ICS8421002AGI-01LF [ICSI]
FEMTOCLOCKS? CRYSTAL-TO-HSTL FREQUENCY SYNTHESIZER; FEMTOCLOCKS ? CRYSTAL - TO- HSTL频率合成器型号: | ICS8421002AGI-01LF |
厂家: | INTEGRATED CIRCUIT SOLUTION INC |
描述: | FEMTOCLOCKS? CRYSTAL-TO-HSTL FREQUENCY SYNTHESIZER |
文件: | 总13页 (文件大小:198K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ICS8421002I-01
FEMTOCLOCKS™ CRYSTAL-TO-
HSTL FREQUENCY SYNTHESIZER
Integrated
Circuit
Systems, Inc.
GENERAL DESCRIPTION
FEATURES
The ICS8421002I-01 is a 2 output HSTL • Two HSTL outputs (VOHmax = 1.5V)
ICS
HiPerClockS™
Synthesizer optimized to generate Ethernet
• Selectable crystal oscillator interface
reference clock frequencies and is a member of
or LVCMOS/LVTTL single-ended input
the HiPerClocksTM family of high performance
clock solutions from ICS. Using a 25MHz,
• Supports the following output frequencies: 156.25MHz,
125MHz, 62.5MHz
18pF parallel resonant crystal, the following frequencies
can be generated based on the 2 frequency select pins
(F_SEL[1:0]): 156.25MHz, 125MHz and 62.5MHz. The
ICS8421002I-01 uses ICS’ 3rd generation low phase
noise VCO technology and can achieve 1ps or lower typi-
cal rms phase jitter, easily meeting Ethernet jitter
requirements. The ICS8421002I-01 is packaged in a small
20-pin TSSOP package.
• VCO range: 560MHz - 680MHz
• RMS phase jitter @ 156.25MHz, using a 25MHz crystal
(1.875MHz - 20MHz): 0.44ps (typical)
• Power supply modes:
Core/Output
3.3V/1.8V
2.5V/1.8V
• -40°C to 85°C ambient operating temperature
• Available in both standard and lead-free RoHS compliant
packages
FREQUENCY SELECT FUNCTION TABLE
PIN ASSIGNMENT
nc
VDDO
Q0
VDDO
1
20
19
18
17
16
15
14
13
12
11
Q1
2
Output Frequency
M Divider N Divider
nQ1
3
(25MHz Ref.)
F_SEL1 F_SEL0
GND
VDD
nQ0
MR
Value
Value
4
5
0
0
1
1
0
1
0
1
25
4
156.25
125
nXTAL_SEL
REF_CLK
XTAL_IN
XTAL_OUT
F_SEL1
nPLL_SEL
nc
VDDA
F_SEL0
VDD
6
7
8
9
25
25
5
10
62.5
not used
not used
10
ICS8421002I-01
20-Lead TSSOP
6.5mm x 4.4mm x 0.92mm
BLOCK DIAGRAM
F_SEL[1:0]
package body
G Package
Top View
Pulldown
2
Pulldown
nPLL_SEL
Q0
F_SEL[1:0]
0 0 ÷4 (default)
0 1 ÷5
nQ0
Pulldown
REF_CLK
1
0
1
0
25MHz
XTAL_IN
1 0 ÷10
Q1
1 1 Not Used
Phase
Detector
VCO
OSC
nQ1
XTAL_OUT
Pulldown
nXTAL_SEL
M = 25 (fixed)
Pulldown
MR
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ICS8421002I-01
FEMTOCLOCKS™ CRYSTAL-TO-
HSTL FREQUENCY SYNTHESIZER
Integrated
Circuit
Systems, Inc.
TABLE 1. PIN DESCRIPTIONS
Number
1, 7
Name
nc
Type
Unused
Description
No connect.
2, 20
3, 4
VDDO
Power
Ouput
Output supply pins.
Q0, nQ0
Differential output pair. HSTL interface levels.
Active HIGH Master Reset. When logic HIGH, the internal dividers are
reset causing the true outputs Qx to go low and the inverted outputs nQx
to go high. When logic LOW, the internal dividers and the outputs are
enabled. LVCMOS/LVTTL interface levels.
5
MR
Input
Pulldown
Selects between the PLL and REF_CLK as input to the dividers. When
6
nPLL_SEL
VDDA
Input
Pulldown LOW, selects PLL (PLL Enable). When HIGH, deselects the reference clock
(PLL Bypass). LVCMOS/LVTTL interface levels.
8
Power
Input
Power
Input
Input
Analog supply pin.
F_SEL0,
F_SEL1
9, 11
10, 16
12, 13
14
Pulldown Frequency select pins. LVCMOS/LVTTL interface levels.
Core supply pin.
VDD
XTAL_OUT,
XTAL_IN
Parallel resonant crystal interface. XTAL_OUT is the output,
XTAL_IN is the input.
REF_CLK
Pulldown LVCMOS/LVTTL reference clock input.
Selects between crystal or REF_CLK inputs as the the PLL Reference
Pulldown source. Selects XTAL inputs when LOW. Selects REF_CLK when HIGH.
LVCMOS/LVTTL interface levels.
15
nXTAL_SEL
Input
17
GND
Power
Output
Power supply ground.
18, 19
nQ1, Q1
Differential output pair. HSTL interface levels.
NOTE: Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum Units
CIN
Input Capacitance
4
pF
RPULLDOWN Input Pulldown Resistor
51
kΩ
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ICS8421002I-01
FEMTOCLOCKS™ CRYSTAL-TO-
HSTL FREQUENCY SYNTHESIZER
Integrated
Circuit
Systems, Inc.
ABSOLUTE MAXIMUM RATINGS
SupplyVoltage, V
4.6V
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device.These ratings are stress specifications only.Functional
operation of product at these conditions or any conditions be-
yond those listed in the DC Characteristics or AC Character-
istics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
DD
Inputs, V
-0.5V to VDD + 0.5V
I
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
PackageThermal Impedance, θ
73.2°C/W (0 lfpm)
-65°C to 150°C
JA
StorageTemperature, T
STG
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = 3.3V 5ꢀ, VDDO = 1.8V 0.2V, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical
Maximum Units
VDD
VDDA
VDDO
IDD
Core Supply Voltage
3.135
3.135
3.135
3.3
3.3
3.3
3.465
3.465
3.465
110
V
V
Analog Supply Voltage
Output Supply Voltage
Power Supply Current
Analog Supply Current
Output Supply Current
V
mA
mA
mA
IDDA
IDDO
12
No Load
0
TABLE 3B. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = 2.5V 5ꢀ, VDDO = 1.8V 0.2V, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical
Maximum Units
VDD
VDDA
VDDO
IDD
Core Supply Voltage
2.375
2.375
2.375
2.5
2.5
2.5
2.625
2.625
2.625
96
V
V
Analog Supply Voltage
Output Supply Voltage
Power Supply Current
Analog Supply Current
Output Supply Current
V
mA
mA
mA
IDDA
IDDO
12
No Load
0
TABLE 3C. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = VDDA = 3.3V 5ꢀ OR 2.5V 5ꢀ, VDDO = 1.8V 0.2V,
TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
VDD = 3.3V
Minimum Typical Maximum Units
2
VDD + 0.3
VDD + 0.3
0.8
V
V
V
V
VIH
VIL
Input High Voltage
Input Low Voltage
VDD = 2.5V
1.7
-0.3
-0.3
V
DD = 3.3V
VDD = 2.5V
0.7
REF_CLK, MR,
F_SEL0, F_SEL1,
nPLL_SEL, nXTAL_SEL
VDD = VIN = 3.465
or 2.5V
Input
High Current
IIH
150
µA
µA
REF_CLK, MR,
F_SEL0, F_SEL1,
nPLL_SEL, nXTAL_SEL
VDD = 3.465V or 2.5V,
Input
Low Current
IIL
-150
V
IN = 0V
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FEMTOCLOCKS™ CRYSTAL-TO-
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TABLE 3D. HSTL DC CHARACTERISTICS, VDD = VDDA = 3.3V 5ꢀ,VDDO = 1.8V 0.2V, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VOH
Output High Voltage; NOTE 1
1.0
0
1.5
0.5
60
V
V
VOL
Output Low Voltage; NOTE 1
VOX
Output Crossover Voltage; NOTE 2
Peak-to-Peak Output Voltage Swing
40
0.6
ꢀ
V
VSWING
1.3
NOTE 1: Outputs terminated with 50Ω to ground.
NOTE 2: Defined with respect to output voltage swing at a given condition.
TABLE 3E. HSTL DC CHARACTERISTICS, VDD = VDDA = 2.5V 5ꢀ,VDDO = 1.8V 0.2V, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VOH
Output High Voltage; NOTE 1
0.8
0
1.5
0.6
60
V
V
VOL
Output Low Voltage; NOTE 1
VOX
Output Crossover Voltage; NOTE 2
Peak-to-Peak Output Voltage Swing
40
0.5
ꢀ
V
VSWING
1.5
NOTE 1: Outputs terminated with 50Ω to ground.
NOTE 2: Defined with respect to output voltage swing at a given condition.
TABLE 4. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Typical Maximum Units
Fundamental
25
Mode of Oscillation
Frequency
22.4
27.2
50
7
MHz
Ω
Equivalent Series Resistance (ESR)
Shunt Capacitance
Drive Level
pF
1
mW
NOTE: Characterized using an 18pF parallel resonant crystal.
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ICS8421002I-01
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TABLE 5A. AC CHARACTERISTICS, VDD = VDDA = 3.3V 5ꢀ,VDDO = 1.8V 0.2V, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
F_SEL[1:0] = 00
F_SEL[1:0] = 01
F_SEL[1:0] = 10
Minimum Typical Maximum Units
140
112
56
170
136
68
MHz
MHz
MHz
ps
fOUT
Output Frequency
tsk(o)
tjit(Ø)
Output Skew; NOTE 1, 3
20
156.25MHz, (1.875MHz - 20MHz)
125MHz, (1.875MHz - 20MHz)
62.5MHz,(1.875MHz - 20MHz)
20ꢀ to 80ꢀ
0.44
0.48
0.49
ps
RMS Phase Jitter (Random);
NOTE 2
ps
ps
tR / tF
odc
Output Rise/Fall Time
Output Duty Cycle
215
48
815
52
ps
ꢀ
NOTE 1: Defined as skew between outputs at the same supply voltages and with equal load conditions.
Measured at VDDO/2.
NOTE 2: Please refer to the Phase Noise Plot.
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.
TABLE 5B. AC CHARACTERISTICS, VDD = VDDA = 2.5V 5ꢀ,VDDO = 1.8V 0.2V, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
F_SEL[1:0] = 00
F_SEL[1:0] = 01
F_SEL[1:0] = 10
Minimum Typical Maximum Units
140
112
56
170
136
68
MHz
MHz
MHz
ps
fOUT
Output Frequency
tsk(o)
tjit(Ø)
Output Skew; NOTE 1, 3
20
156.25MHz, (1.875MHz - 20MHz)
125MHz, (1.875MHz - 20MHz)
62.5MHz,(1.875MHz - 20MHz)
20ꢀ to 80ꢀ
0.41
0.49
0.50
ps
RMS Phase Jitter (Random);
NOTE 2
ps
ps
tR / tF
odc
Output Rise/Fall Time
Output Duty Cycle
315
48
715
52
ps
ꢀ
NOTE 1: Defined as skew between outputs at the same supply voltages and with equal load conditions.
Measured at VDDO/2.
NOTE 2 Please refer to the Phase Noise Plot.
NOTE 3 This parameter is defined in accordance with JEDEC Standard 65.
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FEMTOCLOCKS™ CRYSTAL-TO-
HSTL FREQUENCY SYNTHESIZER
Integrated
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TYPICAL PHASE NOISE AT 156.25MHZ @ 3.3V
0
-10
-20
-30
-40
-50
-60
-70
-80
Ethernet Jitter Filter
156.25MHz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.44ps (typical)
-90
-100
-110
-120
Raw Phase Noise Data
-130
-140
-150
-160
-170
-180
-190
Phase Noise Result by adding
Ethernet Filter to raw data
100
1k
10k
100k
1M
10M
100M
OFFSET FREQUENCY (HZ)
TYPICAL PHASE NOISE AT 62.5MHZ @ 3.3V
0
-20
-40
Ethernet Jitter Filter
62.5MHz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.49ps
-60
-80
-100
Raw Phase Noise Data
-120
-140
-160
-180
-200
Phase Noise Result by adding
Ethernet Filter to raw data
100
1k
10k
100k
1M
10M
100M
OFFSET FREQUENCY (HZ)
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PARAMETER MEASUREMENT INFORMATION
VDD
VDD
VDDA
VDDO
VDDA
VDDO
SCOPE
SCOPE
Qx
Qx
HSTL
HSTL
GND
GND
nQx
nQx
0V
0V
HSTL 3.3V/1.8V OUTPUT LOAD AC TEST CIRCUIT
HSTL 2.5V/1.8V OUTPUT LOAD AC TEST CIRCUIT
nQx
Qx
80ꢀ
tF
80ꢀ
tR
VSWING
20ꢀ
Clock
Outputs
nQy
20ꢀ
Qy
tsk(o)
OUTPUT SKEW
OUTPUT RISE/FALL TIME
Phase Noise Plot
nQ0, nQ1
Q0, Q1
tPW
tPERIOD
Phase Noise Mask
tPW
odc =
x 100ꢀ
tPERIOD
Offset Frequency
f1
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
RMS PHASE JITTER
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
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ICS8421002I-01
FEMTOCLOCKS™ CRYSTAL-TO-
HSTL FREQUENCY SYNTHESIZER
Integrated
Circuit
Systems, Inc.
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise.The ICS8421002I-01 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL.VDD, VDDA, and VDDO
should be individually connected to the power supply
plane through vias, and bypass capacitors should be
used for each pin. To achieve optimum jitter performance,
power supply isolation is required. Figure 1 illustrates how
a 10Ω resistor along with a 10µF and a .01μF bypass
3.3V or 2.5V
VDD
.01μF
.01μF
10Ω
VDDA
10μF
capacitor should be connected to each VDDA
.
FIGURE 1. POWER SUPPLY FILTERING
CRYSTAL INPUT INTERFACE
The ICS8421002I-01 has been characterized with 18pF par-
2 below were determined using a 25MHz 18pF parallel reso-
nant crystal and were chosen to minimize the ppm error.
allel resonant crystals.The capacitor values shown in Figure
XTAL_OUT
C1
22p
X1
18pF Parallel Crystal
XTAL_IN
C2
22p
ICS8421002I-01
Figure 2. CRYSTAL INPUt INTERFACE
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FEMTOCLOCKS™ CRYSTAL-TO-
HSTL FREQUENCY SYNTHESIZER
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POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8421002I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8421002I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5ꢀ = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VDD_MAX * IDD_MAX = 3.465V * 122mA = 422.7mW
Power (outputs)MAX = 32.8mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 32.8mW = 65.6mW
Total Power_MAX (3.465V, with all outputs switching) = 422.7mW + 65.6mW = 488.3mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device.The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = JunctionTemperature
θJA = Junction-to-AmbientThermal Resistance
Pd_total =Total Device Power Dissipation (example calculation is in section 1 above)
TA = AmbientTemperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W perTable 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.488W * 66.6°C/W = 117.5°C. This is below the limit of 125°C.
This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE θJA FOR 20-PIN TSSOP, FORCED CONVECTION
θJA byVelocity (Linear Feet per Minute)
0
200
98.0°C/W
66.6°C/W
500
88.0°C/W
63.5°C/W
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
73.2°C/W
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.
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3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
HSTL output driver circuit and termination are shown in Figure 3.
VDDO
Q1
VOUT
RL
50Ω
FIGURE 3. HSTL DRIVER CIRCUIT AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load.
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = (V
Pd_L = (V
/R ) * (V
- V
)
OH_MAX
OH_MAX
L
DD_MAX
/R ) * (V
- V
)
OL_MAX
L
DD_MAX
OL_MAX
Pd_H = (1V/50Ω) * (2V - 1V) = 20mW
Pd_L = (0.4V/50Ω) * (2V - 0.4V) = 12.8mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 32.8mW
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RELIABILITY INFORMATION
TABLE 7. θJAVS. AIR FLOW TABLE FOR 20 LEAD TSSOP
θJA byVelocity (Linear Feet per Minute)
0
200
98.0°C/W
66.6°C/W
500
88.0°C/W
63.5°C/W
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
73.2°C/W
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS8421002I-01 is: 2951
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PACKAGE OUTLINE - G SUFFIX FOR 20 LEAD TSSOP
TABLE 7. PACKAGE DIMENSIONS
Millimeters
SYMBOL
MIN
MAX
N
A
20
--
1.20
0.15
1.05
0.30
0.20
6.60
A1
A2
b
0.05
0.80
0.19
0.09
6.40
c
D
E
6.40 BASIC
0.65 BASIC
E1
e
4.30
4.50
L
0.45
0°
0.75
8°
α
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-153
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TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging Temperature
ICS8421002AGI-01
ICS8421002AGI-01T
ICS8421002AGI-01LF
ICS8421002AGI-01LFT
ICS421002AI01
ICS421002AI01
ICS1002AI01L
ICS1002AI01L
20 Lead TSSOP
tube
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
20 Lead TSSOP
2500 tape & reel
tube
20 Lead "Lead-Free" TSSOP
20 Lead "Lead-Free" TSSOP
2500 tape & reel
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free Configuration and are RoHS compliant.
The aforementioned trademarks, HiPerClockS and FEMTOCLOCKS are trademarks of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use or
for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal
commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended
without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in
life support devices or critical medical instruments.
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Clock Generator, 226.66MHz, PDSO20, 6.50 X 4.40 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-20
IDT
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