IT3D-180P-25H03 [HRS]
High-Speed(10+Gbps) BGA Mezzanine Connectors; 高速（ 10 + Gbps）的BGA夹层连接器
| 型号： | IT3D-180P-25H03 |
| 厂家： | 
HRS |
| 描述： | High-Speed(10+Gbps) BGA Mezzanine Connectors |
| 文件： | 总20页 (文件大小：1602K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NEW
High-Speed(10+Gbps) BGA Mezzanine Connectors
IT3 Series
ꢀFlexibility
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and XAUI
as it is in tomorrow’s 10+Gbps systems.
With the ability to transmit differential, single-ended,
and power through one package and being stackable
from 15 – 40mm, IT3 can solve your interface needs
for both current and future generations.
ꢀMechanical features
ꢀ Unique 3-piece structure for flexibility
ꢀ Stacking heights from 15 to 40mm
(*15mmH is 2-piece)
∞
ꢀ Staggered 1.5mm 1.75mm ball grid array
Interposer
Signal Ground
ꢀ Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
ꢀ Differential, single-ended, and power
ꢀ Low mating/extracting forces
ꢀ Wide misalignment tolerances for multiple
connector use
Signal / Ground Configuration
ꢀ Both of SnPb and Pb-free are available
ꢀ Excellent reflow solderability
ꢀSignal integrity features
ꢀ
Insertion loss to Crosstalk Ratio (ICR)
60�
50�
40�
30�
20�
10�
�
0�
�
The ICR performance meets the extrapolated
IEEE 802.3ap specification for 6.25Gbps with
fully-populated pin assignment, and 10+Gbps
with skipped pin assignment.
ICR�
IEEE spec�
-10�
-20�
-30�
-40�
ꢀ Return Loss
The differential return loss meets the
extrapolated IEEE 802.3ap specification
up to 12GHz.
RL�
IEEE Spec�
0�
�
-50��
0�
0�
5�
10�
15�
20�
5�
10�
15�
20�
Frequency (GHz)�
Frequency (GHz)�
ꢀStacking height variations
Stacking Height
17mm
20mm
22mm
25mm
26mm
28mm
30mm
32mm
38mm
40mm
Contact Position
100
200
300
*
*
*
*
* : Under planning
2010.02
1
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀProduct Specifications
Current Rating: 1.0A / pin (note 1)
Operating Temperature Range: -55˚C to +85˚C
Operating Humidity Range: For relative humidity,
90% max (no condensation is permitted)
Rating
Voltage Rating: 50Vrms
Storage Temperature Range: -10˚C to +60˚C
Item
Specification
Conditions
1. Insulation Resistance
2. Withstanding Voltage
100V DC
1000Mø min.
No flashover or insulation breakdown
150V duty for 60 seconds (2mA max leak)
50mø max. (height 15-24mm) (note 2)
55mø max. (height 25-32mm)
60mø max. (height 33-40mm)
1) No electrical discontinuity of 1µs or more
2) No damage, crack, or loose part
3. Contact Resistance
4. Vibration
100mA
Frequency: 20 to 500Hz; power spectrum density: 0.02G2/Hz
Overall rms G: 3.1 Grms; for 15 minutes in three directions
1) Contact resistance change: 20mø or less
2) Insulation resistance: 100Mø min.
3) No damage, crack or loose part
5. Cyclic Temperature
and Humidity
25˚C, 80% RH: 60 min dwell time, 30 min ramp time
65˚C, 50% RH: 60 min dwell time under 24 cycles
6. Durability
(Mating/Un-mating)
1) Contact resistance change: 20mø or less
2) No damage, crack or loose part
100 cycles
Note1: Refer to IT3 derating curves on test report TR636E-20041 for power application.
Note2: The value of contact resistance includes 2 contact points and the bulk resistance.
ꢀMaterial Information
ꢀReceptacle
Component
Material
Finish & Remarks
Housing
Locator
LCP
LCP
Black , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 µm) over Nickel (1.5 µm)
Mounting Area : Gold (0.03 µm) over Nickel (1.5 µm)
Contact
Copper Alloy
Other
: Nickel (1.5 µm)
Tin-Lead (SnPb)
Tin (Pb-Free)
Polystyrene
Sn(63)-Pb(37)
Sn(96.5)-Ag(3)-Cu(0.5)
Black
Solder Ball
Tray
Pick Up Cap
Pick Up Tape
Stainless steel
Paper (Nomex)
300pos
100pos and 200pos
ꢀInterposer
Component
Material
Finish & Remarks
Guide (Mounting Side)
PBT
LCP
PBT
Black , UL 94V-0
Gray , UL 94V-0
Gray , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 µm) over Nickel (1.5 µm)
Other : Nickel (1.5 µm)
Guide (Detachable/Mating Side)
Blade
Contact
Ground Shield
Tray
LCP
Copper Alloy
Copper Alloy
Polypropylene
----------
2
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀOrdering Information
ꢀReceptacle
(
)
IT 3 ** - *** S - BGA ** **
1
2
3
4
5
6
7
ꢀInterposer
(
)
IT 3 ** - *** P - ** H ** **
1
2
3
4
8
6
9
1
2
5
6
Series name : IT3
Receptacle Type
BGA : Ball Grid Array
Package Specification
Blank : Standard
D
: Mating Receptacle
D* : Mating Receptacle ( Customized )
: Mounting Receptacle
** : Customized
7
M
Material and Plating Specification of Receptacle
(37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5)
Contact Area : Au(0.76µm)+Ni(1.5µm)
(57) : Eutectic Solder Sn(63)-Pb(37)
M* : Mounting Receptacle ( Coustomized )
Interposer Type
Blank: Standard
** : Customized
Contact Area : Au(0.76µm)+Ni(1.5µm)
Contact Positions : 100, 180*, 200, 300
*180 pos. is 2 columns depopulated version for
higher voltage proof.
Connector type
S : Receptacle
P : Interposer
Stacking Height (mm)
17, 20, 22, 25, 26, 28, 30, 32, 38, 40
Plating Specification of Interposer
(03) : Contact Area : Au(0.76µm)+Ni(1.5µm)
3
4
8
9
3
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀSignal Integrity
ꢀPin assignment
For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the
figures below. In the following data, one victim pair and eight aggressor pairs are included.
7
4
1
8
5
2
9
6
3
16
13
10
17
14
11
18
15
12
Mating receptacle side
Mounting receptacle side
Signal
Ground
Victim pair
Aggressor pair
ꢀImpedance profile at 60ps rise time (20-80%)
The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles are
designed with higher impedance to offset the via’s low impedance.
115
110
105
100
95
115
110
105
100
95
115
110
105
100
95
S11
1000
S11
1000
S11
1000
0
200
400
600
800
0
200
400
600
800
0
200
400
600
800
Time (ps)
Time (ps)
Time (ps)
25mm Height
32mm Height
17mm Height
ꢀDifferential propagation delay
Stacking Height (mm)
Delay (ps)
17
25
32
101.05
146.69
188.48
4
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀDifferential Insertion Loss
The differential insertion loss is less than -2dB up to 12GHz.
0�
-1�
-2�
-3�
-4�
-5�
-6�
-7�
-8�
-9�
�
0�
-1�
-2�
-3�
-4�
-5�
-6�
-7�
-8�
-9�
�
0�
-1�
-2�
-3�
-4�
-5�
-6�
-7�
-8�
-9�
�
S514�
20�
S514�
20�
S514�
20�
-10��
0�
-10��
0�
-10��
0�
5�
10�
15�
5�
10�
15�
5�
10�
15�
25mm Height
32mm Height
17mm Height
ꢀDifferential Return Loss
The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap spec up to
12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.)
0�
�
0�
�
0�
�
-10�
-10�
-10�
-20�
-30�
-40�
-20�
-30�
-40�
-20�
-30�
-40�
RL�
RL�
RL�
IEEE Spec�
IEEE Spec�
IEEE Spec�
-50��
0�
-50��
0�
-50��
0�
5�
10�
15�
20�
5�
10�
15�
20�
5�
10�
15�
20�
Frequency (GHz)�
Frequency (GHz)�
Frequency (GHz)�
25mm Height
32mm Height
17mm Height
ꢀDifferential Near-End Crosstalk (NEXT)
The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT is not as
critical because TX and RX can be grouped into separate wafers.
0�
-10�
�
0�
-10�
�
0�
-10�
�
S51�
S52�
S53�
S54�
S56�
S57�
S58�
S59�
Sum�
S51�
S52�
S53�
S54�
S56�
S57�
S58�
S59�
Sum�
S51�
S52�
S53�
S54�
S56�
S57�
S58�
S59�
Sum�
-20�
-30�
-40�
-50�
-20�
-30�
-40�
-50�
-20�
-30�
-40�
-50�
-60��
0�
-60��
0�
-60��
0�
5�
10�
15�
20�
5�
10�
15�
20�
5�
10�
15�
20�
Frequency (GHz)�
Frequency (GHz)�
Frequency (GHz)�
25mm Height
32mm Height
17mm Height
5
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀDifferential Far-End Crosstalk (FEXT)
Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower crosstalk
can be achieved by skipping pins.
0�
-10�
�
0�
-10�
�
0�
-10�
�
S141�
S142�
S143�
S144�
S146�
S147�
S148�
S149�
Sum�
S141�
S142�
S143�
S144�
S146�
S147�
S148�
S149�
Sum�
S141�
S142�
S143�
S144�
S146�
S147�
S148�
S149�
Sum�
-20�
-30�
-40�
-50�
-20�
-30�
-40�
-50�
-20�
-30�
-40�
-50�
-60��
0�
-60��
0�
-60��
0�
5�
10�
15�
20�
5�
10�
15�
20�
5�
10�
15�
20�
Frequency (GHz)�
Frequency (GHz)�
Frequency (GHz)�
25mm Height
32mm Height
17mm Height
ꢀInsertion-Loss-to-Crosstalk-Ratio (ICR) for FEXT
The insertion-loss-to-crosstalk-ratio (ICR) for 8-aggressor FEXT meets the extrapolated IEEE 802.3ap
specification up to 12GHz.
60�
50�
40�
30�
20�
10�
�
60�
50�
40�
30�
20�
10�
�
60�
50�
40�
30�
20�
10�
�
ICR�
IEEE spec�
ICR�
IEEE spec�
ICR�
IEEE spec�
0��
0�
0��
0�
0��
0�
5�
10�
15�
20�
5�
10�
15�
20�
5�
10�
15�
20�
Frequency (GHz)�
Frequency (GHz)�
Frequency (GHz)�
25mm Height
32mm Height
17mm Height
6
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀReceptacle
A
Shown: 200 position mating receptacle, IT3M-200S-BGA
*Unit: mm
Contact Positions
Type
Solder Ball Material
Part Number
CL No.
A
Mating
Receptacle
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
IT3D-100S-BGA(37)
IT3D-100S-BGA(57)
IT3M-100S-BGA(37)
IT3M-100S-BGA(57)
IT3D2-180S-BGA(37)
IT3D2-180S-BGA(57)
IT3M2-180S-BGA(37)
IT3M2-180S-BGA(57)
IT3D-200S-BGA(37)
IT3D-200S-BGA(57)
IT3M-200S-BGA(37)
IT3M-200S-BGA(57)
IT3D-300S-BGA(37)
IT3D-300S-BGA(57)
IT3M-200S-BGA(37)
IT3M-200S-BGA(57)
636-0013-1-37
636-0013-1-57
636-0014-4-37
636-0014-4-57
636-0011-6-37
636-0011-6-57
636-0012-9-37
636-0012-9-57
636-0003-8-37
636-0003-8-57
636-0004-0-37
636-0004-0-57
636-0007-9-37
636-0007-9-57
636-0008-1-37
636-0008-1-57
100
21.0
(100 signals/90 grounds)
Mounting
Receptacle
Mating
Receptacle
180
(180 signals/162 grounds)
Mounting
Receptacle
38.5
56.0
Mating
Receptacle
200
(200 signals/180 grounds)
Mounting
Receptacle
Mating
Receptacle
300
(300 signals/270 grounds)
Mounting
Receptacle
7
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀInterposer
A
0.5
Mating Side
Mounting Side
IT3D*-300S-BGA(**) Daughter card
Mating Side
Spacer
Spacer
Mother board
Mounting Side
IT3**-300P-25H(**)
IT3M*-300S-BGA(**)
Mating Cross Section(FREE)
Mating condition with spacers
Mating condition without spacers
*Unit: mm
Height
(mm)
Height
(mm)
Part Number
CL No.
A
B
C
D
Part Number
CL No.
A
B
C
D
IT3-200P-17H(03)
IT3-300P-17H(03)
IT3-100P-20H(03)
IT3-200P-20H(03)
IT3-300P-20H(03)
IT3-200P-22H(03)
IT3-300P-22H(03)
IT3-100P-25H(03)
636-0100-4-03 41.5
636-0130-5-03 59.0
636-0223-4-03 24.0
636-0224-7-03 41.5 18.8 19.6 20.0
636-0225-0-03 59.0
636-0209-3-03 41.5
636-0210-2-03 59.0
636-0150-2-03 24.0
IT3-100P-28H(03)
IT3M2-180P-28H(03) 636-0107-3-03 41.5
636-0170-0-03 24.0
15.8 16.6 17.0
17
20
22
26.8 27.6 28.0
28
IT3-200P-28H(03)
IT3-300P-28H(03)
IT3-200P-30H(03)
IT3-300P-30H(03)
IT3-200P-32H(03)
IT3-300P-32H(03)
IT3-100P-38H(03)
IT3-200P-38H(03)
IT3-300P-38H(03)
IT3-100P-40H(03)
IT3-200P-40H(03)
IT3-300P-40H(03)
636-0105-8-03 41.5
636-0140-9-03 59.0
636-0180-3-03 41.5
636-0185-7-03 59.0
636-0115-1-03 41.5
636-0145-2-03 59.0
636-0200-9-03 24.0
636-0195-0-03 41.5 36.8 37.6 38.0
636-0190-7-03 59.0
636-0230-0-03 24.0
28.8 29.6 30.0
30.8 31.6 32.0
30
32
20.8 21.6 22.0
IT3M2-180P-25H(03) 636-0157-1-03 41.5
23.8 24.6 25.0
25
26
IT3-200P-25H(03)
IT3-300P-25H(03)
IT3-100P-26H(03)
IT3-200P-26H(03)
IT3-300P-26H(03)
636-0155-6-03 41.5
636-0160-6-03 59.0
636-0165-0-03 24.0
636-0110-8-03 41.5 24.8 25.6 26.0
636-0135-9-03 59.0
38
40
636-0227-5-03 41.5 38.8 39.6 40.0
636-0175-3-03 59.0
8
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀPCB footprint (mounting foot pattern)
Column
No.n
No.1
Row
Signal
Ground
A
C
D
E
G
H
J
B
F
K
L
M
N
P
R
T
U
V
W
0.875
1.75
Signal Pad
Ground Pad
0.875
A
B
Minimum clearance for all devices
Minimum clearance for sensitive devices
C
Mounting Receptacle – IT3M
Column
No.1
No.n
Row
Signal
Ground
W
U
R
N
L
V
T
P
M
K
H
F
J
G
E
C
A
D
B
0.875
1.75
Signal Pad
Ground Pad
0.875
A
B
C
Minimum clearance for all devices
Minimum clearance for sensitive devices
Mating Receptacle – IT3D
*Unit: mm
Dimension (mm)
100
180 / 200
300
15.75
28.10
30.10
33.25
45.60
47.50
50.75
63.10
65.10
A
B
C
9
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀSpacers
Spacers are required to support the PWB’s and protect the BGA solder joints.
Stacking
Height
Spacers
Suggested spacer style is shown below:
Spacer, male-male, M3 thread
The recommended spacer height corresponds to the interposer stacking height as shown in the chart below:
Stacking Height
Recommended Spacer Height
17 mm
20 mm
22 mm
25 mm
26 mm
28 mm
30 mm
32 mm
38 mm
40 mm
17 +/-0.127 mm
20 +/-0.127 mm
22 +/-0.127 mm
25 +/-0.127 mm
26 +/-0.127 mm
28 +/-0.127 mm
30 +/-0.127 mm
32 +/-0.127 mm
38 +/-0.127 mm
40 +/-0.127 mm
10-
50mm
10-
50mm
Two spacers located diagonally are minimally
required. Some applications may require 4 spacers.
Spacers should be located 10 – 50 mm from the
corners of the receptacles to prevent excessive
mechanical loading on the interconnections.
If assembly will be subjected to vibration, spacers
should be located to prevent resonance, and
additional spacers may be required.
Ø3.5
Non plated through hole
Recommended Spacer Location
10
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀInterposer installation
Position interposer directly over mounting receptacle, aligning the polarity chamfers.
If positioned properly, the interposer should slide easily onto the mounting receptacle. Place installation cap
onto interposer and push straight down to engage the locking latches:
Manual Installation
*Installation caps are available upon
request for manual operation
Press firmly on installation cap only,
not on wafers or interposer body
Locking
Latch
Always support PWB from
underside to prevent flexing
ꢀDaughter card installation
After the interposer is mounted, install spacers onto motherboard. To install mating receptacle, align the
spacer holes in the daughter card with the threads on the spacers.
The spacers help align the mating receptacle with the interposer. If positioned correctly, the mating
receptacle will slip down into the interposer.
Push directly down on the assembly to lock the mating receptacle in place. Install nuts onto the spacer
threads. Tighten nuts to specified torque.
11
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀDaughter card removal
To remove a daughter card, first
remove the nuts from the reinforcing
spacers, then lift the daughter card
straight off the interposers, as shown
right.
ꢀInterposer removal
Interposer Removal
1) Hold the Interposer Assembly on the walls
without locking latches
2) Gently rotate one side of the Interposer
Assembly laterally 10° maximum
Locking
Latch
10°MAX
Caution: do not rotate more than 10 degrees
3) While gently rotating, pull up on other side of
the Interposer Assembly
4) The Interposer Assembly is removed, and
the Mounting Receptacle is ready to accept
another Interposer Assembly.
12
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀAssembly reflow soldering profile
Parameters
Eutectic (SnPb)
Pb-Free
Comment
Preheat Ramp Rate
2 - 3ç/sec
2 - 3ç/sec
0 - 120 sec
160 - 215ç
230 - 250ç
45 - 120 sec
>6ç/sec
260ç
Other components may limit ramp rate to 2ç/sec
Soak requirements determined by board design,
oven capability, and paste activation requirements
Caution - "oversoaking" may exhaust flux and
affect soldering
Cooler peak temperatures may require longer
TAL's
Shorter TAL's may require higher peak
temperatures
Faster cooling rates produce finer grain structures
and smoother joint appearances
Open body design allows for low delta T between
package and solder joint
Soak Time
Soak Temperature
0 - 120 sec
140 - 180ç
205 - 225ç
30 - 90 sec
>6ç/sec
240ç
Peak Reflow Temperature
Time Above Liquidus (TAL)
Cooling Rate
Maximum Package Body Temperature (T)
Maximum Delta T between Body and
PWB at Liquidus
Standard practice is easy to achieve with open
body design
10ç
10ç
Package Body Exposure Limit
at Maximum Temperature
Adjust profile if maximum exposure limit is
approached or exceeded
5 sec
5 sec
Reflow Profile
Max Body Temp
MaxPeak Temp
240
225
260
250
Reflow
Min Peak Temp
Melting Point
205
183
230
217
160
Min Soak Temp
140
21
21
Time, typically 3 to 7 minutes total
Different solder pastes have different thermal performance characteristics. Consult with paste manufacturer for optimum profile
settings.
Check thermal exposure limits of PWB laminate if processing with Pb-free solder.
13
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀMating self alignment
*Unit: mm
+/-0.6
+/-0.8
X-direction
Y-direction
ꢀMating tolerance
Due to its 3-piece design, the IT3 connector system can accept mating tolerances of up to ±0.3mm tolerance
in the X-axis and up to ±0.2mm in the Y-axis.
+/-0.3
+/-0.2
X-direction
Y-direction
14
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀPackaging information
Please order per box with its Minimum Order Quantity (MOQ) of connectors contained.
The number for each configuration is shown below.
ꢀReceptacles
( )
µ
IT 3** - ***S - BGA 57 ...SnPb / Au0.76 m
( )
µ
IT 3** - ***S - BGA 37 ...Pb-Free / Au0.76 m
(1)
(2)
Unit: pcs
(2)
100S
180S
200S
300S
(1)
----------
----------
72
M
D
M*
D*
120
120
----------
72
72
----------
48
48
----------
----------
----------
----------
72
This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you
place more.
Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes)
Dry package and deoxidizer
Box
Cushion
materials
Three trays
+ One empty tray as lid
Bundle
15
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀPackaging information
ꢀInterposers
( )
IT 3 - ***P - **H 03 ...Au0.76 m
µ
(3)
(4)
Unit: pcs
(3)
100P
180P
200P
300P
(4)
----------
----------
----------
----------
17H
80
80
80
80
80
40
40
40
40
40
60
60
60
60
60
30
30
30
30
30
20H
22H
25H
26H
28H
30H
32H
38H
40H
100
----------
100
100
50
----------
----------
80
----------
40
----------
----------
----------
----------
50
50
This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you
place more.
Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes)
Box
Cushion
materials
Bundle
One or two trays (depending on height)
+One empty tray as lid
16
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀTray information
Chamfer (Connector Column1)
Y3
X3
31
31
31
31
31
31
31
31
31 18
Tape
(3.8)
315 0.5
JEDEC Tray for IT3M 100 Position Receptacles
Chamfer (Connector Column1)
Y3
X3
51.7
51.7
51.7
51.7
28.25
51.7
Tape
(3.8)
315 0.5
JEDEC Tray for IT3M 200 Position Receptacles
X3
Chamfer (Connector Column1)
Y3
77.6
77.6
77.6
41.1
(3.8)
315 0.5
Cap
JEDEC Tray for IT3M 300 Position Receptacles
17
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
ꢀTray information (con’t)
X3
Chamfer (Connector Column1)
Y3
31
31
31
31
31
31
31
31
31 18
(3.8)
Tape
315 0.5
JEDEC Tray for IT3D 100 Position Receptacles
X3
Chamfer (Connector Column1)
Y3
51.7
51.7
51.7
51.7
51.7
28.25
Tape
(3.8)
315 0.5
JEDEC Tray for IT3D 200 Position Receptacles
X3
Chamfer (Connector Column1)
Y3
77.6
77.6
77.6
41.1
Cap
(3.8)
315 0.5
JEDEC Tray for IT3D 300 Position Receptacles
18
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
:
NOTES
19
IT3 SeriesꢀHigh-Speed(10+Gbps) BGA Mezzanine Connectors
USA:
USA:
USA:
HIROSE ELECTRIC (U.S.A.), INC. Headquarters
HIROSE ELECTRIC (U.S.A.), INC. North California Office HIROSE ELECTRIC (U.S.A.), INC. Dallas Office
2688 Westhills Court, Simi Valley, CA 93065-6235 20400 Stevens Creek Blvd., Ste 250, Cupertino, 1701 N. Greenville Ave. Ste 817, Richardson,
Phone : 1-805-522-7958
Fax : 1-805-522-3217
http://www.hiroseusa.com
CA 95014
TX 75081
Phone : 1-408-253-9640
Fax : 1-408-253-9641
http://www.hiroseusa.com
Phone : 1-469-330-9200
Fax : 1-469-330-9205
http://www.hiroseusa.com
USA:
USA:
USA:
HIROSE ELECTRIC (U.S.A.), INC. Chicago Office
HIROSE ELECTRIC (U.S.A.), INC. New York Office
HIROSE ELECTRIC (U.S.A.), INC. Detroit Office (Automotive)
2777 Finley Road, Suite 19 Downers Grove, 510 Broadhollow Road, Suite 305, Melville, 37650 Professional Center Drive, Suite 120A,
IL 60515
NY 11747
Livonia, MI 48154
Phone : 1-630-916-1455
Fax : 1-630-916-1451
http://www.hiroseusa.com
Phone : 1-516-249-5259
http://www.hiroseusa.com
Phone : 1-734-542-9963
Fax : 1-734-542-9964
http://www.hiroseusa.com
GERMANY:
THE NETHERLANDS:
FINLAND:
HIROSE ELECTRIC GmbH
Herzog-Carl-Strasse 4 D-73760 Ostfildern
(Scharnhauser Park)
Phone : 49-711-4560-02-1
Fax : 49-711-4560-02-299
http://www.hirose.de
HIROSE ELECTRIC EUROPE B.V.
Hogehillweg #8 1101 CC Amsterdam Z-O
Phone : 31-20-6557490
Fax : 31-20-6557469
http://www.hiroseeurope.com
HIROSE ELECTRIC EUROPE B.V. FINLAND OFFICE
Teknobulevardi 3-5 01530 VANTAA
Phone : 358-46-712-2178
Fax : 358-46-712-2179
http://www.hiroseeurope.com
UNITED KINGDOM:
CHINA:
CHINA:
HIROSE ELECTRIC UK LTD.
HIROSE ELECTRIC CO., LTD. BEIJING REPRESENTATIVE OFFICE HIROSE ELECTRIC (SHANGHAI) CO., LTD.
First Floor, St Andrews House, Caldecotte Lake A1205, Ocean International Center, Building 56# East 4th 1501-02, Cross Tower Building, 318 Fuzhou Road,
Business Park, Milton Keynes MK7 8LE
Phone : 44-1908-369060
Fax : 44-1908-369078
Ring Middle Road, Chao Yang District, Beijing, 100025
Phone : 86-10-5165-9332
Fax : 86-10-5908-1381
Huang Pu District, Shanghai 200001
Phone : 86-21-6391-3355
Fax : 86-21-6391-3335
http://www.hirose.co.uk
http://www.hirose-china.com.cn
http://www.hirose-china.com.cn
CHINA:
HONG KONG:
TAIWAN:
HIROSE ELECTRIC CO., LTD. SHENZHEN OFFICE
Room 1902-05, Office Tower Shun Hing Square, Di Wang Commercial Centre Unit 1102 A&B, Energy Plaza, 92 Granville Road,
5002, ShenNanDong Road, ShenZhen City, Guangdong Province, 518008
Phone : 86-755-8207-0851
HIROSE ELECTRIC HONGKONG TRADING CO., LTD.
HIROSE ELECTRIC TAIWAN CO., LTD.
No.28 Lane 247 Sec. 2, Yen Ping N, Rd. Taipei
Phone : 886-2-2557-7351,7352
Fax : 886-2-2552-9851
Tsim Sha Tsui East, Kowloon
Phone : 852-2803-5338
Fax : 86-755-8207-0873
Fax : 852-2591-6560
http://www.hirose-taiwan.com.tw
http://www.hirose-china.com.cn
http://www.hirose-hongkong.com.hk
SINGAPORE:
KOREA:
HIROSE ELECTRIC CO., LTD. Singapore Branch
HIROSE KOREA CO., LTD.
10 Anson Road #26-16 International Plaza 079903 1261-10, Jeoungwhang-Dong, Shihung-City,
Phone : 65-6324-6113
65-6324-6123
Kyunggi-Do 429-450
Phone : 82-31-496-7000,7124
Fax : 82-31-496-7100
Fax :
http://www.hirose-singapore.com.sg
http://www.hirose.co.kr
®
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: 81-3-3491-5300, FAX: 81-3-3495-5230
http://www.hirose.com
http://www.hirose-connectors.com
The contents of this catalog are current as of date of 02/2010. Contents are subject to change without notice for the purpose of improvements.
20
相关型号：
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