IC62VV25616L-55TI [ICSI]

256Kx16 bit 1.8V and Ultra Low Power CMOS Static RAM; 256Kx16位1.8V和超低功耗CMOS静态RAM
IC62VV25616L-55TI
型号: IC62VV25616L-55TI
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

256Kx16 bit 1.8V and Ultra Low Power CMOS Static RAM
256Kx16位1.8V和超低功耗CMOS静态RAM

存储 静态存储器
文件: 总11页 (文件大小:234K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IC62VV25616L  
IC62VV25616LL  
Document Title  
256Kx16 bit 1.8V and Ultra Low Power CMOS Static RAM  
Revision History  
Revision No  
History  
Draft Date  
Remark  
0A  
Initial Draft  
November 13,2001  
Preliminary  
The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and  
products. ICSI will answer to your questions about device. If you have any questions, please contact the ICSI offices.  
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
1
IC62VV25616L  
IC62VV25616LL  
256K x 16 1.8V ULTRA  
LOW POWER CMOS STATIC RAM  
FEATURES  
DESCRIPTION  
The ICSI IC62VV25616L and IC62VV25616LL are low-power,  
4.194,304 bit static RAMs organized as 262,144 words by 16  
bits. They are fabricated using ICSI's high-performance CMOS  
technology. This highly reliable process coupled with innova-  
tive circuit design techniques, yields high-performance and  
low power consumption devices.  
• High-speed access times: 55, 70, 100 ns  
CMOS low power operation  
ICC1=10mA (typical)* operating  
ISB2=1µA (typical)* CMOS standby  
* Typical values are measured at VCC=1.8V,  
TA=25°C  
When CE is HIGH (deselected) or both LB and UB are HIGH,  
the device assumes a standby mode at which the power  
dissipation can be reduced by using CMOS input levels.  
• TTL compatible interface levels  
• Single 1.65V-2.2V Vcc power supply  
• Fully static operation: no clock or refresh  
required  
Easy memory expansion is provided by using Chip Enable  
Output and Enable inputs, CE and OE. The active LOW Write  
Enable (WE) controls both writing and reading of the memory.  
A data byte allows Upper Byte (UB) and Lower Byte (LB)  
access.  
• Three state outputs  
• Data control for upper and lower bytes  
• Industrial temperature available  
The IC62VV25616L and IC62VV25616LL are packaged in the  
JEDEC standare 44-pin TSOP-2 and 48-pin 6*8mm TF-BGA.  
• Available in the 44-pin TSOP-2 and 48-pin  
6*8mm TF-BGA  
FUNCTIONAL BLOCK DIAGRAM  
256K x 16  
MEMORY ARRAY  
A0-A17  
DECODER  
VCC  
GND  
I/O0-I/O7  
Lower Byte  
I/O  
DATA  
COLUMN I/O  
CIRCUIT  
I/O8-I/O15  
Upper Byte  
CE  
OE  
WE  
CONTROL  
CIRCUIT  
UB  
LB  
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors  
which may appear in this publication. © Copyright 2001, Integrated Circuit Solution Inc.  
2
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
IC62VV25616L  
IC62VV25616LL  
PIN CONFIGURATIONS  
48-Pin TF-BGA (TOP View)  
44-Pin TSOP-2  
A4  
A3  
A2  
A1  
A0  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A5  
A6  
A7  
OE  
UB  
LB  
2
1
2
3
4
5
6
3
4
A0  
A3  
A1  
A4  
A2  
5
LB  
I/O  
OE  
UB  
N/C  
A
B
C
D
E
F
CE  
6
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A16  
A15  
A14  
A13  
A12  
7
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
A8  
A9  
A10  
A11  
A17  
CE  
I/O  
0
8
8
9
I/O  
I/O  
A5  
A6  
I/O  
I/O  
2
9
10  
11  
12  
1
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
GND  
Vcc I/O  
A17  
NC  
A14  
A12  
A7  
I/O  
I/O  
I/O  
I/O  
Vcc  
3
4
5
GND  
A16  
A15  
A13  
A10  
I/O  
I/O  
I/O  
I/O  
6
14  
13  
NC  
A8  
WE  
I/O  
7
15  
G
H
NC  
A9  
A11  
NC  
PIN DESCRIPTIONS  
A0-A17  
I/O0-I/O15  
CE  
Address Inputs  
LB  
Lower-byte Control (l/O0-I/O7)  
Upper-byte Control (l/O8-I/O15)  
No Connection  
Data Input/Output  
Chip Enable Input  
Output Enable Input  
Write Enable Input  
UB  
NC  
OE  
Vcc  
GND  
Power  
WE  
Ground  
TRUTH TABLE  
I/O PIN  
I/O8-I/O15  
Mode  
WE  
CE  
OE  
LB  
UB  
I/O0/-I/O7  
Power  
Not Selected  
X
X
H
L
X
X
X
H
X
H
High-Z  
High-Z  
High-Z  
High-Z  
Stand by  
Stand by  
Output Disabled H  
X
L
L
L
L
L
L
L
L
H
X
L
X
H
L
X
H
H
L
High-Z  
High-Z  
DOUT  
High-Z  
DOUT  
DIN  
High-Z  
High-Z  
High-Z  
DOUT  
DOUT  
High-Z  
DIN  
Active  
Stand by  
Active  
Read  
H
H
H
L
L
H
L
L
L
Write  
X
X
X
L
H
L
Active  
L
H
L
High-Z  
DIN  
L
L
DIN  
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
3
IC62VV25616L  
IC62VV25616LL  
OPERATING RANGE  
Range  
Commercial  
Ambient Temperature  
VCC  
1.65V- 2.2V  
0°C to +70°C  
Industrial  
–40°C to +85°C  
1.65V - 2.2V  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol Parameter  
Value  
Unit  
V
VTERM  
TBIAS  
VCC  
Terminal Voltage with Respect to GND  
Temperature Under Bias  
Vcc related to GND  
–0.5 to Vcc + 0.4  
–40 to +85  
–0.3 to +4.0  
–65 to +150  
1.0  
°C  
V
TSTG  
PT  
StorageTemperature  
°C  
W
Power Dissipation  
Notes:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the  
device. This is a stress rating only and functional operation of the device at these or any other conditions above  
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect reliability.  
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)  
Symbol Parameter  
Test Conditions  
Min.  
Max.  
Unit  
VOH  
Output HIGH Voltage  
IOH = –0.1 mA  
1.4  
V
VOL  
Output LOW Voltage  
IOL = 0.1 mA  
0.2  
V
(1)  
VIH  
Input HIGH Voltage  
Input LOW Voltage  
Input Leakage  
1.4  
–0.2  
–1  
VCC + 0.2  
V
V
(2)  
VIL  
ILI  
0.4  
1
GND VIN VCC  
GND VOUT VCC, OUTPUTS DISABLED  
µA  
µA  
ILO  
Output Leakage  
–1  
1
Notes:  
1. VIH(max.) = VCC+2.0V for pulse width less than 10 ns.  
2. VIL(min.) = –2.0V for pulse width less than 10 ns.  
CAPACITANCE(1)  
Symbol  
CIN  
Parameter  
Input Capacitance  
Conditions  
VIN = 0V  
Max.  
6
Unit  
pF  
COUT  
Output Capacitance  
VOUT = 0V  
8
pF  
Notes:  
1. Tested initially and after any design or process changes that may affect these parameters.  
4
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
IC62VV25616L  
IC62VV25616LL  
AC TEST CONDITIONS  
Parameter  
Input Pulse Level  
Input Rise and Fall Times  
Unit  
0.4V to 1.4V  
5 ns  
Input Reference Level  
Output Reference Level  
0.9V  
0.9V  
Output Load  
See Figures 1  
AC TEST LOADS  
1 TTL  
1 TTL  
OUTPUT  
OUTPUT  
100 pF or 30PF (for 55ns)  
5 pF  
Including  
jig and  
Including  
jig and  
scope  
scope  
Figure 1  
Figure 2  
IC62VV25616L POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
-55  
-70  
-100  
Symbol Parameter  
TestConditions  
Min. Max.  
Min. Max.  
Min. Max.  
Unit  
ICC1  
ICC2  
ISB2  
Vcc Dynamic Operating  
Supply Current  
VCC = 1.8V,  
IOUT = 0 mA, f = fMAX  
Com.  
Ind.  
20  
20  
15  
15  
10  
10  
mA  
Vcc Dynamic Operating  
Supply Current  
VCC =1.8V,  
IOUT = 0 mA, f = 1MHZ  
Com.  
Ind.  
2
2
2
2
2
2
mA  
µA  
CMOS Standby  
Current (CMOS Inputs)  
VCC = Max., Other inputs= 0 - VCC  
Com.  
Ind.  
35  
50  
35  
50  
35  
50  
1) CE  
VCC – 0.2V (CE controlled)  
2) LB/ UB  
VCC – 0.2V (LB/ UB controlled)  
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.  
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
5
IC62VV25616L  
IC62VV25616LL  
IC62VV25616LL POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
-55  
-70  
-100  
(2)  
(2)  
(2)  
Symbol Parameter  
TestConditions  
VCC = 1.8V, CE  
IOUT = 0 mA, f = fMAX  
VIL  
Typ . Max.  
Typ . Max.  
Typ . Max.  
7
7
Unit  
mA  
ICC1  
ICC2  
ISB2  
Vcc Dynamic Operating  
Supply Current  
VIL  
Com.  
Ind.  
20  
20  
10  
10  
15  
15  
10  
10  
Vcc Dynamic Operating  
Supply Current  
VCC = 1.8V, CE  
Com.  
Ind.  
2
2
2
2
2
2
mA  
µA  
IOUT = 0 mA, f = 1MHZ  
CMOS Standby  
VCC = Max., Other inputs= 0 - VCC  
Com.  
Ind.  
2
10  
15  
2
10  
15  
2
10  
15  
Current (CMOS Inputs)  
1) CE  
VCC – 0.2V (CE controlled)  
2) LB/ UB  
VCC – 0.2V (LB/ UB controlled)  
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.  
2. Typical values are measured at Vcc=1.8V, Ta=25°C, and are not guaranteed or tested.  
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)  
-55  
-70  
-100  
Min.  
Symbol Parameter  
Min.  
55  
10  
5
Max.  
Min.  
70  
10  
5
Max.  
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tRC  
Read Cycle Time  
100  
15  
5
tAA  
Address Access Time  
Output Hold Time  
55  
70  
100  
tOHA  
tACE  
tDOE  
CE Access Time  
55  
30  
20  
70  
35  
25  
100  
50  
OE Access Time  
(2)  
tHZOE  
OE to High-Z Output  
OE to Low-Z Output  
CE to High-Z Output  
CE to Low-Z Output  
LB, UB Access Time  
LB, UB o High-Z Output  
LB. UB to Low-Z Output  
30  
(2)  
tLZOE  
(2)  
tHZCE  
0
20  
0
25  
0
30  
(2)  
tLZCE  
tBA  
10  
0
10  
0
10  
0
55  
25  
70  
25  
100  
35  
tHZB  
tLZB  
0
0
0
Notes:  
1. Test conditions assume signal transition times of 5 ns or less, input pulse levels of 0.4V to 1.4V and output  
loading specified in Figure 1.  
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.  
6
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
IC62VV25616L  
IC62VV25616LL  
AC TEST LOADS  
READ CYCLE NO.1(1,2) (Address Controlled) (CE = OE = VIL, UB or LB = VIL)  
t
RC  
ADDRESS  
t
AA  
t
OHA  
t
OHA  
DATA VALID  
DOUT  
PREVIOUS DATA VALID  
AC WAVEFORMS  
READ CYCLE NO. 2(1,3) (OE Controlled)  
t
RC  
ADDRESS  
t
AA  
t
OHA  
OE  
CE  
t
HZOE  
t
DOE  
LZOE  
ACE  
t
t
t
HZCE  
t
LZCE  
LB, UB  
t
BA  
t
HZB  
t
LZB  
HIGH-Z  
DOUT  
DATA VALID  
Notes:  
1. WE is HIGH for a Read Cycle.  
2. The device is continuously selected. OE, CE, UB, or LB = VIL.  
3. Address is valid prior to or coincident with CE LOW transitions.  
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
7
IC62VV25616L  
IC62VV25616LL  
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)  
-55  
-70  
-100  
Max  
Symbol  
tWC  
Parameter  
Write Cycle Time  
Min.  
55  
50  
50  
0
Max.  
Min.  
70  
65  
65  
0
Max.  
Min.  
100  
80  
80  
0
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
40  
tSCE  
tAW  
CE to Write End  
Address Setup Time to Write End  
Address Hold from Write End  
Address Setup Time  
tHA  
tSA  
0
0
0
tPWB  
tPWE  
tSD  
LB, UB Valid to End of Write  
WE Pulse Width  
45  
45  
25  
0
60  
55  
30  
0
80  
80  
40  
0
Data Setup to Write End  
Data Hold from Write End  
WE LOW to High-Z Output  
WE HIGH to Low-Z Output  
tHD  
(3)  
tHZWE  
5
30  
5
30  
5
(3)  
tLZWE  
Notes:  
1. Test conditions assume signal transition times of 5 ns or less, input pulse levels of 0.4V to 1.4V and output loading specified in  
Figure 1.  
2. The internal write time is defined by the overlap of CE LOW, and UB or LB, and WE LOW. All signals must be in valid states to  
initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the  
rising or falling edge of the signal that terminates the Write.  
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.  
AC WAVEFORMS  
WRITE CYCLE NO. 1(1,2) (CE Controlled)  
t
WC  
VALID ADDRESS  
SCS  
ADDRESS  
CE  
t
SA  
t
t
HA  
t
AW  
t
PWE  
WE  
t
PBW  
UB, LB  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
DOUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
Notes:  
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least  
one of the LB and UB inputs being in the LOW state.  
2. WRITE = (CE) [ (LB) = (UB) ] (WE).  
8
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
IC62VV25616L  
IC62VV25616LL  
WRITE CYCLE NO. 2 (WE Controlled)  
t
WC  
ADDRESS  
VALID ADDRESS  
t
HA  
LOW  
CE  
t
AW  
t
PWE  
WE  
t
SA  
t
PBW  
UB, LB  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
DOUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
WRITE CYCLE NO. 3 (UB / LB Controlled)  
t
WC  
t
WC  
ADDRESS 1  
ADDRESS 2  
ADDRESS  
t
SA  
CE  
LOW  
t
HA  
SA  
t
HA  
t
WE  
t
PBW  
t
PBW  
UB, LB  
WORD 1  
WORD 2  
t
HZWE  
t
LZWE  
HIGH-Z  
DOUT  
DATA UNDEFINED  
t
HD  
t
HD  
t
SD  
t
SD  
DATAIN  
VALID  
DATAIN  
VALID  
DIN  
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
9
IC62VV25616L  
IC62VV25616LL  
DATA RETENTION SWITCHING CHARACTERISTICS  
Symbol  
VDR  
Parameter  
Vcc for Data Retention  
TestCondition  
See Data Retention Waveform  
Min.  
1.0  
Max.  
2.2  
Unit  
V
IDR  
Data Retention Current  
Vcc = 1.2V, CE  
Vcc – 0.2V  
Com. (-L)  
Com. (-LL)  
15  
6
µA  
Ind. (-L)  
20  
8
Ind. (-LL)  
tSDR  
tRDR  
Data Retention Setup Time  
RecoveryTime  
See Data Retention Waveform  
See Data Retention Waveform  
0
5
ns  
ns  
DATA RETENTION WAVEFORM (CE or LB/UB Controlled)  
t
SDR  
Data Retention Mode  
tRDR  
V
V
CC  
DR  
1.65V  
1.4V  
CE VCC - 0.2V  
CE, LB/UB  
GND  
10  
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
IC62VV25616L  
IC62VV25616LL  
ORDERING INFORMATION  
Industrial Range: -40°C to +85°C  
Commercial Range: 0°C to +70°C  
Speed (ns) Order Part No.  
Package  
Speed (ns) Order Part No.  
Package  
55  
IC62VV25616L-55TI  
IC62VV25616L-55BI  
TSOP-2  
6*8mmTF-BGA  
55  
IC62VV25616L-55T  
IC62VV25616L-55B  
TSOP-2  
6*8mmTF-BGA  
70  
IC62VV25616L-70TI  
IC62VV25616L-70BI  
TSOP-2  
6*8mmTF-BGA  
70  
IC62VV25616L-70T  
IC62VV25616L-70B  
TSOP-2  
6*8mmTF-BGA  
100  
IC62VV25616L-100TI  
IC62VV25616L-100BI  
TSOP-2  
6*8mmTF-BGA  
100  
IC62VV25616L-100T  
IC62VV25616L-100B  
TSOP-2  
6*8mmTF-BGA  
ORDERING INFORMATION  
Commercial Range: 0°C to +70°C  
Industrial Range: -40°C to +85°C  
Speed (ns) Order Part No.  
Package  
Speed (ns) Order Part No.  
Package  
55  
IC62VV25616LL-55TI  
IC62VV25616LL-55BI  
TSOP-2  
6*8mmTF-BGA  
55  
IC62VV25616LL-55T  
IC62VV25616LL-55B  
TSOP-2  
6*8mmTF-BGA  
70  
IC62VV25616LL-70TI  
IC62VV25616LL-70BI  
TSOP-2  
6*8mmTF-BGA  
70  
IC62VV25616LL-70T  
IC62VV25616LL-70B  
TSOP-2  
6*8mmTF-BGA  
100  
IC62VV25616LL-100TI  
IC62VV25616LL-100BI  
TSOP-2  
6*8mmTF-BGA  
100  
IC62VV25616LL-100T  
IC62VV25616LL-100B  
TSOP-2  
6*8mmTF-BGA  
Integrated Circuit Solution Inc.  
HEADQUARTER:  
NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,  
HSIN-CHU, TAIWAN, R.O.C.  
TEL: 886-3-5780333  
Fax: 886-3-5783000  
BRANCH OFFICE:  
7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD,  
HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.  
TEL: 886-2-26962140  
FAX: 886-2-26962252  
http://www.icsi.com.tw  
Integrated Circuit Solution Inc.  
LPSR019-0A 11/13/2001  
11  

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ICSI

IC62VV25616L-70TI

Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, TSOP2-44
ISSI

IC62VV25616LL

256Kx16 bit 1.8V and Ultra Low Power CMOS Static RAM
ICSI

IC62VV25616LL-100B

256Kx16 bit 1.8V and Ultra Low Power CMOS Static RAM
ICSI

IC62VV25616LL-100BI

256Kx16 bit 1.8V and Ultra Low Power CMOS Static RAM
ICSI

IC62VV25616LL-100BI

Standard SRAM, 256KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, TFBGA-48
ISSI