DF24A50DS-0.9PTB [HRS]

0.9 mm Pitch Vertical Mating Board-to-Wire Connectors; 0.9毫米间距垂直插接板对线连接器
DF24A50DS-0.9PTB
型号: DF24A50DS-0.9PTB
厂家: HRS    HRS
描述:

0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
0.9毫米间距垂直插接板对线连接器

连接器
文件: 总8页 (文件大小:415K)
中文:  中文翻译
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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
0.9 mm Pitch Vertical Mating Board-to-Wire Connectors  
DF24 Series  
Space-saving  
Double row socket  
Double row header (SMT)  
Low-profile  
Double row socket  
Features  
11. Space saving  
Small contact pitch (0.9 mm) together with vertical mating  
direction allows high density mounting of the board  
components.  
3.8  
12. Low profile  
Two-level contact location and horizontal wire exits allow a  
low profile of 3.8 mm, when fully.  
8.2  
Double row header (SMT)  
13. Reliable mating/un-mating  
Complete vertical mating, with both sides self-aligned, is  
confirmed with tactile “click” sensation.  
Long contact wipe  
Two-point socket contact  
14. High contact reliability  
2-point socket contact, with a long wipe (0.55 mm) assures  
highly reliable electrical and mechanical connection.  
0.55mm  
15. Prevention of solder wicking  
Despite its low-profile, solder wicking is prevented by the  
nickel barrier and solder collection areas.  
16. Self-alignment and side-pull protection  
The walls of the double row socket assembly will self-align  
during the mating and protect header and socket  
assemblies from a accidental side-pull on the wires.  
Contact - header  
17. Simplified un-mating  
A pull strap for double row socket version may be selected  
for easier un-mating.  
Self-alignment and side-pull protection  
18. Contact deformation protection  
Flat contact blades on the headers are supported by the  
insulator’s walls, protecting them from deformation during  
handling.  
Socket contacts  
Wall  
19. Board placement with automatic equipment  
Supplied on reels containing 1,000 assemblies.  
Contact blades  
10. RoHS compliant  
All components and materials comply with the requirements  
of the EU Directive 2002/95/EC.  
Applications  
Notebook computers, miniature office automation devices,  
miniature consumer devices, cameras, recording devices  
and other devices requiring vertical mating reliable  
connectors.  
Contact deformation protection  
B297  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors  
Product Specifications  
AWG28  
AWG30  
:1A  
Operating temperature range  
Operating humidity range  
–35ç to +85ç (Note 2)  
Current rating  
(Note 1)  
Wire size  
:0.5A  
Relative humidity 20% to 80%  
Rating  
AWG32~36 :0.3A  
Storage temperature range  
Storage humidity range  
–10ç to +60ç (Note 3)  
Relative humidity 40% to 70% (Note 3)  
Voltage rating  
80V AC  
Item  
Specification  
Conditions  
1.Insulation resistance  
2.Withstanding voltage  
3.Contact resistance  
500 M ohms min.  
100V DC  
No flashover or insulation breakdown.  
30 mø max.  
250V AC/one minute  
1 mA, 20 mV max.  
4.Insertion-Extraction force (per contact) 0.12N min., 2N max.  
Measured with a steel pin of 0.15mm thickness  
5.Vibration  
No electrical discontinuity of 1μs or more.  
Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 2 hours, 3 axis  
96 hours at temperature of 40 2ç and humidity of 90% to 95%.  
Temperature: –55ç +5ç to +35ç +85ç +5ç to +35ç  
Contact resistance: 30 mø max.  
Insulation resistance: 250 Mø min.  
6.Humidity  
Contact resistance: 30 mø max.  
Insulation resistance: 500 Mø min.  
7.Temperature cycle  
Time: 30 2 to 3 30 2 to 3 (Minutes)  
5 cycles  
8.Durability (mating / un-mating) Contact resistance: 30 mø max.  
30 cycles  
Reflow: At the recommended temperature profile  
Manual soldering: 350ç for 3 seconds  
9.Resistance to soldering heat No deformation of components affecting performance.  
Note 1: Current rating for header is 1A.  
Note 2: Includes temperature rise caused by current flow.  
Note 3: The term “storage” refers to products stored for long period of time prior to mounting and use. Operating temperature range and  
humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation.  
Note 4: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for  
a specific part number shown.  
Materials and Finishes  
Product  
Component  
Material  
Finish  
Remarks  
UL94V-0  
––––––––––  
UL94V-0  
––––––––––  
––––––––––  
Socket  
Insulators  
Polyamide  
Color : Black  
Gold plated  
Color : Black  
Gold plated  
––––––––––––  
Crimp contact  
Contact-socket  
Insulator  
Phosphor bronze  
Polyamide  
Header  
Contact-blade  
Pull strap  
Phosphor bronze  
PET  
Pull strap  
Ordering information  
Connectors  
# *  
DF24 - DS - 0.9 C  
1
2
3
4
5
6
1 Series Name : DF24  
2 Form type  
4 Connector type  
DS : Double-row socket  
DP : Double-row header  
5 Contact pitch : 0.9 mm  
6 Housing type  
Pin headers A : Standard type  
Sockets Blank : Standard type  
A : Pull strap version  
3 Number of contacts : 40, 50  
C : Crimp housing  
V : Straight SMT header  
PTB : Pull strap (Note)  
Note: The pull strap is an optional.  
Contacts  
DF24 - 2830 SCF A  
1
2
3
1 Applicable conductor  
2830 : AWG 28 to 30  
3234 : AWG 32 to 34  
0036 : AWG 36  
2 Packaging  
SCF : Socket contact / reel  
3 Plating  
A : Gold plated  
B298  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors  
Double-row header (SMT)  
A
0.15  
P=0.9  
P=0.9  
Contact  
Contact  
A
B
PCB mounting pattern  
A
0.05  
0.5 0.03  
P=0.9 0.03  
Contact  
No.1  
Specification number  
(51): Embossed tape packaging (1,000 pieces per reel).  
Contact  
No.2  
Unit: mm  
RoHS  
Part number  
CL No.  
Number of contacts  
A
B
Packaging  
1,000 pcs. / reel  
1,000 pcs. / reel  
DF24A-40DP-0.9V(**)  
DF24A-50DP-0.9V(**)  
687-3208-0-**  
687-3209-2-**  
40  
50  
17.1  
21.6  
19.6  
24.1  
YES  
Packaging specifications  
2
0.1  
4
0.1  
12 0.1  
Section A-A  
A
2
0.5  
Part number label  
D+2  
(D+6)MAX  
0
0.4 0.1  
4.55 0.15  
A
Unreeling direction  
Unit: mm  
Part number  
Number of contacts  
A
B
C
D
32.4  
44.4  
40  
50  
32  
44  
28.4  
40.4  
14.2  
20.2  
DF24A-40DP-0.9V(**)  
B299  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors  
Double-row socket  
A
A
1
No. of contacts  
indicator  
B
8.2  
6.5  
C
P=0.9  
Contact  
Contact  
4.8  
D
Unit: mm  
Part number  
CL No.  
Number of contacts  
A
B
C
D
Packaging  
100 pcs. / bag  
100 pcs. / bag  
RoHS  
17.1  
21.6  
21.1  
25.2  
DF24B-40DS-0.9C  
DF24B-50DS-0.9C  
687-3301-5  
687-3302-8  
40  
50  
22.1  
18.75  
23.25  
YES  
26.2  
Double-row socket (Pull strap)  
A
0.3  
A
1
No. of contacts  
indicator  
B
C
8.2  
6.5  
P=0.9  
Contact  
Contact  
4.8  
D
Unit: mm  
RoHS  
YES  
Part number  
CL No.  
Number of contacts  
50  
A
B
C
D
Packaging  
21.6  
25.2  
100 pcs. / bag  
DF24BA-50DS-0.9C  
687-3304-3  
27.4  
23.25  
Note: Refer to page 5 for pull strap tab.  
B300  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors  
Crimp contact  
1.03  
0.85  
Part number  
CL No. Applicable wire size Packaging Quantity Finish RoHS  
DF24-2830SCFA 687-3001-1  
DF24-3234SCFA 687-3004-0  
28 – 30  
32 – 34  
36  
Reel  
20,000 Gold plated YES  
DF24-36SCFA  
687-3003-7  
Applicable wire (Tin plated annealed copper wire)  
Wire size (Stranded wire conductor)  
AWG28 (7 / 0.127mm)  
Jacket diameter  
AWG30 (7 / 0.107mm)  
0.6mm max  
AWG32 (7 / 0.087mm)  
AWG36 (7 / 0.057mm)  
0.4mm max  
Note: When using other than the recommended wire, contact  
your nearest Hirose representative.  
Tools  
Type  
Description  
Applicator  
Press unit  
Part number  
AP105-DF24-2830S  
AP105-DF24-3234S  
AP105-DF24-36S  
CM-105  
Applicable contacts  
DF24-2830SCFA  
DF24-3234SCFA  
DF24-36SCFA  
CL No.  
901-4602-5  
901-4592-3  
901-4606-6  
901-0005-4  
550-0179-2  
t=0.12  
––––––––––––––––––––––––  
DF24-****SCFA  
Contact extraction tool  
DF-C-PO(B)  
Pull strap  
A
B
Applicable socket  
π [DF24BA-50DS-0.9C]  
Seal  
Unit: mm  
Part number  
CL No.  
687-3300-2  
Number of contacts  
50  
A
B
Packaging  
500 pcs. / bag  
RoHS  
YES  
DF24-50DS-PTB  
25  
75  
Before attachment of the pull strap  
Pull strap attached  
B301  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors  
Pull Strap Attachment Procedure  
1 With the adhesive side of the pull strap facing upward, pass both ends of the strap through the elongated openings  
at both ends of the socket.  
Adhesive side  
Elongated opening  
Elongated opening  
Socket  
2 Peel-off the protective paper on one side and place one end of the strap over exposed adhesive (as illustrated  
below), using the remaining paper side as the alignment guide.  
Protective paper  
3 Peel-off the remaining protective paper and place the other end of the strap over the adhesive, using the already  
attached end as the alignment guide.  
Completed  
B302  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors  
Usage recommendations and Precautions  
1. Recommended  
Temperature(ç)  
temperature profile  
250  
(Including Lead-free solder)  
240  
220  
Reflow conditions  
Preheating:  
200  
150  
100  
50  
190  
170  
180 10ç 60~20sec.  
Soldering:  
250ç max.  
Preheating  
Soldering  
240çmin. 20sec. max.  
220çmin. 60sec. max.  
0
50  
100  
150  
200  
250  
Time(S)  
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, providing that  
there is a return to normal temperature between the first and second cycle.  
Note 2: The temperature profile indicates the board surface at the point of contacts with the  
connector terminals.  
2.Recommended manual soldering Manual soldering: 300 10ç for 3 seconds  
3.Recommended screen thickness and Thickness: 0.12mm  
opening area ratio (Pattern area ratio) Opening area ratio: 80%  
4. Board warpage  
Maximum of 0.03mm at the connector center, with both ends of the connector as reference points.  
Refer to Nylon Connector Use Handbook”.  
5. Cleaning conditions  
6. Wire preparation and  
contact crimping  
Refer to “Nylon Connector Use Handbook”.  
The crimp contacts are of a very small form and because of this, crimping should be performed carefully  
based on the content of the Crimping Conditions Table and the Crimping Quality Standards Manual.  
Removal of the inserted socket contacts  
7. Precautions  
* Using the socket contact extraction tool (DF-C-PO(B) ) carefully lift the contact retention tab on the  
insulator housing, as shown on the Fig.1 and pull-out the wire.  
* Lift the tab ONLY enough to remove the contact. Exercise caution NOT to deflect too much.  
* The tab should return to its original position after the contact is removed.  
* The tab must be in its original position before inserting the new socket contact.  
Contact extraction tool  
Contact  
retention tab  
DF-C-PO(B)  
Fig. 1. Contact Removal  
B303  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors  
7. Precautions  
Connector Mating/Un-mating  
* Hold the socket at both ends (as illustrated on Fig.2) when mating or un-mating. The mating/un-  
mating of the connectors must be within the indicated angle of 20° on both axis.  
DO NOT MATE /  
UN-MATE HOLDING  
BY THE WIRES.  
20°  
20°  
Hold here  
Fig. 2. Mating / Un-mating  
Bundling of the Wires  
* To avoid wire damage or termination faults bundling of the wires should be at the distance of 20 mm  
min. from the socket (Fig. 3-1)  
* When bundling at the distance less than the recommended 20 mm, it is critical to avoid sharp bend  
radius (Fig. 3-2) or apply stretching or twisting forces (Fig. 3-3)  
Do not stretch  
or twist  
Bundling close to socket  
Sharp bend  
Fig. 3-1  
Fig. 3-2  
Fig. 3-3  
Fig. 3. Bundling requirements  
* Do not mate/un-mate connectors when not mounted on the board.  
* Do not use connector as the only support for the board.  
* Do not use flux compounds when hand soldering.  
* Slight color shade difference of the insulator bodies will not affect the form, fit or function of the  
connectors.  
B304  

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