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HSA1300D [HSMC]

SILICON PNP EPITAXIAL TYPE; PNP硅外延型
HSA1300D
型号： HSA1300D
厂家： HI-SINCERITY MOCROELECTRONICS    HI-SINCERITY MOCROELECTRONICS
描述：

SILICON PNP EPITAXIAL TYPE
PNP硅外延型
文件： 总3页 (文件大小：37K)
中文：  中文翻译
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Spec. No. : HD200202  
Issued Date : 1999.07.01  
Revised Date : 2002.02.20  
Page No. : 1/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
HSA1300D  
SILICON PNP EPITAXIAL TYPE  
Description  
• Strobo Flash Applications  
• Medium Power Amplifier Applications  
TO-126ML  
Features  
• High DC Current Gain and Excellenr hFE Linearity  
• hFE(1)=140-600, (VCE=-1V, IC=-0.5A)  
• hFE(2)=60 (Min.), 120(Typ.), (VCE=-1V, IC=-4A)  
• Low Saturation Voltage.  
• VCE(sat)=-0.5V(Max.), (IC=-2A, IE=-50mA)  
Absolute Maximum Ratings (Ta=25°C)  
Characteristic  
Symbol  
VCBO  
VCES  
VCEO  
VEBO  
IC  
Ratios  
Unit  
V
Collector-Base Voltage  
-20  
-20  
-10  
-6  
-2  
-5  
Collector-Emitter Voltage  
Emitter-Base Voltage  
V
V
A
DC  
Collector Current  
Pulsed (Note1)  
ICP  
Base Current  
IB  
-2  
A
Collector Power Dissipation  
Junction Temperature  
Storage Temperature Range  
PC  
Tj  
Tstg  
1.5  
150  
-55~150  
W
°C  
°C  
Note 1: Pulse Width=10ms(Max.), Duty Cycle=30%(Max.)  
Electrical Characteristics (Ta=25°C)  
Symbol  
V(BR)CEO  
V(BR)EBO  
ICBO  
Min.  
-10  
-6  
-
Typ.  
-
-
-
-
Max.  
Unit  
V
V
nA  
nA  
Test Condition  
IC=10mA, IB=0  
IE=-1mA, IC=0  
VCE=-20V, IE=0  
-
-
-100  
-100  
600  
-
-0.50  
-1.5  
-
IEBO  
-
VBE=-6V, IC=0  
*hFE(1) (Note 2)  
*hFE(2)  
*VCE(sat)  
VBE  
140  
60  
-
-
-
-
VCE=-1V, IC=0.5A  
VCE=-1V, IC=-4A  
IC=-2A, IB=-50mA  
VCE=-1V, IC=-2A  
VCE=-1V, IC=-0.5A  
VCE=-10V, IE=0, f=1KHZ  
120  
-0.20  
-0.83  
140  
50  
V
V
MHz  
pF  
fT  
Cob  
-
-
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%  
Classifications of hFE  
Rank  
hFE(1)  
Y
GR  
200-400  
EL  
300-600  
140-280  
HSA1300D  
HSMC Product Specification  
Spec. No. : HD200202  
Issued Date : 1999.07.01  
Revised Date : 2002.02.20  
Page No. : 2/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Characteristics Curve  
Current Gain & Collector Current  
Saturation Voltage & Collector Current  
1000  
1000  
CE(sat)  
V
C
B
@ I =40I  
125oC  
25oC  
75oC  
100  
75oC  
25oC  
CE  
hFE @ V =1V  
125oC  
10  
100  
0.1  
1
10  
Collector Current-I (mA)  
100  
1000  
1
10  
100  
Collector Current-I (mA)  
1000  
10000  
C
C
ON Voltage & Collector Current  
Capacitance & Reverse-Biased Voltage  
1000  
1000  
25oC  
75oC  
100  
125oC  
Cob  
BE(ON)  
V
CE  
@ V =1V  
100  
10  
0.1  
1
10  
100  
1000  
10000  
0.1  
1
10  
100  
C
Reverse Biased Voltage (V)  
Collector Current-I (mA)  
Safe Operating Area  
100  
10  
1
PT=1ms  
PT=100ms  
PT=1s  
0.1  
1
10  
Forward Voltage-V (V)  
100  
CE  
HSA1300D  
HSMC Product Specification  
Spec. No. : HD200202  
Issued Date : 1999.07.01  
Revised Date : 2002.02.20  
Page No. : 3/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
TO-126ML Dimension  
Marking:  
H
S A  
A
B
1 3 0 0 D  
Date Code  
Control Code  
D
F
O
H
E
3
2
1
C
N
Style: Pin 1.Emitter 2.Collector 3.Base  
I
G
J
M
L
K
3-Lead TO-126ML Plastic Package  
HSMC Package Code : D  
*: Typical  
Inches  
Millimeters  
Min.  
Inches  
Max.  
Millimeters  
DIM  
DIM  
Min.  
Max.  
Max.  
3.70  
0.69  
1.12  
1.52  
3.12  
2.12  
1.25  
1.42  
Min.  
-
Min.  
Max.  
*4.56  
0.84  
15.00  
7.62  
3.75  
4.12  
2.14  
A
B
C
D
E
F
0.1356  
0.0170  
0.0344  
0.0501  
0.1131  
0.0737  
0.0294  
0.0462  
0.1457  
0.0272  
0.0444  
0.0601  
0.1231  
0.0837  
0.0494  
0.0562  
3.44  
0.43  
0.87  
1.27  
2.87  
1.87  
0.74  
1.17  
I
*0.1795  
0.0331  
0.5906  
0.3003  
0.1478  
0.1625  
0.0842  
-
J
0.0268  
0.5512  
0.2903  
0.1378  
0.1525  
0.0740  
0.68  
14.00  
7.37  
3.50  
3.87  
1.88  
K
L
M
N
O
G
H
Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.  
2.Controlling dimension: millimeters.  
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.  
Material:  
• Lead: 42 Alloy; solder plating  
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0  
Important Notice:  
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
• HSMC reserves the right to make changes to its products without notice.  
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory:  
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454  
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel: 886-3-5983621~5 Fax: 886-3-5982931  
HSA1300D  
HSMC Product Specification  

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