DF30RC-34DP-0.4V(82) [HRS]
Board Connector;
| 型号： | DF30RC-34DP-0.4V(82) |
| 厂家： | 
HRS |
| 描述： | Board Connector 连接器 |
| 文件： | 总8页 (文件大小：527K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
DF30 Series
Space-saving design
Connector footprint is minimized.
<40 contacts, mated>
(0.90)
Fig.1
Features
High contact reliability
1. High-density mounting
This connector offers a space-saving design that
reduces the connector footprint.
The low stacking height of 0.9 mm is highly suited for
applications that require a low mounted height. (Fig.1)
2. High contact reliability
DF30*-*DP-0.4V
Projections on the header terminals increase the
wiping ability and provide superior mating reliability.
During mating, the projections of the header
terminals produce a tactile click, which helps to
confirm proper insertion. (Fig.2)
3. Self-alignment feature
DF30*-*DS-0.4V
A self-alignment range of 0.3 mm is provided on the
receptacle and allows for easier mating in tight
spaces. (Fig.3)
Projections on the header
strengthen mating retention.
4. Wide selection of pin counts
Fig.2
Standard pin counts are 20, 22, 24, 30, 34, 40, 50,
60, 70, and 80 positions. Smaller pin counts are
also available that are applicable to LCD and
camera modules in cell phones.
Wide self-alignment range: 0.3 mm
In addition, reinforced types are available for each
pin count model. (The external shape is the same
for both standard and reinforced types.)
5. Suitable for automatic mounting
0.3mm
Although this connector is extremely small, it still
has a sufficient vacuum area for pick-and-place
machines to hold the part.
Receptacle area: 1.12 mm
Header area: 1.11 mm
6.Test connectors
Highly durable test connectors are available which
allow mounted production parts to be tested for
electrical performance. Test connectors feature a
higher number of insertions and removals cycles.
These test connectors are for test purposes only
and cannot be used for production requirements.
For details, please contact your Hirose sales
representative.
Fig.3
1
2015.1w
DF30 Series●0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
Product Specifications
Operating temperature range : -35ç to 85ç (Note 1)
Storage temperature range -10ç to 60ç (Note 2)
Storage humidity range Relative humidity 40% to 70% (Note 2)
Rated current 0.3A
Rating
Rated voltage 30V AC
Operating humidity range
: Relative humidity 20% to 80%
Item
1. Insulation resistance 50 Mø min.
2. Withstanding voltage No flashover or insulation breakdown.
Specification
Conditions
100V DC
100V AC / one minute
3. Contact resistance
100 mø max.
100 mA
Frequency: 10 to 55 Hz, single amplitude of
0.75mm, 2 hours, 3 axis
96 hours at temperature of 40ç 2ç and RH of
90% to 95%
4. Vibration
No electrical discontinuity of 1 µs or more
Contact resistance: 100 mø max.
Insulation resistance: 25 Mø min.
5. Humidity
Temperature: -55ç +5ç to +35ç +85ç +5ç to +35ç
Duration: 30 10 30 10(Minutes)
➝ ➝ ➝
5 cycles
➝
➝
➝
Contact resistance: 100 mø max.
Insulation resistance: 50 Mø min.
6. Temperature cycle
7. Durability
(insertions/withdrawals)
50 cycles
Contact resistance: 100 mø max.
(Connector for conductivity tests: 500 cycles)
8. Resistance to
soldering heat
No deformation of components affecting
performance.
Reflow: At the recommended temperature profile
Manual soldering: 350ç for 3 seconds
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating temperature range
and humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation.
Materials
Connectors
Receptacles
and
Component
Insulator
Contacts
Material
LCP
Phosphor bronze
Phosphor bronze
Finish
Remarks
UL94V-0
-------------
-------------
Color : Black
Gold plated
Tin plated
Headers
Metal fittings
Product Number Structure
Receptacles and Headers
( )
**
u
DF30 FC * DS - 0.4 V
q
w
e
r
t
y
qSeries name: DF30
wConfiguration
FB/RB: With metal fittings, without bosses
FC/RC: Without metal fittings, without bosses
CJ: Connector for conductivity tests
tContact pitch: 0.4 mm
yTermination section
V: Straight SMT
Packaging
u
(81): Embossed tape packaging (5,000 pcs/reel)
(82): Embossed tape packaging (1,000 pcs/reel)
e
Number of contacts: 20, 22, 24, 30, 34, 40, 50, 60, 70, 80
rConnector type
DS: Double row receptacle
DP: Double row header
2
DF30 Series●0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
A
B
Receptacles (with metal fittings)
Note 2
P=0.4
0.15
C
Flat surface HRS logo
CAV. NO.
2.54
Metal fittings
E+0.05
D -0.05
0
0
BRecommended PCB
B
0.02
mounting pattern
P=0.4 0.02
(
)
[Specification number] -**, **
(
):
(
)
)
81 Embossed tape packaging 5,000 pcs/reel
(
):
(
82 Embossed tape packaging 1,000 pcs/reel
0.23 0.02
Recommended solder paste thickness: 120 μm
Unit: mm
RoHS
Part No.
HRS No.
No. of contacts
A
B
C
D
E
DF30FB-20DS-0.4V(
DF30FB-22DS-0.4V(
DF30FB-24DS-0.4V(
DF30FB-30DS-0.4V(
DF30FB-34DS-0.4V(
DF30FB-40DS-0.4V(
DF30FB-50DS-0.4V(
DF30FB-60DS-0.4V(
DF30FB-70DS-0.4V(
DF30FB-80DS-0.4V(
)
)
)
)
)
)
)
)
)
)
**
**
**
**
**
**
**
**
**
**
684-1098-3 **
684-1099-6 **
684-1100-3 **
684-1101-6 **
684-1102-9 **
684-1103-1 **
684-1104-4 **
684-1105-7 **
684-1106-0 **
684-1107-2 **
20
22
24
30
34
40
50
60
70
80
6.22
6.62
7.02
8.22
3.6
4.0
4.4
5.6
6.4
7.6
9.6
11.6
13.6
15.6
5.72
6.12
6.52
7.72
8.52
9.72
11.72
13.72
15.72
17.72
6.52
6.92
7.32
8.52
1.2
9.02
1.36
1.6
2.0
2.4
2.8
3.2
9.32
Yes
10.22
12.22
14.22
16.22
18.22
10.52
12.52
14.52
16.52
18.52
Note 1: Order by number of reels.
Note 2: Receptacles with 24 or fewer contacts positions will not have recessed areas.
Receptacles (without metal fittings)
A
B
(
)
[Specification number] -**, **
(
):
(
)
)
81 Embossed tape packaging 5,000 pcs/reel
Note 2
P=0.4
(
):
(
82 Embossed tape packaging 1,000 pcs/reel
C
Flat surface
CAV. NO.
0.15
HRS logo
Unit: mm
No. of
contacts
20
BRecommended PCB
Part No.
HRS No.
A
B
C
RoHS
mounting pattern
DF30FC-20DS-0.4V(**) 684-1109-8 **
DF30FC-22DS-0.4V(**) 684-1110-7 **
DF30FC-24DS-0.4V(**) 684-1111-0 **
DF30FC-30DS-0.4V(**) 684-1112-2 **
DF30FC-34DS-0.4V(**) 684-1113-5 **
DF30FC-40DS-0.4V(**) 684-1078-6 **
DF30FC-50DS-0.4V(**) 684-1114-8 **
DF30FC-60DS-0.4V(**) 684-1082-3 **
DF30FC-70DS-0.4V(**) 684-1115-0 **
DF30FC-80DS-0.4V(**) 684-1116-3 **
6.22 3.6
6.62 4.0
7.02 4.4
8.22 5.6
9.02 6.4 1.36
10.22 7.6
12.22 9.6
14.22 11.6 2.4
16.22 13.6 2.8
18.22 15.6 3.2
22
24
30
34
40
50
60
70
B
0.02
1.2
P=0.4 0.02
Yes
1.6
2.0
0.23 0.02
80
Recommended solder paste thickness: 120 μm
Note 1: Order by number of reels.
Note 2: Receptacles with 24 or fewer contacts positions will not have recessed areas.
3
DF30 Series●0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
A
B
Header (with metal fittings)
P=0.4
Note 2
Note 2
HRS logo
CAV. NO.
C
Flat surface
0.15
1.1
Metal fittings
Recommended PCB mounting pattern
E+0.05
0
0
D-0.05
B
0.02
P=0.4 0.02
(
)
[Specification number -**, **
(
(
):
(
)
)
81 Embossed tape packaging 5,000 pcs/reel
):
(
82 Embossed tape packaging 1,000 pcs/reel
0.23 0.02
Recommended solder paste thickness: 120 μm
Unit: mm
Part No.
HRS No.
No. of contacts
A
B
C
D
E
RoHS
DF30RB-20DP-0.4V(**) 684-1279-8 **
DF30RB-22DP-0.4V(**) 684-1280-7 **
DF30RB-24DP-0.4V(**) 684-1281-0 **
DF30RB-30DP-0.4V(**) 684-1282-2 **
DF30RB-34DP-0.4V(**) 684-1283-5 **
DF30RB-40DP-0.4V(**) 684-1284-8 **
DF30RB-50DP-0.4V(**) 684-1286-3 **
DF30RB-60DP-0.4V(**) 684-1287-6 **
DF30FB-70DP-0.4V(**) 684-1075-8 **
DF30FB-80DP-0.4V(**) 684-1136-0 **
20
22
24
30
34
40
50
60
70
80
5.14
5.54
5.94
7.14
7.94
9.14
11.14
13.14
15.14
17.14
3.6
4.0
4.4
5.6
6.4
7.6
9.6
11.6
13.6
15.6
4.64
5.04
5.44
6.64
7.44
8.64
10.64
12.64
14.64
16.64
5.44
5.84
6.24
7.44
8.24
9.44
11.44
13.44
15.44
17.44
1.2
1.36
1.6
2.0
2.4
2.8
3.2
Yes
Note 1: Order by number of reels.
Note 2: Headers with 24 or fewer contacts positions will not have protruding areas.
Header (without metal fittings)
A
B
(
)
[Specification number] -**, **
P=0.4
(
(
):
(
)
)
81 Embossed tape packaging 5,000 pcs/reel
Note 2
Note 2
):
(
82 Embossed tape packaging 1,000 pcs/reel
HRS logo
CAV. NO.
C
Flat surface
0.15
Unit: mm
No. of
contacts
20
BRecommended PCB
Part No.
HRS No.
A
B
C
RoHS
mounting pattern
DF30RC-20DP-0.4V(**) 684-1268-1 **
DF30RC-22DP-0.4V(**) 684-1269-4 **
DF30RC-24DP-0.4V(**) 684-1270-3 **
DF30RC-30DP-0.4V(**) 684-1271-6 **
DF30RC-34DP-0.4V(**) 684-1272-9 **
DF30RC-40DP-0.4V(**) 684-1273-1 **
DF30RC-50DP-0.4V(**) 684-1275-7 **
DF30RC-60DP-0.4V(**) 684-1276-0 **
DF30FC-70DP-0.4V(**) 684-1077-3 **
DF30FC-80DP-0.4V(**) 684-1144-9 **
5.14 3.6
5.54 4.0
5.94 4.4
7.14 5.6
7.94 6.4 1.36
9.14 7.6
11.14 9.6
13.14 11.6 2.4
15.14 13.6 2.8
17.14 15.6 3.2
22
24
30
34
40
50
60
70
1.2
B
0.02
P=0.4 0.02
Yes
1.6
2.0
80
0.23 0.02
Note 1: Order by number of reels.
Recommended solder paste thickness: 120 μm
Note 2: Receptacles with 24 or fewer contacts positions will not have recessed areas.
4
DF30 Series●0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
Packaging Specification
Embossed Carrier Tape Dimensions - Receptacle
Reel Dimensions
F-F
(1.7)
1.4 0.15
0.3 0.1
Part number label
Unreeling direction
8
0.1
0.1
4 0.1
2
F
A
A
D
E
0.5
1
H
F
G
G
Unit: mm
E
Unreeling direction
Part No.
A
B
C
D
H
G-G
DF30#-20DS-0.4V(**)
DF30#-22DS-0.4V(**)
DF30#-24DS-0.4V(**)
DF30#-30DS-0.4V(**)
DF30#-34DS-0.4V(**)
DF30#-40DS-0.4V(**)
DF30#-50DS-0.4V(**)
DF30#-60DS-0.4V(**)
DF30#-70DS-0.4V(**)
DF30#-80DS-0.4V(**)
16.0
7.5
17.5
21.5
—
24.0
32.0
11.5
14.2
25.5
33.5
29.5
37.5
28.4
Embossed tape 32mm or wider will have perforated feed holes on two sides.
Embossed Carrier Tape Dimensions - Header
Reel Dimensions
E-E
(1.6)
Part number label
4
0.1
8
0.1
1.3 0.15
0.3 0.1
Unreeling direction
2
0.1
E
A
A
C
0.5
1
D
E
F
F
Unreeling direction
Unit: mm
D
Part No.
A
B
C
F-F
DF30#-20DP-0.4V(**)
DF30#-22DP-0.4V(**)
DF30#-24DP-0.4V(**)
DF30#-30DP-0.4V(**)
DF30#-34DP-0.4V(**)
DF30#-40DP-0.4V(**)
DF30#-50DP-0.4V(**)
DF30#-60DP-0.4V(**)
DF30#-70DP-0.4V(**)
DF30#-80DP-0.4V(**)
16.0
7.5
17.5
21.5
29.5
24.0
11.5
25.5
5
DF30 Series●0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
Usage Recommendations
1. Recommended temperature
● Ordinary solder cream
profile
250
240
220
200
10 to 20 sec.
Soldering
150
100
60 to 90 sec.
Preheating
Time (seconds)
● Lead-free solder cream
10 seconds or less
250
200
150
100
230
60 seconds or less
Soldering
150
60 to 120 sec.
Preheating
Time (seconds)
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is a
return to normal temperature between the first and second cycle.
Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the
connector terminals.
2. Recommended manual soldering Manual soldering: 340 10ç for 3 seconds
3. Recommended screen thickness Thickness: 0.12 mm
and open area ratio
Opening are ratio: DS side 100%, DP side 84%
(Pattern area ratio)
4. Board warpage
Maximum of 0.02 mm at the connector center, with both ends of the connector as
reference points.
5. Cleaning conditions
6. Precautions
Please refer to the “Handbook on the Use of Wire-to-Board Connectors”.
■ Terminals are exposed on the header side. Please note that touching them with bare
hands causes contact failure or static electricity, resulting in damage to the components.
■ Note that mating/unmating when the product is not mounted on the PCB could cause
damage or deformation of the terminal.
■ Avoid supporting the PCB using only the connectors. Other means of support are
needed.
■ Care should be taken that excessive prying during mating/unmating could cause
damage.
■ In the case of hand soldering, please do not apply any flux, which could cause flux
wicking.
■ The product may differ slightly in color due to different production lots of the resin. This
color variation has no influence on the performance.
■ Please refer to the next page for the precautions for mating/unmating.
■ Care should be taken to secure the mated connector and FPC within the device with
housings and cushioning materials. This will help prevent disconnections or unmating in
the event of dropping, other external forces or stressed routing of the FPC.
6
DF30 Series●0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
Handling Precautions when mating the connectors
DF30*-*DS-0.4V(**)
DF30*-*DP-0.4V(**)
0.3mm
0.3mm
Receptacle
Keep the connectors parallel to each other when
positioning.
Header
Do not attempt to mate the connectors starting at one
end or side.
Press-down evenly until slight resistance is felt.
Overcoming this slight resistance will complete the
mating of receptacle with the header.
A definite "click" sensation will confirm the fully mated
condition.
7
DF30 Series●0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
DF30*-*DS-0.4V(**)
Fully mated
DF30*-*DP-0.4V(**)
Receptacle
Lift even one side, keeping both boards parallel to
each other.
Header
When handling circumstances prevent the connector
from being kept level during un-mating, one end may
be lifted separate as shown on Fig. A.
However, to utilize this procedure the connector must
be mounted on a sufficiently rigid circuit board.
Any deflection of the board during this operation may
result in damage to the connector or solder joints.
Do not attempt the start of the un-mating of the
connectors from one side (Fig. B).
Fig. A
Fig. B
When removal is from the width orientation as
illustrated in the diagram to the left, damage could be
caused to the connector. Do not perform removal from
the width orientation.
®
2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN
+
+
TEL: 81-45-620-3526 Fax: 81-45-591-3726
http://www.hirose.com
http://www.hirose-connectors.com
The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use.
The contents of this catalog are current as of date of 1/2015. Contents are subject to change without notice for the purpose of improvements.
8
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