HJ1538 [HSMC]
PNP EPITAXIAL PLANAR TRANSISTOR; PNP外延平面晶体管
| 型号： | HJ1538 |
| 厂家： | 
HI-SINCERITY MOCROELECTRONICS |
| 描述： | PNP EPITAXIAL PLANAR TRANSISTOR |
| 文件： | 总3页 (文件大小：34K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : HE6020-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 1/3
HI-SINCERITY
MICROELECTRONICS CORP.
HJ1538
PNP EPITAXIAL PLANAR TRANSISTOR
Description
High-definition CRT display video output, wide-band amp.
Features
• High fT: fT=400MHz
• High breakdown voltage: VCEO=-120Vmin
• Small reverse transfer capacitance and excellent HF response
(Ta=25°C)
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature .................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ................................................................................... 1.3 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage................................................................................... -120 V
BVCEO Collector to Emitter Voltage................................................................................ -120 V
BVEBO Emitter to Base Voltage.......................................................................................... -3 V
IC Collector Current...................................................................................................... -100 mA
IC Peak Collector Current............................................................................................. -100 mA
(Ta=25°C)
Characteristics
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
IC=-10uA, IE=0
IC=-1mA, IB=0
IE=-100uA, IC=0
VCB=-80V
VEB=-2V
IC=-30mA, IB=-3mA
IC=-30mA, IB=-3mA
VCE=-10V, IC=-10mA
VCE=-10V, IC=-100mA
VCE=-10V, IC=-50mA
VCB=-30V, f=1MHz
BVCBO
BVCEO
BVEBO
ICBO
-120
-120
-3
-
-
-
-
-
-
-
-
-
V
V
V
nA
nA
V
-
-100
-100
-1
-1
320
-
-
-
-
-
IEBO
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
fT
V
60
40
400
2.8
160
-
-
-
-
-
MHz
pF
Cob
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank
D
E
F
Range
60-120
100-200
160-320
HSMC Product Specification
Spec. No. : HE6020-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 2/3
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
100
10
10000
1000
100
CE
=10V
V
CE(sat)
C
B
V
@ I =10I
10
1
10
100
1000
10
100
1000
Collector Current (mA)
Collector Current (mA)
Saturation Voltage & Collector Current
Capacitance & Reverse-Biased Voltage
10000
100
1000
10
BE(sat)
V
C
B
@ I =10I
Cob
100
1
1
1
10
100
1000
10
100
Collector Current (mA)
Reverse Biased Voltage (V)
Cutoff Frequency & I
C
1000
f T
100
10
1
10
100
1000
Collector Current (mA)
HSMC Product Specification
Spec. No. : HE6020-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 3/3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Marking :
A
C
HSMC Logo
Part Number
Date Code
Product Series
D
B
Rank
Ink Mark
L
F
G
Style : Pin 1.Base 2.Collector 3.Emitter
3
2
H
E
K
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code : J
*:Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
0.0866 0.1102
Millimeters
DIM
DIM
Min.
Max.
0.55
1.95
1.50
0.60
6.80
5.80
Min.
Max.
2.80
*2.30
0.90
0.80
5.50
1.60
A
B
C
D
E
F
0.0177 0.0217
0.0650 0.0768
0.0354 0.0591
0.0177 0.0236
0.2520 0.2677
0.2125 0.2283
0.45
1.65
0.90
0.45
6.40
5.40
G
H
I
J
K
L
2.20
-
-
-
*0.0906
0.0354
0.0315
-
-
-
0.2047 0.2165
0.0551 0.0630
5.20
1.40
Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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