HY51VS65173HGLT-6I [HYNIX]

EDO DRAM, 4MX16, 60ns, CMOS, PDSO50;
HY51VS65173HGLT-6I
型号: HY51VS65173HGLT-6I
厂家: HYNIX SEMICONDUCTOR    HYNIX SEMICONDUCTOR
描述:

EDO DRAM, 4MX16, 60ns, CMOS, PDSO50

动态存储器 光电二极管 内存集成电路
文件: 总11页 (文件大小:83K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
4M x 16Bit EDO DRAM ET Part  
PRELIMINARY  
DESCRIPTION  
This familiy is a 64Mbit dynamic RAM organized 4,194,304 x 16bit configuration with Extented Data Out  
mode CMOS DRAMs. Extended data out mode is a kind of page mode which is useful for the read opera-  
tion. The advanced circuit and process allow this device to achieve high performance and low power dissi-  
pation. Features are access time(45ns or 50ns) and refresh cycle(4K ref) and power consumption(Normal  
or low power with self refresh).  
Advanced CMOS process as well as circuit techniques for wide operating margins allow this device to  
achieve high speed access and high reliability  
FEATURES  
Extended data out operation  
Read-modify-write capability  
Multi-bit parallel test capability  
LVTTL(3.3V) compatible inputs and outputs  
/RAS only, CAS-before-/RAS, Hidden and self  
refresh(L-version) capability  
JEDEC standard pinout  
50pin plastic SOJ/TSOP-II(400mil)  
Single power supply of 3.3V +/- 10%  
Battery back up operation(L-version)  
Fast access time and cycle time  
Part No  
tRAC  
tAA  
tCAC  
tRC  
tHPC  
HY51V65173HG-45I  
HY51V65173HG-5I  
HY51V65173HG-6I  
45ns  
50ns  
60ns  
23ns  
25ns  
30ns  
12ns  
13ns  
15ns  
74ns  
84ns  
17ns  
20ns  
25ns  
104ns  
Power dissipation  
Refresh cycle  
Part No  
45ns  
50ns  
60ns  
Ref  
Normal  
L-part  
Active  
468mW  
432mW  
396mW  
HY51V65173HG*  
HY51V65173HGL*  
4K Ref  
4K Ref  
64ms  
1.8mW(CMOS level Max)  
0.72mW (L-version : Max)  
128ms  
Standby  
* : /RAS only, CBR and hidden refresh  
ODERING INFORMATION  
Part Number  
Access Time  
Package  
HY51V65173HGJ-45  
HY51V65173HGJ-5  
HY51V65173HGJ-6  
45ns  
50ns  
60ns  
400mil 50pin SOJ  
HY51V65173HGT-45I  
HY51V65173HGT-5I  
HY51V65173HGT-6I  
45ns  
50ns  
60ns  
400mil 50pin TSOP-II  
(S) : Self refresh,  
(L) : Low power  
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev.0.0/Jan.01  
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
PIN CONFIGURATION  
VCC  
1
50 VSS  
IO0  
IO1  
IO2  
2
3
4
49  
48  
IO15  
IO14  
47 IO13  
46  
IO3  
VCC  
IO4  
5
6
7
8
9
IO12  
45  
44  
43  
42  
41  
40  
39  
38  
VSS  
IO11  
IO10  
IO5  
IO6  
IO9  
IO8  
NC  
IO7 10  
NC  
11  
12  
13  
14  
15  
16  
VCC  
VSS  
/WE  
/LCAS  
/UCAS  
/RAS  
37  
36  
35  
34  
NC  
NC  
/OE  
NC  
NC  
NC 17  
NC  
A0  
A1  
A2  
A3  
A4  
18  
19  
20  
21  
22  
23  
33  
32  
NC  
A11  
31  
30  
29  
28  
27  
A10  
A9  
A8  
A7  
A5 24  
A6  
26 VSS  
VCC 25  
50 Pin Plastic SOJ / TSOP-II  
PIN DESCRIPTION  
Pin  
Function  
/RAS  
/UCAS, /LCAS  
/WE  
Row Address Strobe  
Column Address Strobe  
Write Enable  
/OE  
Output Enable  
A0-A11  
A0-A11  
I/O 0- I/O 15  
Vcc  
Address Inputs  
Refresh Address Inputs  
Data Input / Output  
Power (3.3V)  
Vss  
Ground  
NC  
No connection  
Rev.0.0/Jan.01  
2
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
TA  
Rating  
Unit  
oC  
oC  
Ambient Temperature  
Storage Temperature  
-40 ~ +85  
-55 ~ 125  
TSTG  
-0.5 ~ Vcc + 0.5  
(Max 4.6V)  
Voltage on Any Pin relative to Vss  
VT  
V
Voltage on Vcc relative to Vss  
Short Circuit Output Current  
Power Dissipation  
Vcc  
IOUT  
PT  
-0.5 ~ 4.6  
V
mA  
W
50  
1
Note : Operation at above absolute maximum rating can adversely affect device reliability.  
Recommended DC OPERATING CONDITIONS (TA= -40 to 85 oC)  
Parameter  
Symbol  
Min  
Typ.  
Max  
Unit  
Note  
Power Supply Voltage  
Power Supply Voltage  
Input High Voltage  
Input Low Voltage  
Vcc  
Vss  
VIH  
VIL  
3.0  
0
3.3  
3.6  
0
V
V
V
V
1,2  
2
0
-
2.0  
-0.3  
Vcc + 0.3  
0.8  
1
-
1
Note : All voltages are referenced to Vss  
1. 6.0V at pulse width 10ns which is measured at Vcc  
2. -0.1V at pulse width 10ns which is measured at Vss  
Rev.0.0/Jan.01  
3
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
DC CHARACTERISTICS (Vcc = 3.3V +/- 10%, TA= -40 to 85°C)  
Symbol  
Parameter  
Min  
Max  
Unit  
Note  
Output Level  
Output Level voltage(Iout= -2mA)  
VOH  
2.4  
Vcc  
V
Output Level  
Output Level voltage(Iout=2mA)  
0
0.4  
V
VOL  
ICC1  
45ns  
50ns  
60ns  
-
-
-
130  
120  
110  
Operating current ( tRC = tRC min)  
mA  
1, 2  
Standby current (TTL interface)  
Power supply standby current  
(/RAS, /UCAS,/LCAS=VIH, Dout = High-Z)  
ICC2  
ICC3  
-
1
mA  
mA  
45ns  
50ns  
60ns  
45ns  
50ns  
60ns  
-
-
-
-
-
-
-
-
-
-
-
130  
120  
110  
100  
90  
/RAS only refresh current (tRC= tRC min)  
2
1, 3  
4
Extended data out page mode current  
(/RAS=VIL, /CAS, Address cycling : tHPC=tHPC min)  
ICC4  
mA  
80  
CMOS interface ( /RAS, /UCAS, /LCAS >= Vcc-0.2V, Dout = High-Z)  
Standby current ( L-version)  
0.5  
mA  
uA  
ICC5  
200  
130  
120  
110  
45ns  
50ns  
60ns  
ICC6  
/CAS-before-/RAS refresh current (tRC=tRC min)  
mA  
Battery back up operating current (standby with CBR)  
(tRC=31.25us, tRAS=300ns, Dout=High-Z)  
-
-
-
350  
5
uA  
mA  
uA  
4, 5  
1
ICC7  
Standby current (CMOS)  
ICC8 Power supply standby current  
/RAS=VIH, /UCAS./LCAS=VIL, Dout=Enable)  
Self refresh current  
ICC9  
350  
5
(/RAS, /UCAS, /LCAS <=0.2V, Dout=High-Z)  
-5  
-5  
5
5
uA  
uA  
II(L)  
IO(L) Output leakage current, (Dout is disabled, 0V<= Vout<=Vcc)  
Note :  
Input leakage current, Any input (0V<= Vin<=Vcc)  
1. Icc depends on output load condition when the device is selected, Icc(max) is specified at the output open condition  
2. Address can be changed once or less while RAS=VIL  
3. Measured with one sequential address change per EDO cycle, tHPC  
4. VIH>=Vcc-0.2V, 0V<=VIL<=0.2V  
5. L-Version  
Rev.0.0/Jan.01  
4
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
CAPACITANCE (Vcc=3.3V +/-10%, TA=25°C)  
Parameter  
Symbol  
Min.  
Max  
Unit  
Note  
Input capacitance (Address)  
Input capacitance (Clocks)  
CI1  
CI2  
-
-
-
5
5
7
pF  
pF  
pF  
1
1
Output capacitance (Data-in, Data-out)  
CI/O  
1, 2  
Note : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.  
2. /RAS, /UCAS and /LCAS = VIH to disable Dout  
AC CHARACTERISTICS (Vcc=3.3V +/-10%, TA= -40~85C, Note 1, 2, 19,20)  
Test Condition  
Input rise and fall times = 2ns  
Input level : VIL/VIH = 0.0 / 0.3V  
Input timing reference level : VIL/VIH = 0.8/2.0V  
Output timing reference level :  
VOL/VOH=0.8/0.2V  
Output load : 1 TTL gate + CL (100pF)  
including scope and jig  
Read, Write, Read-modify-Write and Refresh Cycles  
-45I  
-5I  
-6I  
Parameter  
Symbol  
Unit  
Note  
Min  
74  
25  
7
Max  
Min  
84  
30  
8
Max  
Min  
104  
40  
10  
60  
10  
0
Max  
Random read or write cycle time  
/RAS precharge time  
tRC  
tRP  
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
-
-
-
24  
/CAS precharge time  
tCP  
-
-
-
/RAS pulse width  
tRAS  
tCAS  
tASR  
tRAH  
tASC  
tCAH  
tRCD  
tRAD  
tRSH  
tCSH  
tCRP  
45  
7
10,000  
50  
8
10,000  
10,000  
/CAS pulse width  
10,000  
10,000  
10,000  
Row address set-up time  
Row address hold time  
Column address set-up time  
Column address hold time  
/RAS to /CAS delay time  
/RAS to Column address delay time  
/RAS hold time  
0
-
-
0
-
-
-
-
7
8
10  
0
21  
21  
3
0
-
0
-
-
7
-
8
-
10  
14  
12  
15  
42  
5
-
11  
9
33  
22  
-
12  
10  
13  
40  
5
37  
25  
-
45  
30  
-
4
12  
38  
5
/CAS hold time  
-
-
-
22  
/CAS to /RAS precharge time  
-
-
-
Rev.0.0/Jan.01  
5
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
- continued -  
-45I  
-5I  
-6I  
Parameter  
Symbol  
Unit  
Note  
Min  
12  
0
Max  
-
Min  
13  
0
Max  
-
Min  
15  
0
Max  
-
/OE to Din delay time  
/OE delay time from Din  
/CAS delay time from Din  
Transition time ( Rise and Fall)  
Refresh period  
tODD  
tDZO  
tDZC  
tT  
ns  
ns  
ns  
ns  
5
6
6
7
-
-
-
0
-
0
-
0
-
2
50  
64  
128  
2
50  
64  
128  
2
50  
64  
128  
-
-
-
ms 4K Ref.  
ms 4K Ref.  
tREF  
Refresh period (L-version)  
-
-
-
Read Cycles  
-45I  
-5I  
-6I  
Parameter  
Symbol  
Unit  
Note  
Min  
-
Max  
Min  
-
Max  
Min  
-
Max  
Access time from /RAS  
Access time from /CAS  
tRAC  
tCAC  
tAA  
45  
12  
23  
12  
-
50  
13  
25  
13  
-
60  
15  
30  
15  
-
ns  
8, 9  
-
-
-
ns 9,10,17  
ns 9,11,17  
Access time from column address  
Access time from /OE  
-
-
-
tOAC  
tRCS  
tRCH  
tRRH  
tRAL  
tCAL  
tOFF  
tOEZ  
tCDD  
tRDD  
tWDD  
tOFR  
tWEZ  
tOH  
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
9
21  
Read command set-up time  
0
0
0
Read command hold time to /CAS  
Read command hold time to /RAS  
Column address to /RAS lead time  
Column address to /CAS lead time  
Output buffer turn off delay time from /CAS  
Output buffer turn off delay time from /OE  
/CAS to Din delay time  
0
-
0
-
0
-
12,22  
12  
0
-
0
-
0
-
23  
15  
-
-
25  
15  
-
-
30  
18  
-
-
-
-
-
12  
12  
-
13  
13  
-
15  
15  
-
13,26  
13  
-
-
-
12  
12  
12  
-
13  
13  
13  
-
15  
15  
15  
-
5
/RAS to Din delay time  
-
-
-
/WE to Din delay time  
-
-
-
Output buffer turn off delay time from /RAS  
Output buffer turn off delay time from /WE  
Output data hold time  
12  
12  
-
13  
13  
-
15  
15  
-
13,26  
13  
-
-
-
3
3
3
26  
tOHR  
tRCHR  
tOHO  
tCLZ  
Output data hold time from /RAS  
Read command hold time from /RAS  
Output data hold time from /OE  
/CAS to output in low-Z  
3
-
3
-
3
-
26  
45  
3
-
50  
3
-
60  
3
-
-
-
-
0
-
0
-
0
-
Rev.0.0/Jan.01  
6
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
Write Cycles  
-45I  
-5I  
-6I  
Parameter  
Symbol  
Unit  
Note  
Min  
0
Max  
Min  
0
Max  
Min  
0
Max  
Write command set-up time  
Write command hold time  
Write command pulse width  
Write command to /RAS lead time  
Write command to /CAS lead time  
Data-in set-up time  
tWCS  
tWCH  
tWP  
tRWL  
tCWL  
tDS  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
14,21  
21  
7
8
10  
10  
15  
10  
0
7
8
12  
7
13  
8
23  
0
0
15, 23  
15, 23  
tDH  
Data-in hold time  
7
8
10  
Read-Modify-Write Cycles  
-45I  
-5I  
-6I  
Parameter  
Symbol  
Unit  
Note  
Min  
101  
63  
Max  
Min  
116  
67  
Max  
Min  
140  
79  
Max  
Read-modify-write cycle time  
/RAS to /WE delay time  
tRWC  
tRWD  
tCWD  
tAWD  
tOEH  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
14  
14  
14  
/CAS to /WE delay time  
30  
30  
34  
Column address to /WE delay time  
/OE hold time from /WE  
40  
42  
49  
12  
13  
15  
Refresh cycles  
-45I  
-5I  
-6I  
Unit  
Note  
Parameter  
Symbol  
Min  
Max  
Min  
Max  
Min  
Max  
/CAS set-up time  
( /CAS-before-/RAS Refresh Cycle)  
tCSR  
tCHR  
tWRP  
tWRH  
tRPC  
5
-
5
-
5
-
ns  
ns  
ns  
ns  
ns  
21  
22  
/CAS hold time  
( /CAS-before-/RAS Refresh Cycle)  
7
0
7
5
-
-
-
-
8
0
8
5
-
-
-
-
10  
0
-
-
-
-
/WE set-up time  
( /CAS-before-/RAS Refresh Cycle)  
/WE hold time  
( /CAS-before-/RAS Refresh Cycle)  
10  
5
/RAS precharge to /CAS hold time  
( /CAS-before-/RAS Refresh Cycle)  
21  
Rev.0.0/Jan.01  
7
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
Extended Data Out Mode Cycles  
-45I  
-5I  
-6I  
Parameter  
Symbol  
Unit  
Note  
Min  
17  
7
Max  
Min  
20  
8
Max  
Min  
25  
10  
-
Max  
EDO page mode cyle time  
Write pulse width during /CAS precharge  
EDO mode /RAS pulse width  
tHPC  
tWPE  
tRASP  
tACP  
-
-
-
ns  
ns  
ns  
25  
-
-
-
-
100K  
-
100K  
100K  
16  
Access time from /CAS precharge  
/RAS hold time from /CAS precharge  
/CAS hold time referred /OE  
-
28  
-
-
28  
-
-
35  
-
ns 9,17,22  
tRHCP  
tCOL  
tCOP  
26  
7
28  
8
35  
10  
5
ns  
ns  
ns  
-
-
-
/CAS to /OE set-up time  
5
-
5
-
-
Read command hold time  
from /CAS precharge  
tRCHP  
26  
-
28  
-
35  
-
ns  
Output data hold time from /CAS low  
/OE precharge time  
tDOH  
tOEP  
3
7
-
-
3
8
-
-
3
-
-
ns  
ns  
9,27  
10  
EDO Page Mode Read-Modify-Write Cycle  
-45I  
-5I  
-6I  
Unit  
Note  
Parameter  
Symbol  
Min  
Max  
Min  
Max  
Min  
Max  
EDO read-modify-write cycle time  
tHPRWC  
tCPW  
57  
-
57  
-
68  
-
ns  
ns  
EDO page mode read-modify-write cycle  
/CAS precharge to /WE delay time  
45  
-
45  
-
54  
-
14,22  
Self Refresh Cycle (L-Version)  
-45I  
-5I  
-6I  
Parameter  
Symbol  
Unit  
Note  
Min  
100  
90  
Max  
Min  
100  
90  
Max  
Min  
100  
110  
-50  
Max  
/RAS pulse width ( self refresh)  
/RAS precharge time ( self refresh)  
/CAS hold time ( self refresh)  
tRASS  
tRPS  
-
-
-
-
-
-
-
-
-
us  
ns  
ns  
31  
31  
23  
tCHS  
-50  
-50  
Rev 0.0 / Jan’01  
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
Notes :  
1. AC measurements assume tT = 2ns  
2. AC initial pause of 200us is required after power up followed by a minimum of eight initialization cycles  
( any combination of cycles containing /RAS-only refresh or /CAS-before-/RAS refresh)  
3. Operation with the tRCD(max) limit insures that tRAC(max) can be met, tRCD(max) is specified as a  
reference point only : if tRCD is greater than the specified tRCD(max) limit, then access time is  
controlled exclusively by tCAC.  
4. Operation with the tRAD(max) limit insures that tRAC(max) can be met, tRAD(max) is specified as a  
reference point only : if tRAD is greater than the specified tRAD(max) limit, then access time is  
controlled exclusively by tAA.  
5. Either tODD or tCDD must be satisfied.  
6. Either tDZO or tDZC must be satisfied.  
7. VIH(min) and VIL(max) are reference levels for measuring timing of input signals, also transition times  
are measured between VIH(min) and VIL(max)  
8. Assumes that tRCD<=tRCD(max) and tRAD<=tRAD(max). If tRCD or tRAD is greater than the maximum  
recommended value shown in this table, tRAC exceeds the value shown  
9. Measured with a load circuit equivalent to 1 TTL loads and 100pF.  
10. Assumes that tRCD>=tRCD(max) and tRCD + tCAC(max) >= tRAD + tAA(max)  
11. Assumes that tRAD>=tRAD(max) and tRCD + tCAC(max) <= tRAD + tAA(max)  
12. Either tRCH of tRRH must be satified for a read cycles  
13. tOFF(max), tOEZ(max), tOFR(max) and tWEZ(max) define the time at which the outputs achieve the  
open circuit condition and is not referenced to output voltage levels  
14 tWCS, tRWD, tCWD, tAWD and tCPW are not restrictive operating parameters. They are included in  
the data sheet as electrical characteristics only : If tWCS >=tWCS(min), the cycle is an early write  
cycle and the data out pin will remain open circuit(high impedance) throughout the entire cycle :  
If tRWD>=tRWD(min), tCWD>=tCWD(min), tAWD>=tAWD(min), the cycle is a read-modify-write and  
the data output will contain data read from the selected cell : if neither of the above sets of conditions  
is satified, the condition of the data out (at access time) is indeterminate.  
15. tDS and tDH are refered to /UCAS and /LCAS leading edge in early write cycles and to /WE leading  
edge in delayed write or read-modify-write cycles  
16. tRASP defineds /RAS pulse width in extended data out mode cycles  
17. Access time is determined by the longest among tAA, tCAC and tACP  
18 In delaying write or read-modify-write cycles, /OE must disable output buffer prior to applying data to  
the device.  
Rev 0.0 / Jan’01  
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
19. When output buffers are enabled once, sustain the low impedence state until valid data is obtained.  
when output buffer is turned on and off within a very short time, generally it causes large Vcc/Vss line  
noise, which causes to degrade VIH min / VIL max level  
20. When both /UCAS and /LCAS go low at the same time, all 16 bit data are written into the device.  
/UCAS and /LCAS cannot be staggered within the same write / read cycles  
21. tASC, tCAH, tRCS, tWCS, tWCH, tCSR and tRPC are determined by the earlier falling edge of /UCAS or /LCAS  
22. tCRP, tCHR, tRCH,tACP and tCPW are determined by the later rising edge of /UCAS or /LCAS  
23. tCWL, tDH, tDS and tCHS should be satified by the both /UCAS and /LCAS  
24. tCP is determined by the time that both /UCAS and /LCAS are high  
25. tHPC(min) can be achieved during a series of EDO mode early write cycles or EDO mode read cycels  
If both write and read operation are mixed in a EDO mode, /RAS cycle[EDO mode mix cycle (1)(2)]  
minimum value of /CAS cycle tHPC[tCAS + tCP + 2tT] become greater than the specified tHPC(min)  
value. The value of CAS cycle time of mixed EDO page mode is shown in EDO page mode mix cycle  
(1) and (2)  
26. Data output turns off and becomes high impedance from later rising edge of /RAS and /CAS.  
Hold time and turn off time are specified by the timing specifications of later rising edge of /RAS and  
/CAS between tOHR and tOH and between tOFR and tOFF  
27. tDOH defines the time at which the output level go cross, VOL=0.8V, VOH=2.0V of output timing  
reference level.  
28. Before and after self refresh mode, execute CBR refresh to all refresh addresses in or within 64ms  
period on the condition a) and b) below  
a) Enter self refresh mode within 15.6us after either burst refresh or distributed refresh at equal interval  
to all refresh addresses are completed.  
b) Start burst refresh or distributed refresh at equal interval to all refresh addresses within 15.6us after  
exiting from self refresh mode  
29. In case of entering from /RAS-only-refresh, It is necessary to execute CBR refresh before and after  
self refresh mode according as note 28  
30. For L-version, It is available to apply each 128ms and 31.2us instead of 64ms and 15.6us at note 28  
31. At tRASS > 100us, self refresh mode is activated, and not active at tRASS < 10us, It is undefined within  
the range of 10us < tRASS < 100us. For tRASS > 10us, It is necessary to satify tRPS  
32. XXX : H or L [ H : VIH(min) <= VIN <=VIH(max), L : VIH(min) <=VIN <=VIH(max)]  
///// : Invalid Dout  
When the address, clock and input pins are not described on timing waveforms, their pins must be  
applied VIH or VIL  
Rev 0.0 / Jan’01  
HY51V65173HGJ-45/5/6I  
HY51V65173HGT-45/5/6I  
PACKAGE INFORMATION  
400mil 50pin TSOP- II Dimension  
Unit: mm  
0.40 MIN  
20.95 MIN  
21.35 MAX  
0 ~ 5 deg.  
0.60 MAX  
0.145  
0.125  
0.05  
0.04  
1.15 MAX  
0.80  
0.30 0.10  
0.28 0.08  
0.80  
0.08 MIN  
0.18 MAX  
0.10  
Dimension including the plating thickness  
Base material dimension  
Rev.0.0/Jan.01  
11  

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