IC9-68RD-0.635SFA [HRS]
Card Bus Socket Connectors; 卡总线插座连接器
| 型号： | IC9-68RD-0.635SFA |
| 厂家： | 
HRS |
| 描述： | Card Bus Socket Connectors |
| 文件： | 总4页 (文件大小：99K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Card Bus Socket Connectors
IC9 Series
ꢀFeatures
1. Compliant with PC Card Standards
Complies with latest requirements of PC Card
Standard.
2. Repairable
Repairable terminations of connector solder
joints after installation on the board.
3. Lead Offset
Available with two board mounting levels of
terminations, to allow use of different height
components.
ꢀProduct Specifications
Current rating 0.5 A
Operating temperature
Storage temperature
Storage humidity
-55ç to +85ç (Note 1)
-10ç to +60ç (Note 2)
Ratings
Voltage rating 125 V AC Operating humidity
95% R.H. or less (No condensation)
40 to 70% (Note 2)
Item
Specification
1000M ohms min.
Conditions
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
500 V DC
500 V AC / 1 minute
1 mA
No flashover or insulation breakdown.
40 m ohms max. (initial value)
No electrical discontinuity of 100ns or
more
Frequency: 10 to 2000 Hz, single amplitude of 0.75 mm or
acceleration of 147 m/s (peak), 4 hours in each of the 3 directions.
4. Vibration
2
5. Humidity (Steady state) Insulation resistance: 100 M ohms min.
96 hours at temperature of 40ç and humidity of 90% to 95%
-55ç, 30 min/15 to 30ç, within 5 min/85ç30 min
/15 to 35ç, within 5 min, for 5 cycles
6. Temperature cycle
No damage, cracks, or parts looseness.
Change of contact resistance from the
start should be 20 m ohms max.
7. Durability
(Insertion/withdrawal)
10000 cycles at 400 to 600 cycles per hour
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
8. Resistance to
soldering heat
No deformation of components
affecting performance.
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
ꢀMaterials
Part
Material
PA
Finish
Black
Notes
Insulator
UL94V-0
Contact Area : gold plating
Contact
Phosphor bronze
Brass
-----------------
-----------------
Lead Area
Contact Area : gold plating
Lead Area : solder plating
: solder plating
Ground plate
A48
ꢀOrdering Information
IC9 - 68 R D - 0.635 SFA
1
2
3
4
5
6
1
2
3
4
5
6
Series name : IC9
Number of contacts : 68
R : card connector
D : 2-row alignment
Lead pitch : 0.635 mm
Offset type
SF : 0.3 mm offset
SFA : 0.9 mm offset
BLead Offset
ꢀType with 0.3 mm offset
ꢀType with 0.9 mm offset
BMounting Method
1. Place and solder the connector without the ground plate as shown in fig.(a).
2. Place the ground plate over the connector as shown in Fig.(b), making sure that the locking tabs are correctly
aligned with the slots on both sides of the insulator. Press firmly at both ends to assure secure lock.
Note: Care should be taken that the termination leads of the ground plate are not deformed or damaged during
this operation.
3. Solder the termination leads of the ground plate to the board.
A49
ꢀCard Connectors
Part Number
CL No.
A
IC9-68RD-0.635SF
IC9-68RD-0.635SFA
640-0901-2
640-0902-5
0.3
0.9
Socket Connector
Ground Plate
Combined Condition
A50
BPCB mounting pattern
BTemperature Profile
5 s.max
240ç
250
200
200ç
Applicable Conditions
:
:
Reflow system
Solder
IR reflow
Paste type 63 Sn/37 Pb
(Flux content 9 wt%)
160ç
150
150ç
Test board Glass epoxy 60mm x 60mm x 1.6 mm
Metal mask thickness: 0.15 mm
100
Recommended temperature profile.
50
(30s)
The temperature may be slightly changed according to the
solder paste type and amount.
25ç
(20 to 30s)
Soldering
(60 to 90s)
Preheating
(60s)
0
start
60
120
Time(seconds)
A51
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