HY1403U [HUAYI]

N-Channel Enhancement Mode MOSFET;
HY1403U
型号: HY1403U
厂家: HUAYI MICROELECTRONICS CO.,LTD.    HUAYI MICROELECTRONICS CO.,LTD.
描述:

N-Channel Enhancement Mode MOSFET

文件: 总12页 (文件大小:1538K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HY1403D/U/V  
N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
z
30V/42A  
RDS(ON) = 10 mΩ(typ.) @VGS =- 10V  
RDS(ON) = 14 mΩ(typ.) @VGS = -4.5V  
S
D
S
z
z
z
100% Avalanche Tested  
Reliable and Rugged  
G
D
G
S
D
G
Halogen  
Free and Green Devices Available  
(RoHS Compliant)  
TO-252-2L  
TO-251-3L  
TO-251-3S  
Applications  
z
z
Switching Application  
Power Management for DC/DC  
N-Channel MOSFET  
Ordering and Marking Information  
Package Code  
U : TO-251-3L  
D : TO-252-2L  
V: TO-251-3S  
D
U
V
HY1403 HY1403 HY1403  
Assembly Material  
G : Halogen Free  
Date Code  
YYXXX WW  
YYXXXJWW G YYXXXJWW G YYXXXJWW G  
Note: HUAYI lead-free products contain molding compounds/die attach materials and 100% matte tin plate  
Termi-Nation finish;which are fully compliant with RoHS. HUAYI lead-free products meet or exceed the lead-  
Free require-ments of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature.  
HUAYI defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed  
900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
HUAYI reserves the right to make changes, corrections, enhancements, modifications, and improveme nts to  
this pr-oduct and/or to this document at any time without notice.  
1
V1.1  
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HY1403D/U/S  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings (TC=25°C Unless Otherwise Noted)  
VDSS  
VGSS  
TJ  
Drain-Source Voltage  
30  
V
±20  
Gate-Source Voltage  
Maximum Junction Temperature  
Storage Temperature Range  
Diode Continuous Forward Current  
150  
°C  
°C  
A
-55 to 150  
TSTG  
IS  
TC=25°C  
42  
Mounted on Large Heat Sink  
IDM  
TC=25°C  
TC=25°C  
TC=100°C  
TC=25°C  
140**  
42  
A
A
Pulsed Drain Current *  
ID  
Continuous Drain Current  
30  
30  
PD  
Maximum Power Dissipation  
W
12  
T =100°C  
c
Thermal Resistance-Junction to Case  
Thermal Resistance-Junction to Ambient  
Drain-Source Avalanche Energy  
4.2  
°C/W  
°C/W  
mJ  
RJC  
RJA  
EAS  
110  
70***  
L=0.5mH  
Note  
*
Repetitive rating ; pulse width limiited by junction temperature  
** Drain current is limited by junction temperature  
*** VD=24V  
Electrical Characteristics (TC = 25C Unless Otherwise Noted)  
HY1403  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Static Characteristics  
BVDSS Drain-Source Breakdown Voltage  
IDSS Zero Gate Voltage Drain Current  
VGS(th) Gate Threshold Voltage  
30  
-
-
-
1
V
VGS=0V, IDS=250A  
VDS=30V, VGS=0V  
-
A  
TJ=125°C  
-
1.0  
-
-
50  
1.6  
-
3.0  
±100  
11  
V
VDS=VGS, IDS=250A  
VGS=±20V, VDS=0V  
VGS=10V, IDS=21A  
VGS=4.5V, IDS=21A  
IGSS  
Gate Leakage Current  
nA  
-
10  
14  
m  
m  
*
RDS(ON)  
Drain-Source On-state Resistance  
17  
Diode Characteristics  
*
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
ISD=21A, VGS=0V  
-
-
-
0.8  
21  
13  
1.1  
V
-
-
ns  
nC  
IDS=21A, dlSD/dt=100A/s  
Qrr  
2
V1.1  
www.hymexa.com  
HY1403D/U/S  
Electrical Characteristics (Cont.) (TC = 25C Unless Otherwise Noted)  
HY1403  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Dynamic Characteristics  
RG  
Ciss  
Coss  
Crss  
Gate Resistance  
VGS=0V,VDS=0V,F=1MHz  
-
-
-
-
-
-
-
-
2.9  
1012  
251  
119  
15  
-
-
Input Capacitance  
VGS=0V,  
VDS=15V,  
Frequency=1.0MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
-
-
td(ON) Turn-on Delay Time  
Tr Turn-on Rise Time  
td(OFF) Turn-off Delay Time  
Tf Turn-off Fall Time  
Gate Charge Characteristics  
28  
24  
35  
19  
VDD=15 V, RG= 3 ,  
13  
I
DS =21A, VGS=10 V,  
ns  
20  
10  
Qg  
Qgs  
Qgd  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
-
-
-
29  
-
-
-
V
I
DS=24V, VGS=10 V,  
DS =21A  
nC  
4.6  
4.3  
Note * : Pulse test ; pulse width 300s, duty cycle2%.  
3
www.hymexa.com  
V1.1  
HY1403D/U/S  
Typical Operating Characteristics  
Power Dissipation  
Drain Current  
60  
60  
50  
50  
40  
30  
20  
10  
40  
30  
20  
10  
TC=25oC  
0
TC=25oC,VG=10V  
0
20 40 60 80 100 120 140 160 180 200  
0
20 40 60 80 100 120 140 160 180 200  
Tc -  
Temperature (°C)  
Tc-Case Temperature (°C)  
Case  
Safe Operation Area  
400  
100  
Limit  
100s  
Rds(on)  
1ms  
10  
1
10ms  
DC  
TC=25OC  
0.1  
0.01  
0.1  
1
10  
100  
400  
VDS - Drain - Source Voltage (V)  
Thermal Transient Impedance  
10  
1
Duty = 0.5  
0.2  
0.1  
0.05  
0.1  
0.02  
0.01  
0.01  
Single  
Mounted on minimum pad  
RJA : 110oC/W  
0.001  
0.1  
0.0001  
0.001  
0.01  
1
10  
Square Wave Pulse Duration (sec)  
4
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V1.1  
HY1403D/U/S  
Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Output Characteristics  
80  
70  
60  
50  
40  
30  
20  
10  
0
17  
15  
13  
11  
9
VGS=4.5V  
VGS= 4.5,5,6,7,8,9,10V  
VGS=10V  
4V  
7
3.5V  
3V  
5
3
1
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
10  
20  
30  
40  
50  
VDS - Drain - Source Voltage (V)  
ID - Drain Current (A)  
Gate-Source On Resistance  
Gate Threshold Voltage  
1.6  
24  
20  
16  
12  
8
IDS=21A  
IDS =250A  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
4
0
2
3
4
5
6
7
8
9
10  
-50 -25  
0
25 50 75 100 125 150  
VGS - Gate - Source Voltage (V)  
Tj - Junction Temperature (°C)  
5
www.hymexa.com  
V1.1  
HY1403D/U/S  
Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
200  
100  
VGS = 10V  
IDS = 21A  
Tj=150oC  
10  
1
Tj=25oC  
RON@Tj=25oC: 10m  
0.1  
-50 -25  
0
25 50 75 100 125 150  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
Tj - Junction Temperature (°C)  
VSD - Source - Drain Voltage (V)  
Capacitance  
Gate Charge  
10  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
Frequency=1MHz  
VDS= 24V  
DS= 21A  
9
8
7
6
5
4
3
2
1
0
I
Ciss  
Coss  
Crss  
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
VDS - Drain - Source Voltage (V)  
QG -Gate Charge (nC)  
www.hymexa.com  
6
V1.1  
HY1403D/U/S  
Avalanche Test Circuit  
VDS  
L
VDSX(SUS)  
tp  
DUT  
VDS  
IAS  
RG  
VDD  
VDD  
IL  
tp  
EAS  
0.01Ω  
tAV  
Switching Time Test Circuit  
VDS  
RD  
VDS  
90%  
DUT  
VGS  
RG  
VDD  
10%  
VGS  
tp  
td(on) tr  
td(off) tf  
www.hymexa.com  
7
V1.1  
HY1403D/U/S  
Package Information  
TO-252-2L  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
2.20  
0.00  
0.97  
0.68  
5.20  
0.43  
5.98  
NOM  
2.30  
MAX  
2.40  
0.20  
1.17  
0.90  
5.50  
0.63  
6.22  
A
A1  
A2  
b
-
1.07  
0.78  
b3  
c
5.33  
0.53  
D
6.10  
D1  
E
5.30REF  
6.60  
6.40  
4.63  
6.80  
-
E1  
e
-
2.286BSC  
H
9.40  
1.38  
10.10 10.50  
L
1.50  
1.75  
L1  
L2  
L3  
L4  
L5  
θ
2.90REF  
0.51BSC  
0.88  
-
-
1.28  
1.00  
1.95  
8°  
-
1.80  
-
1.65  
0°  
8
V1.1  
www.hymexa.com  
HY1403D/U/S  
TO-251-3L  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
2.20  
0.97  
0.68  
0.00  
0.00  
5.20  
0.43  
5.98  
NOM  
2.30  
MAX  
2.40  
1.17  
0.90  
0.10  
0.10  
5.50  
0.63  
6.22  
A
A2  
b
1.07  
0.78  
b2  
b2'  
b3  
c
0.04  
0.04  
5.33  
0.53  
D
6.10  
D1  
E
5.30REF  
6.60  
6.40  
4.63  
6.80  
-
E1  
e
-
2.286BSC  
16.52  
9.40  
H
16.22  
9.15  
0.88  
1.65  
16.82  
9.65  
1.28  
1.95  
L1  
L3  
L5  
1.02  
1.80  
9
V1.1  
www.hymexa.com  
HY1403D/U/S  
TO-251-3L  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
2.20  
0.97  
0.68  
5.20  
0.43  
5.98  
NOM  
2.30  
MAX  
2.40  
1.17  
0.90  
5.50  
0.63  
6.22  
A
A2  
b
1.07  
0.78  
b3  
c
5.33  
0.53  
D
6.10  
D1  
E
5.30REF  
6.60  
6.40  
4.63  
6.80  
-
E1  
e
-
2.286BSC  
11.22  
4.10  
H
10.00  
3.90  
0.88  
1.65  
11.44  
4.30  
1.28  
1.95  
L1  
L3  
L5  
1.02  
1.80  
10  
www.hymexa.com  
V1.1  
HY1403D/U/S  
Device Per Unit  
Package Type  
TO-252-2L  
Unit  
Tube  
Quantity  
75  
TO-252-2L  
Reel  
Tube  
Tube  
2500  
75  
TO-251-3L  
TO-251-3S  
75  
Classification Profile  
11  
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V1.1  
HY1403D/U/S  
Classification Reflow Profiles  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Preheat & Soak  
100 C  
150 C  
60-120 seconds  
150 C  
200 C  
60-120 seconds  
Temperature min (Tsmin  
)
Temperature max (Tsmax  
)
Time (Tsmin to Tsmax) (ts)  
Average ramp-up rate  
(Tsmax to TP)  
3 C/second max.  
3C/second max.  
Liquidous temperature (TL)  
Time at liquidous (tL)  
183 C  
60-150 seconds  
217 C  
60-150 seconds  
Peak package body Temperature  
(Tp)*  
See Classification Temp in table 1  
20** seconds  
See Classification Temp in table 2  
30** seconds  
Time (tP)** within 5C of the specified  
classification temperature (Tc)  
Average ramp-down rate (Tp to Tsmax  
)
6 C/second max.  
6 C/second max.  
6 minutes max.  
8 minutes max.  
Time 25C to peak temperature  
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)  
Volume mm3  
Package  
Thickness  
Volume mm3  
<350  
350  
<2.5 mm  
235 C  
220 C  
220 C  
2.5 mm  
220 C  
Table 2. Pb-free Process – Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm3  
Volume mm3  
350-2000  
260 C  
Volume mm3  
<350  
260 C  
260 C  
250 C  
>2000  
260 C  
245 C  
245 C  
1.6 mm – 2.5 mm  
2.5 mm  
250 C  
245 C  
Reliability Test Program  
Test item  
SOLDERABILITY  
Method  
JESD-22, B102  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
Description  
5 Sec, 245qC  
168 Hrs /500 Hrs /1000 Hrs, Bias @ 150°C  
96 Hrs, 100RH, 2atm, 121qC  
500 Cycles, -55qC~150qC  
HOLT  
PCT  
TCT  
&XVWRPHUꢀ6HUYLFH  
Worldwide Sales and Service: sales@hymexa.com  
Technical Support: Technology@hymexa.com  
Huayi Microelectronics Co., Ltd.  
No.8928,Shangji Road,Economic and Technological Development Zone,Xi'an,China  
TEL: (86-029) 86685706  
FAX: (86-029) 86685705  
E-mail: sales@hymexa.com  
Web net: www.hymexa.com  
12  
V1.1  
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