DF30FB-24DP-0.4V [HRS]

0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors; 节距为0.4mm ,0.9 mm高,板对板/板对FPC连接器
DF30FB-24DP-0.4V
型号: DF30FB-24DP-0.4V
厂家: HRS    HRS
描述:

0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
节距为0.4mm ,0.9 mm高,板对板/板对FPC连接器

连接器 FPC连接器
文件: 总11页 (文件大小:865K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors  
DF30 Series  
Extremely small size  
Header  
(0.90)  
Receptacle  
40 positions shown  
Overview  
Low profile  
Increased mated retention  
High contact reliability  
Continuous miniaturization and increased component  
density on PCB created demand for extremely low profile  
connectors. This series is addition of a new extremely low  
profile connectors to Hirose's wide range of high reliability  
board-to-board/board-to-FPC connection solutions.  
Header  
DF30*-*DP-0.4V  
Features  
1. Contact reliability  
Concentration of the contact's normal forces at the single  
point assures good contact wipe and electrical reliability,  
while confirming the fully mated condition with a definite  
tactile click.  
0.9mm  
Receptacle  
DF30*-*DS-0.4V  
2. Self alignment  
Protrusion improves mated retention  
Recognizing the difficulties of mating extremely small  
connectors in limited spaces the connectors will self align  
in horizontal axis within 0.3 mm.  
3. Automatic board placement  
Packaged on tape-and-reel the plug and headers have  
sufficiently large flat areas to allow pick-up with vacuum  
nozzles of automatic placement equipment.  
Self alignment  
4. Variety of contact positions and styles  
Available in standard contact positions of: 20, 22, 24, 30,  
34, 40, 50, 60, 70 and 80 with and without metal fittings.  
Addition of metal fittings does not affect external  
dimensionsof the connectors.  
0.3mm  
Smaller contact positions are also available.  
5. Support for continuity test connector  
Connectors which have increased insertion and removal  
durability are available for continuity tests. Contact your  
Hirose sales representative for details.  
Applications  
Cellular phones, PDA's, mobile computers, digital  
cameras, digital video cameras, and other devices  
demanding high reliability connections in extremely  
limited spaces.  
2004.10  
1
Product Specifications  
Operating temperature range : -35ç to 85ç (Note 1)  
Rated current 0.3A  
Rating  
Storage temperature range -10ç to 60ç (Note 2)  
Storage humidity range Relative humidity 40% to 70% (Note 2)  
Operating humidity range  
: Relative humidity 20% to 80%  
Rated voltage 30V AC  
Item  
Specification  
Conditions  
1. Insulation resistance 50 Mø min.  
100V DC  
2. Withstanding voltage No flashover or insulation breakdown.  
100V AC / one minute  
3. Contact resistance  
4. Vibration  
100 mø max.  
100 mA  
No electrical discontinuity of 1 µs or more  
Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 2 hours, 3 axis  
96 hours at temperature of 40ç 2ç and RH of  
90% to 95%  
Contact resistance: 100 mø max.  
Insulation resistance: 25 Mø min.  
5. Humidity  
Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç  
Duration: 30/10/30/10(Minutes)  
5 cycles  
Contact resistance: 100 mø max.  
Insulation resistance: 50 Mø min.  
6. Temperature cycle  
7. Durability  
(insertions/withdrawals)  
Contact resistance: 100 mø max.  
50 cycles(Connector for conductivity tests: 500 cycles)  
8. Resistance to  
soldering heat  
No deformation of components  
affecting performance.  
Reflow: At the recommended temperature profile  
Manual soldering: 300ç for 3 seconds  
Note 1: Includes temperature rise caused by current flow.  
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating temperature range and  
humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation.  
Materials and Finishes  
Connectors  
Component  
Insulator  
Contacts  
Material  
LCP  
Phosphor bronze  
Phosphor bronze  
Finish  
Color : Black  
Gold plated  
Remarks  
UL94V-0  
-------------  
-------------  
Receptacles  
and  
Headers  
Metal fittings  
Tin-cupper plated  
Ordering information  
Receptacles and Headers  
DF30 FC -  
DS - 0.4 V ( )  
**  
*
1
2
3
4
5
6
7
5
6
1
2
Series name: DF30  
Configuration  
Contact pitch: 0.4 mm  
Termination section  
V: Straight SMT  
Packaging  
FB: With metal fittings, without bosses  
FC: Without metal fittings, without bosses  
CJ: Connector for conductivity tests  
Number of positions: 20, 22, 24, 30, 34, 40, 50, 60, 70, 80  
Connector type  
7
(81): Embossed tape packaging (5,000 pieces per reel)  
(82): Embossed tape packaging (1,000 pieces per reel)  
3
4
DS: Double row receptacle  
DP: Double row header  
2
Receptacles (with metal fittings)  
A
B
Note 2  
P=0.4  
0.15  
C
Flat surface  
HRS logo  
2.54  
Metal fittings  
BRecommended PCB mounting pattern  
E+0.05  
0
D-00.05  
B
0.02  
P=0.4 0.02  
0.23 0.02  
Recommended solder paste thickness: 120 µm  
(
)
[Specification number] -**, **  
(
)
(
)
81 : Embossed tape packaging 5,000 pieces per reel  
* Tolerances non- accumulative.  
Part Number  
Unit: mm  
E
CL No.  
Number of contacts  
A
B
C
D
(
)
)
)
)
)
)
)
)
)
)
20  
22  
24  
30  
34  
40  
50  
60  
70  
80  
06.22  
06.62  
07.02  
08.22  
09.02  
10.22  
12.22  
14.22  
16.22  
18.22  
03.6  
04.0  
04.4  
05.6  
06.4  
07.6  
09.6  
11.6  
13.6  
15.6  
1.20  
1.20  
1.20  
1.20  
1.36  
1.60  
2.00  
2.40  
2.80  
3.20  
05.72  
06.12  
06.52  
07.72  
08.52  
09.72  
11.72  
13.72  
15.72  
17.72  
06.52  
06.92  
07.32  
08.52  
09.32  
10.52  
12.52  
14.52  
16.52  
18.52  
DF30FB-20DS-0.4V **  
CL684-1098-3-**  
CL684-1099-6-**  
CL684-1100-3-**  
CL684-1101-6-**  
CL684-1102-9-**  
CL684-1103-1-**  
CL684-1104-4-**  
CL684-1105-7-**  
CL684-1106-0-**  
CL684-1107-2-**  
(
DF30FB-22DS-0.4V **  
(
DF30FB-24DS-0.4V **  
(
DF30FB-30DS-0.4V **  
(
DF30FB-34DS-0.4V **  
(
DF30FB-40DS-0.4V **  
(
DF30FB-50DS-0.4V **  
(
DF30FB-60DS-0.4V **  
(
DF30FB-70DS-0.4V **  
(
DF30FB-80DS-0.4V **  
Note 1: Order by number of reels.  
Note 2: Receptacles with 24 or fewer contacts positions will not have recessed areas.  
3
Receptacles (without metal fittings)  
A
B
Note 2  
P=0.4  
C
Flat surface  
0.15  
HRS logo  
BRecommended PCB mounting pattern  
B
0.02  
P=0.4 0.02  
0.23 0.02  
Recommended solder paste thickness: 120 µm  
(
)
[Specification number] -**, **  
(
)
(
)
81 : Embossed tape packaging 5,000 pieces per reel  
* Tolerances non- accumulative.  
Part Number  
Unit: mm  
C
CL No.  
Number of contacts  
A
B
(
)
)
)
)
)
)
)
)
)
)
20  
22  
24  
30  
34  
40  
50  
60  
70  
80  
06.22  
06.62  
07.02  
08.22  
09.02  
10.22  
12.22  
14.22  
16.22  
18.22  
03.6  
04.0  
04.4  
05.6  
06.4  
07.6  
09.6  
11.6  
13.6  
15.6  
1.20  
1.20  
1.20  
1.20  
1.36  
1.60  
2.00  
2.40  
2.80  
3.20  
DF30FC-20DS-0.4V **  
CL684-1109-8-**  
CL684-1110-7-**  
CL684-1111-0-**  
CL684-1112-2-**  
CL684-1113-5-**  
CL684-1078-6-**  
CL684-1114-8-**  
CL684-1082-3-**  
CL684-1115-0-**  
CL684-1116-3-**  
(
DF30FC-22DS-0.4V **  
(
DF30FC-24DS-0.4V **  
(
DF30FC-30DS-0.4V **  
(
DF30FC-34DS-0.4V **  
(
DF30FC-40DS-0.4V **  
(
DF30FC-50DS-0.4V **  
(
DF30FC-60DS-0.4V **  
(
DF30FC-70DS-0.4V **  
(
DF30FC-80DS-0.4V **  
Note 1: Order by number of reels.  
Note 2: Receptacles with 24 or fewer contacts positions will not have recessed areas.  
4
Header (with metal fittings)  
A
B
P=0.4  
Note 2  
Note 2  
C
Flat surface  
HRS logo  
0.15  
1.1  
Metal fittings  
BRecommended PCB mounting pattern  
E+0.05  
0
0
D -0.05  
B
0.02  
P=0.4 0.02  
0.23 0.02  
Recommended solder paste thickness: 120 µm  
(
)
[Specification number] -**, **  
(
)
(
)
81 : Embossed tape packaging 5,000 pieces per reel  
* Tolerances non- accumulative.  
Part Number  
Unit: mm  
E
CL No.  
Number of contacts  
A
B
C
D
(
)
)
)
)
)
)
)
)
)
)
20  
22  
24  
30  
34  
40  
50  
60  
70  
80  
05.14  
05.54  
05.94  
07.14  
07.94  
09.14  
11.14  
13.14  
15.14  
17.14  
03.6  
04.0  
04.4  
05.6  
06.4  
07.6  
09.6  
11.6  
13.6  
15.6  
1.20  
1.20  
1.20  
1.20  
1.36  
1.60  
2.00  
2.40  
2.80  
3.20  
04.64  
05.04  
05.44  
06.64  
07.44  
08.64  
10.64  
12.64  
14.64  
16.64  
05.44  
05.84  
06.24  
07.44  
08.24  
09.44  
11.44  
13.44  
15.44  
17.44  
DF30FB-20DP-0.4V **  
CL684-1129-5-**  
CL684-1130-4-**  
CL684-1131-7-**  
CL684-1132-0-**  
CL684-1133-2-**  
CL684-1134-5-**  
CL684-1135-8-**  
CL684-1074-5-**  
CL684-1075-8-**  
CL684-1136-0-**  
(
DF30FB-22DP-0.4V **  
(
DF30FB-24DP-0.4V **  
(
DF30FB-30DP-0.4V **  
(
DF30FB-34DP-0.4V **  
(
DF30FB-40DP-0.4V **  
(
DF30FB-50DP-0.4V **  
(
DF30FB-60DP-0.4V **  
(
DF30FB-70DP-0.4V **  
(
DF30FB-80DP-0.4V **  
Note 1: Order by number of reels.  
Note 2: Headers with 24 or fewer contacts positions will not have protruding areas.  
5
Header (without metal fittings)  
A
B
P=0.4  
Note 2  
Note 2  
HRS logo  
C
Flat surface  
0.15  
BRecommended PCB mounting pattern  
B
0.02  
P=0.4 0.02  
0.23 0.02  
Recommended solder paste thickness: 120 µm  
(
)
[Specification number] -**, **  
(
)
(
)
81 : Embossed tape packaging 5,000 pieces per reel  
* Tolerances non- accumulative.  
Part Number  
Unit: mm  
C
CL No.  
Number of contacts  
A
B
(
)
)
)
)
)
)
)
)
)
)
20  
22  
24  
30  
34  
40  
50  
60  
70  
80  
05.14  
05.54  
05.94  
07.14  
07.94  
09.14  
11.14  
13.14  
15.14  
17.14  
03.6  
04.0  
04.4  
05.6  
06.4  
07.6  
09.6  
11.6  
13.6  
15.6  
1.20  
1.20  
1.20  
1.20  
1.36  
1.60  
2.00  
2.40  
2.80  
3.20  
DF30FC-20DP-0.4V **  
CL684-1138-6-**  
CL684-1139-9-**  
CL684-1140-8-**  
CL684-1141-0-**  
CL684-1142-3-**  
CL684-1079-9-**  
CL684-1143-6-**  
CL684-1083-6-**  
CL684-1077-3-**  
CL684-1144-9-**  
(
DF30FC-22DP-0.4V **  
(
DF30FC-24DP-0.4V **  
(
DF30FC-30DP-0.4V **  
(
DF30FC-34DP-0.4V **  
(
DF30FC-40DP-0.4V **  
(
DF30FC-50DP-0.4V **  
(
DF30FC-60DP-0.4V **  
(
DF30FC-70DP-0.4V **  
(
DF30FC-80DP-0.4V **  
Note 1: Order by number of reels.  
Note 2: Headers with 24 or fewer contacts positions will not have protruding areas.  
6
BPackaging Specification  
Embossed Carrier Tape Dimensions - Receptacle  
F-F  
(2.3)  
2
0.1  
4
1.4 0.15  
0.3 0.1  
8
0.1  
0.1  
F
A
A
F
G
G
Unreeling direction  
H
G-G  
1.7+0.25  
-0.05  
1.5+0.2  
-0  
Detail H  
Reel Dimensions  
Unreeling direction  
2
0.5  
Part number label  
D+2  
0
E MAX  
Unit: mm  
Part Number  
A
B
C
D
E
(
)
)
)
)
)
)
)
)
)
)
16.0  
16.0  
16.0  
16.0  
16.0  
24.0  
24.0  
24.0  
24.0  
32.0  
07.5  
07.5  
07.5  
07.5  
07.5  
11.5  
11.5  
11.5  
11.5  
14.2  
16.4  
16.4  
16.4  
16.4  
16.4  
24.4  
24.4  
24.4  
24.4  
32.4  
22.4  
22.4  
22.4  
22.4  
22.4  
30.4  
30.4  
30.4  
30.4  
38.4  
DF30#-20DS-0.4V **  
(
DF30#-22DS-0.4V **  
(
DF30#-24DS-0.4V **  
(
DF30#-30DS-0.4V **  
(
DF30#-34DS-0.4V **  
(
DF30#-40DS-0.4V **  
(
DF30#-50DS-0.4V **  
(
DF30#-60DS-0.4V **  
(
DF30#-70DS-0.4V **  
(
28.4  
DF30#-80DS-0.4V **  
Embossed tape 32mm or wider will have perforated feed holes on two sides.  
7
Embossed Carrier Tape Dimensions - Header  
E-E  
(2.2)  
1.3 0.15  
0.3 0.1  
2
0.1  
4
0.1  
8 0.1  
E
A
A
A
F
F
E
Unreeling direction  
F-F  
Reel Dimensions  
Unreeling direction  
2
0.5  
Part number label  
C+2  
0
D MAX  
Unit: mm  
D
Part Number  
A
B
C
(
)
)
)
)
)
)
)
)
)
)
16.0  
16.0  
16.0  
16.0  
16.0  
16.0  
24.0  
24.0  
24.0  
24.0  
07.5  
07.5  
07.5  
07.5  
07.5  
07.5  
11.5  
11.5  
11.5  
11.5  
16.4  
16.4  
16.4  
16.4  
16.4  
16.4  
24.4  
24.4  
24.4  
24.4  
22.4  
22.4  
22.4  
22.4  
22.4  
22.4  
30.4  
30.4  
30.4  
30.4  
DF30#-20DP-0.4V **  
(
DF30#-22DP-0.4V **  
(
DF30#-24DP-0.4V **  
(
DF30#-30DP-0.4V **  
(
DF30#-34DP-0.4V **  
(
DF30#-40DP-0.4V **  
(
DF30#-50DP-0.4V **  
(
DF30#-60DP-0.4V **  
(
DF30#-70DP-0.4V **  
(
DF30#-80DP-0.4V **  
8
BUsage Recommendations  
1. Recommended temperature profile  
Reflow Conditions  
(Temperature)  
250ç  
10 sec. max  
Preheating: 150ç to 170ç 60 to 120 sec.  
Soldering: 245 5ç  
220ç  
10 sec. max.  
60 sec. max.  
250ç max.  
220ç  
200ç  
150ç  
100ç  
50ç  
60 to 120 sec.  
60 sec. max.  
0ç  
0 sec.  
50 sec.  
100 sec.  
150 sec. (Time)  
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is  
a return to normal temperature between the first and second cycle.  
Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the  
connector terminals.  
2. Recommended manual soldering  
Manual soldering: 290 10ç for 3 seconds  
3. Recommended screen thickness and  
open area ratio (Pattern area ratio)  
4.Board warpage  
Thickness: 0.12 mm  
Opening are ratio: DS side 100%, DP side 84%  
Maximum of 0.02 mm at the connector center, with both ends of the connector as reference points.  
Refer to "Nylon Connector Use Handbook".  
5.Cleaning conditions  
6. Precautions  
Due to the extremely small size of the connectors, handling it with bare hands should  
be avoided. Follow the recommendations given on the proceeding pages.  
Use of fluxes is NOT recommended.  
Different production lots may exhibit some discoloration of the insulator material. This  
will not affect form, fit or function of the connectors.  
The connectors should not be used a sole PCB support. It is recommended to use  
additional means of board support.  
9
BHandling Precautions when mating the connectors  
0.3mm  
0.3mm  
Receptacle  
Keep the connectors parallel to each other when positioning.  
Header  
Do not attempt to mate the connectors starting at one end or side.  
Press-down evenly until slight resistance is felt.  
Overcoming this slight resistance will complete the mating of  
receptacle with the header.  
A definite "click" sensation will confirm the fully mated condition.  
10  
BHandling Precautions when un-mating the connectors  
DF30*-*DS-0.4V(81)  
Fully mated  
DF30*-*DP-0.4V(81)  
Receptacle  
Lift even one side, keeping both boards parallel to each other.  
Header  
When handling circumstances prevent the connector from being  
kept level during un-mating, one end may be lifted separate as  
shown on Fig. A.  
However, to utilize this procedure the connector must be mounted  
on a sufficiently rigid circuit board.  
Any deflection of the board during this operation may result in  
damage to the connector or solder joints.  
Do not attempt the start of the un-mating of the connectors from one  
side (Fig. B).  
Fig. A  
Fig. B  
When removal is from the width orientation as illustrated in the  
diagram to the left, damage could be caused to the connector. Do  
not perform removal from the width orientation.  
11  

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