IC15A-PDR-SF-EJL [HRS]

PCMCIA Connector, 68 Contact(s), 2 Row(s), Female, Right Angle, Surface Mount Terminal;
IC15A-PDR-SF-EJL
型号: IC15A-PDR-SF-EJL
厂家: HRS    HRS
描述:

PCMCIA Connector, 68 Contact(s), 2 Row(s), Female, Right Angle, Surface Mount Terminal

PC 连接器
文件: 总9页 (文件大小:253K)
中文:  中文翻译
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PC Card Single Slot SMT Connectors for the AV Market (that Support 5 V Cards)  
IC15 Series  
Reliable card ejection  
2-point card ejection  
IC15A  
Equipment outline  
Three-stage card ejection  
Features  
1. Reliable card ejection  
IC15: When card is inserted.  
IC15: When card is not inserted.  
Button does not protrude.  
Designed for the front mounted Audio/Visual equipment  
the connectors eject the inserted card by applying force  
equally at each edge of the card (distance of 6 mm  
minimum), allowing easy hold of the card for the final  
removal.  
Button does not protrude.  
In use  
Press ejection button.  
Ejection button pressed by mistake.  
Button is inserted.  
Button is released, protrudes for card ejection.  
Card is ready  
for ejection  
2. New three-stage “Pop-Up” card ejection  
mechanism  
Ejection button does not protrude.  
Press ejection button.  
The button does not protrude without the card being  
inserted, preventing it’s damage when carrying the  
portable devices.  
Card is ready for ejection  
Damage prevention of  
ejection button.  
Card ejected  
3. Secure board retention  
Built-in 4 points of board retention posts assure that the  
card insertion shock is not transferred to the solder joints.  
4. Supports lead-free environments  
All components use lead-free materials.  
Applications  
DVD recorders, LCD TVs, PDP and other digital AV equipment  
A60  
Product Specifications  
Current rating  
Ratings  
0.5A  
125V AC  
Operating temperature range  
Operating humidity range  
ç
ç
Storage temperature range  
Storage humidity range  
ç
ç
-55 to +85 (Note 1)  
-40 to +70 (Note 1)  
Relative humidity 95% max.  
(No condensation)  
Voltage rating  
40% to 70% (Note 1)  
Item  
Specifications  
Conditions  
11. Insulation resistance  
12. Withstanding voltage  
13. Contact resistance  
500 V DC  
100 Mø min.  
500 V AC / one minute  
1mA DC  
No flashover or insulation breakdown.  
60 mø max. (Initial value)  
Frequency: 10 to 2000 Hz, single amplitude of 1.52 mm or  
acceleration of 147m/s2(peak), 4 hours / 3 axis  
14. Vibration  
No electrical discontinuity of 100 ns or more.  
Insulation resistance: 100 Mø min.  
15. Humidity  
96 hours at temperature of 40ç 2ç and humidity of 90% to 95%  
+
+
+
+
+
Temperature: -55ç 5ç to 35ç 85ç 5ç to 35ç  
Duration: 30 5 max. 30 5 max. (Minutes) 5 cycles  
10000 cycles at 400 to 600 cycles per hour  
Reflow: At the recommended temperature profile  
Manual soldering: 300 ç for 3 seconds  
16. Temperature cycle  
17. Durability (mating/unmating)  
18.Resistance to soldering heat  
Insulation resistance: 100 Mø min.  
Contact resistance: 20mø max. from initial value  
No deformation of any component. No affect on contacts.  
Note 1: Includes temperature rise caused by current flow.  
Note 2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity  
range covers non- conducting condition of installed connectors in storage, shipment or during transportation.  
Materials/Finish  
SMT unit  
Component  
Insulator  
Material  
Finish  
Remarks  
UL94V-0  
Heat resistant thermoplastic compound  
Color: Black  
Contact area: Gold plated  
Termination area: Tin plated  
-------------  
Contacts  
Brass  
-------------  
-------------  
-------------  
Ground/eject metal fittings  
Positioning pin  
Stainless steel  
Brass  
Tin plated  
Guide unit  
Component  
Material  
PBT  
Finish  
Remarks  
Frame  
Color: Black  
-------------  
UL94V-0  
-------------  
Cover/Metal components  
Spring  
Stainless  
Stainless steel  
ABS  
-------------  
-------------  
Ejection button  
Color: Gray  
UL94V-HB  
Note: Lead free products  
A61  
Ordering information  
SMT unit  
IC15 A - PDR - SF M - EJL  
1
2
3
4
5
6
1
2
Series name: IC15  
4
5
SF: Right angle surface mount  
M: With Vacuum pick-up plate  
Stand off height  
A: 2.2mm  
6
Ejection button type  
EJL: Left button eject  
Terminal type  
PDR: Reverse type (5V type)  
3
Guide unit  
IC15 A - G - P EJL  
7
8
9
10  
11  
7
8
Series name:IC15  
10  
11  
Eject mechanism codes  
P: Pop-up button  
Stand off height  
A: 2.2mm  
Ejection button type  
EJL: Left button eject  
9
G: Guide unit  
Note: One SMT unit and one Guide unit constitute one assembly. They can not be ordered separate.  
A62  
Reverse type  
Left Pop-up button type  
3
59.5  
Eject metal components movable range  
No.35  
No.2  
No.36  
35.75MAX  
No.34  
1
SMT unit (  
)
No.1  
2.6  
No.68  
2.4  
3
59.1(Mounting screw pitch)  
Eject metal  
components  
movable range  
15L  
10MAX  
3
54(PC card width)  
Guide unit ( 2 )  
7
28.2  
Outline of the PC card  
37MAX  
Eject metal components movable range  
29MIN  
C
No.35  
No.68  
No.36  
No.2  
No.34  
No.1  
SMT unit (1)  
Stand off height  
Part Number  
Guide unit (2)  
Weight (g)  
CL No.  
Part Number  
CL No.  
IC15A-PDR-SF-EJL  
IC15A-PDR-SFM-EJL  
CL640-1500-7  
CL640-1502-2  
18.4  
18.7  
2.2mm  
IC15A-G-PEJL  
CL640-1503-5  
1: Above illustration shows the SMT unit and the Guide unit connected together.  
2: Dimensions for card fitting are in accordance with “PC card standard”.  
3 Indicated dimensions are symmetrical to the center of the card insertion slot.  
A63  
BPCB mounting pattern  
Reverse type  
Stand off 2.2mm  
2.65 0.05  
55.05 0.05  
Mounting area  
1
52.4 0.05  
Edge of the inserted PC card  
Ø1.9+0.1 (Plated through hole)  
0
Ø1.9+0.1 (Plated through hole)  
0
55.75 0.05  
3.35 0.05  
Metal fitting mounting area  
C
1
52.9MAX  
59.1 0.05  
66.8MIN  
1
1
Note 1 Indicated dimensions are symmetrical to the center of the card insertion slot.  
BPCB mounting pattern (Enlarged detail)  
Reverse type  
47.4725 0.05  
4.9275 0.05  
No.68  
No.34  
No.1  
No.2  
68-0.37 0.03  
P=0.635 0.03  
Ø1.65 0.05  
No.35  
Ø1.65 0.05  
A64  
BMethod of Attachment to the Board and Precautions  
(1) Exercise caution when handling the Guide unit.  
(1) If needed, re-position the push rod or the stroke arm as indicated in Fig.1  
SMT unit  
Guide unit  
A
A
Push rod  
PAL  
Stroke arm  
PCB outline  
Fig. 1  
(2 : 1)  
(2 : 1)  
A
A
Interference  
Interference  
Fig. 2  
A65  
(2) Align the left and right locking tabs (Fig. 4) of the Guide unit shield plate with the left and right openings on the SMT unit  
insulator. (Fig. 3)  
Shield plate  
A
Pushrod  
Stroke arm  
PAL  
Fig. 3  
Opening  
A
Locking tabs  
Shield plate  
Protrusions  
SMT unit  
PCB  
Fig. 4  
A66  
(3) Assuring the correct alignment firmly press-down the shield plate of the Guide unit (at the areas “A”) into the SMT unit until a  
loud “click” sound is heard. Both units should be now firmly locked together.  
Area A  
Spring area – do not touch  
A
Area A  
Note 1: When placing the Guide unit over the SMT unit, DO NOT press on any other area than “A”.  
(4) Attach the Guide unit in two places using recommended screws (Not supplied).  
PAL  
Screw description  
Recommended Fastening Torque  
M2∞0.4  
0.12~0.16 (N • m)  
Note 2: When attaching the screws exercise caution not to deform the shield plate.  
Note 3: Do not insert/eject the PC card before the SMT unit and the Guide unit are fully mounted and locked.  
Note 4: Metal components of these connector assemblies have sharp edges. Use caution when handling and assembling.  
Note 5: Slight tool marks or cleaning fluid residue on the surfaces of the Guide unit will not affect form, fit or function of the assemblies.  
A67  
BRecommended temperature profile  
250ç(PEAK)  
220ç  
250  
200  
150  
100  
50  
170ç  
150ç  
60s(MAX)  
60~120s  
25ç  
0
START  
Time (Seconds)  
Recommended conditions  
• Reflow system: IR reflow  
• Solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Flux content 10.5wt%)  
• Test board: Glass epoxy 80mm∞125mm∞1.6mm thick  
• Metal mask: 0.15mm thick  
The temperature profiles are based on the above conditions.  
In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board  
size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations.  
A68  

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