MC-212SC06 [HRS]

50 MHz - 95 MHz RF/MICROWAVE SPLITTER AND COMBINER, 0.6 dB INSERTION LOSS;
MC-212SC06
型号: MC-212SC06
厂家: HRS    HRS
描述:

50 MHz - 95 MHz RF/MICROWAVE SPLITTER AND COMBINER, 0.6 dB INSERTION LOSS

瞄准线 射频 微波 射频和微波 射频分光器 射频合路器 微波分光器 微波合路器
文件: 总2页 (文件大小:101K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC-200SC,MC200SD Series (30 to 370 MHz)  
Specifications  
Balance  
(deg) (dB)  
(MHZ)  
(deg)  
(dB Max)  
(dB Min)  
Isolation  
V.S.W.R.  
(Max)  
()  
Impedance  
(g)  
Weight  
Model No. Frequency Phase a above 3dB  
Range Difference Insertion Loss  
Phase Amplitude  
MC-201SC  
MC-212SC  
MC-217SC  
MC-218SC  
MC-201SD  
MC-211SD  
MC-212SD  
MC-213SD  
030~200  
050~095  
045~070  
070~100  
030~230  
170~230  
045~104  
330~370  
0
0.6  
0.6  
0.6  
0.6  
0.6  
0.6  
0.6  
1.3  
20  
20  
20  
20  
20  
20  
20  
16  
1.3  
1.2  
1.2  
1.2  
1.3  
1.2  
1.2  
1.4  
±3  
±3  
±3  
±3  
±3  
±3  
±3  
±4  
±0.1  
±0.5  
±0.5  
±0.5  
±0.15  
±0.5  
±0.5  
±0.5  
75  
75  
75  
75  
50  
50  
50  
50  
1
1
1
1
1
1
1
1
- 90  
- 90  
- 90  
0
- 90  
- 90  
- 90  
NOTE 1: The insertion loss of the 2-way 90˚type is the average output of the 0˚port and the -90˚port minus 3 dB coupling.  
NOTE 2: When ordering items with embossed tape packaging, affix (06) to the end of the product number. One reel contains 500 pieces.  
Function Diagram  
Recommended Board Pattern  
Pins 2, 3, 4, 5, and 6 are ground.  
Pins 3, 4, 7, and 8 are ground.  
Please apply resist processing to the area around the  
electrode pads.  
Usage Precautions  
1.Soldering  
(1)Recommended temperature profile  
(2)Recommended hand soldering conditions  
Soldering iron temperature: 260˚C  
Soldering time: Within 10 seconds  
(3)Recommended screen thickness0.15 mm  
Preheating  
40 to 120 s  
Soldering  
20 to 60 s  
Slow cooling  
Natural cooling  
for 1 min. or longer  
1Up to two cycles are permitted at the same conditions provided that the item is at  
room temperature between the first and second cycle.  
2The temperature indicates the board surface temperature of the contact lead  
portion.  
3Reflow soldering should be performed at a peak temperature of 240˚C or less at  
the surface of the printed circuit board.  
4The temperature profile will change depending on the conditions which include  
board size, solder used, and solder thickness.  
1After opening the package reseal promptly or store in a desiccator with a  
2.Product Storage  
desiccant.  
2Store in a place that is not exposed to harmful gases which include sulfur or  
chlorine, etc.  
3Use within one year of delivery.  
45  
MC-200SC, MC-200SD Series (30 to 370 MHz)  
Typical Data  
MC-201SC  
MC-212SC  
MC-217SC  
MC-218SC  
MC-201SD  
MC-211SD  
MC-212SD  
MC-213SD  
46  

相关型号:

MC-212SD

Coil Components (SMD)
HRS

MC-212SD06

45 MHz - 104 MHz RF/MICROWAVE SPLITTER AND COMBINER, 0.6 dB INSERTION LOSS
HRS

MC-213R

Coil Components (Relay Headers)
HRS

MC-213RC

Coil Components (Relay Headers)
HRS

MC-213SD

Coil Components (SMD)
HRS

MC-213SD(06)

Splitter, 330MHz Min, 370MHz Max, 1.3dB Insertion Loss-Max
HRS

MC-213SD06

330 MHz - 370 MHz RF/MICROWAVE SPLITTER AND COMBINER, 1.3 dB INSERTION LOSS
HRS

MC-214RC

Coil Components (Relay Headers)
HRS

MC-215RC

Coil Components (Relay Headers)
HRS

MC-216RC

Coil Components (Relay Headers)
HRS

MC-217SC

Coil Components (SMD)
HRS

MC-217SC(06)

Splitter, 45MHz Min, 70MHz Max, 0.6dB Insertion Loss-Max
HRS