HY2141-XWXX [HYCON]
Quality Approval Sheet;型号: | HY2141-XWXX |
厂家: | HYCON Technology Corporation |
描述: | Quality Approval Sheet |
文件: | 总15页 (文件大小:1785K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HY2141 Series
Quality Approval Sheet
HY2141 Series
Quality Approval Sheet
Table of Contents
1
2
3
Statement ............................................................................................................................3
ISO Certificate.....................................................................................................................4
Reliability Test Introduction...............................................................................................5
3.1
3.2
3.3
3.4
Package Reliability Test Flow.....................................................................................5
Package Reliability Test Plan .....................................................................................6
Product Reliability Test Flow ......................................................................................7
Product Reliability Test Plan.......................................................................................7
4
5
Product Information............................................................................................................8
4.1
4.2
4.3
4.4
4.5
Package Reliability Result..........................................................................................8
Product Reliability Result ...........................................................................................8
Product Storage Condition.........................................................................................9
Reflow Profile Suggestion........................................................................................10
Product Label System..............................................................................................11
Green Product...................................................................................................................12
5.1
5.2
5.3
Hazardous Substances Control Item within test report ............................................12
Hazardous Substances Control Item within letter.....................................................13
Restricted Use of Conflict Minerals ..........................................................................15
HYCON Technology Corporation
www.hycontek.com
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HY2141 Series
Quality Approval Sheet
1 Statement
HYCON Technology Corporation positions ourselves as a leading manufacturer of high precision
integrated circuits in analog and digital signal processing applications.
Our quality system is in full accordance with ISO9000 procedures. Our products are not only
innovative and leading-edge from a design perspective, but they are also, based on our reliability
data, exceptionally robust and conform to industrial standards resulted from their high stability.
HYCON Technology Corporation strives to produce reliable and high-quality products that meet
customers’ requirements.
Due to the rising environmental and human rights concerns around the world, the need for
environmental protection and hazardous (banned) substance elimination in electronic
components and systems is receiving increased attention within the semiconductor and
electronics industries. HYCON Technology Corporation asserts the concept of sustainable
corporate development and social responsibility and respects international human rights
therefore we not only have been devoted to the provision of Green products which are in
compliance with Restriction of Hazardous Substances (RoHS) Directive (EU) 2016/293, (EU)
2015/863, 2011/65/EU, Halogen Free (IEC 61249-2-21) and REACH 1907/2006(EC) ANNEX
XVII and SVHC (Substance of Very High Concern) under REACH (Registration, Evaluation,
Authorization and Restriction of Chemicals) current version of restricted substances and
prescribed regulations but also all products supplied to customers are of conflict-free minerals.
If necessary, please contact HYCON Technology Corporation’s sales/agents for more
information, and we will keep on providing our best support and service to you.
Sam Sun
Senior Manager, QC. Dept.,
Quality Assurance Division.
HYCON TECHNOLOGY CORPORATION
HYCON Technology Corporation
www.hycontek.com
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HY2141 Series
Quality Approval Sheet
2 ISO Certificate
Audited by creditworthy TÜV SUD Asia Pacific Ltd. TÜV Süddeutschland Group, HYCON Technology
Corporation procured the anticipating certificate of ISO 9001:2015.
HYCON Technology Corporation is certified in the scope of “Design, Manufacturing, Marketing and Service of
Integrated Circuits”.
By fulfilling ISO 9001:2015, it is the very first stage of quality management system of HYCON Technology
Corporation. We’re going to continuously practice quality objective, “Ceaseless Quality Improvement”, “Fearless
in Confronting Challenges”, “Innovative Thinking” and “Sticking to Commitment” in every products realization
and company evolving activities. HYCON Technology Corporation devotes to provide customers,
representatives, suppliers with total satisfaction.
HYCON Technology Corporation
www.hycontek.com
Page 4
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HY2141 Series
Quality Approval Sheet
3 Reliability Test Introduction
3.1 Package Reliability Test Flow
Start
Electrical Function Test
Visual Inspection
C-SAM Sampling Inspection <SAT>
MSL Preconditioning
<Moisture Sensitivity Level>
C-SAM Sampling Inspection <SAT>
Electrical Function Test
HTSL
TC
PCT
UHAST
Solderability
Electrical Function Test
Generate Report
Visual Inspection
HYCON Technology Corporation
www.hycontek.com
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HY2141 Series
Quality Approval Sheet
3.2 Package Reliability Test Plan
Sampling Plan
Test Item
Reference Document
Test Condition and Readout
SS/Acc. LTPD
Temperature Cycling:
-65℃~150℃, 5 cycles
Bake:125℃, 24 hrs.
Soaking:(MSL1 or MSL3)
MSL Preconditioning
JESD22-A113
212/6
5%
(PC)
IPC/JEDEC J-STD-020
MSL1:85℃, 85%RH, 168 hrs.
MSL3:30℃, 60%RH, 192 hrs.
Reflow:3 times @ 260℃ Peak
High Temperature
Storage Life
(HTSL)
JESD22-A103
150℃, 1000 hrs.
25/0
10%
Temperature Cycling
(TC)
MIL-STD-883 Method 1010
JESD22-A104
-65℃~150℃, 500 cycles
25/0
25/0
10%
10%
Pressure Cooker Test
(PCT)
JESD22-A102
JESD22-A118
JESD22-B102
121℃, 100%RH, 2atm, 168hrs.
High Temperature
Accelerated Stress Test
(UHAST)
130℃, 85%RH, 96 hrs.
25/0
15/0
10%
15%
Solderability
(SD)
5 ± 0.5 sec.
HYCON Technology Corporation
www.hycontek.com
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Quality Approval Sheet
3.3 Product Reliability Test Flow
Start
Electrical Function Test
ESD
Latch Up
HTOL
Electrical Function Test
Generate Report
3.4 Product Reliability Test Plan
Test Item
ESD-HBM
Reference Document
Test Condition and Readout
SS/Acc.
MIL-STD-883 Method 3015
JESD22-A115
3/0
3/0
3/0
It is proceeded until condition we
can carry out using test equipment.
ESD-MM
Latch-Up
JESD78
High Temperature
Operating Life
(HTOL)
MIL-STD-883 Method 1005
JESD22-A108
77/0
125℃, 1000 hrs.
LTPD 3%
JESD85
HYCON Technology Corporation
www.hycontek.com
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Quality Approval Sheet
4 Product Information
4.1 Package Reliability Result
Package Reliability
Material
Composition
Green
Model
Type
Pins
MSL
HTSL
TC
PCT
UHAST
SD
HY2141-XWXX
HY2141-XAXX
Wafer
-
-
-
-
-
-
-
PASS
★
PASS
★
PASS
★
PASS
★
PASS
★
DFN8 (2.0X2.0mm)
8
Green
1
4.2 Product Reliability Result
Test Item
Result
ESD-HBM
ESD-MM
Latch-Up
Pass ± 2.25KV
Pass ± 250V
Pass ± 110mA
At 90% Confidence Level
λ = 0.0718 FIT
High Temperature Operating Life Test
(HTOL)
MTTF = 1,588,906 years
★:It refers to assembly house reliability qualification report of the same process/package.
HYCON Technology Corporation
www.hycontek.com
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Quality Approval Sheet
4.3 Product Storage Condition
4.3.1 Wafer Product
4.3.1.1 The product should be vacuum sealed in dry pack and kept in an
environmentally controlled area within 15°C~35°C and 60%RH, and besides,
should be used within 6 months.
4.3.1.2 The package assembly process must be finished within 7 days.
4.3.1.3 To reduce the risk of containment or oxidation, the residual wafer product must
be kept in Nitrogen (N
2
) purge cabinet within 20℃~30℃ or well vacuum sealed
in dry pack once again.
4.3.2 Dice Product
4.3.2.1 The product should be vacuum sealed in dry pack and kept in an
environmentally controlled area within 15°C~35°C and 60%RH, and besides,
should be used within 6 months.
4.3.2.2 The package assembly process should be finished within 24 hours.
4.3.2.3 To reduce the risk of containment or oxidation, the residual dices product should
be well vacuum sealed in dry pack.
4.3.3 Package Product
4.3.3.1 Moisture Classification Level and Floor Life and Baking Condition.(J-STD-033)
Moisture Sensitive Level
Level 1
Floor Life (out of bag) at Factory Ambient
Unlimited at 30°C/85% RH
1 year ( 30°C/60% RH)
Level 2
Level 2a
4 weeks ( 30°C/60% RH)
Level 3
168 hours ( 30°C/60% RH)
72 hours ( 30°C/60% RH)
48 hours ( 30°C/60% RH)
24 hours ( 30°C/60% RH)
Mandatory bake before use.
Level 4
Level 5
Level 5a
Level 6
HYCON Technology Corporation
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Quality Approval Sheet
4.3.3.2 The product should be vacuum sealed and kept in an environmentally
controlled area at 30°C/60% RH, and besides, should be used within 12
months.
4.3.3.3 Floor Life,
MSL-1:Unlimited at 30°C/85% RH.
MSL-3:The assembly process should be finished within 168 hours.
( 30°C/60% RH).
4.3.3.4 After the floor life has expired (e.g., MSL-3:168 hours) or other conditions (e.g.,
Bag Damaged) have occurred to indicate excess moisture exposure, the baking
condition as below,
MSL-1:No need to bake.
MSL-3:
Tray packing:125 ºC 5ºC, 9 hours.
Tape & Reel packing:40 ºC @ ≤ 5%RH Chamber, 13 days.
Tube packing:25 ºC @ ≤ 5%RH Chamber, 13 days.
4.4 Reflow Profile Suggestion
HYCON products are all green products (Halogen Free, Pb-Free), the reflow profile
suggestion refers to J-STD-020 as below:
HYCON Technology Corporation
www.hycontek.com
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HY2141 Series
Quality Approval Sheet
4.5 Product Label System
In order to improve management and traceability, we upgrade label system and introduce
1D and 2D barcode. The barcode label was launched since 2015 Q4. The change of label
shall not affect the product function and specification.
4.5.1 Label Example
Wafer Product
Package Product
4.5.2 Symbols of Label
4.5.2.1 The ”Pb-free, Green” mark means it is Green Product that meets RoHS
Directive, SVHC under REACH and Halogen free.
4.5.2.2 MSL:Moisture Sensitivity Level.
4.5.2.3 Plating Spec:
e3:Pure Sn
e4:Precious Metal.
4.5.2.4 260C:Peak temperature of IR Reflow.
4.5.2.5 “MSL”, “Plating SPEC” and “260C” are showed on package product label ONLY.
4.5.2.6 Above data refers to IPC/JEDEC Joint Standard J-STD-609.
HYCON Technology Corporation
www.hycontek.com
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Quality Approval Sheet
5 Green Product
5.1 Hazardous Substances Control Item within test report
No.
Material & Substance
Legal Reference
Threshold
M.D.L
EU Directive 2011/65/EU
California Proposition 65
EU REACH Regulation
86/677/EEC
RoHS2.0
Lead (Pd) and its compounds
1
1000ppm (0.1wt%)
≦2ppm
Norway’s PoHS
EU Directive 2011/65/EU
EU REACH Regulation
TCO 5.2
EU Directive 2011/65/EU
EU REACH Regulation
Norway’s PoHS
RoHS2.0
2
3
1000ppm (0.1wt%)
100ppm (0.01wt%)
≦2ppm
≦2ppm
Mercury (Hg) and its compounds
RoHS2.0
Cadmium (Cd) and its compounds
EU Directive 98/101/EC
EU Directive 2011/65/EU
EU REACH Regulation
RoHS2.0
4
5
1000ppm (0.1wt%)
1000ppm (0.1wt%)
≦2ppm
≦5ppm
Hexavalent chromium (Cr6+) compounds
EU Directive 2011/65/EU
EU REACH Regulation
RoHS2.0
Polybrominated Biphenyls (PBBs)
RoHS2.0
EU Directive 2011/65/EU
EU REACH Regulation
6
1000ppm (0.1wt%)
≦5ppm
Polybrominated Diphenyl Ethers (PBDEs)
(PBDEs,PBBE,PBDOs,PBBOs, DecaBDE)
RoHS2.0
Phthalates, e.g.:
(EU) 2015/863/EU, 2011/65/EU
JIG-101 Ed 4.1
Canadian Environmental Protection
Act
Di (2-ethylhexyl) Phthalate (DEHP)
Di-n-butyl Phthalate (DBP)
Butyl Benzyl Phthalate (BBP)
Diisobutyl Phthalate (DIBP)
Di-iso-nonyl Phthalate (DINP)
Diisodecyl phthalate (DIDP)
Di-n-hexyl Phthalate (DNHP)
7
1000ppm (0.1wt%)
≦50ppm
OSPAR
IEC 61249-2-21
JPCA-ES01 2003
Halogen Free
8
900ppm (0.09 wt%)
900ppm (0.09 wt%)
1500 ppm (0.15wt%)
≦50ppm
≦50ppm
≦50ppm
Bromine (Br)
IEC 61249-2-21
JPCA-ES01 2003
Halogen Free
Chlorine (CI)
9
IEC 61249-2-21
JPCA-ES01 2003
Halogen Free
Total Halogen Contained (CI+Br)
10
2006/122/EC
(EU) 757/2010
Norway PoHS
Stockholm Convention
SONY GP (SS-00259)
(EU) 2016/293
Perfluorooctyl acid (PFOA) and individual salts and esters of PFOA
Perfluorooctane Sulphnate (PFOS) related substances,
11
12
10 ppm (0.001wt%)
Forbidden(N.D)
≦10ppm
≦5ppm
Halogenated Flame Restardants, e.g.:
Stockholm Convention
Norway PoHS
JIG-101 Ed 4.1
Hexabromocyclododecane (HBCCD)
TBBP-A
SONY GP (SS-00259)
Ozone Depleting Substances:
Chlorofluorocarbons (CFCs)
Hydrochlorofluorocarbons (HCFCs)
Halons
Bromodifluoromethane and Isomers (HBFCs)
Hydrofluorocarbon (HFC) and Perfluorocarbons (PFC)
Other ozone depleting substances
Montreal Protocol Annex A, B, C
JIG-101 Ed 4.1
13
Forbidden(N.D)
≦1ppm
※
※
Third-Party Hazardous Substance Test Reports provided by our suppliers and updated within 14-day prior or post to the expiration date are available upon customer request.
HYCON Environmental Policy:http://www.hycontek.com/en/company-en/1781#tab2
HYCON Technology Corporation
www.hycontek.com
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Quality Approval Sheet
5.2 Hazardous Substances Control Item within letter
No.
Material & Substance
Legal Reference
Threshold
M.D.L
1
2
3
4
5
6
Short-chain chlorinated paraffins (SCCP)
Medium-chain chlorinated pararffins (MCCP)
Long-chain chlorinated paraffins LCCP
Forbidden(N.D)
Forbidden(N.D)
Forbidden(N.D)
Forbidden(N.D)
Forbidden(N.D)
Forbidden(N.D)
≦5ppm
≦5ppm
≦5ppm
≦5ppm
≦5ppm
≦5ppm
ED/67/2008
EU REACH Regulation
Norway PoHS
Chlorinated Paraffins (CP)
Polychlorinated Biphenyls and Derivatives (PCBS)
Polychlorinated terphenyls and Derivatives (PCT)
Polychlorinated Phenols and Derivatives (PCPS), e.g.:
EU REACH Regulation
Stockholm Convention
Norway PoHS
7
Forbidden(N.D)
≦5ppm
Pentachlorophenol (CAS No.87-86-5)
JIG-101 Ed 4.1
8
9
Polychlorinated Naphthalenes and Derivatives (PCN)
Persistent Organic Pollutants (POPs)
Forbidden(N.D)
Forbidden(N.D)
≦5ppm
≦10ppm
Stockholm Convention
JIG-101 Ed 4.1
Blue Angel (German Eco-label)
TCO 5.2 (Swedish Eco-label)
SONY GP (SS-00259)
10
Polyvinyl Chloride (PVC), Vinyl Chloride and PVC blends
Forbidden(N.D)
≦1ppm
Polyarmatic Hydrocarbons (PAHs), e.g.:
Substance
Naphthalene
Acenaphthylene
Acenaphthene
Fluorene
CAS No.
91-20-3
208-96-8
83-32-9
86-73-7
85-01-8
120-12-7
206-44-0
129-00-0
Substance
CAS No.
218-01-9
205-99-2
207-08-9
50-32-8
Chrysebe
Benzo(b)fluoranthene
Benzo(K)fluoranthene
Benzo(a)pyrene
(EU)1272/2013
OSPAR
German: LMBG
SONY GP (SS-00259)
11
Forbidden(N.D)
-
Phenanthrene
Anthracene
Fluoranthere
Pyrene
Indeno(1,2,3-cd)pyrene
Dibenzo(a,h)anthracene
Benzo(g,hi)perylene
Benzo€pyren (BeP)
Benzo(j)fluoranthere
(BjFA)
193-39-5
53-70-3
191-24-2
192-97-2
Bebzo(a)anthracene
56-55-3
205-82-3
12
13
Aliphatic Chlorinated hydrocarbon (CHCs)
Dimethyl Fumarate (DMF)
94/60/EEC
2009/251/EC
SONY GP (SS-00259)
EU REACH Regulation
JIG-101 Ed 4.1
Forbidden(N.D)
Forbidden(N.D)
≦1ppm
≦0.1ppm
14
15
16
17
Asbestos
Forbidden(N.D)
Forbidden(N.D)
Forbidden(N.D)
300ppm (0.03wt%)
≦1ppm
≦5ppm
-
SONY GP (SS-00259)
EU
Directive
76/769/EEC,
2002/61/EEC
2003/03/EEC
SONY GP (SS-00259)
Japan Industrial Safety and Health
Law (ISHL)
SONY GP (SS-00259)
EU Directive 86/677/EEC
Norway’s PoHS
EU REACH Regulation
SONY GP (SS-00259)
JIG-101 Ed 4.1
Basel Convention
86/677/EEC
76/769/EEC
Basel Convention
EU Directive 94/27/EEC
EU REACH Regulation
Basel Convention
Basel Convention
Japan Industrial Safety and Health
Law (ISHL)
Azo compounds
Red Phosphorus, Yellow Phosphorus
Arsenic (As) and Arsenic compounds
≦2ppm
18
19
Antimony (Sb) and its compounds
Selenium (Se) and its compounds
Nickel (Ni) and its compounds
900ppm (0.09wt%)
1000 ppm (0.1wt%)
≦2ppm
≦2ppm
20
21
22
Forbidden(N.D)
≦2ppm
≦2ppm
≦2ppm
Tellurium (Te) and its compounds
Beryllium (Be) and its compounds
(except Beryllium oxide)
1000 ppm (0.1wt%)
100ppm (0.01wt%)
23
Beryllium oxide
Forbidden(N.D)
≦2ppm
SONY GP (SS-00259)
JIG-101 Ed 4.1
Germany : ChemVerbots V
Denmark : Danish Statutory Order
No. 289
24
Formaldehyde and its compounds
Forbidden(N.D)
≦1ppm
SONY GP (SS-00259)
89/677/EEC,
99/51/EEC,
Bi- substituted Organic Tin Compounds
Tri-substituted Organic Tin Compounds
e.g.: Tributyltin (TBT) and Triphenyltin (TPT)
2009/425/EC
25
26
Japan Chem-sub Law
Norway’s PoHS
SONY GP (SS-00259)
JIG-101 Ed 4.1
REACH Annex XVII
Norway’s PoHS
OSPAR
(EU)1907/2006
JIG-101 Ed 4.0
SONY GP (SS-00259)
Forbidden(N.D)
≦0.03ppm
Bisphenol A, (CAS No. 80-05-7)
50ppm (0.005wt%)
-
27
28
Hexachlorocyclohexaneisomers (HCH)
Cyclohexane, (CAS No.110-82-7)
Forbidden(N.D)
1000ppm
≦1ppm
29
30
31
Perchlorate
Forbidden(N.D)
Forbidden(N.D)
Forbidden(N.D)
-
Triclosan, (CaS No. 3380-34-5)
Norway’s PoHS
≦10ppm
≦10ppm
OSPAR 396/2009
2003/53/EC
Nonylphenol /ethoxylates (NP/NPEs) and related substances
HYCON Technology Corporation
www.hycontek.com
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Quality Approval Sheet
California Proposition 65
(EC)850/2004
Japan: Chem-sub
U.S. EPA
32
Hexachlorobutadiene
Forbidden(N.D)
≦1ppm
OSPAR
2003/53/EC
33
34
Alkylphenols
Forbidden(N.D)
Forbidden(N.D)
≦10ppm
≦5ppm
Ethylene glycol monomethyl ether acetate
2-Methoxyethanol (CAS NO.109-86-4)
Other ethylene glycol monomethyl ether and acetate
California Proposition 65
35
36
N-p-phenylenediamine
Japan: Chem-sub Law
EU REACH Regulation
SONY GP (SS-00259)
SONY GP (SS-00259)
Japan: Chem-sub
JIG-101 Ed 4.1
Japan: Nuclear material
reactors*3,
JGPSSI
Forbidden(N.D)
Forbidden(N.D)
≦10ppm
≦10ppm
Cobalt dichloride
37
38
39
Specific Benzotriazole (UV absorber)
Forbidden(N.D)
Forbidden(N.D)
1000 ppm (0.1 wt%)
≦10ppm
Radioactive Substances
Uranium (U), strontium (Pu), strontium (Rn), strontium (Am), thorium
(Th), strontium (Cs), strontium (Sr) or other radioactive materials
≦10ppm
Benzenamine, N-phenyl-, reaction products with styrene and 2,4,4-
trimethylpentene (BNST)
SONY GP (SS-00259)
Reaction of di-n-octyl-bis(2-ethylhexyl decyl acetate) tin and
monooctyl-tris(2-ethylhexyl decyl acetate) tin
Reaction mass of 2-ethylhexyl
10-ethyl-4,4-dioctyl-7-oxo-8-oxa-3,5-dithia-4-stannatetradecan
oate and 2-ethylhexyl
10-ethyl-4-[[2-[(2-ethylhexyl)oxy]-2-oxoethyl]thio]-4-octyl-7-ox o-
8-oxa-3,5-dithia-4-stannatetradecanoate (reaction mass of
DOTE and MOTE)
EU REACH Regulation
(EC)1907/2006
SONY GP (SS-00259)
40
1000 ppm (0.1 wt%)
EU REACH Regulation
SONY GP (SS-00259)
REACH Regulation (EC)
No.1907/2006
SONY GP (SS-00259)
Japan: Industrial Safety and
Health Law
41
42
43
1,2-Benzenedicarboxylic acid, dihexyl ester, branched and linear
2-(2H-benzotriazol-2-yl)-4,6-ditertpentylphenol (UV-328)
Bis(chloromethyl)ether
1000 ppm (0.1 wt%)
1000 ppm (0.1 wt%)
Forbidden(N.D)
≦1ppm
SVHC (Substance of Very High Concern) under REACH
(Registration, Evaluation, Authorization and Restriction of
Chemicals) latest version of restricted substances and prescribed
regulations
44
REACH Regulation (EC)
1000 ppm (0.1 wt%)
Refer to http://echa.europa.eu/candidate-list-table
※ The SVHC are not contained in HYCON Technology Corporation’s product based upon the information collected from our supply chain.
The “not contained” means equal or less than the defined threshold in the material. The defined threshold is 0.1 % (1,000 ppm) per weight,
unless otherwise specified. Our products are in compliance with the SVHC under REACH current version of restricted substances and
prescribed regulations.
HYCON Technology Corporation
www.hycontek.com
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5.3 Restricted Use of Conflict Minerals
HYCON Technology Corporation hereby declares all products supplied to customers are of
conflict-free minerals.
Over the past few years, provoking society and environmental problems generated from
manufacturing product raw materials and processes has grabbed the public’s attention.
Minerals from Democratic Republic of the Congo (DRC) even raised serious armed
conflicts. Despite HYCON Technology Corporation does not procure minerals directly
ourselves, still asserting the concept of sustainable corporate development and social
responsibility and respects international human rights. HYCON Technology Corporation
is in support of not using conflict minerals and is committed to fully survey supply chain,
taking social and environmental responsibilities together with joint vendors, thus hereby
declares:
1. Not to purchase conflict minerals from mines in the conflict regions.
2. Demand joint vendors not to use conflict minerals and to disclose the origin of
Tantalum (Ta), Tin (Sn), Gold (Au), Tungsten (W), Cobalt (Co), Palladium (Pd) used
in products and to provide restricted use of conflict minerals letter of commitment.
3. Demand joint vendors to formally convey the request of Restricted Use of Conflict
Minerals to their upstream suppliers.
4. Conflict-Free Minerals Policy:http://www.hycontek.com/en/company-en/1781#tab4
HYCON Technology Corporation
www.hycontek.com
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