HY11P13 [HYCON]
8-Bit RISC-like Mixed Signal Microcontroller;
| 型号： | HY11P13 |
| 厂家： | 
HYCON Technology Corporation |
| 描述： | 8-Bit RISC-like Mixed Signal Microcontroller 微控制器 |
| 文件： | 总40页 (文件大小：1120K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HY11P13
Datasheet
8-Bit RISC-like Mixed Signal Microcontroller
.
Embedded 4x20 LCD Driver
Low Noise Amplifier
18-Bit Σ∆ADC
© 2009-2011 HYCON Technology Corp.
www.hycontek.com
DS-HY11P13-V14_EN
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
Table of Contents
1.
FEATURES ...............................................................................................................................................5
2.
PIN DEFINITION ....................................................................................................................................... 6
64PIN Diagram LQFP64 ....................................................................................................................... 6
LQFP64 Pinout I/O Description............................................................................................................. 7
2.1.
2.2.
3.
APPLICATION CIRCUIT.........................................................................................................................10
Bridge SensorⅠ.................................................................................................................................. 10
Bridge SensorⅡ.................................................................................................................................. 11
Bridge Sensor (Pressure Sensor)....................................................................................................... 12
IR Sensor ............................................................................................................................................13
3.1.
3.2.
3.3.
3.4.
3.5.
4-20mA Current Panel Meter (Two-wire type) ....................................................................................14
.
4.
FUNCTION OUTLINE.............................................................................................................................15
Internal Block Diagram........................................................................................................................ 15
Related Description and Supporting Documents................................................................................15
SD18 Network..................................................................................................................................... 16
Low Noise OPAMP Network ............................................................................................................... 17
4.1.
4.2.
4.3.
4.4.
5.
REGISTER LIST ..................................................................................................................................... 18
6.
ELECTRICAL CHARACTERISTICS ...................................................................................................... 20
Recommended operating conditions .................................................................................................. 20
Internal RC Oscillator.......................................................................................................................... 21
Supply current into VDD excluding peripherals current......................................................................22
Port1~2................................................................................................................................................24
Reset (Brownout, External RST pin, Low Voltage Detect)..................................................................25
6.1.
6.2.
6.3.
6.4.
6.5.
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page2
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.6.
6.7.
6.8.
6.9.
Power System..................................................................................................................................... 27
LCD .....................................................................................................................................................29
Low Noise OPAMP.............................................................................................................................. 30
SD18, Power Supply and Recommended Operating Conditions .......................................................31
7.
ORDERING INFORMATION................................................................................................................... 37
8.
PACKAGE INFORMATION..................................................................................................................... 38
LQFP64 (L064) ...................................................................................................................................38
LQFP64(LS64)....................................................................................................................................39
8.1.
8.2.
9.
REVISION RECORD............................................................................................................................... 40
.
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page3
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
Attention：
1.
HYCON Technology Corp. reserves the right to change the content of this datasheet without further
notice. For most up-to-date information, please constantly visit our website:
http://www.hycontek.com .
2.
HYCON Technology Corp. is not responsible for problems caused by figures or application circuits
narrated herein whose related industrial properties belong to third parties.
3.
Specifications of any HYCON Technology Corp. products detailed or contained herein stipulate the
performance, characteristics, and functions of the specified products in the independent state. We
does not guarantee of the performance, characteristics, and functions of the specified products as
placed in the customer’s products or equipment. Constant and sufficient verification and evaluation
is highly advised.
4.
Please note the operating conditions of input voltage, output voltage and load current and ensure
the IC internal power consumption does not exceed that of package tolerance. HYCON Technology
Corp. assumes no responsibility for equipment failures that resulted from using products at values
that exceed, even momentarily, rated values listed in products specifications of HYCON products
specified herein.
5.
Notwithstanding this product has built-in ESD protection circuit, please do not exert excessive static
electricity to protection circuit.
.
6.
Products specified or contained herein cannot be employed in applications which require extremely
high levels of reliability, such as device or equipment affecting the human body, health/medical
equipments, security systems, or any apparatus installed in aircrafts and other vehicles.
Despite the fact that HYCON Technology Corp. endeavors to enhance product quality as well as
reliability in every possible way, failure or malfunction of semiconductor products may happen.
Hence, users are strongly recommended to comply with safety design including redundancy and
fire-precaution equipments to prevent any accidents and fires that may follow.
7.
8.
Use of the information described herein for other purposes and/or reproduction or copying without
the permission of HYCON Technology Corp. is strictly prohibited.
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page4
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
1. Features
8-bit RISC, 66 instructions included.
Operating voltage range: 2.2V to 3.6V,
operation temperature range: -40℃~85℃.
External Crystal Oscillator and Internal High
Precision RC Oscillator, 6 CPU clock rates
enable users to have the most power-saving
plan.
Ultra-Low Input Noise (<1uVpp) OP provides
high output impedance, small signal
amplification and low current voltage
transformation.
1.0 V internal analog circuit common ground
that equips with Push-Pull drive ability to
provide sensor driving voltage.
Active Mode 300uA@2MHz
Standby Mode 3uA@32KHz
Sleep Mode 1uA
LVD low voltage detection function has 14
steps of voltage detection configuration and
external input voltage detection function.
VDDA can select 4 different output voltage that
equips with 10mA low dropout regulator
function.
4K Word OTP (One Time Programmable) Type
program memory, 256 Byte Data Memory.
Brownout detector and Watch dog Timer,
prevents CPU from Crash.
4x20 LCD driver
Static、1/2、1/3、1/4 Duty and 1/3 Bias
programmable option.
18-bit fully differential input Sigma-Delta
Analog-to-Digital Converter (A/D)
Build-in PGA (Programmable Gain
Amplifier) 1/4x、1/2x、1x. …128x, 10 input
signal gain selection.
Built-in Charge Pump regulated circuit,
providing 4 LCD Bias voltage.
.
8-bit Timer A
Build-in Input zero adjustment can
increase measurement range according
to different application.
16-bit Timer B module has Capture/ Compare
function.
8-bit Timer C module can generate PWM/PFD
waveform.
Built-in high impedance input buffer (Not
suitable for 32x or upwards input gain).
Built-in absolute temperature sensor
Serial communication SPI module
Support 6 stack level
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page5
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2. Pin Definition
2.1. 64PIN Diagram LQFP64
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
NC
COM1
SEG0/CO
M2
NC
SEG1/CO
M3
NC
VDDA
ACM
OPO
SEG2
SEG3
SEG4
HY11P13
AI0
SEG5
LQFP64
AI1
SEG6
AI2
AI3
SEG7
SEG8
AI4
SEG9
.
AI5
AI6
AI7
NC
VSS
SEG10
SEG11
SEG12
SEG13
SEG14
1
2
3
4
5
6
7
8
9
1 0 1 1 1 2 1 3 1 4 1 5 1 6
Figure 2-1 HY11P13 LQFP64 Pin Diagram
Note 1：VPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.
Note 2：TST and PT1.3 use the same pin. Input voltage cannot exceed Vdd+0.3V while operating.
Note 3：If PT1.3 is not configured as external button pin, the anti-interference ability will be enhanced.
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page6
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.2. LQFP64 Pinout I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin
Characteristic
NO.
Pin Name
RST/VPP
Description
Pin
Buffer
Type
Type
1
RST
VPP
I
S
P
Reset IC
P
EPROM programming voltage input
PT1.0/INT0/PSCK
PT1.0
INT0
I
I
I
S
S
S
Digital input
2
Interrupt input INT0
PSCK
OTP programming interface SCK
PT1.1/INT1/PSDI/SCE
PT1.1
INT1
PSDI
SCE
I
I
I
I
S
S
S
S
Digital input
3
4
Interrupt input INT 1
OTP programming interface SDI
SPI communication interface SCE
PT1.2/SDI/LVDIN
PT1.3/TST
.
PT1.2
SDI
I
S
S
A
Digital input
I/O
A
SPI communication interface SDI
LVD external signal input interface
LVDIN
5
6
PT1.3
TST
I
I
S
S
S
Digital input
Test Mode input pin (invalid)
Digital output
PT1.4
I/O
PT1.5/PSDO/SDO
PT1.5
PSDO
SDO
I/O
O
S
C
S
Digital I/O
7
OTP programming interface SDO
SPI communication interface SDO
I/O
PT1.6/SCK
PT1.7/BZ
8
9
PT1.6
SCK
I/O
I/O
S
S
Digital input/output
SPI communication interface SCK
PT1.7
BZ
I/O
O
S
C
A
A
A
Digital I/O
Buzzer output
10
11
12
SEG21
SEG20
SEG19
O
Segment output for LCD
Segment output for LCD
Segment output for LCD
O
O
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page7
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
VLCD
NC
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
P
-
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
P
-
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
COM/segment output for LDO
COM/segment output for LDO
COM output for LDO
COM output for LDO
Power supply for LDO
Unused
.
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
VDD
P
P
Power supply for IC operation
PT2.0/XTO
42
43
44
PT2.0
XTO
I/O
A
S
A
Digital I/O
External oscillator output
PT2.1/XTI
PT2.1
XTI
I/O
A
S
A
Digital I/O
External oscillator input
PT2.2/PWM0/PFD
PT2.2
I/O
O
C
C
Digital I/O
PWM0
PWM output
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page8
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
PFD
O
C
PFD output
PT2.3/TMCKI
PT2.4/CCP0
PT2.5/CCP1
45
46
47
PT2.3
I/O
I
S
S
Digital I/O
TMCKI
TIMERC clock source input
PT2.4
CCP0
I/O
I
S
S
Digital I/O
CCP mode signal interface
PT2.5
CCP1
I/O
S
S
-
Digital I/O
I
-
-
-
-
CCP mode signal interface
Unused
48
49
50
51
NC
NC
-
Unused
NC
-
Unused
NC
-
Unused
VDDA
Regulator output
Analog circuit voltage source
Internal analog circuit common
ground pin
52
53
P
P
P
P
ACM
54
55
56
57
58
59
60
61
62
63
OPO
AI0
AI1
AI2
AI3
AI4
AI5
AI6
AI7
NC
A
A
A
A
A
A
A
A
A
-
A
A
A
A
A
A
A
A
A
-
OP output
.
Analog channel pin
Analog channel pin
Analog channel pin
Analog channel pin
Analog channel pin
Analog channel pin
Analog channel pin
Analog channel pin
Unused
VSS
Grounding pin for IC operation
voltage
64
P
P
Table 2-1 Pin Definition and Function Description
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page9
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3. Application Circuit
3.1. Bridge Sensor I
.
Figure 3-1 Bridge Sensor Application Circuit
Note 1：DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page10
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3.2. Bridge Sensor II
.
Figure 3-2 Application Circuit of Temperature Compensation Bridge Sensor
Note 1：Using temperature compensation resistor NTC basic circuit
Note 2：DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page11
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3.3. Bridge Sensor (Pressure Sensor)
.
Figure 3-3 Temperature Compensative Bridge Sensor Application Circuit (wo/ internal PGA amplification)
Note 1：Using temperature compensation resistor NTC basic circuit
Note 2：Pressure sensor zero point voltage address can be configured through DCSET[2:0] bias adjustment.
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page12
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3.4. IR Sensor
.
Figure 3-4 IR Sensor Application Circuit
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page13
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3.5. 4-20mA Current Panel Meter (Two-wire Type)
.
Figure 3-5 4-20mA Panel Meter that Unneeded to Connect External Power Supply
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page14
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4. Function Outline
4.1. Internal Block Diagram
XTI XTO VDD
VSS
TMCKI/CCP/PPF
PTn.x/BZ
SPI
C
C
P
P
C
C
C
Data
Memory
(STK：6L)
(SP：128B)
(GPR：256B)
RC
Oscillator
(HAO)
TIMER
A/B/C
(CCP)
(PPF)
PORT
(PT1、PT2)
(BZ)
Interface
(SPI)
(LPO)
D
D
COMx
SEGx
Program
Memory
(OTP：4KW)
HARDWARE
MULTIPLIER
8x8
LCD
4x20
CPU
H08A
Watch Dog
P
VLCD
SD18
(PGA)
(ΣΔAD)
(Network)
(Temp.senor)
RESET
(BOR)
(STACK)
(WDT)
Low Voltage
Detect
Low Noise
OPAMP
(Network)
Power
System
(LVD)
(RST)
C
A
C
C
P
P
RST
LVDIN
AIx
LNOP
VDDA ACM
.
C
P
D
A
Common I/O Pad
Power Pad
Digital Pad
Analog Pad
Figure 4-1 HY11P13 Internal Block Diagram
4.2. Related Description and Supporting Documents
IC Function Related Operating Instruction
DS-HY11P13-Vxx
UG-HY11S14-Vxx
HY11P13 Data Sheet
HY11P Series Users’ Manual
APD-CORE002-Vxx H08A Instruction Description
Development Tool Related Operating Instruction
APD-HYIDE006-Vxx HY11xxx Series Development Tool Software Instruction
Manual
APD-HYIDE005-Vxx HY11xxx Series Development Tool Hardware Instruction
Manual
APD-OTP001-Vxx
OTP Products Programming Pin Manual
Product Production Related Operating Instruction
APD-HYIDE004-Vxx HY1xxxx Series Production Line Specialized Programmer
Manual
BDI-HY11P13-Vxx
HY11P13 Individual Product Die Bonding Information
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page15
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4.3. SD18 Network
.
Figure 4-2 SD18 Network
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page16
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4.4. Low Noise OPAMP Network
.
Figure 4-3 Low Noise OPAMP Network
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page17
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
5. Register List
“-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1
“.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition
Address File Name
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
A-RESET
N/A
i-RESET
N/A
R/W
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
Contents of FSR0 to address data memory value of FSR0 not changed
00H
01H
02H
03H
04H
05H
06H
07H
08H
09H
0FH
10H
11H
12H
16H
17H
18H
1AH
1BH
1DH
1EH
1FH
20H
21H
22H
23H
24H
26H
27H
29H
2AH
2BH
2CH
2DH
30H
31H
32H
33H
37H
39H
3AH
3BH
3CH
3DH
3EH
3FH
40H
41H
42H
43H
44H
45H
46H
47H
48H
49H
4AH
4BH
4CH
4DH
4EH
4FH
51H
INDF0
Contents of FSR0 to address data memory value of FSR0 post-incremented
Contents of FSR0 to address data memory value of FSR0 post-decremented
Contents of FSR0 to address data memory value of FSR0 pre-incremented
Contents of FSR0 to address data memory value of FSR0 offset by W
Contents of FSR1 to address data memory value of FSR0 not changed
Contents of FSR1 to address data memory value of FSR0 post-incremented
Contents of FSR1 to address data memory value of FSR0 post-decremented
Contents of FSR1 to address data memory value of FSR0 pre-incremented
Contents of FSR1 to address data memory value of FSR0 offset by W
POINC0
PODEC0
PRINC0
PLUSW0
INDF1
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
POINC1
PODEC1
PRINC1
PLUSW1
FSR0H
FSR0L
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
FSR0[8]
FSR1[8]
TOS[8]
.... ...x
.... ...u
Indirect Data Memory Address Pointer 0 Low Byte,FSR0[7:0]
xxxx xxxx uuuu uuuu
.... ...x .... ...u
xxxx xxxx uuuu uuuu
.... 0000 .... 0000
0000 0000 0000 0000
*,*,*,* *,*,*,*
'-,-,-,- -,-,-,*
*,*,*,* *,*,*,*
-,-,-,- *,*,*,*
*,*,*,* *,*,*,*
r,rw0,rw0,- -,r,r,r
-,-,-,- *,*,*,*
*,*,*,* *,*,*,*
-,-,-,- *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
FSR1H
FSR1L
Indirect Data Memory Address Pointer 1 Low Byte,FSR1[7:0]
TOSH
TOS[11]
PC[11]
TOS[10]
PC[10]
TOS[9]
Top-of-Stack Low Byte (TOS<7:0>)
STKFL STKUN STKOV
TOSL
STKPRT[2:0]
PC[9]
STKPTR
PCLATH
PCLATL
TBLPTRH
TBLPTRL
TBLDH
TBLDL
000. .000
.... 0000
000. .000
.... 0000
PC[8]
PC Low Byte for PC<7:0>
0000 0000 0000 0000
TBLPTR[11] TBLPTR[10] TBLPTR[9] TBLPTR[8]
.... 0000
.... 0000
Program Memory Table Pointer Low Byte (TBLPTR<7:0>)
Program Memory Table Latch High Byte
Program Memory Table Latch Low Byte
Product Register of Multiply High Byte
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
PRODH
PRODL
INTE1
Product Register of Multiply Low Byte
r,r,r,r r,r,r,r
GIE
ADCIE
RCIE
TMCIE
TMBIE
TMAIE
TMAIF
WDTIE
SSPIE
WDTIF
SSPIF
E1IE
E0IE
*,*,*,* *,*,*,*
-,-,-,- -,*,*,*
-,*,*,* *,*,*,*
-,-,-,- -,*,*,*
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
INTE2
TXIE
CCP1IE CCP0IE
.... .000
.000 0000 .000 0000
.... .000 .... .000
xxxx xxxx uuuu uuuu
.... .000
INTF1
ADCIF
TMCIF
TMBIF
E1IF
E0IF
INTF2
CCP1IF
CCP0IF
Working Register
WREG
BSRCN
STATUS
PSTATUS
LVDCN
PWRCN
MCKCN1
MCKCN2
MCKCN3
OPCN1
ADCRH
ADCRM
ADCRL
ADCCN1
ADCCN2
ADCCN3
AINET1
AINET2
TMACN
TMAR
BSR[0]
Z
..... ...0
...x xxxx
000d .0..
..... ...0
...u uuuu
uduu .d..
C
DC
N
OV
-,-,-,* *,*,*,*
rw0,rw0,rw0,rw0 -,rw0,-,-
-,*,r,r *,*,*,*
*,*,*,* -,-,-,-
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,- *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
.
PD
TO
IDLEB
LVD
BOR
SKERR
VLDX[3:0]
LVDFG
LVDON
ENACM
ADCCK
HSCK
.000 0000 .000 uuuu
0000 .... 0000 ....
ENHAO 0000 0001 0000 0001
VDDAX[1:0]
ENVDDA
ADCS[2:0]
XTHSP
XTSP
ENXT
HSS[1:0]
PERCK
OPP[1:0]
CPUCK[1:0]
LSCK
..00 0000
..00 0000
LCDS[2:0]
BZS[2:0]
OPN[2:0]
000. 0000 000. 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
OPM[1:0]
ENOP
ADC conversion memory HighByte
ADC conversion memory Middle Byte
ADC conversion memory Low Byte
r,r,r,r r,r,r,r
r,r,r,r r,r,r,r
PGAGN[1:0]
VRBUF VREGN
ADGN[2:0]
ENADC
ENHIGN ENCHP
INBUF
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,- -,-,-,-
*,*,*,* *,*,*,*
-,*,*,* *,*,*,-
*,*,*,* w1,*,*,*
r,r,r,r r,r,r,r
DCSET[2:0]
..00 0000
000. ....
..00 0000
000. ....
OSR[2:0]
INH[2:0]
INL[2:0]
INX[1:0]
INIS
OPIS
0000 0000 0000 0000
.000 000. .000 000.
VRH[1:0]
VRL[1:0]
WDTS[2:0]
TMAS[1:0]
TMBS[1:0]
ENTMA
TMACK
ENWDT
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
TimerA data register
ENTMB TMBCK
TMBCN
TMBRH
TMBRL
TMCCN
PRC
TMBSYC TMBR2R
0000 00..
0000 00..
*,*,*,* *,*,-,-
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
TimerB High Byte data register
TimerB Low Byte data register
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
1111 1111 1111 1111
0000 0000 0000 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
TMCCK[1:0]
TMCS1[2:0]
TMCS0[1:0]
ENTMC
TimerC programmable register
TimerC register
TMCR
CCP1M[3:0]
CCP0M[3:0]
CCPCN
CCP0RH
CCP0RL
CCP1RH
CCP1RL
PASC
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,-,*,* -,-,-,-
*,*,*,* -,-,-,-
*,*,*,* *,*,*,*
CCP0 High Byte data register
CCP0 Low Byte data register
CCP1 High Byte data register
CCP1 Low Byte data register
PASCF[1:0]
PWMRL[1:0]
PASF
0.00 ….
0000 ….
0.00 ….
0000 ….
PWMCN
PWMR
ENPWM
ENPFD
PWM MSB Byte register
xxxx xxxx uuuu uuuu
Table 5-1(a) HY11P13 Register List
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page18
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
“-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1
“.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition
Address File Name
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
A-RESET
0000 000. 0000 000.
000. .... 000. ....
i-RESET
R/W
VLCDX[1:0]
LCDBI[1:0]
52H
53H
54H
55H
56H
57H
58H
59H
5AH
5BH
5CH
5DH
5EH
60H
61H
6DH
6EH
6FH
70H
71H
72H
74H
75H
77H
78H
79H
LCDCN1
LCDCN2
LCD0
ENLCD
LCDBL
LCDPR
LCDBF
*,*,*,* *,*,*,-
*,*,*,- -,-,-,-
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* -,-,*,*
r,r,-,- -,-,-,r
*,*,*,* *,*,*,*
*,*,*,* r,r,r,r
*,*,*,* -,-,-,-
-,-,-,- -,-,*,-
*,*,*,* *,*,*,*
-,-,-,- *,*,*,*
-,*,-,* -,*,-,-
-,-,*,* *,*,*,*
-,-,*,* *,*,*,*'
-,-,*,* *,*,*,*
-,-,*,* -,-,-,-
*,*,-,- *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
LCDMX[1:0]
Segment SEG2@[3:0] and SEG3@[7:4] data register of LCD
Segment SEG4@[3:0] and SEG5@[7:4] data register of LCD
Segment SEG6@[3:0] and SEG7@[7:4] data register of LCD
Segment SEG8@[3:0] and SEG9@[7:4] data register of LCD
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
LCD1
LCD2
LCD3
Segment SEG10@[3:0] and SEG11@[7:4] data register of LCD
Segment SEG12@[3:0] and SEG13@[7:4] data register of LCD
Segment SEG14@[3:0] and SEG15@[7:4] data register of LCD
Segment SEG16@[3:0] and SEG17@[7:4] data register of LCD
Segment SEG18@[3:0] and SEG19@[7:4] data register of LCD
Segment SEG20@[3:0] and SEG21@[7:4] data register of LCD
LCD4
LCD5
LCD6
LCD7
LCD8
LCD9
SSPM<1:0>
SSPCON1
SSPSTA
SSPBUF
PT1
SSPEN
CKP
CKE
SMP
0000 ..00
00.. ...0
uuuu ..uu
00.. ...0
SSPBUY SSPOV
BF
SSP Receive Buffer/Transmit Register
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
PT1.7
TC1.7
PT1.6
TC1.6
PT1.5
TC1.5
PT1.4
TC1.4
PT1.3
PU1.3
PT1.2
PT1.1
PU1.1
PT1.0
TRISC1
PT1DA
PT1PU
PT1M1
PT1M2
PT2
0000 ....
.... .0..
0000 ....
.... .0..
DA1.2
PU1.2
PU1.7
PU1.6
PU1.5
PU1.4
PU1.0
0000 0000 0000 0000
INTEG1[1:0]
INTEG0[1:0]
.... 0000
.0.0 .0..
.... 0000
.0.0 .0..
PM1.7[0]
PM1.6[0]
PT2.4
PM1.5[0]
PT2.2
PT2.5
TC2.5
PU2.5
PT2.3
TC2.3
PU2.3
PT2.1
TC2.1
PU2.1
PT2.0
TC2.0
PU2.0
..xx xxxx
..00 0000
..00 0000
..00 ....
..uu uuuu
..00 0000
..00 0000
..00 ....
TRISC2
PT2PU
PT2M1
PT2M2
TC2.4
TC2.2
PU2.4
PU2.2
PM2.2[1] PM2.2[0]
PWMTR[1] PWMTR[0]
PM2.5[1]
PM2.5[0] PM2.4[1] PM2.4[0] 00.. 0000
00.. 0000
General Purpose Register as 128Byte
General Purpose Register as 128Byte
80H ~ FFH GPR0
100H~17FH GPR1
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
Figure 5-1(b) HY11P13 Register List (continued)
.
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page19
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6. Electrical Characteristics
Absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Voltage applied at VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 4.0 V
Voltage applied to any pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .−0.2 V to VDD + 0.3 V
Voltage applied to RST/VPP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 6.9 V
Voltage applied to TST/PT1.3 pin . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to VDD + 1 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature, Tstg: (unprogrammed device) . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . −55℃ to 150℃
(programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40℃ to 85℃
Total power dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5w
Maximum output current sink by any PORT1 to PORT3 I/O Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25mA
6.1. Recommended operating conditions
TA = -40℃ ~ 85℃, unless otherwise noted
Sym.
VDD
Parameter
Test Conditions
All digital peripherals and CPU
Analog peripherals
Min. Typ. Max.
unit
2.2
2.4
0
3.6
3.6
0
Supply Voltage
V
Supply Voltage
External
VSS
XTSP[0]=0, XTHSP[0]=0
Watch crystal
Ceramic resonator
Crystal
32.768K
VDD = 2.2V,
XTSP[0]=1, XTHSP[0]=0
Oscillator
Hz
450K
1M
8M
8M
XT
.
ENXT[0]=1
Frequency
XTSP[0]=1, XTHSP[0]=0
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page20
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.2. Internal RC Oscillator
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
HAO
LPO
Parameter
Test Conditions
Min. Typ. Max.
unit
MHz
KHz
High Speed Oscillator frequency
Low Power Oscillator frequency
ENHAO[0]=1
1.8
22
2.0
28
2.2
35
VDD supply voltage be enable LPO
HAO vs. VDD
LPO vs. VDD
2.030
2.025
2.020
2.015
2.010
2.005
2.000
1.995
1.990
1.985
1.980
1.975
1.970
30.00
29.00
28.00
27.00
26.00
25.00
24.00
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
VDD
VDD
Figure 6.2-1 HAO vs. VDD
Figure 6.2-2 LPO vs. VDD
HAO vs. TA@VDD=3.0V
LPO vs. Temperature @VDD
1.980
31.00
30.00
29.00
28.00
27.00
26.00
25.00
24.00
1.960
1.940
1.920
1.900
1.880
VDD=3.6V
.
VDD=3.0V
1.860
1.840
VDD=2.2V
65
1.820
-40
-35
-15
5
25
45
85
-40
℃
-15
℃
15
℃
25
℃
45
℃
75
℃
85
℃
Temperature (
)
℃
Temperature(
)
℃
Figure 6.2-3 HAO vs. Temperature
Figure 6.2-4 LPO vs. Temperature
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page21
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.3. Supply Current into VDD Excluding Peripherals Current
TA = 25℃,VDD = 3.0V,OSC_LPO = 28KHz, unless otherwise noted
Sym. Parameter
Test Conditions
Min. Typ. Max.
unit
mA
mA
mA
uA
Active mode 1
OSC_CY = 8MHz, OSC_HAO = off, CPU_CK = 8MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 2MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 1MHz
OSC_CY = 32768Hz, OSC_HAO = off, CPU_CK = 16384Hz
OSC_CY = off, OSC_HAO = off, CPU_CK = LPO, Idle state
OSC_CY = off, OSC_HAO = off, CPU_CK = off, Sleep state
1.2
0.32
0.18
7
2
0.55
0.3
12
IAM1
Active mode 2
IAM2
Active mode 3
IAM3
Low Power 1
ILP1
Low Power 2
1.65
0.65
3
uA
ILP2
Low Power 3
1.2
uA
ILP3
OSC_CY：External Oscillator frequency.
OSC_HAO：Internal High Accuracy Oscillator frequency.
CPU_CK：CPU core work frequency.
IAM1 vs VDD
IAM2 vs VDD
450
400
350
300
250
200
150
100
1.9
1.7
1.5
1.3
1.1
0.9
0.7
0.5
.
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-1 IAM1 vs. VDD
Figure 6.3-2 IAM2 vs. VDD
IAM3 vs VDD
ILP1 vs VDD
250
200
150
100
50
10
9
8
7
6
5
4
3
2
1
0
0
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-3 IAM3 vs. VDD
Figure 6.3-4 ILP1 vs. VDD
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page22
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
ILP2 vs VDD
ILP3 vs VDD
2.50
2.00
1.50
1.00
0.50
0.00
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-5 ILP2 vs. VDD
Figure 6.3-6 ILP3 vs. VDD
IAM1 with temperature at VDD=3V
ILP2 with temperature at VDD=3V
1.30
3
2.6
2.2
1.8
1.4
1
1.29
1.28
1.27
1.26
1.25
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
)
)
℃
℃
Figure 6.3-7 IAM1 vs. Temperature
Figure 6.3-8 ILP2 vs. Temperature
.
ILP3 with temperature at VDD=3V
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
)
℃
Figure 6.3-9 ILP3 vs. Temperature
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page23
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.4. Port1~2
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
Input voltage and Schmitt trigger and leakage current and timing
High-Level input voltage
2.1
VIH
V
Low-Level input voltage
0.9
0.8
0.1
180
VIL
V
Vhys
ILKG
RPU
Input Voltage hysteresis(VIH - VIL )
Leakage Current
uA
kɖ
Port pull high resistance
Output voltage and current and frequency
VDD -0.3
High-level output voltage
IOH=10mA
IOL=-10mA
VOH
V
VSS +0.3
Low-level output voltage
VOL
VOH vs IOH @VDD=3V
VOH vs. IOH@VDD=2.2V
2.35
3.00
2.85
2.70
2.55
2.40
2.25
2.10
2.20
2.05
1.90
1.75
1.60
1.45
1.30
1.15
1.00
25
85
℃
25
℃
℃
85
℃
.
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
IOH
IOH
Figure 6.4-1 VOH vs. IOH @VDD=3.0V
Figure 6.4-2 VOH vs. IOH @VDD=2.2V
VOL vs. IOL@VDD=3.0V
VOL vs. IOL@VDD=2.2V
0.9
0.8
0.6
0.9
0.8
85
℃
0.6
0.5
0.3
0.2
0.0
85
℃
0.5
0.3
0.2
0.0
25
℃
25
℃
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
Figure 6.4-3 VOL vs. IOL@VDD=3.0V
Figure 6.4-4 VOL vs. IOL@VDD=2.2V
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page24
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.5. Reset (Brownout, External RST pin, Low Voltage Detect)
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
us
2
Pulse length needed to accepted reset internally, td-LVR
1.6
1.85
70
2.1
V
BOR
VDD Start Voltage to accepted reset internally (LH),VLVR
Hysteresis, VHYS-LVR
mV
us
2
Pulse length needed as RST/VPP pin to accepted reset internally, td-RST
Input Voltage to accepted reset internally
Hysteresis, VHYS-RST
0.9
V
RST
0.8
10
V
15
uA
Operation current, ILVD
External input voltage to compare reference voltage
1.2
100
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
V
TA = -40℃ ~ 85 ℃
ppm/℃
Compare reference voltage temperature drift
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1011b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1010b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1001b
LVD
.
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1000b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0111b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0011b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0010b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0001b
V
BOR：Brownout Reset
LVR：Low Voltage Reset of BOR
LVD：Low Voltage Detect
RST：External Reset pin
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page25
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
.
Figure 6.5-1 BOR Reset Diagram
Figure 6.5-2 RST Reset Diagram
*1 rRST：Please see BOR Introduce of HY11Pxx series User’s Guide (UG-HY11S14-Vxx).
VLVR and VLVR Release Voltaage vs. TA
1.98
1.96
1.94
LVR Release Voltage
V
1.92
1.90
1.88
1.86
1.84
1.82
1.80
LVR Voltage
V
-40
-35
-15
5
25
45
65
85
℃
℃
℃
℃
℃
℃
℃
℃
TA
.
Figure 6.5-3 LVR vs. Temperature
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page26
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.6. Power System
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
uA
IL = 0mA
VDDAX[1:0]=00b
VDDAX[1:0]=00b
VDDAX[1:0]=01b
VDDAX[1:0]=10b
VDDAX[1:0]=11b
VDDAX[1:0]=00b
VDDAX[1:0]=01b
VDDAX[1:0]=10b
VDDAX[1:0]=11b
TA=-40℃~85℃
22
3.3
2.9
2.6
2.4
135
150
165
180
50
VDDA operation current, IVDDA
IL = 0.1mA,
V
VDD≧VDDA+0.2V
V
Select VDDA output voltage
V
V
IL = 10mA
mV
mV
mV
mV
ppm/℃
%/V
uA
VDDA
Dropout voltage
Temperature drift
VDDAX[1:0]=11b
IL = 0.1mA
±0.2
20
VDD Voltage drift
VDD=2.5V~3.6V
IL = 0mA
ACM operation current, IACM
Output voltage ,VACM
Output voltage with Load
Temperature drift
ENACM[0]=1
IL = 0uA
IL = ±200uA
TA=-40℃~85℃
1.0
V
0.98
1.02
VACM
ppm/℃
uV/V
ACM
ENACM[0]=1,
50
.
IL = 10uA
VDDA Voltage drift
100
VDDA：Adjust Voltage Regulator
ACM：Analog Common Mode Voltage
VDDA@2.4V with VDD
VDDA@2.4V with VDD
2.3900
2.390
2.388
2.386
2.384
2.382
2.380
2.378
2.376
2.374
2.372
2.3895
2.3890
2.3885
2.3880
2.3875
2.3870
2.3865
2.3860
2.3855
2.3850
2.3845
2.3840
L
I =10mA
L
I =0.1mA
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V
VDD(V)
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V
VDD(V)
Figure 6.6-1 VDDA lL=0.1mA vs. VDD
Figure 6.6-2 VDDA lL=10mA vs. VDD
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page27
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
VDDA with temperature
VDDA with temperature
2.3880
2.3910
2.3900
2.3890
2.3880
2.3870
2.3860
2.3850
2.3840
2.3830
2.3820
2.3810
L
I =10mA
I
L
=0.1mA
2.3860
2.3840
2.3820
2.3800
2.3780
2.3760
2.3740
2.3720
2.3700
2.3680
2.3660
VDD=3.0V
VDD=2.6V
VDD=3.0V
VDD=2.5V
-40
-35
-15
5
25
45
65
85
-40
-35
-15
5
25
45
65
85
℃
TA(
)
TA(℃)
Figure 6.6-3 VDDA lL=0.1mA vs. Temperature
Figure 6.6-4 VDDA lL=10mA vs. Temperature
ACM Load with VDDA
ACM vs. VDD with temperature @VDDA=2.4V
0.992
1.010
IL=200uA
VDD=3.6V
0.992
1.005
1.000
0.995
0.990
0.985
0.980
VDD=2.5V
IL=10uA
0.991
IL=0uA
0.991
0.990
IL=-200uA
0.990
0.989
0.989
0.988
2.4
2.6
2.9
3.3
-40
-20
0
20
TA (
40
60
80
100
Internal VDDA(V)
℃
)
Figure 6.6-5 ACM Load vs. VDDA
Figure 6.6-6 ACM vs. Temperature
.
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page28
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.7. LCD
TA = 25℃,VDD = 3.0V, CVLCD =4.7uF,unless otherwise noted.
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
Operation supply current without
output buffer.(all segment turn on)
LCDPR[0]=1
VDD = 2.2V
10
uA
ILCD
VDD = 3.0V
Supply Voltage at VLCD pin
LCDPR[0]=0
VDD = 2.2V,
2.2
3.6
V
V
VLCDX[1:0]=11b
VLCDX[1:0]=10b
VLCDX[1:0]=01b
VLCDX[1:0]=00b
2.295
2.52
2.55
2.8
2.805
3.08
LCDPR[0]=1,
CVLCD =4.7uF
Embedded Charge Pump output
voltage at VLCD pin
VLCD
ZLCD
2.745
2.97
3.05
3.3
3.355
3.63
kΩ
Output impedance with LCD buffer
fLCD =128Hz,VLCD=3.05V
10
VLCD Start Time
VLCD vs. VDD
142
VDD=2.2V
3.08
3.05
3.02
2.99
2.96
2.93
2.90
122
102
82
62
42
22
2
VDD=3.0V
VDD=3.6V
.
2.55
2.8
3.05
3.3
VLCD(V)
VDD(V)
Figure 6.7-1 LCD start time
Figure 6.7-2 VLCD vs. VDD
VLCD vs. Load
VLCD vs. Load
3.5
3.3
3.1
2.9
2.7
2.5
2.3
2.1
3.3
VDD=3.0V
VDD=2.2V
3.1
2.9
2.7
2.5
2.3
2.1
10
20
30
40
50
60
IL(uA)
70
80
90
100
125
150
175
200
225
250
275
300
325
350
IL(uA)
Figure 6.7-3 VLCD vs. IL @VDD=2.2V
Figure 6.7-4 VLCD vs. IL @VDD=3.0V
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page29
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.8. Low Noise OPAMP
TA = 25℃,VDD = 3.0V, VDDA=2.4V, unless otherwise noted
Sym.
VLNOP
ILNOP
Parameter
Supply voltage at VDDA
Test Conditions
Min. Typ. Max.
unit
V
ENVDDA[0]=0
2.4
3.6
Operation supply current
OPM[1:0]=xxb
200
uA
Input offset voltage without chopper.
Input offset voltage with chopper
OPM[1:0]=1xb
OPM[1:0]=0xb
-2
2
mV
uV
20
0.1
2
VOS-OP
OPM[1:0]=00b
OPM[1:0]=10
VO=1.2V,
TA=-40℃~85℃
uV/℃
Input offset voltage temperature drift.
Unit gain load regulation
IL=+1mA
IL=-1mA
0.1
%VO
VOLR
VDDA=2.4V
Common-mode voltage input range
Common-mode rejection ratio
OPM[1:0]=xxb
OPM[1:0]=xxb
0.1
VDDA-1.1
V
CMVR
CMRR
90
dB
LNOPoffset vs Temperature
0.195
0.190
0.185
0.180
0.175
0.170
0.165
no chopper
VDDA=2.4V
VDDA=3.3V
.
-40 -30 -20 -10
0
10 25 30 40 50 60 70 85
Temperature(
)
℃
Figure 6.8-1 LNOP Offset Temperature
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page30
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.9. SD18, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
ENVDDA[0]=0
2.4
25
3.6
300
VSD18
Modulator sample frequency, ADC_CK
Over Sample Ratio, OSR
ENADC[0]=1
250
KHz
f SD18
256
32768
168
150
120
INBUF[0]=1,VRBUF[0]=0
Operation supply current
without PGA
GAIN =4,
ADC_CK=250KHz
ENADC[0]=1
uA
I SD18
INBUF[0]=0,VRBUF[0]=1
ENADC[0]=1
INBUF[0]=0,VRBUF[0]=0
6.9.1 PGA, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V, unless otherwise noted
Sym.
VPGA
I PGA
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
Operation supply current
Gain temperature drift
ENVDDA[0]=0
2.4
3.6
PGAGN[1:0]=<01>or<1x>
320
5
uA
TA = -40℃~ 85℃
ppm/℃
GAIN=128
GPGA
.
6.9.2 SD18, Performance II (fSD18=250KHz)
TA = 25℃,VDD = 3.0V, VDDA=2.9V,VVR=1.0V,GAIN=1 without PGA, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
VDDA=2.4V,VVR=1.0V,ΔSI=±200mV
±0.003
±0.01
Integral Nonlinearity(INL)
%FSR
INL
VDDA=2.4V,VVR=1.0V,ΔSI=±450mV
No Missing Codes3
ADC_CK=250KHz,OSR[2:0]=010b
INBUF[0]=0b,VRBUF[0]=0b
23
Bits
Temperature drift
INBUF[0]=1b,VRBUF[0]=0b
TA = -40℃~ 85℃
ppm/℃
Gain 1~x16 (INBUF[0]=0b,)
Gain 1~x4 (INBUF[0]=1b,)
2
GSD18
INBUF[0]=0b,VRBUF[0]=1b
INBUF[0]=1b,VRBUF[0]=1b
ΔAI=0V
Offset error of Full Scale Rang input
voltage range with Chopper and
ΔVR=0.9V
Gain=2
Gain=2
1
1
EOS
Buffer(INBUF,VRBUF) without PGA DCSET[2:0]=<000>
%FSR
* Δ AI is external
Offset error of Full Scale Rang input
voltage range with Chopper without
PGA and Buffer(INBUF,VRBUF)
Offset temperature drift with
chopper without PGA and Buffer
(INBUF,VRBUF).
short
uV/℃
GAIN=1
GAIN=2
GAIN=4
2
1
0.5
© 2009-2011 HYCON Technology Corp
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HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
GAIN=16
0.15
2
GAIN=1
GAIN=2
GAIN=4
Offset temperature drift with chopper and Buffer
(INBUF,VRBUF) without PGA.
1
0.5
Offset temperature drift with chopper without Buffer
(INBUF,VRBUF).
GAIN=128
0.02
90
VCM=0.7V to 1.7V,
VSI=0V,
GAIN=1
VSI=0V,
VVR=1.0V,without PGA
Common-mode rejection
dB
dB
CMSD18
VCM=0.7V to 1.7V,
75
VVR=1.0V, without PGA
GAIN=16
GAIN=1
PGA=off
GAIN=16
PGA=8
VDDA=3.0V,ΔVDDA=±
PSRR
DC power supply rejection
100mV,VVR=1.0V,
75
VSI=1.2V,VSI-=1.2V,
SD18 Offset Drfit vs. Temperature
SD18 Offset Drfit vs. Temperature
5
0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
-5
-10
-15
-20
-25
.
-40℃ -20℃ 0℃
20℃ 40℃ 60℃ 80℃
-40℃ -20℃ 0℃
20℃ 40℃ 60℃ 80℃
TA
TA
Gain=1, SI and VR buffer off
VIN short to ACM
∆VR=1.2V, VDDA=2.4V
Gain=16, SI and VR buffer off
VIN short to ACM
∆VR=1.2V, VDDA=2.4V
Figure 6.9-1(a) SD18 Offset Temperature Drift
Figure 6.9-1(b) SD18 Offset Temperature Drift
SD18 Gain Drfit vs. Temperature
SD18 Offset Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
1
0.5
0
-0.5
-1
-1.5
-2
-0.03%
-40℃ -20℃ 0℃
20℃ 40℃ 60℃ 80℃
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
Gain=128, SI and VR buffer off
VIN short to ACM
∆VR=1.2V, VDDA=2.4V
TA
TA
Gain=1, SI and VR buffer off
∆SI=300mV, ∆VR=0.9V
VDDA=2.4V
Figure 6.9-1(c) SD18 Offset Temperature Drift
Figure 6.9-2(a) SD18 Gain Drift with Temperature
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page32
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
SD18 Gain Drfit vs. Temperature
SD18 Gain Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
TA
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
Gain=128, SI and VR buffer off
∆SI=4.6875mV, ∆VR=0.9V
VDDA=2.4V
TA
Gain=16, SI and VR buffer off
∆SI=37.5mV, ∆VR=0.9V
VDDA=2.4V
Figure 6.9-2(b) SD18 Gain Drift with Temperature
Figure 6.9-2(c) SD18 Gain Drift with Temperature
.
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page33
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.9.3 SD18, Temperature Sensor
TA = 25℃,VDD = 3.0V, VDDA=3.3V, unless otherwise noted
Sym.
TCS
Parameter
Test Conditions
ΔVR=2.4V,VRGN[0]=1,
INBUF[0]=1
Min. Typ. Max.
unit
uV/℃
℃
Sensor temperature drift
178
-289
±2
Absolute Temperature Scale 0°K
One point calibrate error temperature
KT
Calibration at 25℃ of -40℃~85℃
℃
TCERR
TPS Voltage vs. Temperature
70
60
50
40
30
20
10
0
-45
-30
-15
0
15
30
45
60
75
90
TA(℃)
Figure 6.9-3 TPS Output Voltage vs. Temperature Drift
.
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page34
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.9.4 SD18 Noise Performance
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
HY11P13 provides important input noise specification that aims at SD18. Table 6.9-4(a)
and Table 6.9-4(b) lists out the relations of typical noise specification, gain, output rate and
maximum input voltage of single end. Test conditions are external input signal short,
voltage reference: 1.2V and 1024 records were sampled.
ENOB(RMS) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF (1)
Output rate(HZ)
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25
0.5
1
16.3
16.3
16.2
16.1
16.0
15.9
15.6
14.8
14.5
14.0
17.4
17.3
17.2
17.1
16.9
16.6
16.3
15.3
15.0
14.6
17.9
17.9
17.8
17.6
17.5
17.2
16.8
15.9
15.5
15.1
18.5
18.4
18.3
18.2
18.0
17.7
17.3
16.4
16.0
15.6
19.0
18.9
18.8
18.7
18.5
18.2
17.7
16.9
16.5
16.0
19.5
19.4
19.3
19.2
18.9
18.7
18.3
17.4
17.0
16.6
20.0
19.8
19.7
19.6
19.4
19.2
18.8
17.8
17.5
17.0
20.4
20.2
20.1
20.0
19.8
19.6
19.3
18.3
18.0
17.5
2
2
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
(1) Max.Vin (mV) is the max. input voltage of single end to ground (VSS).
Table 6.9-4(a) SD18 ENOB Table
.
RMS Noise(uV) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF
Output rate(HZ)
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25 121.08 57.40 38.74 26.66 18.39 13.21
9.49
5.12
2.80
1.48
0.87
0.51
0.33
0.32
0.20
0.14
6.98
3.91
2.13
1.12
0.65
0.39
0.24
0.23
0.14
0.10
0.5
1
61.63 29.23 19.21 13.51
9.78
5.19
2.86
1.67
1.01
0.70
0.62
0.41
0.28
7.02
3.77
2.06
1.19
0.73
0.46
0.45
0.29
0.19
32.21 15.70 10.25
7.31
4.06
2.37
1.44
0.92
0.89
0.56
0.38
2
2
16.59
9.00
5.04
3.03
2.61
1.66
1.13
8.54
4.84
2.97
1.84
1.81
1.13
0.77
5.91
3.33
2.02
1.29
1.27
0.80
0.55
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
Table 6.9-4(b) SD18 RMS Noise Table
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page35
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
The RMS noise are referred to the input. The Effective Number of Bits (ENOB(RMS
Bit)) is defined as:
FSR
ln
RMSNoise
ENOB(RMS)
ln(2)
2 VREF 1024ADO
k
- Average
2
k1
RMSNoise
223
Where FSR (Full- Scale Range) 2 VREF/Gain.
1024ADO
k
k1
Average
1024
RMS Noise Diagram
RMS Noise Diagram
3
2
450
400
350
300
250
200
150
100
50
Gain=1
Output rate ~ 8sps
Gain=1
Output rate ~ 8sps
1
0
-1
-2
-3
.
0
-3
-2
-1
0
1
2
3
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 20-bit output
LSB base on 20-bit output
Figure 6.9-4(a) RMS Noise Diagram
Figure 6.9-4(b) Output Code Diagram
RMS Noise Diagram
RMS Noise Diagram
350
300
250
200
150
100
50
Gain=128
Output rate ~ 8sps
5
4
Gain=128
Output rate ~ 8sps
3
2
1
0
-1
-2
-3
-4
-5
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 18-bit output
LSB base on 18-bit output
Figure 6.9-4(c) RMS Noise Diagram
Figure 6.9-4(d) Output Code Diagram
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page36
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
7. Ordering Information
Shipment
Packing
Type
-
Package
Type
Package
Drawing
Unit
Material
Device No.1
Pins
Code2
MSL3
Q’ty Composition
4
HY11P13-D000
HY11P13-L064
HY11P13-LS64
Die
-
D
L
L
000
064
S64
000
000
000
100
160
250
-
Green
Green
Green
4
4
LQFP
LQFP
64
64
Tray
MSL-3
MSL-3
Tray
1 Device No.: Model No. – Package Type Description – Code (Blank Code/ Standard/
Customized Programming Code)
Ex: Your customized programming code is 008 and you require die shipment.
The device No. will be HY11P13-D000-008.
Ex: You request blank code in die package.
The device No. will be HY11P13-D000.
Ex: You request blank code in LQFP 64 package.
The device No. will be HY11P13-L064.
And please clearly indicate the shipment packing type when placing orders.
Ex: Your customized programming code is 009 and you require products in LQFP 64
.
package.
The device No. will be HY11P13-LS64-009.
And please clearly indicate the shipment packing type when placing orders.
2 Code:
“001”~ “999” is standard or customized programming code. Blank code does not have
these numbers.
3 MSL:
The Moisture Sensitivity Level ranking conforms to IPC/JEDEC J-STD-020 industry
standard categorization. The products are processed, packed, transported and used
with reference to IPC/JEDEC J-STD-033.
4 Green (RoHS & no Cl/Br):
HYCON products are Green products that compliant with RoHS directive and are
Halogen free (Br/Cl<0.1%).
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page37
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8. Package Information
8.1. LQFP64 (L064)
.
JEDEC MS-026 compliant
© 2009-2011 HYCON Technology Corp
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DS-HY11P13-V14_EN
page38
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.2. LQFP64(LS64)
.
JEDEC MS-026 compliant
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page39
HY11P13
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
9. Revision Record
Major differences are stated thereinafter:
Version Page Revision Summary
V04
V06
ALL
First edition
With reference to documentation: DS-HY11P13-V06_TC
Features revision
4
6~8
8~13
Table 2-1 Pin Definition and Function Description revision
Chapter 3 Application Circuit revision
24~25 Chapter 6.6 Power System revision
26
Chapter 6.8 Low Noise OPAMP revision
Chapter 6.9.2 SD18, PerformanceⅡrevision
28~30
V07
V08
15~16 Chapter 5 Register List revision
4
Features revision
9~10
Chapter 3.1 & 3.2 content revision
24~25 Chapter 6.6 Power System revision
V09
V13
1
5
6
Cover Revised
Feature revised, delete 1/2bias description
.
Add in Note 3 description
10~14 Revised application circuit, added in RC circuit of RST
15
4
Revised Internal Block Diagram
Revise Chapter 1 content
10
11
15
16
19
26
28
Revise Figure 3-2
Revise Figure 3-3
Revise Development Tool Related Operating Instruction serial numbers
Add in SD18 Network chapter
Revise Chapter 6
Revise temp. drift spec of power system
Reduce LCD current spec.
34~35 Add in the chapter of SD18 Noise Performance
36
38
17
Chapter 7 Ordering information revision
Add in package information – 8.2 LQFP64(LS64)
Added in 4.4 Low Noise OPAMP Network
V14
© 2009-2011 HYCON Technology Corp
www.hycontek.com
DS-HY11P13-V14_EN
page40
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