ICS2309M-1HT [ICSI]

3.3 VOLT ZERO DELAY, LOW SKEW BUFFER; 3.3伏零延迟,低偏移缓冲器
ICS2309M-1HT
型号: ICS2309M-1HT
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
3.3伏零延迟,低偏移缓冲器

文件: 总9页 (文件大小:196K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
Description  
Features  
The ICS2309 is a low phase noise, high-speed PLL  
based, low-skew zero delay buffer. Based on ICS’  
proprietary low jitter Phase Locked Loop (PLL)  
techniques, the device provides eight low skew outputs  
at speeds up to 133 MHz at 3.3 V. The outputs can be  
generated from the PLL (for zero delay), or directly  
from the input (for testing), and can be set to tri-state  
mode or to stop at a low level. The PLL feedback is  
on-chip and is obtained from the CLKOUT pad.  
Clock outputs from 10 to 133 MHz  
Zero input-output delay  
Eight low skew (<250 ps) outputs  
Device-to-device skew <700 ps  
Full CMOS outputs with 25 mA output drive  
capability at TTL levels  
5 V tolerant CLKIN  
Tri-state mode for board-level testing  
Advanced, low power, sub-micron CMOS process  
Operating voltage of 3.3 V  
The ICS2309 is available in two different versions. The  
ICS2309-1 is the base part. The ICS2309-1H is a high  
drive version with faster rise and fall times.  
Industrial temperature range available  
Packaged in 16-pin SOIC and TSSOP (-1H version  
only)  
Pb (lead) free package available for -1H version  
(16-pin TSSOP only)  
Block Diagram  
VDD  
2
PLL  
0
1
CLKIN  
CLKOUT  
CLKA1  
CLKA2  
CLKA3  
CLKA4  
Control  
Logic  
2
S2, S1  
CLKB1  
CLKB2  
CLKB3  
CLKB4  
2
GND  
MDS 2309 D  
1
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
Pin Assignment  
CLKIN  
CLKA1  
CLKA2  
VDD  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CLKOUT  
CLKA4  
CLKA3  
VDD  
GND  
GND  
CLKB1  
CLKB2  
S2  
CLKB4  
CLKB3  
S1  
16 pin narrow (150 mil) SOIC  
Output Clock Mode Select Table  
S2  
0
S1  
0
CLKA1:A4  
Tri-state (note 1)  
Running  
CLKB1:B4  
Tri-state (note 1)  
Tri-state (note 1)  
Running  
A & B Source  
PLL  
PLL Status  
OFF  
0
1
PLL  
ON  
1
0
Running  
CLKIN (note 2)  
PLL  
OFF  
1
1
Running  
Running  
ON  
Note 1. Outputs are in high impedance state  
Note 2. Buffer mode only; not zero delay between input and output  
Pin Descriptions  
Pin  
Pin  
Pin Type  
Pin Description  
Number  
Name  
1
2 - 3  
4
CLKIN  
CLKA1:A4  
VDD  
Input  
Clock input (5 V tolerant).  
Output Clock outputs A1:A4. See table above.  
Power  
Power  
Power supply. Connect to 3.3 V.  
Connect to ground.  
5
GND  
6 - 7  
8
CLKB1:B4  
S2  
Output Clock outputs B1:B4. See table above.  
Input  
Input  
Select input 2. See table above. Internal pull-up.  
Select input 1. See table above. Internal pull-up.  
9
S1  
10 - 11  
12  
CLKB1:B4  
GND  
Output Clock outputs B1:B4. See table above.  
Power  
Power  
Connect to ground.  
13  
VDD  
Power supply. Connect to 3.3 V.  
14 - 15  
16  
CLKA1:A4  
CLKOUT  
Output Clock outputs A1:A4. See table above.  
Input Buffered output. Internall feedback on this pin.  
MDS 2309 D  
2
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
External Components  
The ICS2309 requires a minimum number of external components for proper operation. Decoupling  
capacitors of 0.01 mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND  
on pins 13 and 12, as close to the device as possible. A series termination resistor of 33may be used to  
each clock output pin to reduce reflections.  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the ICS2309. These ratings,  
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of  
the device at these or any other conditions above those indicated in the operational sections of the  
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can  
affect product reliability. Electrical parameters are guaranteed only over the recommended operating  
temperature range.  
Item  
Rating  
Supply Voltage, VDD  
All Inputs and Outputs  
CLKIN and FBIN inputs  
7 V  
-0.5 V to VDD+0.5 V  
-0.5 V to 5.5 V  
2000 V  
Electrostatic Discharge (HBM)  
Ambient Operating Temperature (Commercial)  
Ambient Operating Temperature (Industrial)  
Storage Temperature  
0 to +70°C  
-40 to +85°C  
-65 to +150°C  
150°C  
Junction Temperature  
Soldering Temperature  
260°C  
Recommended Operation Conditions  
Parameter  
Min.  
Typ.  
Max.  
+85  
Units  
°C  
Ambient Operating Temperature (Industrial)  
Ambient Operating Temperature (Commercial)  
Power Supply Voltage (measured in respect to GND)  
-40  
0
+70  
°C  
+3.0  
+3.6  
V
MDS 2309 D  
3
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
DC Electrical Characteristics  
ICS2309M-1, VDD = 3.3 V ±10%, Ambient Temperature -40 to +85°C(Industrial), (0-70°C Commercial)  
Parameter  
Operating Voltage  
Input High Voltage  
Input Low Voltage  
Input Low Current  
Input High Current  
Output High Voltage  
Output Low Voltage  
Operating Supply Current  
Symbol  
Conditions  
Min.  
3.0  
2
Typ.  
Max. Units  
VDD  
3.6  
V
V
V
IH  
V
I
0.8  
50  
V
IL  
VIN = 0V  
VIN = VDD  
µA  
µA  
V
IL  
I
100  
IH  
V
I
I
= -12 mA  
= 12 mA  
2.4  
OH  
OH  
OL  
V
0.4  
32  
12  
V
OL  
IDD  
No Load  
mA  
µA  
Power Down Supply  
Current  
CLKIN = 0, Note 1  
Short Circuit Current  
Input Capacitance  
I
Each output  
±50  
5
mA  
pF  
OS  
C
S2, S1, CLKIN  
IN  
Note 1: When there is no clock signal present at CLKIN, the ICS2309 will enter power down mode. The  
PLL is stopped and the outputs are tri-state.  
AC Electrical Characteristics  
ICS2309M-1, VDD=3.3 V ±10%, Ambient temperature -40 to +85°C(Industrial), (0-70°C Commercial),  
Parameter  
Symbol  
Conditions  
Min. Typ. Max. Units  
Output Clock Frequency  
Output Clock Frequency  
Output Rise Time  
f
10 pF load, See table on page 2  
30 pF load, See table on page 2  
0.8 to 2.0 V, outputs loaded  
2.0 to 0.8 V, outputs loaded  
10  
10  
133  
100  
2.5  
2.5  
60  
MHz  
MHz  
ns  
IN  
t
OR  
Output Fall Time  
t
ns  
OF  
DC  
Output Clock Duty Cycle  
t
measured at 1.4V, Fout=66.67  
MHz  
40  
45  
50  
50  
%
Output Clock Duty Cycle  
t
measured at 1.4V, Fout=50  
MHz  
55  
%
DC  
Device to Device Skew  
Output to Output Skew  
Input to Output Skew  
Input to Output Skew  
rising edges at VDD/2  
rising edges at VDD/2  
rising edges at VDD/2  
700  
250  
±350  
8.7  
ps  
ps  
ns  
ns  
rising edges at VDD/2, S2= 1,  
S1 = 0  
1
5
Cycle to Cycle Jitter  
PLL Lock Time  
measured at 66.67M, outputs  
loaded  
200  
1.0  
ps  
Note 2  
ms  
Note 2: With VDD at a steady rate and valid input at CLKIN  
MDS 2309 D  
4
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
ICS2309M-1H, VDD=3.3 V ±10%, Ambient temperature -40 to +85°C(Industrial), (0-70°C Commercial),  
Parameter  
Symbol  
Conditions  
Min. Typ. Max. Units  
Output Clock Frequency  
Output Clock Frequency  
Output Rise Time  
f
10 pF load, See table on page 2  
30 pF load, See table on page 2  
0.8 to 2.0 V, outputs loaded  
2.0 to 0.8 V, outputs loaded  
10  
10  
133  
100  
1.5  
1.5  
60  
MHz  
MHz  
ns  
IN  
t
OR  
Output Fall Time  
t
ns  
OF  
Output Clock Duty Cycle  
t
measured at 1.4V, Fout=66.67  
MHz  
40  
45  
50  
50  
%
DC  
Output Clock Duty Cycle  
t
measured at 1.4V, Fout=50  
MHz  
55  
%
DC  
Device to Device Skew  
Output to Output Skew  
Input to Output Skew  
Input to Output Skew  
rising edges at VDD/2  
rising edges at VDD/2  
rising edges at VDD/2  
700  
250  
±350  
8.7  
ps  
ps  
ps  
ns  
rising edges at VDD/2, S2= 1,  
S1 = 0  
1
5
Cycle to Cycle Jitter  
PLL Lock Time  
measured at 66.67M, outputs  
loaded  
200  
1.0  
ps  
Note 3  
ms  
Note 3: With VDD at a steady rate and valid input at CLKIN  
MDS 2309 D  
5
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Min Max  
Inches  
Max  
16  
Symbol  
Min  
--  
A
A1  
A2  
b
C
D
--  
1.20  
0.15  
1.05  
0.30  
0.20  
5.1  
0.047  
0.006  
0.041  
0.012  
0.05  
0.80  
0.19  
0.09  
4.90  
0.002  
0.032  
0.007  
E1  
E
INDEX  
AREA  
0.0035 0.008  
0.193 0.201  
0.252 BASIC  
0.169 0.177  
0.0256 Basic  
E
E1  
e
6.40 BASIC  
4.30 4.50  
0.65 Basic  
1 2  
D
L
0.45  
0.75  
0.018  
0.030  
α
0°  
8°  
0°  
8°  
A
2
A
A
1
c
- C -  
e
SEATING  
PLANE  
b
L
.10 (.004)  
C
Thermal Characteristics for 16TSSOP  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
θ
θ
θ
θ
Still air  
78  
70  
68  
37  
°C/W  
°C/W  
°C/W  
°C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
Thermal Resistance Junction to Case  
MDS 2309 D  
6
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Inches  
16  
Symbol  
Min  
Max  
1.75  
0.25  
0.51  
0.25  
10.00  
4.00  
Min  
Max  
A
A1  
B
C
D
E
e
1.35  
0.10  
0.33  
0.19  
9.80  
3.80  
.0532  
.0040  
.013  
.0075  
.3859  
.1497  
.0688  
.0098  
.020  
.0098  
.3937  
.1574  
E
H
INDEX  
AREA  
1.27 BASIC  
0.050 BASIC  
1
2
H
h
L
5.80  
0.25  
0.40  
0°  
6.20  
0.50  
1.27  
8°  
.2284  
.010  
.016  
0°  
.2440  
.020  
.050  
8°  
D
α
A
h x 45  
A1  
C
- C -  
e
SEATING  
PLANE  
B
L
.10 (.004)  
C
Thermal Characteristics for 16SOIC  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
θ
θ
θ
θ
Still air  
120  
115  
105  
58  
°C/W  
°C/W  
°C/W  
°C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
Thermal Resistance Junction to Case  
MDS 2309 D  
7
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
Ordering Information  
Part / Order Number  
Marking  
Shipping Packaging  
Tubes  
Package  
16-pin SOIC  
16-pin SOIC  
16-pin SOIC  
16-pin SOIC  
16-pin SOIC  
16-pin SOIC  
16-pin SOIC  
16-pin SOIC  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
Temperature  
-40 to +85° C  
-40 to +85° C  
0 to +70° C  
0 to +70° C  
-40 to +85° C  
-40 to +85° C  
0 to +70° C  
ICS2309MI-1  
ICS2309MI-1T  
ICS2309M-1  
ICS2309MI-1  
ICS2309MI-1  
ICS2309M-1  
ICS2309M-1  
ICS2309MI-1H  
ICS2309MI-1H  
ICS2309M-1H  
ICS2309M-1H  
2309GI1H  
Tape and Reel  
Tubes  
ICS2309M-1T  
Tape and Reel  
Tubes  
ICS2309MI-1H  
ICS2309MI-1HT  
ICS2309M-1H  
ICS2309M-1HT  
ICS2309GI-1H  
ICS2309GI-1HT  
ICS2309GI-1HLF  
ICS2309GI-1HLFT  
ICS2309G-1H  
Tape and Reel  
Tubes  
Tape and Reel  
Tubes  
0 to +70° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
0 to +70° C  
0 to +70° C  
0 to +70° C  
2309GI1H  
Tape and Reel  
Tubes  
309GI1HL  
309GI1HL  
Tape and Reel  
Tubes  
2309G-1H  
ICS2309G-1HT  
ICS2309G-1HLF  
ICS2309G-1HLFT  
2309G-1H  
Tape and Reel  
Tubes  
2309G1HL  
2309G1HL  
Tape and Reel  
0 to +70° C  
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no  
responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other  
circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as  
those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without  
additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant  
any ICS product for use in life support devices or critical medical instruments.  
MDS 2309 D  
8
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS2309  
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER  
Revision History  
Rev. Originator  
Date  
Description of Change  
A
B
P. Griffith  
P. Griffith  
12/01/04 New device/datasheet; Prelminary.  
12/27/04 Add TSSOP package. Made corrections to IDD, IDDP, input capacitance and duty cycle  
specs/test conditions. Removed jitter specs for CL=15 pF. Added I/O skew spec for  
bypass mode and duty cycle spec for Fout=50 MHz.  
C
D
P. Griffith  
P. Griffith  
1/25/05 Made corrections to test conditions for output rise time, fall time, duty cycle and  
cycle-to-cycle jitter. Moved from Preliminary to Final.  
5/24/05 Added LF ordering info to 16-pin TSSOP (-1H version only); added Thermal Chars for  
16-pin TSSOP package  
MDS 2309 D  
9
Revision 052405  
Integrated Circuit Systems 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  

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