HFBR-5301 [HP]
Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package Style; 光纤通道133兆位和光纤通道133兆位和成本1X9封装形式
| 型号： | HFBR-5301 |
| 厂家： | 
HEWLETT-PACKARD |
| 描述： | Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package Style |
| 文件： | 总12页 (文件大小：204K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Fibre Channel 133 MBd and
266 MBd Transceivers in Low
Cost 1x9 Package Style
Technical Data
HFBR-5301 133 MBd
HFBR-5302 266 MBd
Features
The products are produced in the
new industry standard 1x9 SIP
package style with a duplex SC
connector interface as defined in
the Fiber Channel ANSI FC-PH
standard document.
• Full Compliance with ANSI
X3T11 Fibre Channel
Physical and Signaling
Interface
• Multisourced 1x9 Package
Style with Duplex SC
Connector
• Wave Solder and Aqueous
Wash Process Compatibility
• Compatible with Various
Manufacturers FC-0 and
FC-1 Circuits
The HFBR-5301 is a 1300 nm
transceiver specified for use in
133 MBd, 12.5 MB/s, 12-M6-LE-I
Fibre Channel interfaces to either
62.5/125 µm or 50/125 µm
multimode fiber-optic cables.
These are packaged in the optical
subassembly portion of the
receiver.
The HFBR-5302 is a 1300 nm
transceiver specified for use in
266 MBd, 25 MB/s, 25-M6-LE-I
Fibre Channel interfaces to either
62.5/125 µm or 50/125 µm
Applications
• Fibre Channel 12.5 MB/s
12-M6-LE-I Interfaces for
1300 nm LED Links to
1500 m
• Fibre Channel 25 MB/s
25-M6-LE-I Interfaces for
1300 nm LED Links to
1500 m
These PIN/preamplifier combina-
tions are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and the Signal Detect
function. The Data output is
differential. The Signal Detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL refer-
enced (shifted) to a +5 volt
power supply.
multimode fiber-optic cables.
Transmitter Sections
The transmitter sections of the
HFBR-5301 and HFBR-5302
utilize 1300 nm InGaAsP LEDs.
These LEDs are packaged in the
optical subassembly portion of
the transmitter section. They are
driven by a custom silicon IC
which converts PECL logic
signals, into an analog LED drive
current.
Description
The HFBR-5301 and HFBR-5302
Fibre Channel Transceivers from
Hewlett-Packard provide the
system designer with products to
implement Fibre Channel designs
for use in multimode fiber (MMF)
applications. These include the
12.5 MB/sec 12-M6-LE-I interface
and the 25 MB/sec 25-M6-LE-I
interface for 1300 nm LED links.
Package
The overall package concept for
the HP Fibre Channel trans-
ceivers consists of three basic
elements; the two optical
subassemblies, an electrical
subassembly and the housing
with integral duplex SC connec-
tor interface. This is illustrated in
the block diagram in Figure 1.
Receiver Sections
The receiver sections of the
HFBR-5301 and HFBR-5302
utilize InGaAs PIN photo diodes
coupled to a custom silicon
transimpedance preamplifier IC.
5963-5608E (3/95)
215
The electrical subassembly con-
sists of a high volume multilayer
printed circuit board to which the
IC chips and various surface-
mount passive circuit elements
are attached.
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DUPLEX SC
RECEPTACLE
DATA OUT
PIN
SIGNAL
DETECT
OUT
PREAMP IC
OPTICAL
SUBASSEMBLIES
The package includes internal
shields for the electrical and
optical subassemblies to insure
high immunity to external EMI
fields and low EMI emissions.
LED
DATA IN
DRIVER IC
TOP VIEW
Figure 1. Block Diagram.
The outer housing, including the
duplex SC connector, is molded
of filled non-conductive plastic to
provide mechanical strength and
electrical isolation. The solder
posts are isolated from the circuit
design of the transceiver, while
they can be connected to a
The package outline drawing and
pin out are shown in Figures 2
and 3. The details of this package
outline and pin out are compliant
with the multisource definition of
the 1x9 single in-line package
(SIP). The low profile of the
Hewlett-Packard transceiver
design complies with the
maximum height allowed for the
duplex SC connector over the
entire length of the package.
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
ground plane on the circuit
board, doing so will have no
impact on circuit performance.
The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the trans-
ceiver by mating with the duplex
SC connectored fiber cables.
39.12
(1.540)
12.70
(0.500)
MAX.
AREA
RESERVED
FOR
PROCESS
25.40
(1.000)
12.70
(0.500)
MAX.
PLUG
HFBR-5XXX
DATE CODE (YYWW)
H
SINGAPORE
+ 0.08
- 0.05
0.75
3.30 ± 0.38
(0.130 ± 0.015)
+ 0.003
- 0.002
10.35
(0.407)
(0.030
)
MAX.
Application Information
The Applications Engineering
group in the Hewlett-Packard
Optical Communication Division
is available to assist with the
technical understanding and
design trade-offs associated with
these transceivers. You can
contact them through your local
Hewlett-Packard sales
2.92
(0.115)
18.52
(0.729)
4.14
+ 0.25
- 0.05
+ 0.010
- 0.002
1.27
0.46
(0.018)
)
ø
(9x)
(0.050
(0.163)
NOTE 1
NOTE 1
23.55
(0.927)
20.32
(0.800)
16.70
(0.657)
17.32 20.32 23.32
(0.682) (0.800) (0.918)
[8x(2.54/.100)]
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
representative.
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
The following information is
provided to answer some of the
most common questions about
the use of these parts.
Figure 2. Package Outline Drawing.
216
8
7
Generic Cabling for Customer
Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecom-
munications Cabling Standard
per SP-2840.
1 = V
EE
HFBR-5301, 62.5/125µm
N/C
2 = RD
3 = RD
4 = SD
5 = V
6
5
HFBR-5302, 62.5/125µm
4
3
2
1
0
CC
HFBR-5301,
50/125µm
6 = V
CC
7 = TD
8 = TD
Transceiver Signaling
Operating Rate Range and
BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to
HFBR-5302, 50/125µm
N/C
9 = V
EE
TOP VIEW
0
0.5
1
1.5
2
FIBER OPTIC CABLE LENGTH – km
Figure 3. Pinout Diagram.
Figure 4. Optical Power Budget vs.
Fiber Optic Cable Length.
Compatibility with Fibre
Channel FC-0/1 Chip Sets
represents the remaining OPB at
any link length, which is available
for overcoming non-fiber cable
losses.
encode the data (symbols/bit).
The HFBR-5301 and HFBR-5302
transceivers are compatible with
various manufacturers FC-0 and
FC-1 integrated circuits. Evalua-
tion boards, which include the
Hewlett-Packard transceivers, are
available from these manufactur-
ers. The Applications Engineering
group in the Hewlett- Packard
Optical Communication Division
is available to assist you with
implementation details.
The specifications in this data
sheet have all been measured
using the standard Fibre Channel
symbol rates of 133 Mbd or
266 MBd.
Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging charac-
teristics than normally associated
with these technologies in the
industry. The industry convention
is 1.5 dB aging for 1300 nm
LEDs. The HP LEDs will experi-
ence less than 1 dB of aging over
normal commercial equipment
mission life periods. Contact your
Hewlett-Packard sales represen-
tative for additional details.
The transceivers may be used for
other applications at signaling
rates different than specified in
this data sheet. Depending on the
actual signaling rate, there may
be some differences in optical
Transceiver Optical Power
Budget vs. Link Length
-2
1 x 10
Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to in-line connectors, splices,
optical switches, and to provide
margin for link aging and
-3
1 x 10
Figure 4 was generated with a
Hewlett-Packard fiber optic link
model containing the current
industry conventions for fiber
cable specifications and the Fibre
Channel optical parameters.
These parameters are reflected in
the specified performance of the
transceiver in this data sheet.
This same model has been used
extensively in the ANSI and IEEE
committees, including the ANSI
X3T9.5 committee, to establish
the optical performance require-
ments for various fiber-optic
interface standards. The cable
parameters used come from the
ISO/IEC JTC1/SC 25/WG3
-4
1 x 10
-5
1 x 10
-6
1 x 10
-7
1 x 10
-8
1 x 10
-9
1 x 10
unplanned losses due to cable
plant reconfiguration or repair.
-10
1 x 10
1 x 10
1 x 10
-11
-12
-6
-4
-2
0
2
Figure 4 illustrates the predicted
OPB associated with the two
transceivers specified in this data
sheet at the Beginning of Life
(BOL). These curves represent
the attenuation and chromatic
plus modal dispersion losses
associated with the 62.5/125 µm
and 50/125 µm fiber cables only.
The area under the curves
RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:
1. 133 & 266 MBd
7
2. PRBS 2 -1
3. CENTER OF SYMBOL SAMPLING
4. T = 25 °C
A
CC
5. V
= 5 V
DC
6. INPUT OPTICAL RISE/FALL TIMES =
1.0/1.9 ns
Figure 5. HFBR-5301/5302 Bit Error
Rate vs. Relative Receiver Input
Optical Power.
217
power budget to do this. This is
primarily caused by a change of
receiver sensitivity.
may be induced by electrostatic
discharge (ESD). These trans-
ceivers are certified as MIL-STD-
883C Method 3015.4 Class 2
devices.
These transceivers are compat-
ible with industry standard wave
and hand solder processes.
These transceivers can also be
used for applications which
require different Bit Error Rate
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the
receivers input optical power
level.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Care should be used to avoid
shorting the receiver data or
signal detect outputs directly to
ground.
Solder and Wash Process
Compatibility
Board Layout – Decoupling
Circuit and Ground Planes
Transceiver Jitter
Performance
The transceivers are delivered
with a protective process plug
inserted into the duplex SC
connector receptacle. This
process plug protects the optical
subassemblies during wave solder
and aqueous wash processing and
acts as a dust cover during
shipping.
You should take care in the layout
of your circuit board to achieve
optimum performance from these
transceivers. Figure 6 provides a
good example of a schematic for
a power supply decoupling circuit
that works well with these parts.
Hewlett-Packard further recom-
mends that a contiguous ground
The Hewlett-Packard 1300 nm
transceivers are designed to
operate per the system jitter
allocations stated in FC-PH
Annex A.4.3 and A.4.4.
The HP 1300 nm transmitters will
tolerate the worst case input
electrical jitter allowed, without
violating the worst case output
optical jitter requirements.
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
The HP 1300 nm receivers will
tolerate the worst case input
optical jitter allowed without
violating the worst case output
electrical jitter allowed.
HFBR-530X
TOP VIEW
Rx
Rx
Tx
Tx
V
RD
2
RD
3
SD
4
V
V
TD
7
TD
8
V
EE
1
CC
CC
6
EE
9
5
The jitter specifications stated in
the following tables are derived
from the values in FC-PH Annex
A.4.3 and A.4.4. They represent
the worst case jitter contribution
that the transceivers are allowed
to make to the overall system
jitter without violating the
C1
C2
V
CC
R2
R3
C5
L1
C3
L2
C4
TERMINATION
AT PHY
DEVICE
R1
R4
V
CC
INPUTS
R5
R7
V
CC
AT V
TRANSCEIVER
FILTER
PINS
CC
TERMINATION
AT TRANSCEIVER
INPUTS
allowed allocation. In practice,
the typical contribution of the HP
transceivers is below these
C6
R9
R10
R6
R8
maximum allowed amounts.
RD
RD
SD
V
TD
TD
CC
NOTES:
Recommended Handling
Precautions
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 ohms.
R2 = R3 = R5 = R7 = R9 = 82 ohms.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
Hewlett-Packard recommends
that normal static precautions be
taken in handling and assembly
of these transceivers to prevent
damage and/or degradation which
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Figure 6. Recommended Decoupling and Termination Circuits.
218
Regulatory Compliance
The first case is during handling
of the transceiver prior to mount-
ing it on the circuit board. You
should use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas.
plane be provided in the circuit
board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommen-
dation is in keeping with good
high frequency board layout
practices.
These transceiver products are
intended to enable system
designers to develop equipment
that complies with the various
international regulations govern-
ing certification of Information
Technology Equipment. See the
Regulatory Compliance Table for
details.
Board Layout - Hole Pattern
The second case to consider is
static discharges to the exterior
of the equipment chassis contain-
ing the transceiver parts. To the
extent that the transceiver duplex
SC connector is exposed to the
outside of the equipment chassis,
it may be subject to whatever
ESD system level test criteria that
the equipment is intended to
meet.
The Hewlett-Packard transceiver
complies with the circuit board
“Common Transceiver Footprint”
hole pattern defined in the
original multisource announce-
ment for the 1x9 pin package
style. This drawing is reproduced
in Figure 7 with the addition of
ANSI Y14.5M compliant dimen-
sioning to be used as a guide in
the mechanical layout of your
circuit board.
Electromagnetic Interference
(EMI)
Most equipment designs utilizing
these high-speed transceivers
from Hewlett-Packard will need
to meet the requirements of the
FCC in the United States,
CENELEC EN55022 (CISPR 22)
in Europe and VCCI in Japan.
The HFBR-5301 and HFBR-5302
are suitable for use in designs
ranging from a single transceiver
in a desktop computer to large
quantities of transceivers in a
hub, switch or concentrator.
Immunity
Equipment utilizing these trans-
ceivers will be subject to radio-
frequency electromagnetic fields
in some environments. These
transceivers have a high immunity
to such fields (see AN1075,
“Testing and Measuring Electro-
magnetic Compatibility Perfor-
mance of the HFBR-510X/520X
Fiber-Optic Transceivers,” 5963-
3358E).
Board Layout – Art Work
The Applications Engineering
group has developed Gerber file
art work for a multilayer printed
circuit board layout incorporating
the recommendations above.
Contact your local Hewlett-
Packard sales representative for
details.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
1.9 ± 0.1
.075 ± .004
ø
(2X)
–A–
Transceiver Reliability and
Performance Qualification
Data
20.32
.800
Ø0.000
M
A
The 1x9 transceivers have passed
Hewlett-Packard reliability and
performance qualification testing
and are undergoing ongoing
quality monitoring. Details are
available from your Hewlett-
Packard sales representative.
0.8 ± 0.1
.032 ± .004
ø
(9X)
20.32
.800
Ø0.000
M
A
These transceivers are manu-
factured at the Hewlett-Packard
Singapore location which is an
ISO 9002 certified facility.
2.54
(8X)
.100
TOP VIEW
Figure 7. Recommended Board Layout Hole Pattern.
219
Regulatory Compliance Table
Feature
Test Method
Performance
Electrostatic Discharge
(ESD) to the Electrical
Pins
Mil-STD-883C
Method 3015.4
Class 2 (2000 to 3999 Volts) Withstand up to
2200 V applied between electrical pins.
Electrostatic Discharge
(ESD) to the Duplex
SC Receptacle
Variation of
IEC 801-2
Typically withstand at least 25 kV without damage
when the Duplex SC Connector Receptacle is
contacted by a Human Body Model Probe.
Electromagnetic
Interference (EMI)
FCC Class B
CENELEC EN55022
Transceivers typically provide a 13 dB margin at
133 MBd, and a 7 dB margin at 266 MBd to the
Class B (CISPR 22B) noted standard limits when tested at a certified test
VCCI Class 2
range with the transceiver mounted to a circuit
card without a chassis enclosure.
Immunity
Variation of
IEC 801-3
Typically show no measurable effect from a 10 V/m
field swept from 10 to 450 MHz applied to the
transceiver when mounted to a circuit card without
a chassis enclosure.
220
4
3
200
180
160
140
120
t = 1.8 ns
r
t = 1.9 ns
r
t = 2.0 ns
r
2
1
t = 2.1 ns
r
t = 2.2 ns
r
TRANSMITTER
100
OUTPUT OPTICAL
RISE TIMES – ns
0
80
60
-1
1280 1300 1320 1340 1360 1380
-3
-2
-1
1
2
3
0
λc – TRANSMITTER OUTPUT OPTICAL
EYE SAMPLING TIME POSITION – ns
CENTER WAVELENGTH – nm
CONDITIONS:
1. T = 25 °C
A
CC
2. V
= 5 V
DC
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/1.9 ns
4. INPUT OPTICAL POWER IS NORMALIZED
TO CENTER OF DATA SYMBOL
HFBR-5302 Typical Transmitter
test results of λc, ∆λ and tr are
correlated and comply with the
allowed spectral width as a
function of center wavelength for
various rise and fall times.
5. NOTES 11a AND 12a APPLY
Figure 9. HFBR-5301, Relative Input
Optical Power vs. Eye Sampling Time
Position.
Figure 8. Typical Transmitter Output
Optical Spectral Width (FWHM) vs.
Transmitter Output Optical Center
Wavelength and Rise/Fall Times.
220
5
4
3
2
1
Ordering Information
Accessory Duplex SC
Connectored Cable
Assemblies
The HFBR-5301 and HFBR-5302
1300 nm products are available
for production orders through the
Hewlett-Packard Component
Sales Offices and Authorized
Distributors world wide.
Hewlett-Packard also offers two
compatible Duplex SC connec-
tored jumper cable assemblies to
assist you in the evaluation of
these transceiver products. These
cables may be purchased from
HP with the following part
numbers. They are available
through the Hewlett-Packard
Component Field Sales Offices
and Authorized Distributors world
wide.
Applications Support
Materials
Contact your local Hewlett-
Packard Component Field Sales
Office for information on how to
obtain PCB layouts and Test
fixtures for the 1x9 transceivers.
0
-1.5
-1
-0.5
0
0.5
1
1.5
EYE SAMPLING TIME POSITION – ns
CONDITIONS:
1. T = 25 °C
A
CC
2. V
= 5 V
DC
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/1.9 ns
4. INPUT OPTICAL POWER IS NORMALIZED
TO CENTER OF DATA SYMBOL
5. NOTES 11 AND 12 APPLY
1. HFBR-BKD001
A duplex cable 1 meter long
assembled with 62.5/125 µm
fiber and Duplex SC connector
plugs on both ends.
Figure 10. HFBR-5302, Relative Input
Optical Power vs. Eye Sampling Time
Position.
2. HFBR-BKD010
A duplex cable 10 meters long
assembled with 62.5/125 µm
fiber and Duplex SC connector
plugs on both ends.
221
HFBR-5301, -5302
Absolute Maximum Ratings
Parameter
Storage Temperature
Lead Soldering Temperature
Lead Soldering Time
Supply Voltage
Data Input Voltage
Differential Input Voltage
Output Current
Symbol
TS
TSOLD
tSOLD
VCC
Min.
-40
Typ. Max.
Unit
°C
°C
sec.
V
V
Reference
100
260
10
7.0
VCC
1.4
50
-0.5
-0.5
VI
VD
IO
V
mA
Note 1
HFBR-5301, -5302
Recommended Operating Conditions
Parameter
Operating Temperature - Ambient
Supply Voltage
Data Input Voltage - Low
Data Input Voltage - High
Data and Signal Detect Output Load
Symbol
Min.
0
4.75
-1.810
-1.165
Typ. Max.
70
Unit
°C
V
V
V
Reference
TA
VCC
5.25
VIL - VCC
V - V
-1.475
-0.880
50
IH
CC
RL
Ω
Note 3
HFBR-5301, -5302
Transmitter Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Supply Current
Power Dissipation
Data Input Current - Low
Data Input Current - High
Symbol
ICC
PDISS
IIL
Min.
Typ. Max.
Unit
mA
W
µA
µA
Reference
Note 4
Note 4
165
0.86
0
205
1.1
-350
IIH
14
350
HFBR-5301, -5302
Receiver Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Supply Current
Power Dissipation
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
Symbol
ICC
PDISS
VOL - VCC
VOH - VCC
tr
Min.
Typ. Max.
Unit
mA
W
V
Reference
Note 15
Note 16
Note 17
Note 17
Note 18
Note 18
Note 17
Note 17
Note 18
Note 18
Note 19
Note 20
100
0.3
165
0.5
-1.840
-1.045
0.35
0.35
-1.840
-1.045
0.35
0.35
0
-1.620
-0.880
2.2
V
ns
ns
V
Data Output Fall Time
tf
2.2
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Output Rise Time
Signal Detect Output Fall Time
Signal Detect Assert Time (off to on)
VOL - VCC
VOH - VCC
tr
-1.620
-0.880
2.2
V
ns
ns
µs
µs
tf
2.2
AS_Max
55
100
Signal Detect Deassert Time (on to off) ANS_Max
0
110
350
222
HFBR-5301
Transmitter Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Symbol
Min.
Typ. Max.
Unit
Reference
Output Optical Power
62.5/125 µm, NA = 0.275 Fiber
PO, BOL
PO, EOL
-21
-22
-14
-14
dBm avg. Note 5
dBm avg.
Output Optical Power
PO, BOL
-24.5
-14
dBm avg. Note 5
50/125 µm, NA = 0.20 Fiber
Optical Extinction Ratio
0.001 0.03
%
Note 6
-50
-35
dB
Center Wavelength
Spectral Width - FWHM
Optical Rise Time
Optical Fall Time
Deterministic Jitter Contribution
of Transmitter
λC
∆λ
tr
tf
DJC
1270
1308 1380
nm
nm
ns
137
250
4
Note 8a
Note 8a
Note 9
4
ns
0.16T
1.20
0.09T
0.68
ns p-p
ns p-p
Random Jitter Contribution of
Transmitter
RJC
Note 10
HFBR-5301
Receiver Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Symbol
Min.
Typ. Max.
Unit
Reference
Input Optical Power
Minimum at Window Edge
PIN Min. (W)
-28
dBm avg. Note 11a
Figure 9
Input Optical Power
Minimum at Eye Center
PIN Min. (C)
-29
dBm avg. Note 12a
Figure 9
Input Optical Power Maximum
Operating Wavelength
Signal Detect – Asserted
Signal Detect – Deasserted
Signal Detect – Hysteresis
P
-14
1260
PD + 1.5 dB
-45
dBm avg. Note 11a
IN Max.
λ
PA
PD
1360
-31
nm
dBm avg. Note 13, 19
dBm avg. Note 14, 20
dB
PA - PD
1.5
2.4
HFBR-5301
Receiver Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Deterministic Jitter Contributed by
the Receiver
Random Jitter Contributed by the
Receiver
Symbol
Min.
Typ. Max.
Unit
ns p-p
ns p-p
Reference
Note 9, 11a
DJC
0.19T
1.43
0.35T
2.64
RJC
Note 10,
11a
223
HFBR-5302
Transmitter Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Symbol
Min.
Typ. Max.
Unit
Reference
Output Optical Power
62.5/125 µm, NA = 0.275 Fiber
PO, BOL
PO, EOL
-19
-20
-14 dBm avg. Note 5
-14 dBm avg.
Output Optical Power
PO, BOL
-22.5
-14 dBm avg. Note 5
50/125 µm, NA = 0.20 Fiber
Optical Extinction Ratio
Center Wavelength
Spectral Width - FWHM
Optical Rise Time
0.03
-35
1308 1380
%
dB
Note 6
λC
∆λ
tr
1280
nm
nm
ns
Note 7
Figure 8
Note 7
Figure 8
Note 8
Figure 8
Note 8
137
2.0
2.2
0.6
0.6
Optical Fall Time
tf
ns
Figure 8
Deterministic Jitter Contribution
of Transmitter
Random Jitter Contribution of
Transmitter
DJC
RJC
0.08T
0.30
0.03T
0.11
Note 9
ns p-p
ns p-p
Note 10
HFBR-5302
Receiver Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Symbol
Min.
Typ. Max.
Unit
Reference
Input Optical Power
Minimum at Window Edge
PIN Min. (W)
-26 dBm avg. Note 11
Figure 10
Input Optical Power
Minimum at Eye Center
PIN Min. (C)
-28 dBm avg. Note 12
Figure 10
Input Optical Power Maximum
Operating Wavelength
Signal Detect – Asserted
Signal Detect – Deasserted
Signal Detect – Hysteresis
P
-14
1270
PD + 1.5 dB
-45
dBm avg. Note 11
IN Max.
λ
PA
PD
1380
nm
-27 dBm avg. Note 13, 19
dBm avg. Note 14, 20
dB
PA - PD
1.5
2.4
HFBR-5302
Receiver Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Deterministic Jitter Contributed by
the Receiver
Random Jitter Contributed by the
Receiver
Symbol
Min.
Typ. Max.
Unit
ns p-p
ns p-p
Reference
Note 9, 11
DJC
0.24T
0.90
0.26T
0.97
RJC
Note 10, 11
224
Notes:
extinction ratio is the ratio of the
optical power at the “0” level com-
pared to the optical power at the “1”
level expressed as a percentage or in
decibels.
window time width is calculated to
simulate the effect of worst case
input jitter per FC-PH Annex J
and clock recovery sampling
position in order to insure good
operation with the various FC-0
receiver circuits.
• The integral transmitter is operat-
ing with a 266 MBd, 133 MHz
square-wave, input signal to simu-
late any cross-talk present
1. This is the maximum voltage that
can be applied across the
Differential Transmitter Data Inputs
to prevent damage to the input ESD
protection circuit.
7. This parameter complies with the
requirements for the tradeoffs
between center wave-length, spectral
width, and rise/fall times shown in
Figure 8.
8. The optical rise and fall times are
measured from 10% to 90% when
the transmitter is driven by a 25
MBd (12.5 MHz square-wave) input
signal. This parameter complies with
the requirements for the tradeoffs
between center wavelength, spectral
width, and rise/fall times shown in
Figure 8.
2. When component testing these
products do not short the receiver
data or signal detect outputs directly
to ground to avoid damage to the
part.
3. The outputs are terminated with 50
Ω connected to VCC - 2 V.
between the transmitter and
receiver sections of the
transceiver.
4. The power supply current needed to
operate the transmitter is provided
to differential ECL circuitry. This
circuitry maintains a nearly constant
current flow from the power supply.
Constant current operation helps to
prevent unwanted electrical noise
from being generated and conducted
or emitted to neighboring circuitry.
5. These optical power values are
measured as follows:
• The maximum total jitter added by
the receiver and the maximum
total jitter presented to the clock
recovery circuit comply with the
maximum limits listed in Annex J,
but the allocations of the Rx
added jitter between deterministic
jitter and random jitter are
8.a. The optical rise and fall times are
measured from 10% to 90% when
the transmitter is driven by a 25
MBd (12.5 MHz square-wave) input
signal.
different than in Annex J.
11a. Same as Note 11 except:
• The receiver input signal is a 133
MBd, 27 - 1 psuedorandom data
patter.
• The Beginning of Life (BOL) to
the End of Life (EOL) optical
power degradation is typically 1.5
dB per the industry convention for
long wavelength LEDs. The actual
degradation observed in Hewlett-
Packard’s 1300 nm LED products
is < 1 dB as specified in this data
sheet.
• Over the specified operating
voltage and temperature ranges.
• With 25 MBd (12.5 MHz square-
wave) input signal.
• At the end of one meter of noted
optical fiber with cladding modes
removed.
The average power value can be
converted to a peak power value by
adding 3 dB. Higher output optical
power transmitters are available on
special request.
9. Deterministic Jitter is defined as the
combination of Duty Cycle
Distortion and Data Dependent
Jitter. Deterministic Jitter is
measured with a test pattern
consisting of repeating K28.5
(00111110101100000101) data
bytes and evaluated per the method
in FC-PH Annex A.4.3.
• The integral transmitter is operat-
ing with a 133 MBd, 66.5 MHz
square wave.
• The receiver data window width
is ± 1.73 ns.
• The receiver added jitter maxi-
mums and allocations are
identical to the limits listed in
Annex J.
10. Random Jitter is specified with a
sequence of K28.7 (square wave of
alternating 5 ones and 5 zeros) data
bytes and evaluated at a Bit Error
Ratio (BER) of 1 x 10-12 per the
method in FC-PH Annex A.4.4.
11. This specification is intended to
indicate the performance of the
receiver section of the transceiver
when Input Optical Power signal
characteristics are present per the
following definitions. The Input
Optical Power dynamic range from
the minimum level (with a window
time-width) to the maximum level is
the range over which the receiver is
specified to provide output data with
a Bit Error Rate (BER) better than
12. All conditions of Note 11 apply
except that the measurement is
made at the center of the symbol
with no window time-width.
12a. All conditions of Note 11a apply
except that the measurement is
made at the center of the symbol
with no window time-width.
13. This value is measured during the
transition from low to high levels of
input optical power.
14. This value is measured during the
transition from high to low levels of
input optical power.
15. These values are measured with the
outputs terminated into 50 Ω
connected to VCC - 2 V and an input
optical power level of -14 dBm
average.
6. The Extinction Ratio is a measure of
the modulation depth of the optical
signal. The data “0” output optical
power is compared to the data “1”
peak output optical power and
expressed as a percentage. With the
transmitter driven by a 12.5 MHz
square-wave signal, the average
optical power is measured. The data
“1” peak power is then calculated by
adding 3dB to the measured average
optical power. The data “0” output
optical power is found by measuring
the optical power when the transmit-
ter is driven by a logic “0” input. The
or equal to 1 x 10-12
.
• At the Beginning of Life (BOL)
• Over the specified operating tem-
perature and voltage ranges.
• Input is a 266 MBd, 27 - 1
psuedorandom data pattern.
• Receiver data window time-width
is ± 0.94 ns or greater and
centered at mid-symbol. This data
16. The power dissipation value is the
power dissipated in the receiver
itself. Power dissipation is calculated
as the sum of the products of supply
voltage and supply current, minus
225
the sum of the products of the output
voltages and currents.
17. These values are measured with
respect to VCC with the output
terminated into 50 Ω connected to
VCC - 2 V.
18. The output rise and fall times are
measured between 20% and 80%
levels with the output connected to
VCC - 2 V through 50 Ω.
19. The Signal Detect output shall be
asserted within 100 µs after a step
increase of the Input Optical Power.
20. Signal detect output shall be de-
asserted within 350 µs after a step
decrease in the Input Optical Power.
226
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