HI3055 [HSMC]

NPN EPITAXIAL PLANAR TRANSISTOR; NPN外延平面晶体管
HI3055
型号: HI3055
厂家: HI-SINCERITY MOCROELECTRONICS    HI-SINCERITY MOCROELECTRONICS
描述:

NPN EPITAXIAL PLANAR TRANSISTOR
NPN外延平面晶体管

晶体 晶体管 局域网
文件: 总2页 (文件大小:25K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : HE9004  
Issued Date : 1994.01.25  
Revised Date : 2001.05.31  
Page No. : 1/2  
HI-SINCERITY  
MICROELECTRONICS CORP.  
HI3055  
NPN EPITAXIAL PLANAR TRANSISTOR  
Description  
The HI3055 is designed for general purpose of amplifier and  
switching applications.  
(Ta=25°C)  
Absolute Maximum Ratings  
Maximum Temperatures  
Storage Temperature............................................................................................ -55 ~ +150 °C  
Junction Temperature .................................................................................................... +150 °C  
Maximum Power Dissipation  
Total Power Dissipation (Tc=25°C) ..................................................................................... 20W  
Maximum Voltages and Currents  
BVCBO Collector to Base Voltage...................................................................................... 70 V  
BVCEO Collector to Emitter Voltage................................................................................... 60 V  
BVEBO Emitter to Base Voltage........................................................................................... 5 V  
IC Collector Current............................................................................................................ 10 A  
IB Base Current .................................................................................................................... 6 A  
(Ta=25°C)  
Characteristics  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test Conditions  
IC=200mA, IE=0  
IC=10mA, IB=0  
IE=10mA, IC=0  
VCB=70V, IE=0  
VCE=70V, VEB(off)=1.5V  
VCE=30V, IB=0  
VEB=5V, IC=0  
IC=4A, IB=400mA  
IC=10A, IB=3.3A  
VCE=4V, IC=4A  
BVCBO  
BVCEO  
BVEBO  
ICBO  
ICEX  
ICEO  
70  
60  
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
uA  
uA  
uA  
mA  
V
20  
20  
50  
0.5  
1.1  
8
1.8  
100  
-
IEBO  
*VCE(sat)1  
*VCE(sat)2  
*VBE(on)  
*hFE1  
V
V
20  
5
2
VCE=4V, IC=4A  
VCE=4V, IC=10A  
VCE=10V, IC=500mA, f=1MHz  
*hFE2  
fT  
-
MHz  
*Pulse Test : Pulse Width 380us, Duty Cycle2%  
HI3055  
HSMC Product Specification  
Spec. No. : HE9004  
Issued Date : 1994.01.25  
Revised Date : 2001.05.31  
Page No. : 2/2  
HI-SINCERITY  
MICROELECTRONICS CORP.  
TO-251 Dimension  
Marking :  
A
B
C
HSMC Logo  
Part Number  
Date Code  
Product Series  
D
H
Rank  
Ink Mark  
F
G
Style : Pin 1.Base 2.Collector 3.Emitter  
3
I
K
E
2
1
J
3-Lead TO-251 Plastic Package  
HSMC Package Code : I  
*:Typical  
Inches  
Min. Max.  
Millimeters  
Inches  
Millimeters  
Min. Max.  
DIM  
DIM  
Min.  
Max.  
0.55  
1.50  
0.60  
2.40  
6.80  
7.20  
Min.  
0.2559  
Max.  
-
A
B
C
D
E
F
0.0177 0.0217  
0.0354 0.0591  
0.0177 0.0236  
0.0866 0.0945  
0.2520 0.2677  
0.2677 0.2835  
0.45  
0.90  
0.45  
2.20  
6.40  
6.80  
G
H
I
J
K
6.50  
-
-
-
-
*0.1811  
0.0354  
0.0315  
-
-
-
*4.60  
0.90  
0.80  
5.50  
0.2047 0.2165  
5.20  
Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995.  
2.Controlling dimension : millimeters.  
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.  
Material :  
Lead : 42 Alloy ; solder plating  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
HSMC reserves the right to make changes to its products without notice.  
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory :  
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454  
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5983621~5 Fax : 886-3-5982931  
HI3055  
HSMC Product Specification  

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