HD-19003S-06 [HRS]
1850 MHz - 1950 MHz RF/MICROWAVE 90 DEGREE HYBRID COUPLER;
| 型号： | HD-19003S-06 |
| 厂家： | 
HRS |
| 描述： | 1850 MHz - 1950 MHz RF/MICROWAVE 90 DEGREE HYBRID COUPLER 射频 微波 |
| 文件： | 总2页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Subminiature ceramic couplers (suited to SMT)
HD-S Series
ꢀFeatures
1.Subminiature design
Hirose Electric's expertise in miniaturization and
matching technology has permitted a subminiature,
lightweight design.
2.High performance
HD-19003S
HD-21503S
The high frequency characteristics feature
extremely low loss and a high degree of matching
which makes these couplers ideal for a wide variety
of wireless phone base station applications.
3.Suited to Automatic Mounting
Embossed tape packaging permits automatic
mounting.(Individual delivery can also be
accommodated.)
HD-15003S
HD-20003SH
HD-09003S
ꢀProduct specifications
800 to 2300 MHz
50ø
Frequency range (NOTE)
Characteristic impedance
Maximum usable power (NOTE)
_10ç to +65ç
95% or less
Operating temperature range
Operating relative humidity
Rating
10 to 50 W
NOTE: The frequency range and the maximum usable power will differ depending on the model.
Item
Standard
Conditions
Measured at 100 V DC
1.Insulation resistance 1000 Mø min.
2.Vibration resistance No electrical disconnections of 1µs or greater
Contact resistance: 1000 mø max.
Frequency of 10 to 500 Hz, overall amplitude of 1.52 mm,
98 m/s acceleration, in 3 axial directions, 2 hours each
2
No damage, cracks, or parts looseness
2
3.Shock resistance
No electrical disconnections of 1µs or greater
Contact resistance: 1000 mø max.
980 m/s acceleration, half sine wave, in 3 axial directions,
3 times each
No damage, cracks, or parts looseness
4.Temperature cycle Contact resistance: 1000 mø or less
Insulation resistance: 1000 Mø min.
(
_
55
ç
: 30 min.
ꢀ
5 to 35 : Within 15 min.
ç
ꢀ
85
ç
: 30 min.
ꢀ
5 to 35ç: Within 15min.) for 200 cycles
No damage, cracks, or parts loosenes
ꢀThe test method conforms to MIL-STD-202.
ꢀMaterials
ꢀRecommended board pattern
Part
Material
Ceramic
Processing
Case
Solder plating
ꢀProduction number breakdown
HD - 090 03 S
1
2
3
4
1
Series Name: HD (Directional Couplers) 3 Degree of Coupling
03 : 3dB
10 : 10dB
2 Center Frequency
090 : 900MHz
150 : 1500MHz
190 : 1900MHz
200 : 2000MHz
215 : 2150MHz
16 : 16dB
21 : 21dB
23 : 23dB
4
Board Mounting Method
SH : SMT
SH : SMT High Power
ꢀResist processing should be performed around the electrode pads.
1
ꢀSpecifications
(MHz)
Frequency
Range
(dBMax)
Insertion
Loss
(dB Min) (dB Min)
Isolation Directivity V.S.W.R. Weight Power
(Max)
(g)
(W)
(dB)
Coupling
Frequency
Sensitivity
Model No.
HD-09003S
HD-09010S
HD-09016S
HD-09023S
HD-15003S
HD-15010S
HD-15016S
HD-15021S
HD-19003S
HD-21503S
0800~1000
0840~1960
0840~1960
0840~1960
1400~1600
1400~1600
1400~1600
1400~1600
1850~1950
1900~2300
3+0.4
0
0.35
0.4
0.4
0.4
0.35
0.4
0.4
0.4
0.5
0.5
0.4
-----
0.4
0.4
0.4
-----
20
-----
-----
-----
20
-----
-----
-----
20
20
20
-----
15
15
15
-----
15
10
10
-----
-----
-----
1.22
1.3
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.7
10
20
20
20
10
20
20
20
20
20
50
10 1
16 1
23 1
1.3
1.3
3+0.4
0
1.2
11 1
16 1
21 1
0.4
0.4
0.4
-----
1.25
1.35
1.35
1.2
3+0.4
3+0.4
3+0.4
0
0
-----
1.25
1.25
HD-20003SH 1900~2200
0
-----
°
ꢀThe coupling loss component is not included in the insertion loss. ꢀThere is a 90 phase difference between the output and the coupling.
ꢀWhen ordering embossed tape packaged items, affix (06) to the end of the product number. One reel contains 1,000 pieces.
ꢀExternal dimensions
HD-09003S HD-09023S HD-15016S HD-21503S
HD-09010S HD-15003S HD-15021S
HD-20003SH
HD-09016S HD-15010S HD-19003S
Degree of Coupling
A
2.6
1.6
1.6
1.8
1.8
3dB
10dB
16dB
21dB
23dB
input port
ꢀUsage precautions
1.Soldering
(1)Recommended temperature profile
1Up to two cycles are permitted at the same conditions provided that the item is at room
temperature between the first and second cycle.
2The temperature indicates the board surface temperature of the contact lead portion.
3Reflow soldering should be performed at a peak temperature of 240ç or less at the surface of the
printed circuit board.
4The temperature profile will change depending on the conditions which include board size, solder
used, and solder thickness.
(2)Recommended hand soldering conditions
(3)Recommended screen thickness
Soldering iron temperature: 350ç,Soldering time: Within 5 s
0.15 mm
2.Product Storage
1After opening the package reseal promptly or store in a desiccator with a desiccant.
2Store in a place that is not exposed to harmful gases which include sulfur or chlorine, etc.
3Use within one year of delivery.
2
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HRS
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