HMPS751 [HSMC]
PNP SILICON TRANSISTOR; PNP硅晶体管型号: | HMPS751 |
厂家: | HI-SINCERITY MOCROELECTRONICS |
描述: | PNP SILICON TRANSISTOR |
文件: | 总4页 (文件大小:42K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Spec. No. : HE6317-B
Issued Date : 1992.09.09
Revised Date : 2000.10.01
Page No. : 1/4
HI-SINCERITY
MICROELECTRONICS CORP.
HMPS751
PNP SILICON TRANSISTOR
Description
Amplifier Transistor
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature ................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ....................................................................................... -80 V
VCEO Collector to Emitter Voltage .................................................................................... -60 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current............................................................................................................. -2 A
(Ta=25°C)
Characteristics
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
IC=-100uA, IE=0
IC=-10mA, IB=0
IE=-10uA, IE=0
VCB=-80V, IE=0
BVCBO
BVCEO
BVEBO
ICBO
-80
-60
-5
-
-
-
-
-
-
75
75
75
40
75
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
uA
uA
V
V
V
V
-
-0.1
-0.1
-0.5
-0.3
-1.2
-1
-
-
-
-
IEBO
VEB=-4V, IC=0
*VCE(sat)1
*VCE(sat)2
*VBE(sat)
VBE(on)
*hFE1
IC=-2A, IB=-200mA
IC=-1A, IB=-100mA
IC=-1A, IB=-100mA
IC=-1A, VCE=-2V
IC=-50mA, VCE=-2V
IC=-500mA, VCE=-2V
IC=-1A, VCE=-2
*hFE2
*hFE3
*hFE4
IC=-2A, VCE=-2V
VCE=-5V, IC=-50mA, f=100MHz
fT
-
MHz
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Spec. No. : HE6317-B
Issued Date : 1992.09.09
Revised Date : 2000.10.01
Page No. : 2/4
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
100
10
10
1
CE V
=2
V
BE(sat)
V
C
B
@ I =10I
0.1
0.01
CE(sat)
V
C
B
@ I =10I
1
0.01
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
C
Collector Current-I (mA)
C
Collector Current-I (mA)
On Voltage & Collector Current
Cutoff Frequency & Collector Current
1
1000
100
10
BE(ON)
CE
@ V =2V
V
CE
=5V
V
1
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
10000
C
C
Collector Current-I (mA)
Collector Current-I (mA)
Capacitance & Reverse-Biased Voltage
Safe Operating Area
100
10
1
10000
1000
100
10
T
P =1ms
T
P =100ms
Cob
T
P =1s
1
1
10
Forward Voltage-V (V)
100
0.1
1
10
100
CE
Reverse-Biased Voltage (V)
HSMC Product Specification
Spec. No. : HE6317-B
Issued Date : 1992.09.09
Revised Date : 2000.10.01
Page No. : 3/4
HI-SINCERITY
MICROELECTRONICS CORP.
PD-Ta
700
600
500
400
300
200
100
0
0
20
40
60
80
100
120
140
160
Ambient Temperature-Ta(oC)
HSMC Product Specification
Spec. No. : HE6317-B
Issued Date : 1992.09.09
Revised Date : 2000.10.01
Page No. : 4/4
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
α
α
2
3
Marking :
A
HSMC Logo
Part Number
Date Code
Product Series
B
C
1
2
3
Rank
Laser Mark
HSMC Logo
Product Series
D
Part Number
H
G
Ink Mark
Style : Pin 1.Emitter 2.Base 3.Collector
α
1
I
E
F
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
Inches
Millimeters
DIM
Inches
Min. Max.
0.0142 0.0220
Millimeters
DIM
Min.
Max.
Min.
4.33
4.33
12.70
0.36
-
Max.
4.83
4.83
-
Min.
0.36
Max.
0.56
*2.54
*1.27
*5°
A
B
C
D
E
F
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
G
H
I
-
-
-
-
-
*0.1000
*0.0500
*5°
-
-
-
-
-
-
0.56
*1.27
3.76
α1
α2
α3
-
*2°
*2°
*2°
3.36
*2°
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
相关型号:
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