HY18N50W [HY]

500V / 18A N-Channel Enhancement Mode MOSFET; 500V / 18A N沟道增强型MOSFET
HY18N50W
型号: HY18N50W
厂家: HY ELECTRONIC CORP.    HY ELECTRONIC CORP.
描述:

500V / 18A N-Channel Enhancement Mode MOSFET
500V / 18A N沟道增强型MOSFET

文件: 总4页 (文件大小:299K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HY18N50W  
500V / 18A  
N-Channel Enhancement Mode MOSFET  
500V, RDS(ON)=0.32W@VGS=10V, ID=9A  
Features  
• Low On-State Resistance  
TO-3PN  
• Fast Switching  
• Low Gate Charge & Low CRSS  
• Fully Characterized Avalanche Voltage and Current  
• Specially Desigened for AC Adapter, Battery Charger and SMPS  
• In compliance with EU RoHs 2002/95/EC Directives  
Drain  
2
Mechanical Information  
1
• Case: TO-3PN Molded Plastic  
1
Gate  
2
• Terminals : Solderable per MIL-STD-750,Method 2026  
3
Source  
3
Marking & Ordering Information  
TYPE  
MARKING  
PACKAGE  
PACKING  
HY18N50W  
18N50W  
TO-3PN  
30PCS/TUBE  
Absolute Maximum Ratings (TC=25°C unless otherwise specified )  
Parameter  
Value  
500  
+30  
18  
Units  
Symbol  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
A
A
VGS  
ID  
TC=25  
TC=25℃  
Continuous Drain Current  
Pulsed Drain Current 1)  
IDM  
72  
Maximum Power Dissipation  
Derating Factor  
200  
1.6  
PD  
W
Avalanche Energy with Single Pulse  
L=30mH, IAS=8.6A, VDS=140V  
EAS  
1050  
mJ  
TJ, TSTG  
Operating Junction and Storage Temperature Range  
-55 to +150  
Note : 1. Maximum DC current limited by the package  
Thermal Characteristics  
Parameter  
Symbol  
RqJC  
Value  
0.62  
40  
Units  
℃/W  
℃/W  
Junction-to-Case Thermal Resistance  
Junction-to-Ambient Thermal Resistance  
RqJA  
COMPANY RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGNFUNCTIONS AND RELIABILITY WITHOUT NOTICE  
REV. 1, 11-Jan-2012  
PAGE.1  
HY18N50W  
Electrical Characteristics ( TC=25, Unless otherwise noted )  
Paramter  
Test Condition  
Symbol  
Min.  
Typ.  
Max.  
Units  
Static  
BVDSS  
VGS(th)  
RDS(ON)  
IDSS  
VGS=0VID=250uA  
VDS=VGSID=250uA  
VGS=10VID=9A  
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
Drain-Source On-State Resistance  
Zero Gate Voltage Drain Current  
Gate Body Leakage Current  
Dynamic  
500  
-
-
V
V
2
-
-
4
0.26  
0.32  
1.0  
+100  
W
VDS=500VVGS=0V  
VGS=+30VVDS=0V  
-
-
-
uA  
nA  
IGSS  
-
Total Gate Charge  
Qg  
Qgs  
Qgd  
td(on)  
tr  
-
-
-
-
-
-
-
-
-
-
52.2  
10.8  
14.8  
21.8  
36.8  
88.2  
46  
-
-
VDS=400VID=18A  
nC  
ns  
Gate-Source Charge  
VGS=10V  
Gate-Drain Charge  
-
Turn-On Delay Time  
32  
46  
112  
66  
2650  
420  
12  
Turn-On Rise Time  
VDD=250VID=18A  
VGS=10VRG=25W  
td(off)  
tf  
Turn-Off Delay Time  
Turn-Off Fall Time  
Ciss  
Coss  
Crss  
Input Capacitance  
2250  
320  
7.4  
VDS=25VVGS=0V  
pF  
Output Capacitance  
f=1.0MHZ  
Reverse Transfer Capacitance  
Source-Drain Diode  
Max. Diode Forwad Voltage  
Max. Pulsed Source Current  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
IS  
ISM  
VSD  
trr  
-
-
-
-
-
-
-
-
18  
72  
1.5  
-
A
A
-
IS=18AVGS=0V  
-
V
480  
4.5  
ns  
uC  
VGS=0VIS=18A  
di/dt=100A/us  
Qrr  
-
NOTE : Pulse Test : Pulse Width 300us, duty cycle 2%  
PAGE.2  
REV. 1, 11-Jan-2012  
HY18N50W  
Typical Characteristics Curves ( TC=25, unless otherwise noted)  
100  
10  
1
50  
40  
30  
20  
10  
0
VDS =50V  
VGS= 20V~ 8.0V  
7.0V  
TJ = 125oC  
6.0V  
5.0V  
25oC  
-55oC  
6
0
0
10  
20  
30  
40  
50  
1
2
3
4
5
7
8
9
10  
VDS - Drain-to-Source Voltage (V)  
VGS - Gate-to-Source Voltage (V)  
Fig.1 Output Characteristric  
Fig.2 Transfer Characteristric  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
2
ID =9.0A  
1.5  
1
VGS=10V  
VGS = 20V  
0.5  
0
3
4
5
6
7
8
9
10  
0
4
8
12  
16  
20  
ID - Drain Current (A)  
VGS - Gate-to-Source Voltage (V)  
Fig.3 On-Resistance vs Drain Current  
Fig.4 On-Resistance vs Gate to Source Voltage  
4000  
3000  
2000  
1000  
0
12  
f = 1MHz  
VGS = 0V  
ID =18A  
10  
8
V
DS=400V  
V
DS=250V  
Ciss  
V
DS=100V  
6
4
Coss  
2
Crss  
0
0
5
10  
15  
20  
25  
30  
0
10  
20  
30  
40  
50  
60  
VDS - Drain-to-Source Voltage (V)  
Qg - Gate Charge (nC)  
Fig.5 Capacitance Characteristic  
Fig.6 Gate Charge Characteristic  
REV. 1, 11-Jan-2012  
PAGE.3  
HY18N50W  
Typical Characteristics Curves ( TC=25, unless otherwise noted)  
1.2  
1.1  
1
2.5  
2.1  
1.7  
1.3  
0.9  
0.5  
ID = 250mA  
VGS =10 V  
ID =9.0A  
0.9  
0.8  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TJ - Junction Temperature (oC)  
TJ - Junction Temperature (oC)  
Fig.7 On-Resistance  
vs Junction Temperature  
Fig.8 Breakdown Voltage  
vs Junction Temperature  
100  
10  
VGS = 0V  
TJ = 125oC  
25oC  
1
-55oC  
0.1  
0.01  
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
VSD - Source-to-Drain Voltage (V)  
Fig.9 Body Diode  
Forward Voltage Characteristic  
PAGE.4  
REV. 1, 11-Jan-2012  

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