ICS9169CM-27 [ICSI]

Frequency Generator for Pentium™ Based Systems; 频率发生器奔腾™的系统
ICS9169CM-27
型号: ICS9169CM-27
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

Frequency Generator for Pentium™ Based Systems
频率发生器奔腾™的系统

文件: 总8页 (文件大小:557K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Integrated  
Circuit  
Systems, Inc.  
ICS9169C-27  
Frequency Generator for Pentium™ Based Systems  
General Description  
Features  
•
•
•
•
Twelve selectable CPU clocks operate up to 83.3MHz  
Maximum CPU jitter of ± 200ps  
Six BUS clocks support sync or async bus operation  
250ps skew window for CPU outputs, 500ps skew  
window for BUS outputs  
CPU clocks BUS clocks skew 1-4ns (CPU early)  
Integrated buffer outputs drive up to 30pF loads  
3.0V - 3.7V supply range, CPU(1:6) outputs 2.5V(2.375-  
2.62V)VDD option  
32-pin SOIC/SOJ package  
The ICS9169C-27 is a low-cost frequency generator  
designed specifically for Pentium based chip set systems.  
The integrated buffer minimizes skew and provides all the  
clocks required. A 14.318 MHz XTAL oscillator provides  
the reference clock to generate standard Pentium  
frequencies. The CPU clock makes gradual frequency  
transitions without violating the PLL timing of internal  
microprocessor clock multipliers.  
•
•
•
Twelve CPU clock outputs provide sufficient clocks for the  
CPU, chip set, memory and up to two DIMM connectors (with  
four clocks to each DIMM). Either synchronous(CPU/2) or  
asynchronous (32 MHz) PCI bus operation can be selected  
by latching data on the BSEL input  
•
•
Logic inputs latched at Power-On for frequency selection  
saving pins as Input/Output  
48 MHz clock for USB support and 24 MHz clock for FD.  
•
Block Diagram  
Pin Configuration  
32-Pin SOIC/SOJ  
Functionality  
3.3V±10%, 0-70°C  
Crystal (X1, X2) = 14.31818 MHz  
ADDRESS  
SELECT  
CPU(1:12)  
(MHz)  
BUS (1:6)MHz  
48MHz 24MHz  
REF  
FS2 FS1 FS0  
BSEL=1 BSEL=0  
VDD Groups:  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
50  
60  
25  
30  
32  
32  
48  
48  
24  
24  
REF  
REF  
REF  
REF  
REF  
REF  
REF  
VDD = X1, X2, REF/BSEL  
VDDC1 = CPU1-6  
VDDC2 = CPU7-12 & PLL Core  
VDDB = BUS1-6  
VDDF = 48/24 MHz  
66.6  
REF/2  
55  
33.3  
REF/4  
27.5  
37.5  
41.7  
32  
48  
24  
REF/3  
32  
REF/2  
48  
REF/4  
24  
Latched Inputs:  
L1 = BSEL  
L2 = FS0  
L3 = FS1  
L4 = FS2  
75  
32  
48  
24  
83.3  
Tristate  
32  
48  
24  
Tristate Tristate Tristate Tristate Tristate  
Pentium is a trademark on Intel Corporation.  
9169C-27 Rev C 04/16/98  
ICS reserves the right to make changes in the device data identified in this publication  
without further notice. ICS advises its customers to obtain the latest version of all  
device data to verify that any information being relied upon by the customer is current  
and accurate.  
ICS9169C-27  
Pin Descriptions  
PIN NUMBER  
PIN NAME  
VDD  
TYPE  
DESCRIPTION  
1
PWR  
Power for device logic.  
XTAL or external reference frequency input. This input  
includes XTAL load capacitance and feedback bias for a  
12-16MHz crystal, nominally 14.31818MHz. External crystal  
load of 30pF to GND recommended for VDD power on faster  
than 2.0ms.  
2
X1  
IN  
XTAL output which includes XTAL load capacitance.  
External crystal load of 10pF to GND recommended for VDD  
power on faster than 2.0ms.  
3
X2  
OUT  
4,11,20,26  
GND  
PWR  
OUT  
Ground for device logic.  
Processor clock output which is a multiple of the input  
reference frequency.  
CPU(1)  
5
FS0  
IN  
Frequency multiplier select pins. See shared pin description.*  
CPU  
(2:5) (8:12)  
Processor clock outputs which are a multiple of the input  
reference frequency.  
6,7,9,10,15,16,17,18,19  
8
OUT  
PWR  
Power for CPU(1:6) output buffers only. Can be reduced VDD  
for 2.5V (2.375-2.62V) next generation processor clocks.  
VDDC1  
CPU(6)  
FS1  
Processor clock output which is a multiple of the input  
reference frequency internal pull up devices.  
OUT  
IN  
12  
13  
Frequency multiplier select pin. See shared pin description.*  
Processor clock output which is a multiple of the input  
reference frequency internal pull up devices.  
CPU(7)  
FS2  
OUT  
IN  
Frequency multiplier select pin. See shared pin description.*  
Power for CPU PLL, logic and CPU(7:12)output buffers. Must  
be nominal 3.3V (3.0 to 3.7V)  
14  
VDDC2  
PWR  
BUS clock outputs which are a multiple of the input  
reference clock.  
21,22,24,25,27,28  
BUS (6:1)  
OUT  
23  
29  
VDDB  
VDDF  
PWR  
PWR  
Power for BUS clock buffers BUS(1:6).  
Power for fixed clock buffer (48 MHz, 24 Mhz).  
Fixed 24MHz clock (assuming a 14.31818MHz REF  
frequency).  
30  
31  
24MHz  
48MHz  
REF  
OUT  
OUT  
OUT  
Fixed 48MHz clock (assuming a 14.31818MHz REF  
frequency).  
Fixed 14.31818MHz clock (assuming a 14.31818MHz REF  
frequency).  
32  
Selection for synchronous or asynchronous bus clock  
operation. See shared pin programming description late in this  
data sheet for further explanation.*  
BSEL  
IN  
* Internal pull-up will vary from 350K to 500K based on temperature.  
2
ICS9169C-27  
Shared Pin Operation -  
Input/Output Pins  
Test Mode Operation  
The ICS9169C-27 includes a production test verification  
mode of operation. This requires that the FS0 and FS1 pins  
be programmed to a logic high and the FS2 pin be  
programmed to a logic low(see Shared Pin Operation section).  
In this mode the device will output the following  
frequencies.  
Shared Pin Operation - Input/Output Pins 5, 12, 13 and 32  
on the ICS9169C-27 serve as dual signal functions to the  
device. During initial power-up, they act as input pins. The  
logic level (voltage) that is present on these pins at this time  
is read and stored into a 4-bit internal data latch. At the end  
of Power-On reset, (seeAC characteristics for timing values),  
the device changes the mode of operation for these pins to  
an output function. In this mode the pins produce the  
specified buffered clocks to external loads.  
Pin  
Frequency  
REF  
REF/2  
REF/4  
REF2  
REF/4  
REF/3  
REF  
48MHz  
24MHz  
CPU (1:12)  
To program (load) the internal configuration register for  
these pins, a resistor is connected to either theVDD (logic 1)  
power supply or the GND (logic 0) voltage potential. A 10  
Kilohm(10K) resistor is used to provide both the solid  
CMOS programming voltage needed during the power-up  
programming period and to provide an insignificant load on  
the output clock during the subsequent operating period.  
BSEL=1  
BSEL = 0  
BUS (1:6)  
Note: REF is the frequency of either the crystal connected  
between the devices X1and X2 or, in the case of a device  
being driven by an external reference clock, the frequency  
of the reference (or test) clock on the device’s X1 pin.  
Figs. 1 and 2 show the recommended means of implementing  
this function. In Fig. 1 either one of the resistors is loaded  
onto the board (selective stuffing) to configure the device’s  
internal logic. Figs. 2a and b provide a single resistor loading  
option where either solder spot tabs or a physical jumper  
header may be used.  
These figures illustrate the optimal PCB physical layout  
options. These configuration resistors are of such a large  
ohmic value that they do not effect the low impedance clock  
signals. The layouts have been optimized to provide as little  
impedance transition to the clock signal as possible, as it  
passes through the programming resistor pad(s).  
(Resistors are surface mount devices  
shown schematically between 5.m. pads)  
*use only one programming resistor  
Fig. 1  
3
ICS9169C-27  
Fig. 2b  
Fig. 2a  
Fig. 3  
4
ICS9169C-27  
Technical Pin Function Descriptions  
VDD  
clocks is control-led by the supply that is applied to the  
VDD pin of the device. See the Functionality table at the  
beginning of this data sheet for a list of the specific  
frequencies that this clock operates at and the selection  
codes that are necessary to produce these frequencies.  
This is the power supply to the internal logic of the device as  
well as the following clock output buffers:  
A. REF clock output buffers  
B. BUS clock output buffers  
C. Fixed clock output buffers  
FS0, FS1, FS2  
These pins control the frequency of the clocks at the CPU,  
CPUL, BUS & SDRAM pins. See the Funtionality table at  
the beginning of this data sheet for a list of the specific  
frequencies that this clock operates at and the selection  
codes that are necessary to produce these frequencies. The  
device reads these pins at power-up and stores the  
programmed selection code in an internal data latch. (See  
programming section of this data sheet for configuration  
circuitry recommendations.  
This pin may be operated at any voltage between 3.0 and 5.5  
volts. Clocks from the listed buffers that it supplies will  
have a voltage swing from ground to this level. For the  
actual guaranteed high and low voltage levels of these  
clocks, please consult the AC parameter table in this data  
sheet.  
GND  
This is the power supply ground return pin for the internal  
logic of the device as well as the following clock output  
buffers:  
BSEL  
This pin controls whether the BUS clocks will be synchronous  
(run at half the frequency) with the CPU and CPUL clocks or  
whether they will be asynchronous (run at a pre-programmed  
fixed frequency) clock rate. It is a shared pin and is pro  
grammed the same way as the frequency select pins.  
A. REF clock output buffers  
B. BUS clock output buffers  
C. CPU clock output buffers  
D. Fixed clock output buffers  
VDDC(1:2)  
X1  
These are the power supply pins for the CPU (1:6) and CPU  
(7:12) clock buffers. By separating the clock power pins,  
each group can receive the appropriate power decoupling  
and bypassing necessary to minimize EMI and crosstalk  
between the individual signals. VDDC1 can be reduced to  
2.5V VDD for advanced processor clocks, which will bring  
CPU (1:6) outputs at 0 to 2.5V output swings.  
This pin serves one of two functions. When the device is  
used with a crystal, X1 acts as the input pin for the reference  
signal that comes from the discrete crystal. When the device  
is driven by an external clock signal, X1 is the device’ input  
pin for that reference clock. This pin also implements an  
internal crystal loading capacitor that is connected to ground.  
See the data tables for the value of the capacitor.  
48 MHz  
X2  
This is a fixed frequency clock that is typically used to drive  
Super I/O peripheral device needs.  
This pin is used only when the device uses a Crystal as the  
reference frequency source. In this mode of operation, X2 is  
an output signal that drives (or excites) the discrete crystal.  
This pin also implements an internal crystal loading capacitor  
that is connected to ground. See the data tables for the value  
of the capacitor.  
24 MHz  
This is a fixed frequency clock that is typically used to drive  
Keyboard controller clock needs.  
REF  
CPU  
This is a fixed frequency clock that runs at the same frequency  
as the input reference clock (typically 14.31818 MHz) is  
and typically used to drive Video and ISA BUS  
requirements.  
This pin is the clock output that drives processor and other  
CPU related circuitry that require clocks which are in tight  
skew tolerance with the CPU clock. The voltage swing of  
these clocks is controlled by that which is applied to the  
VDDC pins of the device. See note on VDDC (1:2). See the  
Functionality table at the beginning of this data sheet for a  
list of the specific frequencies that this clock operates at and  
the selection codes that are necessary to produce these  
frequencies.  
VDDB  
This power pin supplies the BUS clock buffers.  
VDDF  
This power pin supplies the 48/24 MHz clocks.  
BUS  
This pin is the clock output that is intended to drive the  
systems plug-in card bus. The voltage swing of these  
5
ICS9169C-27  
Absolute Maximum Ratings  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V  
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND –0.5V to VDD +0.5V  
Ambient Operating Temperature . . . . . . . . . . . . 0°C to +70°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are  
stress specifications only and functional operation of the device at these or any other conditions above those listed in the  
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended  
periods may affect product reliability.  
Electrical Characteristics at 3.3V  
VDD = 3.0 – 3.7V, TA = 0 –70°C unless otherwise stated  
DC Characteristics  
PARAMETER  
Input Low Voltage  
Input High Voltage  
Input Low Current  
Input High Current  
SYMBOL  
TEST CONDITIONS  
MIN  
-
TYP  
MAX  
UNITS  
V
VIL  
VIH  
IIL  
-
0.2VDD  
0.7VDD  
-28.0  
-5.0  
-
-10.5  
-
-
-
V
VIN = 0V  
µA  
µA  
IIH  
VIN = VDD  
5.0  
VOL = 0.8V;  
for CPU, BUS, Fixed CLKs  
Output Low Current1  
Output High Current1  
IOL  
IOH  
16.0  
-
25.0  
-
mA  
mA  
VOL = 2.0V;  
for CPU, BUS, Fixed CLKs  
-30.0  
-14.0  
Output Low Current1  
Output High Current1  
IOL  
IOH  
VOL = 0.8V; for REF CLK  
VOL = 2.0V; for REF CLK  
19.0  
-
30.0  
-38  
-
mA  
mA  
-16.0  
IOL = 8mA;  
for CPU, BUS, Fixed CLKs  
Output Low Voltage1  
Output High Voltage1  
VOL  
VOH  
-
0.3  
2.8  
0.4  
-
V
V
IOH = -8mA;  
for CPU, BUS, Fixed CLKs  
2.4  
Output Low Voltage1  
Output High Voltage1  
Supply Current  
VOL  
VOH  
IDD  
IOL = 10mA; for REF CLK  
IOH = -15mA; for REF CLK  
@66.6 MHz; all outputs unloaded  
-
2.4  
-
0.3  
2.8  
90  
0.4  
-
V
V
180  
mA  
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.  
6
ICS9169C-27  
Electrical Characteristics at 3.3V  
VDD = 3.0 – 3.7V, TA = 0 –70°C unless otherwise stated  
AC Characteristics  
PARAMETER  
Rise Time1  
SYMBOL  
Tr1  
TEST CONDITIONS  
20pF load, 0.8 to 2.0V  
CPU & BUS  
20pF load, 2.0 to 0.8V  
CPU & BUS  
20pF load, 20% to 80%  
CPU & BUS  
MIN  
TYP  
0.9  
0.8  
1.5  
1.4  
50  
MAX  
1.5  
1.4  
2.5  
2.4  
60  
UNITS  
ns  
-
Fall Time1  
Tf1  
-
ns  
Rise Time1  
Tr2  
-
ns  
20pF load, 80% to 20%  
CPU & BUS  
Fall Time1  
Tf2  
-
ns  
Duty Cycle1  
Dt  
20pF load @ VOUT=1.4V  
45  
%
CPU & BUS Clocks;  
Load=20pF, BSEL=1  
CPU & BUS Clocks;  
Load=20pF, BSEL=1  
Jitter, One Sigma1  
Jitter, Absolute1  
Jitter, One Sigma1  
Jitter, Absolute1  
Input Frequency1  
Logic Input Capacitance1  
Crystal Oscillator Capacitance1  
Power-on Time1  
Clock Skew1  
Tj1s1  
-
50  
150  
250  
3
ps  
Tjab1  
Tj1s2  
Tjab2  
Fi  
-250  
-
ps  
REF & Fixed CLKs; Load=20pF  
REF & Fixed CLKs; Load=20pF  
-
1
%
-5  
2
5
%
12.0  
14.318  
5
16.0  
-
MHz  
pF  
pF  
ms  
ps  
CIN  
CINX  
ton  
Logic input pins  
X1, X2 pins  
-
-
-
-
-
1
18  
-
From VDD=1.6V to 1st crossing of  
66.6 MHz VDD supply ramp < 40ms  
2.5  
150  
150  
2.6  
0.5  
4.5  
250  
250  
4
Tsk1  
Tsk2  
Tsk3  
CPU to CPU; Load=20pF; @1.4V  
Clock Skew1  
BUS to BUS; Load=20pF; @1.4V  
ps  
CPU to BUS; Load=20pF; @1.4V  
(CPU is early)  
CPU (@3.3V) to CPU (@2.5V)  
(2.5V CPU is late)  
Clock Skew1  
ns  
Clock Skew1  
Tsk4  
1
ns  
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.  
7
ICS9169C-27  
0.818  
SOIC Package  
Ordering Information  
ICS9169CM-27  
SOJ Package  
ICS9169CJ-27  
Example:  
ICS XXXX M- PPP  
Pattern Number (2 or 3 digit number for parts with ROM code patterns)  
PackageType  
M=SOIC  
J=SOJ  
Device Type (consists of 3 or 4 digit numbers)  
Prefix  
ICS, AV = Standard Device  
ICS reserves the right to make changes in the device data identified in this publication  
without further notice. ICS advises its customers to obtain the latest version of all  
device data to verify that any information being relied upon by the customer is current  
and accurate.  
8

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