HMMC-3128 [HP]
DC-12 GHz Packaged High Efficiency Divide-by-8 Prescaler; DC- 12 GHz的封装高效率分频- 8分频器
| 型号： | HMMC-3128 |
| 厂家： | 
HEWLETT-PACKARD |
| 描述： | DC-12 GHz Packaged High Efficiency Divide-by-8 Prescaler |
| 文件： | 总8页 (文件大小：638K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HMMC-3128
DC-12 GHz Packaged High
Efficiency Divide-by-8 Prescaler
1GC1-8208-TR1-7" diameter reel/500 each
1GC1-8208-BLK-bubble strip/10 each
Data Sheet
Features
• Wide Frequency Range:
0.2-12 GHz
• High Input Power Sensitivity:
On-chip pre- and post-amps
-15 to +10 dBm (1- 8 GHz)
-10 to +8 dBm (8-10 GHz)
-5 to +2 dBm (10-12 GHz)
Package Type:
8-lead SOIC Plastic
4.9 x 3.9 mm typ.
1.55 mm typ.
1.25 mm nom.
0.42 mm nom.
• P : 0 dBm (0.5 V
)
Package Dimensions:
Package Thickness:
Lead Pitch:
p–p
out
• Low Phase Noise:
-153 dBc/Hz @ 100 kHz Offset
• (+) or (-) Single Supply Bias
Lead Width:
Operation
• Wide Bias Supply Range:
4.5 to 6.5 volt operating range
1
Absolute Maximum Ratings
• Differential I/0 with on-chip
(@ T = 25°C, unless otherwise indicated)
A
50 Ω matching
Symbol
Parameters/Conditions
Bias supply voltage
Bias supply voltage
Bias supply delta
Min.
Max.
Units
volts
volts
volts
volts
dBm
Description
V
V
V
+7
CC
EE
CC
The HMMC-3128 is a packaged GaAs
HBT MMIC pre-scaler which offers
dc to 12 GHz frequency translation
for use in communications and EW
systems incorporating high-frequency
PLL oscillator circuits and signal-
path down conversion applications.
The prescaler provides a large input
power sensitivity window and low
phase noise.
-7
0
- V
+7
EE
VLogic
P
Logic threshold voltage
CW RF input power
DC input voltage
V
-1.5
V
-1.2
CC
CC
+10
in(CW)
RFin
V
(@ RF or RF ports)
V 0.5 volts
CC
in
in
2
T
Backside operating temperature -40
+85
+165
310
°C
°C
°C
BS
st
T
T
Storage temperature
-65
Maximum assembly temperature
(60 s max.)
max
Notes
1. Operation in excess of any parameter limit (except T ) may cause permanent damage to the device.
BS
6
2. MTTF > 1 x 10 hours @ T ≤ 85°C. Operation in excess of maximum operating temperature (T ) will degrade MTTF.
BS
BS
DC Specifications/Physical Properties
(T = 25°C, V – V = 5.0 volts, unless otherwise listed)
A
CC
EE
Symbol
Parameters/Conditions
Operating bias supply difference1
Min.
4.5
Typ.
5.0
44
Max.
6.5
Units
volts
mA
V
– V
CC
EE
|I | or |I
CC
|
Bias supply current
37
51
EE
V
V
Quiescent dc voltage appearing at all RF ports
V
volts
CC
RFin(q)
RFout(q)
V
Nominal ECL Logic Level
Logic
(V
contact self-bias voltage, generated on-chip)
V
-1.45
V
-1.32
V
-1.25
volts
CC
CC
CC
Logic
Notes
1. Prescaler will operate over full specified supply voltage range, V or V not to exceed limits specified in Absolute Maximum Ratings section.
CC
EE
RF Specifications
(T = 25°C, Z = 50 Ω, V – V = 5.0 volts)
A
0
CC
EE
Symbol
Parameters/Conditions
Min.
Typ.
14
Max.
Units
GHz
ƒ
ƒ
Maximum input frequency of operation
Minimum input frequency of operation1
12
in(max)
in(min)
0.2
0.5
GHz
(P = -10 dBm)
in
ƒ
Output Self-Oscillation Frequency2
@ dc, (Square-wave input)
3.4
GHz
Self-Osc.
P
-15
-15
-15
-10
-5
> -25
> -20
> -20
> -15
> -10
15
+10
+10
+10
+5
dBm
dBm
dBm
dBm
dBm
dB
in
@ ƒ = 500 MHz, (Sine-wave input)
in
ƒ
ƒ
ƒ
= 1 to 8 GHz
= 8 to 10 GHz
= 10 to 12 GHz
in
in
in
-1
RL
Small-Signal Input/Output Return Loss (@ ƒ < 10 GHz)
in
S
Small-Signal Reverse Isolation (@ ƒ < 10 GHz)
30
dB
12
in
φ
SSB Phase noise (@ P = 0 dBm, 100 kHz offset from a
-153
dBc/Hz
N
in
ƒ
= 1.2 GHz Carrier)
out
Jitter
Input signal time variation @ zero-crossing
(ƒ = 10 GHz, P = -10 dBm)
1
ps
ps
in
in
T or T
r
Output transition time (10% to 90% rise/fall time)
70
f
Notes
1. For sine-wave input signal. Prescaler will operate down to dc for square-wave input signal. Minimum divide frequency limited by input slew-rate.
2. Prescaler may exhibit this output signal under bias in the absence of an RF input signal. This condition may be eliminated by use of the Input dc offset technique described on page 4.
2
RF Specifications (Continued)
(T = 25°C, Z = 50 Ω, V – V = 5.0 volts)
A
0
CC
EE
Symbol
Parameters/Conditions
@ ƒ < 1 GHz
Min.
-2
Typ.
0
Max.
Units
dBm
dBm
dBm
volts
volts
volts
dBm
3
P
out
out
@ ƒ = 2.5 GHz
-3.5
-4.5
-1.5
-2.5
0.5
out
@ ƒ = 3.0 GHz
out
4
|V
P
|
@ ƒ < 1 GHz
out
out(p–p)
@ ƒ = 2.5 GHz
0.42
0.37
-50
out
@ ƒ = 3.0 GHz
out
ƒ
power level appearing at RF or RF
in
in
in
out
Spitback
(@ ƒ 10 GHz, unused RF or RF unterminated)
out
out
ƒ
power level appearing at RF or RF
-55
-30
dBm
dBc
in
in
out
(@ ƒ = 10 GHz, both RF & RF terminated)
in
out
out
P
Power level of ƒ appearing at RF or RF
out out
in
feedthru
(@ ƒ = 12 GHz, P = 0 dBm, referred to P (ƒ ))
in
in
in in
H
Second harmonic distortion output level
(@ ƒ = 3.0 GHz, referred to P (ƒ ))
2
-25
dBc
out
out out
Notes
3. Fundamental of output square wave's Fourier Series.
4. Square wave amplitude calculated from P
.
out
Due to the presence of an off-chip
AC-Coupling and DC-Blocking
Applications
RF-bypass capacitor inside the package
All RF ports are dc connected on-chip
The HMMC-3128 is designed for use in
high frequency communications, micro-
wave instrumentation, and EW radar
systems where low phase-noise PLL
control circuitry or broad-band frequency
translation is required.
(connected to the V contact on the
CC
to the V contact through on-chip 50
CC
device), and the unique design of the
device itself, the component may be
biased from either a single positive
or single negative supply bias. The
backside of the package is not dc
connected to any dc bias point on the
device.
ꢀ resistors. Under any bias condi-
tions where V is not dc grounded
CC
the RF ports should be ac coupled via
series capacitors mounted on the PC
board at each RF port. Only under bias
conditions where V is dc grounded
Operation
CC
(as is typical for negative bias supply
operation) may the RF ports be direct
coupled to adjacent circuitry or in
some cases, such as level shifting
to subsequent stages. In the latter
case the package heat sink may be
“floated” and bias applied as the dif-
The device is designed to operate
when driven with either a single-ended
or differential sinusoidal input signal
over a 200 MHz to 12 GHz bandwidth.
Below 200 MHz the prescaler input
is “slew-rate” limited, requiring fast
rising and falling edge speeds to
properly divide. The device will operate
at frequencies down to dc when driven
with a square-wave.
For positive supply operation, V pins
CC
are nominally biased at any voltage in
the +4.5 to +6.5 volt range with pin 8
(V ) grounded. For negative bias op-
EE
eration V pins are typically grounded
CC
and a negative voltage between -4.5 to
ference between V and V .
CC
EE
-6.5 volts is applied to pin 8 (V ).
EE
3
Input DC Offset
If an RF signal with sufficient signal
to noise ratio is present at the RF
input lead, the prescaler will operate
and provide a divided output equal the
input frequency divided by the divide
modulus. Under certain "ideal" condi-
tions where the input is well matched
at the right input frequency, the com-
ponent may “self-oscillate”, especially
under small signal input powers or
with only noise present at the input.
This “self-oscillation” will produce a
undesired output signal also known
as a false trigger. To prevent false
triggers or self-oscillation conditions,
apply a 20 to 100 mV dc offset voltage
between the RF and RF ports. This
in
in
prevents noise or spurious low level
signals from triggering the divider.
Figure 1. Simplified Schematic
Adding a 10 kꢀ resistor between the
unused RF input to a contact point
MMIC ESD precautions, handling
considerations, die attach and bond-
ing methods are critical factors in suc-
cessful GaAs MMIC performance and
reliability.
unused RF output lead should be ter-
minated into 50 ꢀ to a contact point
at the V potential will result in an
EE
offset of ≈ 25 mV between the RF
inputs. Note however, that the input
sensitivity will be reduced slightly due
to the presence of this offset.
at the V potential or to RF ground
CC
through a dc blocking capacitor.
A minimum RF and thermal PC board
contact area equal to or greater than
2.67 × 1.65 mm (0.105" × 0.065") with
eight 0.020" diameter plated-wall
thermal vias is recommended.
Agilent application note #54, “GaAs
MMIC ESD, Die Attach and Bonding
Guidelines” provides basic information
on these subjects.
Assembly Notes
Independent of the bias applied to the
package, the backside of the package
should always be connected to both
a good RF ground plane and a good
thermal heat sinking region on the
PC board to optimize performance.
For single-ended output operation the
Moisture Sensitivity Classification:
Class 1, per JESD22-A112-A.
Additional References:
PN #18, "HBT Prescaler Evaluation
Board."
4
Symbol
A
Min.
1.35
0.0
Max.
1.75
.25
A1
B
0.33
0.19
4.80
3.80
1.27 BSC
5.80
0.40
0°
0.51
.025
5.00
4.00
1.27 BSC
6.20
1.27
8°
C
D
E
e
H
L
a
Notes:
•
•
•
•
All dimensions in millimeters.
Refer to JEDEC Outline MS-012 for additional tolerances.
Exposed heat slug area on package bottom = 2.67 x 1.65.
Exposed heat sink on package bottom must be soldered to
PCB RF ground plane.
Figure 2. Package and dimensions
Figure 3. Assembly diagram (Single-supply, positive-bias configuration shown)
5
Figure 4. Typical input sensitivity window
Figure 5. Typical supply current & V
vs. supply voltage
Logic
Figure 7. Typical output power vs. output frequency, ƒ (GHz)
Figure 6. Typical phase noise performance
out
Figure 8. Typical “Spitback” power P(ƒ ) appearing at
out
RF input port
6
Device Orientation
Tape Dimensions and Product Orientation
Notes:
1. 10 sprocket hole pitch cumulative tolerance: 0.2 mm.
2. Camber not to exceed 1 mm in 100 mm.
3. Material: Black Conductive Advantek Polystyrene.
4. Ao and Bo measured on a plane 0.3 mm above the bottom of the pocket.
5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier.
6. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.
7
www.agilent.com
www.agilent.com/find/emailupdates
Get the latest information on the
products and applications you select.
For more information on Agilent Technologies’
products, applications or services, please
contact your local Agilent office. The complete
list is available at:
www.agilent.com/find/contactus
www.agilent.com/find/agilentdirect
Quickly choose and use your test
equipment solutions with confidence.
Americas
Canada
Latin America
United States
(877) 894-4414
305 269 7500
(800) 829-4444
www.agilent.com/find/open
Asia Pacific
Australia
China
Hong Kong
India
Agilent Open simplifies the process
of connecting and programming
test systems to help engineers
design, validate and manufacture
electronic products. Agilent offers
open connectivity for a broad range
of system-ready instruments, open
industry software, PC-standard I/O
and global support, which are
combined to more easily integrate
test system development.
1 800 629 485
800 810 0189
800 938 693
1 800 112 929
81 426 56 7832
080 769 0800
1 800 888 848
1 800 375 8100
0800 047 866
1 800 226 008
Japan
Korea
Malaysia
Singapore
Taiwan
Thailand
Europe
www.lxistandard.org
Austria
Belgium
Denmark
Finland
France
Germany
0820 87 44 11
LXI is the LAN-based successor to
GPIB, providing faster, more efficient
connectivity. Agilent is a founding
member of the LXI consortium.
32 (0) 2 404 93 40
45 70 13 15 15
358 (0) 10 855 2100
0825 010 700
01805 24 6333*
*0.14 /minute
1890 924 204
Ireland
This data sheet contains a variety of
typical and guaranteed performance
data. The information supplied should
not be interpreted as a complete list
of circuit specifi cations. Customers
considering the use of this, or other
Agilent GaAs ICs, for their design
should obtain the current production
specifi cations from Agilent. In this
data sheet the term typical refers to
the 50th percentile performance.
For additional information contact
Agilent
Italy
39 02 92 60 8484
31 (0) 20 547 2111
34 (91) 631 3300
0200-88 22 55
Netherlands
Spain
Sweden
Switzerland (French)
41 (21) 8113811(Opt 2)
Switzerland (German) 0800 80 53 53 (Opt 1)
United Kingdom
44 (0) 118 9276201
Other European Countries:
www.agilent.com/find/contactus
Revised: May 7, 2007
Product specifications and descriptions
in this document subject to change
without notice.
MMIC_Helpline@agilent.com.
© Agilent Technologies, Inc. 2007
Printed in USA, November 26, 2007
5989-7354EN
相关型号：
HMMC-3128-BLK
Prescaler, 3128 Series, 1-Func, GAAS, PDSO8, 4.90 X 3.90 MM, 1.55 MM HEIGHT, 1.25 MM PITCH, PLASTIC, MS-012, SOIC-8
AGILENT
HMMC-3128-TR1
3128 SERIES, PRESCALER, PDSO8, 4.90 X 3.90 MM, 1.55 MM HEIGHT, 1.25 MM PITCH, PLASTIC, MS-012, SOIC-8
AVAGO
HMMC-3128-TR1
Prescaler, 3128 Series, 1-Func, GAAS, PDSO8, 4.90 X 3.90 MM, 1.55 MM HEIGHT, 1.25 MM PITCH, PLASTIC, MS-012, SOIC-8
AGILENT
©2020 ICPDF网 联系我们和版权申明