SMD1210-020 [HUAXINAN]

Resettable Fuse PTC SMD1210 Series;


型号：	SMD1210-020
厂家：	HuaXinAn Electronics CO.,LTD
描述：	Resettable Fuse PTC SMD1210 Series
文件：	总6页 (文件大小：381K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMD1210 Series

Resettable Fuse PTC SMD1210 Series

Features

RoHS Compliant ＆ Halogen Free

faster tripping, 1210 Dimension, Surface mountable, Solid state

Operation Current: 0.05A~2.0A

Maximum Voltage: 6V~60Vdc

Operating Temperature：-40℃ to +85℃

Agency recognition:

Dimensions(3225mm/ 1210 mils) Unit: mm

Terminal pad materials :Tin-Plated Nickle-copper

Terminal pad solderability : Meets EIA specification

RS 186-9E and ANSI/J-STD-002 Category 3.

Certification

Delivery Time

Marking

in stock Produce

Part number

UL TUV

Min max Min Max

3.00 3.43 2.35 2.8

Min Max Min Min

3days 18days

0.6

0.5

1.25 0.15 0.1

1.00 0.15 0.1

SMD1210-005

SMD1210-010

SMD1210-020

SMD1210-035

SMD1210-035-30

SMD1210-050

SMD1210-075

SMD1210-075-24

SMD1210-110

SMD1210-110-12

SMD1210-110-16

SMD1210-150

SMD1210-175

SMD1210-200

0.35 0.90 0.15 0.1

0.35 1.00 0.15 0.1

0.35 0.90 0.15 0.1

0.35 0.85 0.15 0.1

0.50 1.10 0.15 0.1

0.4

0.6

1.10 0.15 0.1

1.40 0.15 0.1

1.50 0.15 0.1

Specifications are subject to change without notice

Tel: +86-755-27465585

Email: sales@huaandz.com

HUAAN LIMITED

www.huaandz.com

SMD1210 Series

Thermal Derating Chart-IH(A)

Maximum ambient operating temperatures ℃

Part Number

-40℃

0.08

0.16

0.29

0.47

0.76

1.00

1.60

2.30

-20℃

0.07

0.14

0.26

0.45

0.67

0.97

1.42

0℃

0.06

25℃

40℃

50℃

60℃

70℃

85℃

0.02

SMD1210-005

SMD1210-010

SMD1210-020

SMD1210-035

SMD1210-035-30

SMD1210-050

SMD1210-075

SMD1210-075-24

SMD1210-110

SMD1210-110-12

SMD1210-110-16

SMD1210-150

SMD1210-175

SMD1210-200

0.05A

0.10A

0.20A

0.35A

0.50A

0.75A

1.10A

0.04

0.08

0.16

0.33

0.43

0.64

0.94

0.04

0.07

0.14

0.28

0.40

0.59

0.86

0.03

0.06

0.13

0.24

0.36

0.54

0.80

0.03

0.05

0.11

0.21

0.32

0.48

0.70

0.12

0.22

0.40

0.58

0.86

1.26

0.05

0.08

0.18

0.28

0.40

0.58

2.02

2.22

1.76

2.01

1.50A

1.75A

1.24

1.45

1.11

1.26

1.00

1.10

0.85

0.98

0.65

0.80

2.45

2.60

2.00A

1.78

1.67

1.50

1.45

1.10

2.44

2.35

Electrical characteristics(25℃)

Maximum Time to

Trip

max

Imax

Resistance（Ω）

I Hold

I Trip

Max

Certification

Delivery Time

Current

Time

in stock Produce

Part Number

SMD1210-005

（A）

（S）

Rimin

R1max

UL TUV

3days 18days

0.05 0.15

0.10 0.30

0.20 0.40

0.35 0.75

0.50 1.00

0.75 1.50

1.10 2.20

60V

100

0.6

0.8

0.25

0.50

8.0

1.50

0.60

0.02

0.20

0.10

0.30

0.50

0.60

1.00

2.8

SMD1210-010

SMD1210-020

SMD1210-035

SMD1210-035-30

SMD1210-050

SMD1210-075

SMD1210-075-24

SMD1210-110

SMD1210-110-12

SMD1210-110-16

SMD1210-150

SMD1210-175

SMD1210-200

30V

16V

30V

16V

100

0.8

0.40

0.20

0.18

0.07

0.05

0.03

0.02

0.015

1.3

0.9

0.4

24V

0.45

0.21

0.25

0.21

0.08

0.07

12V

16V

1.50

3.00

1.75 3.50

2.00 4.00

SMD1210 Series

Electrical characteristics(25℃)

Ihold = Hold Current. Maximum current device will not trip in 25°C still air.

Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.

Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).

Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1max = Maximum device resistance is measured one hour post reflow.

Part number System

SMD1210 -XXX

Holding Current Rating

1210 Dimension Surface Mount Device

Our Mark

Test Procedures and Requirements

Test

Test Conditions

Accept/Reject Criteria

Rmin ≤ R ≤ Rmax

Tmaximum Time to Trip

No trip

Resistance

In still air @ 25℃

Time to Trip

Specified current,Vmax，25℃

30min ,at IH

Hold Current

Trip Cycle Life

Trip Endurance

Physical Characteristics

Terminal materials :

Soldering zone

Vmax，Imax，100cycles

Vmax，1hours

No arcing or burning

Tin-Plated Nickle-copper

Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.

Environmental Specifications

Test

Conditions

Resistance change

Passive aging

Humidity aging

Thermal shock

Solvent Resistance

Vibration

+85℃，1000hours

±10%

±5%

+85℃/85%R.H.1000hours

MIL-STD-202,Method 107G ,+85℃/-40℃,20times -30% typical resistance change

MIL-STD-202,Method 215

No change

ML-STD-883C,Test Condition A

Specifications are subject to change without notice

Tel: +86-755-27465585

Email: sales@huaandz.com

HUAAN LIMITED

www.huaandz.com

SMD1210 Series

Recommended Pad layout(mm)

Solder reflow conditions

Profile Feature

Pb-Free Assembly

Average ramp-up rate (TS maxto TP)

Preheat

3℃/second max.

-Temperature Min (TS min)

-Temperature Max (TS max)

-Time (min to max) (TS min to TS max)

Time maintained above:

-Temperature (TL)

150℃

200℃

60-180 seconds

217℃

-Time (tL)

60-150 seconds

260℃

Peak Temperature (TP)

Time within 5℃of actual PeakTemperature (tP)

Ramp-down Rate

20-40 seconds

3℃/second max.

8 minutes max.

0℃~35℃, ≤70%RH

Time 25℃to Peak Temperature

StorageCondition

·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

SMD1210 Series

Solder reflow conditions

·Devices are not designed to be wave soldered to the bottom side of the board.

·Recommended maximum paste thickness is 0.25mm (0.010 inch)

·Device can be cleaned using standard industry methods and solvents.

·Soldering temprature profile meets RoHs leadfree process.

Note : If reflow temperatures exceed the recommended profile, devices may not meet the performance Requirements

Tape Specification and Reel Dimensions

Symbol

Dimensions(mm)

Tape

8.00±0.30

3.50±0.05

1.75±0.10

1.55±0.05

1.00(MIN)

4.00±0.10

2.00±0.05

2.82±0.10

3.46±0.10

0.25±0.10

1.0/1.3/1.8±0.10

390

Leader min

Trailer min

160

Φ178±1.0

Reel

Φ60.2±0.5

11.0±0.5

9.0±1.5

Packaging Quantity

Part Number

Quantity

Part Number

Quantity

Part Number

Quantity

4000PCS

3000PCS

SMD1210-005

SMD1210-010

SMD1210-020

SMD1210-035

SMD1210-035-30

4000PCS SMD1210-050

4000PCS SMD1210-075

4000PCS SMD1210-075-24

4000PCS SMD1210-110

4000PCS SMD1210-110-12

4000PCS SMD1210-110-16

4000PCS SMD1210-150

4000PCS SMD1210-175

4000PCS SMD1210-200

4000PCS

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

SMD1210 Series

Resettable Fuse PTC SMD1210 Series

Storage

The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the

deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with

high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the

components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be

opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.

Warning

• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and

flame.

• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be

used when repeated fault conditions or prolonged trip events are anticipated.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended

electronic, thermal, and mechanical procedures for electronic components.

• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.

• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the

performance of the devices.PPTC SMD can be cleaned by standard methods.

• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper

board layouts or reflow profilecould negatively impact solderability performance of our devices.

Notes

The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit

production devices,However,users should imdependently evaluate and test the suitability of each product.HUAAN makes

on warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,

HUAAN’s only obligations are those im the HUAAN Standard Rerms and Conditions of Sale and in no case will HUAAN be

liable for any incidental,imdirect,or consequential damages arising from the sale,resale,or misues of its products. HUAAN

reserves the right to change of update, without notice, any information contained in this specification.

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

SMD1210-020 [HUAXINAN]

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