
CL
33
tON
tOFF
CL
10
10
RECEIVER DC ELECTRICAL CHARACTERISTICS
VDD = 3.0V - 3.6V or 4.5V - 5.5V as noted , Operating temperature range.
VDD = 3.3V ± 10%
VDD = 5.0V ± 10%
PARAMETER
SYMBOL
CONDITIONS
FIGURE
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
Differential Input Threshold Voltage
VTH
≤
≤
-200
-100
-50
mV
mV
-15 ≤ VICM ≤ +20
-200
-100
-50
17
28
33
17
28
33
Input Hysteresis
Input Resistance
V
HYS
V
ICM = 0V
mV
R
IN
≤
≤
80
92
K
K
-15 ≤ VICM ≤ +20
80
92
VICM = +200mV
RO Output High Level
RO Output Low Level
V
OH
90%
90%
VDD
IOUT = -3.0mA
V
= -200mV
OL
10%
1
10%
1
VDD
ICM
V
IOUT = +3.0mA
RO Output Hi-Z Leakage Current
IOZH
0V
≤
VRO
V
DD
≤
-1
-1
µA
≤
RECEIVER SWITCHING CHARACTERISTICS
VDD = 3.0V - 3.6V or 4.5V - 5.5V as noted , Operating temperature range.
VDD = 3.3V ± 10%
VDD = 5.0V ± 10%
PARAMETER
SYMBOL
CONDITIONS
FIGURE
UNIT
MIN
TYP
26
MAX
32
MIN
TYP
26
MAX
32
Propagation Delay Low - to - High
Propagation Delay High - to - Low
RO Output Rise Time
tRPDR
tRPDF
tRr
V
ID = +1.5V, C
ID = -1.5V
ID = +1.5V, C
ID = -1.5V
ID = +1.5V, C
L
=15pF
9
8
20
20
20
20
ns
ns
ns
V
,
CL
=15pF
8
26
32
26
32
V
L
=15pF
8
1.1
1.1
1.9
3.3
1.1
1.1
1.9
3.3
RO Output Fall Time
Output Pulse Skew
tRf
V
,
CL
=15pF
8
1.9
0.8
3.3
1.6
1.9
0.8
3.3
1.6
ns
ns
tRMSK
V
L
=15pF
8
Receiver Enable to RO Output High
tRZH
RL
= 1K,
CL
=15pF
9
12
16
12
16
ns
Receiver Enable to output Low
Receiver Disable from Output High
Receiver Disable from Output Low
Shutdown to RO Active Output Delay
Shutdown Delay to RO HiZ
tRZL
tRHZ
tRLZ
R
L
= 1K
,
C
L
=15pF
12
6
16
10
10
5
12
6
16
10
10
5
ns
ns
ns
µs
ns
9
RL
= 1K
,
C
L
=15pF
=15pF
=15pF
=15pF
9
9
RL
= 1K
= 1K
= 1K
,
,
,
CL
6
6
tRON
tROFF
RL
CL
9
RL
CL
9
60
100
60
100
HOLT INTEGRATED CIRCUITS
4
HI-4850
TEST CIRCUITS
DE
DI
+
AY
BZ
|VOD|
54Ω
TX
50pF
-
Figure 3 - Driver DC Characteristics ( VOD1, VOD2, and ∆VOD
)
DE
DE
+
+
|VOD3
-
27Ω
27Ω
375Ω
375Ω
AY
AY
BZ
60Ω
DI
|
50pF
|VOD3|
DI
TX
TX
VOCM
BZ
VOCM
-
Figure 4 - Driver DC Characteristics with and without Common-Mode Loading ( VOCM, VOD3, and ∆VOD
)
DE
1Mpbs
AY
BZ
DI
54Ω
50pF
TX
Figure 5 - Driver Switching Characteristics (tPDR, tPDF, tr and tf)
VDD
0V
DI
1.5V
1.5V
1/2V
O
t
t
PDF
PDR
BZ
AY
VO
1/2V
O
t
t
MSK
MSK
VO
90%
90%
V
OD
=
0V
-V
V(AY) - V(BZ)
10%
10%
O
t
t
f
r
Figure 6. Driver Switching Waveforms
HOLT INTEGRATED CIRCUITS
5
HI-4850
1MHz
VDD / GND
DE
50pF
AY
BZ
DI
GND / V
TX
DD
50pF
GND / V
DD
VDD
DE
50%
50%
0V
t
t
LZ
ZL
VDD
AY, BZ
AY, BZ
V
DD/2
DD/2
OUTPUT NORMALLY LOW
OUTPUT NORMALLY HIGH
0.5V
V
OL
OH
V
0.5V
V
0V
t
t
HZ
ZH
Driver Enable / Disable Switching
Figure 7.
1Mbps
RE
AY
BZ
RO
RX
15pF
V
OD2
AY - BZ
0V
0V
INPUT
-VOD2
t
t
PHL
PLH
V
OH
OL
VDD/2
VDD/2
RO
OUTPUT
V
Figure8.Receiver Propagation Delays
1MHz
RE
AY
BZ
+200 mV / -200 mV
RO
VDD / GND
RX
15pF
3V
RE
RO
RO
1.5V
1.5V
0V
5V
t
t
LZ
ZL
2.5V
OUTPUT NORMALLY LOW
OUTPUT NORMALLY HIGH
0.5V
0.5V
V
OL
V
OH
2.5V
0V
t
t
HZ
ZH
Receiver Enable and Disable Times
Figure 9.
HOLT INTEGRATED CIRCUITS
6
HI-4850
PERFORMANCE CHARACTERISITICS OVER SUPPLY AND TEMPERATURE
HI-4850/52
RX PROPAGATION DELAY vs. TEMPERATURE
RX PROP DELAY vs. INPUT COMMON-MODE
48
46
46
44
42
40
38
36
34
32
30
28
45
44
43
42
41
40
4850-4852
DD = 3.0V
CL = 15pF
4850-4852
VDD: [3.0, 5.5]V
CL = 15p
VDD = 3.0V
V
fDATA = 1Mbps
fDATA = 1Mbps
TA =
27ºC
VDD = 5.5V
-55
-30
-5
20
45
70
95
120
-20
-15
-10
-5
0
5
10
15
20
TEMPERATURE (ºC)
Input Common-Mode Voltage (V)
TX DIFFERENTIAL ZERO TO PEAK
AMPLITUDE vs. TEMPERATURE
TX PROPAGATION DELAY vs. TEMPERATURE
206
3.57
3.37
3.17
2.97
2.77
2.57
2.37
2.17
1.97
1.77
1.57
VDD = 5.5V
VDD = 3.0V
4850-4852
DD = [3.0, 5.5]V
CL = 100pF, RL = 54Ω
bit = 1.0us
196
186
176
166
156
146
136
VDD = 5.5V
V
T
4850-4852
VDD = [3.0, 5.5]V
CL = 100pF, RL = 54Ω
T
bit = 1.0us
VDD = 3.0V
-55
-30
-5
20
45
70
95
120
-55
-30
-5
20
45
70
95
120
TEMPERATURE (ºC)
TEMPERATURE (ºC)
TX Rise/Fall Time vs. TEMPERATURE
138
133
128
123
118
113
108
103
VDD = 3.0V
VDD = 5.5V
4850-4852
DD = [3.0, 5.5]V
V
CL = 100pF, RL = 54Ω
Tbit = 1.0us
-55
-30
-5
20
45
70
95
120
TEMPERATURE (ºC)
HOLT INTEGRATED CIRCUITS
7
HI-4850
Full Duplex Receiver Typical Performance Characteristics
HI-4851/52
RX Extended Common-Mode Range:
RX Extended Common-Mode Range:
Minimum Supply, Maximum Common-Mode
Minimum Supply, Minimum Common-Mode
VDD = 3.0V
Tbit = 1.0us
TA = 27ºC
B
A
Input Common-Mode = +23V
VDD = 3.0V
RO
Tbit = 1.0us
TA = 27ºC
Input Common-Mode = -23V
RO
B
A
RX Extended Common-Mode Range:
Maximum Supply, Minimum Common-Mode
RX Extended Common-Mode Range:
Maximum Supply, Maximum Input-CM
VDD = 5.5V
Tbit = 0.5us
VDD = 5.5V
Tbit = 0.5us
TA = 27ºC
TA = 27ºC
RO
B
2V/DIV
A
B
A
Input Common-Mode = +24V
5V/DIV
RO
Input Common-Mode = -24V
2Mbps Data Pulse Over 1000ft CAT-5 UTP
1Mbps Data Pulse Over 1000ft CAT-5 UTP
Cable
Delay
Cable
Delay
DI
DI
B
B
2Mbps Over 1000ft. CAT-5A UTP
1Mbps Over 1000ft. CAT-5A UTP
A
A
VDD = 3.0V
VDD = 3.0V
Tbit = 0.5us
TA = 27ºC
Tbit = 1.0us
TA = 27ºC
RO
RO
HOLT INTEGRATED CIRCUITS
8
HI-4850
TYPICAL TRANCEIVER PERFORMANCE CHARACTERISITICS
RX OUTPUT JITTER VS.
RX OUTPUT JITTER VS.
INPUT COMMON-MODE AND SWING
Jitter: 0.05UI = 50nsPK-PK
5% Duty Error in RO
INPUT COMMON-MODE AND SWING
0.26
0.21
0.16
0.11
0.06
0.01
0.1
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
VDD = 3.0V
CL = 15pF
VDD = 4.5V
CL = 15pF
Tbit = 1.0us
TA = 27ºC
Tbit = 1.0us
TA = 27ºC
VCM = +24V
VCM = +22V
V
CM = 0.0V
VCM = -22V
VCM = -24V
0.1
0.6
1.1
1.6
2.1
2.6
0.1
0.6
1.1
1.6
2.1
2.6
INPUT SIGNAL AMPLITUDE (V)
INPUT SIGNAL AMPLITUDE (V)
HI-4851/52
HI-4851/52
SUPPLY CURRENT vs. TEMPERATURE
75
70
65
60
55
50
45
40
35
Tbit = 1.0us, 50% Duty Cycle
VDD = 5.0V
CL = 50pF
RL = 54Ω
TA = 27ºC
VDD = 3.3V
-55
-35
-15
5
25
45
65
85
105
125
TEMHPEI-R4A8T5U0R/E52(ºC)
Typical TX/RX Propagation
Delay @ 3.3V, 27 ºC
Typical TX Rise/Fall Time
Max Load @ 3.3V, 27 ºC
DI
DI
fDATA = 2Mbps
fDATA = 115Kbps
A
A
B
B
RO
Pre-Emphasis & SR CTRL
HI-4850/52
HI-4850/52
HOLT INTEGRATED CIRCUITS
9
HI-4850
TYPICAL PERFORMANCE CHARACTERISITICS
HI-4850/52
TX Slew-Rate Controlled Output Characteristics:
TX Slew-Rate Controlled Output Characteristics:
VDD = 3.3V, fDATA = 1Mbps, CL < 1pF, RL = ∞
VDD = 3.3V, fDATA = 1Mbps, CL = 50pF, RL = 54Ω
DI
DI
A
B
A
Driver is open CKT
B
TA = 27ºC
A - B
TA = 27ºC
A - B
TX Low Speed Output Characteristics:
TX High Speed Output Characteristics:
VDD = 3.3V, fDATA = 115Kbps, CL = 50pF, RL = 54Ω
VDD = 3.3V, fDATA = 2Mbps, CL = 50pF, RL = 54Ω
DI
TA = 27ºC
TA = 27ºC
DI
A
B
B
A
A - B
A - B
TX / RX Propagation Delay:
TX / RX Propagation Delay:
VDD = 3.3V, fDATA = 1Mbps, CL = 50pF, RL = 54Ω
VDD = 3.3V, fDATA = 2Mbps, CL = 50pF, RL = 54Ω
DI
TA = 27ºC
DI
B
A
ns
ns
500DIV
500DIV
B
A
RO
TA = 27ºC
RO
HOLT INTEGRATED CIRCUITS
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HI-4850
ORDERING INFORMATION
HI - 485x xx x x
PART
NUMBER
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
Blank
F
100% Matte Tin (Pb-free, RoHS compliant)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
-55°C TO +125°C
I
NO
NO
T
M
T
-55°C TO +125°C
M
YES
PART
NUMBER
PACKAGE
DESCRIPTION
PC
PS
16 PIN PLASTIC 4 x 4 mm CHIP SCALE (16PCS) (HI-4852 only. No M-flow)
8 PIN PLASTIC NARROW BODY SOIC (8HN) (HI-4850, HI-4851)
14 PIN PLASTIC NARROW BODY SOIC (14HN) (HI-4852 only)
8 PIN CERDIP (8D) not available Pb-free (HI-4850, HI-4851)
PS
CR
PART
NUMBER
FUNCTION
HALF DUPLEX TRANSCEIVER
4850
4851
FULL DUPLEX TRANCEIVER ALWAYS ENABLED
FULL DUPLEX TRANSCEIVER WITH ENABLE PINS
4852
HOLT INTEGRATED CIRCUITS
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HI-4850
REVISION HISTORY
Revision
Date
Description of Change
DS4850, Rev New
Rev. A
10/12/2011 Initial Release
3/15/2012 Added characterization data. Fixed errors in VIL and VIH values.
Updated Rx Function Table rows 2 and 3 on p. 2 for DE = X. Updated
Rev. B
Rev. C
8/2/2012
package drawings for SOIC-8 (8HN), QFN-16 (16PCS) and SOIC-14
(14HN) packages.
Correct typo on nRE pull-up resistor (should be pull-down).
Update Digital Input pull-up/pull-down current.
Update typo in Figure 4 resistors.
03/13/2013
Update solder temperature (reflow) in Max. Ratings
HOLT INTEGRATED CIRCUITS
12
HI-4850 PACKAGE DIMENSIONS
inches (millimeters)
8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
Package Type: 8HN
.193
BSC
(4.90)
.007 ± .003
(.175 ± .075)
.236
(6.00)
.154
(3.90)
BSC
BSC
PIN 1
See Detail A
.016 ± .004
(.410 ± .100)
.056 ± .006
(1.413 ± .163)
0 to 8
.007 ± .003
(.175 ± .075)
.050
(1.27)
.033 ± .017
(.835 ± .435)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
BSC
Detail A
has no tolerance. (JEDEC Standard 95)
inches (millimeters)
16-PIN PLASTIC CHIP-SCALE PACKAGE
Package Type: 16PCS
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.102 ± .002
(2.600 ± .050)
.157
(4.000)
BSC
.026
(.650)
BSC
.157
(4.000)
.102 ± .002
(2.600 ± .050)
Bottom
View
BSC
Top View
.012 ± .002
(.300 ± .050)
.016 ± .002
(.400 ± .050)
.039
(1.000)
.008
(.200)
max.
typ.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
13
HI-4850 PACKAGE DIMENSIONS
inches (millimeters)
14-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
Package Type: 14HN
.007 ± .003
(.175 ± .075)
.341
(8.65)
BSC
.236
(5.99)
.154
(3.90)
BSC
Top View
BSC
See Detail A
.016 ± .004
(.410 ± .100)
.069
(1.750) max.
.050
(1.27)
BSC
0 to 8
.007 ± .003
(.175 ± .075)
.033 ± .017
(.835 ± .435)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
Detail A
has no tolerance. (JEDEC Standard 95)
inches (millimeters)
8-PIN CERDIP
Package Type: 8D
.380 .004
(9.652 .102)
.005 min
(.127 min)
.248 .003
(6.299 .076)
.039 .006
(.991 .154)
.100
(2.54)
BSC
.314 .003
(7.976 .076)
.015 min
.200 max
(5.080 max)
(.381min)
Base Plane
.010 .006
(.254 .152)
Seating Plane
.163 .037
(4.140 .940)
.018 .006
(.457 .152)
.350 .030
.056 .006
(8.890 .762)
(1.422 .152)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. ( JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
14
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