ICS342MLF [ICSI]

FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER; 现场可编程双路输出SS VersaClock合成
ICS342MLF
型号: ICS342MLF
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER
现场可编程双路输出SS VersaClock合成

晶体 外围集成电路 光电二极管 输出元件 时钟
文件: 总7页 (文件大小:152K)
中文:  中文翻译
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ICS342  
Field Programmable Dual Output SS VersaClock Synthesizer  
Description  
Features  
8-pin SOIC package  
The ICS342 is a low cost, dual-output, field  
Highly accurate frequency generation  
programmable clock synthesizer. The ICS342 can  
generate two output frequencies from 250 kHz to 200  
MHz, using up to two independently configurable PLLs.  
The outputs may employ Spread Spectrum techniques  
to reduce system electro-magnetic interference (EMI).  
M/N Multiplier PLL: M = 1...2048, N = 1...1024  
Output clock frequencies up to 200 MHz  
Two ROM locations for frequency and spread  
selection  
Spread spectrum capability for lower system EMI  
Center or Down Spread up to 4% total  
TM  
Using ICS’ VersaClock software to configure the  
PLL and output, the ICS342 contains a One-Time  
Programmable (OTP) ROM to allow field  
Selectable 32 kHz or 120 kHz modulation  
Input crystal frequency from 5 to 27 MHz  
Input clock frequency from 2 to 50 MHz  
Operating voltage of 3.3 V  
Advanced, low power CMOS process  
For one output clock, use the ICS341. For three  
output clocks, see the ICS343. For more than three  
outputs, see the ICS345 or ICS348.  
programmability. Programming features include 2  
selectable configuration registers. Using Phase-Locked  
Loop (PLL) techniques, the device runs from a  
standard fundamental mode, inexpensive crystal, or  
clock. It can replace multiple crystals and oscillators,  
saving board space and cost.  
The device also has a power down feature that  
tri-states the clock outputs and turns off the PLLs when  
the PDTS pin is taken low.  
Available in Pb (lead) free packaging  
The ICS342 is also available in factory programmed  
custom versions for high-volume applications.  
Block Diagram  
VDD  
OTP ROM  
with PLL  
Divider  
SEL  
CLK1  
Values  
PLL Clock Synthesis,  
Spred Spectrum and  
Control Circuitry  
Crystal or  
clock input  
X1/ICLK  
Crystal  
Oscillator  
CLK2  
X2  
External capacitors are  
required with a crystal input.  
GND  
PDTS (both outputs and PLL)  
MDS 342 F  
1
Revision 090704  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS342  
Field Programmable Dual Output SS VersaClock  
Pin Assignment  
Output Clock Selection Table  
X1/ I CLK  
VDD  
8
7
6
5
1
2
3
4
X2  
SEL CLK1 (MHz) CLK2 (MHz)  
Spread  
Percentage  
User  
Configurable  
User  
PDTS  
SEL  
CLK2  
0
1
User  
Configurable  
User  
User  
Configurable  
User  
GND  
CLK1  
Configurable  
Configurable  
Configurable  
8-pin (150 mil) SOIC  
Pin Description  
Pin  
Number  
Pin  
Name  
Pin  
Type  
Pin Description  
1
2
3
4
5
6
X1/ICLK  
VDD  
XI  
Connect this pin to a crystal or external clock input.  
Connect to +3.3 V.  
Power  
Power  
GND  
Connect to ground.  
CLK1  
CLK2  
SEL  
Output Clock output. Weak internal pull-down when tri-state.  
Output Clock output. Weak internal pull-down when tri-state.  
Input  
Input  
XO  
Select for frequency selection on CLK1 and CLK2. Internal pull-up resistor.  
Powers down entire chip. Tri-states CLK outputs when low. Internal pull-up  
resistor.  
7
8
PDTS  
X2  
Connect this pin to a crystal, or float for clock input.  
External Components  
capacitance of the board to match the nominally  
required crystal load capacitance. Because load  
Series Termination Resistor  
Clock output traces over one inch should use series  
termination. To series terminate a 50trace (a  
commonly used trace impedance), place a 33resistor  
in series with the clock line, as close to the clock output  
pin as possible. The nominal impedance of the clock  
output is 20.  
capacitance can only be increased in this trimming  
process, it is important to keep stray capacitance to a  
minimum by using very short PCB traces (and no vias)  
been the crystal and device. Crystal capacitors must be  
connected from each of the pins X1 and X2 to ground.  
The value (in pF) of these crystal caps should equal  
Decoupling Capacitor  
(C -6 pF)*2. In this equation, C = crystal load  
L
L
capacitance in pF. Example: For a crystal with a 16 pF  
load capacitance, each crystal capacitor would be 20  
pF [(16-6) x 2] = 20.  
As with any high-performance mixed-signal IC, the  
ICS342 must be isolated from system power supply  
noise to perform optimally.  
A decoupling capacitor of 0.01µF must be connected  
between VDD and the PCB ground plane.  
PCB Layout Recommendations  
For optimum device performance and lowest output  
phase noise, the following guidelines should be  
observed.  
Crystal Load Capacitors  
The device crystal connections should include pads for  
small capacitors from X1 to ground and from X2 to  
ground. These capacitors are used to adjust the stray  
1) The 0.01µF decoupling capacitor should be mounted  
on the component side of the board as close to the  
MDS 342 F  
2
Revision 090704  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS342  
Field Programmable Dual Output SS VersaClock  
VDD pin as possible. No vias should be used between  
the decoupling capacitor and VDD pin. The PCB trace  
to VDD pin should be kept as short as possible, as  
should the PCB trace to the ground via. Distance of the  
ferrite bead and bulk decoupling from the device is less  
critical.  
VersaClock software quickly evaluates accessible VCO  
frequencies with available output divide values and  
provides an easy to understand, bar code rating for the  
target output frequencies. The user may evaluate  
output accuracy, performance trade-off scenarios in  
seconds.  
2) The external crystal should be mounted just next to  
the device with short traces. The X1 and X2 traces  
should not be routed next to each other with minimum  
spaces, instead they should be separated and away  
from other traces.  
Spread Spectrum Modulation  
The ICS342 utilizes frequency modulation (FM) to  
distribute energy over a range of frequencies. By  
modulating the output clock frequencies, the device  
effectively lowers energy across a broader range of  
frequencies; thus, lowering a system’s electromagnetic  
interference (EMI). The modulation rate is the time from  
transitioning from a minimum frequency to a maximum  
frequency and then back to the minimum.  
3) To minimize EMI, the 33series termination resistor  
(if needed) should be placed close to the clock output.  
4) An optimum layout is one with all components on the  
same side of the board, minimizing vias through other  
signal layers. Other signal traces should be routed  
away from the ICS342. This includes signal traces just  
underneath the device, or on layers adjacent to the  
ground plane layer used by the device.  
Spread Spectrum Modulation can be applied as either  
“center spread” or “down spread”. During center spread  
modulation, the deviation from the target frequency is  
equal in the positive and negative directions. The  
effective average frequency is equal to the target  
frequency. In applications where the clock is driving a  
component with a maximum frequency rating, down  
spread should be applied. In this case, the maximum  
frequency, including modulation, is the target  
frequency. The effective average frequency is less than  
the target frequency.  
ICS342 Configuration Capabilities  
The architecture of the ICS342 allows the user to easily  
configure the device to a wide range of output  
frequencies, for a given input reference frequency.  
The frequency multiplier PLL provides a high degree of  
precision. The M/N values (the multiplier/divide values  
available to generate the target VCO frequency) can be  
set within the range of M = 1 to 2048 and N = 1 to 1024.  
The ICS342 operates in both center spread and down  
spread modes. For center spread, the frequency can  
be modulated between +/- 0.125% to +/-2.0%. For  
down spread, the frequency can be modulated  
between -0.25% to -4.0%.  
The ICS342 also provides separate output divide  
values, from 2 through 20, to allow the two output clock  
banks to support widely differing frequency values from  
the same PLL.  
Both output frequency banks will utilize identical spread  
spectrum percentage deviations and modulation rates,  
if a common VCO frequency can be identified.  
Each output frequency can be represented as:  
REFFreq  
OutputDivide  
M
-------------------------------------- ----  
OutputFreq =  
N
Spread Spectrum Modulation Rate  
The spread spectrum modulation frequency applied to  
the output clock frequency may occur at a variety of  
rates. For applications requiring the driving of  
“down-circuit” PLLs, Zero Delay Buffers, or those  
adhering to PCI standards, the spread spectrum  
modulation rate should be set to 30-33 kHz. For other  
applications, a 120 kHz modulation option is available.  
ICS VersaClock Software  
ICS applies years of PLL optimization experience into a  
user friendly software that accepts the user’s target  
reference clock and output frequencies and generates  
the lowest jitter, lowest power configuration, with only a  
press of a button. The user does not need to have prior  
PLL experience or determine the optimal VCO  
frequency to support multiple output frequencies.  
MDS 342 F  
3
Revision 090704  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS342  
Field Programmable Dual Output SS VersaClock  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the ICS342. These ratings, which  
are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the  
device at these or any other conditions above those indicated in the operational sections of the  
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can  
affect product reliability. Electrical parameters are guaranteed only over the recommended operating  
temperature range.  
Parameter  
Condition  
Min.  
Typ.  
Max.  
7
Units  
V
Supply Voltage, VDD  
Inputs  
Referenced to GND  
Referenced to GND  
Referenced to GND  
-0.5  
-0.5  
-65  
VDD+ 0.5  
VDD+ 0.5  
150  
V
Clock Outputs  
V
Storage Temperature  
Soldering Temperature  
Junction Temperature  
°C  
°C  
°C  
Max 10 seconds  
260  
125  
Recommended Operation Conditions  
Parameter  
Min.  
0
Typ.  
Max.  
+70  
+85  
+3.45  
4
Units  
°C  
Ambient Operating Temperature (ICS342M)  
Ambient Operating Temperature (ICS342MI)  
Power Supply Voltage (measured in respect to GND)  
Power Supply Ramp Time  
-40  
°C  
+3.15  
+3.3  
V
ms  
DC Electrical Characteristics  
Unless stated otherwise, VDD = 3.3V ±±%, Ambient Temperature -40 to +85°C  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Units  
V
Operating Voltage  
VDD  
3.15  
3.3  
3.45  
Configuration  
mA  
Dependent - See  
TM  
VersaClock Estimates  
Operating Supply Current  
Input High Voltage  
IDD  
Two 33.3333 MHz  
outputs, PDTS = 1, no  
load, Note 1  
13  
20  
mA  
PDTS = 0  
SEL pin  
µA  
V
Input High Voltage  
V
2
IH  
Input Low Voltage  
V
SEL pin  
0.4  
0.4  
V
V
V
V
V
IL  
Input High Voltage, PDTS  
Input Low Voltage, PDTS  
Input High Voltage  
V
VDD-0.5  
VDD/2+1  
IH  
V
IL  
V
ICLK  
ICLK  
IH  
Input Low Voltage  
V
VDD/2-1  
IL  
MDS 342 F  
4
Revision 090704  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS342  
Field Programmable Dual Output SS VersaClock  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Units  
Output High Voltage  
(CMOS High)  
V
I
= -4 mA  
VDD-0.4  
V
OH  
OH  
Output High Voltage  
Output Low Voltage  
Short Circuit Current  
V
I
I
= -12 mA  
= 12mA  
2.4  
V
V
OH  
OH  
V
0.4  
OL  
OS  
OL  
I
70  
20  
mA  
Nominal Output  
Impedance  
Z
O
Internal pull-up resistor  
R
SEL, PDTS pins  
CLK output  
250  
525  
kΩ  
kΩ  
PUP  
Internal pull-down  
resistor  
R
PD  
Input Capacitance  
C
Inputs  
4
pF  
IN  
Note 1: Example with 25 MHz crystal input with two outputs of 33.3 MHz, no load, and VDD = 3.3 V.  
AC Electrical Characteristics  
Unless stated otherwise, VDD = 3.3V ±±%, Ambient Temperature -40 to +85° C  
Parameter  
Symbol  
Conditions  
Fundamental Crystal  
Input Clock  
Min. Typ. Max. Units  
Input Frequency  
F
5
2
27  
50  
MHz  
MHz  
MHz  
ns  
IN  
Output Frequency  
Output Rise Time  
Output Fall Time  
Duty Cycle  
0.25  
200  
t
20% to 80%, Note 1  
80% to 20%, Note 1  
Note 2  
1
1
OR  
t
ns  
OF  
40  
49-51  
4
60  
10  
%
Power-up time  
PLL lock time from  
power-up, Note 3  
ms  
PDTS goes high until  
stable CLK output, Spread  
Spectrum Off, Note 3  
0.2  
4
2
7
ms  
ms  
PDTS goes high until  
stable CLK output, Spread  
Spectrum On, Note 3  
One Sigma Clock Period Jitter  
Maximum Absolute Jitter  
Configuration Dependent  
50  
ps  
ps  
t
Deviation from Mean.  
+200  
ja  
Configuration Dependent  
Note 1: Measured with 15 pF load.  
Note 2: Duty Cycle is configuration dependent. Most configurations are minimum 45% and maximum 55%.  
Note 3: ICS test mode output occurs for first 170 clock cycles on CLK2 for each PLL powered up. PDTS  
transition high on select address change.  
MDS 342 F  
5
Revision 090704  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS342  
Field Programmable Dual Output SS VersaClock  
Thermal Characteristics  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
θ
θ
θ
Still air  
150  
140  
120  
40  
°C/W  
°C/W  
°C/W  
°C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
Thermal Resistance Junction to Case  
θ
MDS 342 F  
6
Revision 090704  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS342  
Field Programmable Dual Output SS VersaClock  
Package Outline and Package Dimensions (8-pin SOIC, 1±0 Mil. Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Inches  
8
Symbol  
Min  
Max  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
Min  
Max  
A
A1  
B
C
D
E
e
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
.0532  
.0040  
.013  
.0075  
.1890  
.1497  
.0688  
.0098  
.020  
.0098  
.1968  
.1574  
E
H
INDEX  
AREA  
1.27 BASIC  
0.050 BASIC  
1
2
H
h
L
5.80  
0.25  
0.40  
0°  
6.20  
.2284  
.010  
.016  
0°  
.2440  
.020  
.050  
8°  
0.50  
1.27  
8°  
D
α
A
h x 45  
A1  
C
- C -  
e
SEATING  
PLANE  
B
L
.10 (.004)  
C
Ordering Information  
Part / Order Number  
Marking  
Shipping  
packaging  
Tubes  
Package  
Temperature  
ICS342MP  
ICS342MIP  
ICS342MLF  
342MP (top line)  
342MIP (top line)  
342MLF (top line)  
8-pin SOIC  
8-pin SOIC  
8-pin SOIC  
0 to +70° C  
-40 to +85° C  
0 to +70° C  
Tubes  
Tubes  
“LF” denotes Pb (lead) free package.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)  
assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would  
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial  
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary  
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any  
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or  
critical medical instruments.  
MDS 342 F  
7
Revision 090704  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  

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