AT-902-PT [HRS]

Fixed Attenuator, 0MHz Min, 4000MHz Max;
AT-902-PT
型号: AT-902-PT
厂家: HRS    HRS
描述:

Fixed Attenuator, 0MHz Min, 4000MHz Max

衰减器 射频 微波
文件: 总5页 (文件大小:164K)
中文:  中文翻译
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Board Mounting Type (DC to 8.0 GHz)  
Stripline Mounting Fixed Attenuators (DC to 8 GHz)  
AT-900 Series  
Features  
1.Frequency Range from DC to 8 GHz  
Although these attenuators are of the surface  
mount type, they offer superior high frequency  
characteristics from DC to 8 GHz.  
2.Abundant Variations of Attenuators  
Attenuation amounts are available in 11 types from  
0 to 10 dB in 1 dB steps.  
AT-900 Type  
AT-900-C Type  
3.Wide Variety of Mounting Styles  
Products are available to complement a wide  
variety of mounting styles including screw mount  
types, solder mount types, and a type in which the  
center electrode has received gold plating for wire  
mounting.  
AT-900-T Type  
AT-900-PT Type  
Product Specifications  
Frequency Range (NOTE)  
Characteristic impedance  
Maximum usable power (NOTE)  
DC to 8.0 GHz  
Operating temperature range  
Operating relative humidity  
-10ç to +65ç  
50ø  
1 W  
Rating  
95% or less  
NOTE: The frequency range and the maximum usable power will differ depending on the model.  
Item  
Standard  
Conditions  
Frequency of 10 to 2000 Hz, overall amplitude of 1.52 mm,  
1.Vibration resistance  
No electrical disconnections of 1µs or greater  
No damage, cracks, or parts looseness  
No electrical disconnections of 1µs or greater  
No damage, cracks, or parts looseness  
No damage, cracks, or parts looseness  
2
98 m/s acceleration, in 3 axial directions, 2 hours each  
2
490 m/s acceleration, half sine wave, in 3 axial  
2.Shock resistance  
3.Temperature cycle  
directions, 3 times each  
(-55ç  
: 30 min.5 to 35ç: Within 15 min.85ç: 30 min  
5 to 35ç: Within 15 min.) for 200 cycles  
The test method conforms to MIL-STD-202.  
Please see the specification items for details concerning the amount of attenuation and the VSWR.  
Materials  
Part  
Material  
Brass  
Processing  
Nickel plating  
----------  
External cladding  
Attenuation element  
Tabs  
Metal film  
Copper  
Solder plating  
Product Number Breakdown  
-
AT --- 9 01 C  
1
2
3
4
AT: Indicates a fixed attenuator.  
Amount of attenuation  
(Examples)  
Form  
4
1
2
3
Blank : With plate and tabs  
01  
:
:
:
1dB  
6dB  
C
: With case, without tabs  
: Without plate and tabs  
: With plate, without tabs  
Indicates the Series Name: AT-900 Series  
06  
PT  
T
00-(0)  
0dB (Through)  
00-(1.5) : 1.5dB  
94  
Board Mounting Type (DC to 8.0 GHz)  
Specifications  
(dB)  
V.S.W.R.  
(Max)  
DC~8GHz  
(ç Max)  
(g)  
(W)  
Power  
Attenuation  
Model No.  
Surface Temperature  
Weight  
DC~4GHz  
4~8GHz  
at Maximum Load  
+0.5  
+0.7  
1.35  
1.35  
1.35  
1.35  
1.35  
1.35  
1.35  
1.35  
1.35  
1.35  
1.35  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
AT-900-(0)  
AT-901  
AT-902  
AT-903  
AT-904  
AT-905  
AT-906  
AT-907  
AT-908  
AT-909  
AT-910  
0
0
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
0
0
1 0.5  
2 0.5  
3 0.5  
4 0.5  
5 0.5  
6 0.5  
7 0.5  
8 0.5  
9 0.5  
10 0.5  
1 0.7  
2 0.7  
3 0.7  
4 0.7  
5 0.7  
6 0.7  
7 0.7  
8 0.7  
9 0.7  
10 0.7  
(ç Max)  
Surface Temperature  
at Maximum Load  
(GHz)  
Frequency Range  
(dB)  
Attenuation  
V.S.W.R.  
(Max)  
(W)  
Power  
(g)  
Weight  
Model No.  
+0.5  
AT-900-(0)-C  
AT-900-(0.5)-C  
AT-901--C  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
1
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
DC~4  
0
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
+85  
0
0.5 0.5  
1 0.5  
AT-900-(1.5)-C  
AT-902-C  
1.5 0.5  
2 0.5  
AT-903-C  
3 0.5  
AT-904-C  
4 0.5  
+0.5  
0
AT-900-(0)-T  
AT-901-T  
0
1
1 0.5  
2 0.5  
3 0.5  
4 0.5  
5 0.5  
6 0.5  
7 0.5  
8 0.5  
9 0.5  
AT-902-T  
1
AT-903-T  
1
AT-904-T  
1
AT-905-T  
1
AT-906-T  
1
AT-907-T  
1
AT-908-T  
1
AT-909-T  
1
AT-910-T  
1
10 0.5  
+0.5  
0
AT-900-(0)-PT  
AT-901--PT  
AT-902--PT  
AT-903--PT  
AT-904--PT  
AT-906--PT  
AT-907--PT  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0
1 0.5  
2 0.5  
3 0.5  
4 0.5  
6 0.5  
7 0.5  
95  
Board Mounting Type (DC to 8.0 GHz)  
External Dimensions Diagrams  
Through  
Soldering (240ç melting point)  
Case  
AT-900-C Type  
AT-900-T Type  
AT-900-PT Type  
AT-900 Type  
Typical Data  
AT-901  
AT-903  
AT-906  
AT-910  
AT-903-T  
96  
Board Mounting Type (DC to 8.0 GHz)  
Mounting Method  
AT-900 Type  
Make the AT-900 tab height from the housing and the  
thickness of the microstrip board the same amount.  
The tabs are attached with high temperature solder (having  
a melting point of 280ç). The soldering temperature to the  
microstrip board must be less than this.  
AT-900-C Type  
The case and ground electrodes are attached with high  
temperature solder (having a melting point of 240ç). The  
soldering temperature to the housing (ground) must be less  
than this.  
The 50ø line and the center electrode of the AT-900-C are  
soldered with the tabs, and mounting is by bonding using  
gold wire, etc.  
Soldering should be performed quickly so that diffusion of  
the center (gold) electrode does not occur.  
97  
Board Mounting Type (DC to 8.0 GHz)  
AT-900-T Type  
The 50ø line and the center electrode of the AT-900-T are  
soldered with the tabs, and mounting is by bonding using  
gold wire, etc.  
Soldering should be performed quickly so that diffusion of  
the center (gold) electrode does not occur.  
AT-900-PT Type  
The ground of the resistor surface and the ground of the  
rear surface are not connected when a single AT-900-PT  
is used. To maintain the high frequency characteristics, the  
board should be processed or a mounting arrangement  
provided so that the ground of the resistor surface and the  
housing (ground) conduct.  
When making connection by soldering with the tabs,  
soldering should be performed quickly so that diffusion of  
the (gold) electrode does not occur.  
98  

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