ICS932S825 [ICSI]

Low Power Clock Chip for Serverworks HT2400 Servers; 低功耗时钟芯片的ServerWorks HT2400服务器
ICS932S825
型号: ICS932S825
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

Low Power Clock Chip for Serverworks HT2400 Servers
低功耗时钟芯片的ServerWorks HT2400服务器

服务器 时钟
文件: 总20页 (文件大小:232K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ICS932S825  
Integrated  
Circuit  
Systems, Inc.  
Low Power Clock Chip for Serverworks HT2400 Servers  
Pin Configuration  
RecommendedApplication:  
Serverworks HT2400-based systems using AMD Opteron  
processors  
X1 1  
X2 2  
64 VDD25MHz  
63 FS0/25MHz_0_2x  
62 25MHz_1_2x  
61 GND25MHz  
60 SPREAD_EN  
59 CPUK8GT_L6  
58 CPUK8GC_L6  
57 CPUK8GT_L5  
56 CPUK8GC_L5  
55 VDDCPU  
VDDREF_STB 3  
REF0_RUN_2x 4  
FS1/REF1_2x 5  
FS2/REF2_2x 6  
GNDREF 7  
OutputFeatures:  
7 - Pairs of AMD Low Power K8 Greyhound  
compliant clocks  
7 - Pair of SRC/PCI Express* Gen 2 clocks  
3 - 14.318 MHz REF clocks including 1 free-running  
2 - 48MHz clocks  
2 - PCI 33 MHz clocks  
2 - 25MHz clocks  
VDD48 8  
48MHz_0_2x 9  
48MHz_1_2x 10  
GND48 11  
SCLK 12  
SDATA 13  
VDDPCI 14  
PCICLK0_2x 15  
54 GND  
53 CPUK8GT_L4  
52 CPUK8GC_L4  
51 CPUK8GT_L3  
50 CPUK8GC_L3  
Features:  
PCICLK1_2x 16  
49 CPUK8GT_L2  
Spread Spectrum for EMI reduction  
GNDPCI 17  
CLKPWRGD/PD# 18  
GND 19  
48 CPUK8GC_L2  
47 VDDCPU  
46 GND  
45 CPUK8GT_L1  
44 CPUK8GC_L1  
43 CPUK8GT_L0  
42 CPUK8GC_L0  
41 GND  
40 PCIeT_L6  
39 PCIeC_L6  
38 PCIeT_L5  
37 PCIeC_L5  
36 VDDPCIe  
35 GND  
Outputs may be disabled via SMBus  
M/N programming via SMBus  
PCIe clocks meet PCIe Gen 2.  
Low Power differential outputs  
VDDA 20  
GNDA 21  
GND 22  
PCIeT_L0 23  
PCIeC_L0 24  
PCIeT_L1 25  
PCIeC_L1 26  
GND 27  
VDDPCIe 28  
PCIeT_L2 29  
PCIeC_L2 30  
PCIeT_L3 31  
PCIeC_L3 32  
Functionality  
FS2 FS1 FS0  
CPU  
(MHz)  
Hi-Z  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
X/6  
180.00  
220.00  
100.00  
133.33  
Reserved  
200.00  
34 PCIeT_L4  
33 PCIeC_L4  
64-TSSOP  
Power Groups  
Pin Number  
Description  
VDD  
8
64  
GND  
11  
61  
48MHz Clocks  
25MHz Clocks  
14  
20  
17  
21  
33 MHz PCI Clocks  
Analog Core  
36, 28  
55, 47  
3
35, 27  
54, 46  
7
PCIe clocks  
K8G CPU Clocks  
REF Clocks, Xtal Osc.  
1276D—10/25/07  
*Other names and brands may be claimed as the property of others.  
ICS932S825  
Pin Description  
PIN #  
PIN NAME  
TYPE  
IN  
DESCRIPTION  
Crystal input, Nominally 14.318MHz.  
1
2
3
X1  
X2  
OUT  
PWR  
Crystal output, Nominally 14.318MHz  
VDDREF_STB  
Ref, XTAL power supply, nominal 3.3V standby power  
14.318MHz Free Running XTAL Output. This output runs as long as  
standby VDD is applied to the part. Default drive is 2 loads.  
Frequency select latch input pin / 14.318 MHz reference clock. Default 2  
load drive.  
4
5
6
REF0_RUN_2x  
FS1/REF1_2x  
FS2/REF2_2x  
OUT  
I/O  
Frequency select latch input pin / 14.318 MHz reference clock. Default 2  
load drive.  
I/O  
7
GNDREF  
VDD48  
PWR  
PWR  
OUT  
OUT  
PWR  
IN  
Ground pin for the REF outputs.  
8
Power pin for the 48MHz output.3.3V  
9
48MHz_0_2x  
48MHz_1_2x  
GND48  
48MHz clock output. Default 2 load drive strength  
48MHz clock output. Default 2 load drive strength  
Ground pin for the 48MHz outputs  
10  
11  
12  
13  
14  
15  
16  
17  
SCLK  
Clock pin of SMBus circuitry, 5V tolerant.  
Data pin for SMBus circuitry, 3.3V tolerant.  
Power supply for PCI clocks, nominal 3.3V  
3.3V PCI clock output. Default 2 load drive strength.  
3.3V PCI clock output. Default 2 load drive strength.  
SDATA  
I/O  
VDDPCI  
PWR  
OUT  
OUT  
PWR  
PCICLK0_2x  
PCICLK1_2x  
GNDPCI  
Ground pin for the PCI outputs  
This 3.3V LVTTL input is a level sensitive strobe used to determine when  
latch inputs are valid and are ready to be sampled. This is an active high  
input. / Asynchronous active low input pin used to power down the device  
into a low power state.  
18  
CLKPWRGD/PD#  
IN  
19  
20  
21  
22  
GND  
PWR  
PWR  
PWR  
PWR  
Ground pin.  
VDDA  
GNDA  
GND  
3.3V power for the PLL core.  
Ground pin for the PLL core.  
Ground pin.  
True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm  
resistor to GND needed)  
Complement clock of 0.8V differential push-pull PCI_Express pair. (no  
50ohm resistor to GND needed)  
True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm  
resistor to GND needed)  
Complement clock of 0.8V differential push-pull PCI_Express pair. (no  
50ohm resistor to GND needed)  
23  
24  
25  
26  
PCIeT_L0  
PCIeC_L0  
PCIeT_L1  
PCIeC_L1  
OUT  
OUT  
OUT  
OUT  
27  
28  
GND  
PWR  
PWR  
Ground pin.  
VDDPCIe  
Power supply for PCI Express clocks, nominal 3.3V  
True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm  
resistor to GND needed)  
Complement clock of 0.8V differential push-pull PCI_Express pair. (no  
50ohm resistor to GND needed)  
True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm  
resistor to GND needed)  
Complement clock of 0.8V differential push-pull PCI_Express pair. (no  
50ohm resistor to GND needed)  
29  
30  
31  
32  
PCIeT_L2  
PCIeC_L2  
PCIeT_L3  
PCIeC_L3  
OUT  
OUT  
OUT  
OUT  
1276D—10/25/07  
2
ICS932S825  
Pin Description (continued)  
PIN #  
PIN NAME  
TYPE  
DESCRIPTION  
Complement clock of 0.8V differential push-pull PCI_Express pair. (no  
50ohm resistor to GND needed)  
True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm  
resistor to GND needed)  
33  
PCIeC_L4  
PCIeT_L4  
OUT  
34  
OUT  
35  
36  
GND  
PWR  
PWR  
Ground pin.  
VDDPCIe  
Power supply for PCI Express clocks, nominal 3.3V  
Complement clock of 0.8V differential push-pull PCI_Express pair. (no  
50ohm resistor to GND needed)  
True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm  
resistor to GND needed)  
37  
38  
39  
PCIeC_L5  
PCIeT_L5  
PCIeC_L6  
OUT  
OUT  
OUT  
Complement clock of 0.8V differential push-pull PCI_Express pair. (no  
50ohm resistor to GND needed)  
True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm  
resistor to GND needed)  
Ground pin.  
Complementary signal of low-power differential push-pull AMD K8  
"Greyhound" clock  
True signal of low-power differential push-pull AMD K8 "Greyhound" clock  
Complementary signal of low-power differential push-pull AMD K8  
"Greyhound" clock  
40  
41  
42  
43  
44  
PCIeT_L6  
GND  
OUT  
PWR  
OUT  
OUT  
OUT  
CPUK8GC_L0  
CPUK8GT_L0  
CPUK8GC_L1  
45  
46  
47  
CPUK8GT_L1  
GND  
OUT  
PWR  
PWR  
True signal of low-power differential push-pull AMD K8 "Greyhound" clock  
Ground pin.  
VDDCPU  
Supply for CPU clocks, 3.3V nominal  
Complementary signal of low-power differential push-pull AMD K8  
"Greyhound" clock  
True signal of low-power differential push-pull AMD K8 "Greyhound" clock  
Complementary signal of low-power differential push-pull AMD K8  
"Greyhound" clock  
True signal of low-power differential push-pull AMD K8 "Greyhound" clock  
Complementary signal of low-power differential push-pull AMD K8  
"Greyhound" clock  
48  
49  
50  
51  
52  
CPUK8GC_L2  
CPUK8GT_L2  
CPUK8GC_L3  
CPUK8GT_L3  
CPUK8GC_L4  
OUT  
OUT  
OUT  
OUT  
OUT  
53  
54  
55  
CPUK8GT_L4  
GND  
OUT  
PWR  
PWR  
True signal of low-power differential push-pull AMD K8 "Greyhound" clock  
Ground pin.  
VDDCPU  
Supply for CPU clocks, 3.3V nominal  
Complementary signal of low-power differential push-pull AMD K8  
"Greyhound" clock  
True signal of low-power differential push-pull AMD K8 "Greyhound" clock  
Complementary signal of low-power differential push-pull AMD K8  
"Greyhound" clock  
56  
57  
58  
CPUK8GC_L5  
CPUK8GT_L5  
CPUK8GC_L6  
OUT  
OUT  
OUT  
59  
60  
61  
62  
CPUK8GT_L6  
SPREAD_EN  
GND25MHz  
25MHz_1_2x  
OUT  
IN  
True signal of low-power differential push-pull AMD K8 "Greyhound" clock  
Asynchronous, active high input to enable spread spectrum functionality.  
PWR  
OUT  
Ground pin for the 25Mhz outputs  
25MHz clock output, 3.3V. Default 2 load drive  
Frequency select latch input pin / Fixed 25MHz 3.3V clock output. Default 2  
load drive  
63  
64  
FS0/25MHz_0_2x  
VDD25MHz  
I/O  
PWR  
Power supply for 25MHz clocks, 3.3V nominal.  
1276D—10/25/07  
3
ICS932S825  
General Description  
The ICS932S825 is a main clock synthesizer chip that all clocks required by Serverworks HT2400-based servers.  
An SMBus interface allows full control of the device.  
Block Diagram  
REF(2:1), REF0_RUN  
X1  
XTAL  
OSC.  
48MHz(1:0)  
25MHz(1:0)  
FIXED PLL  
25MHz PLL  
X2  
25M  
DIV  
CPU/SRC/  
PCI PLL  
CPU  
DIV  
CPUK8G(6:0)  
PCICLK(1:0)  
FS(2:0)  
CKPWRGD/PD#  
SPREAD_EN  
CONTROL  
LOGIC  
PCI33  
DIV  
SDATA  
SCLK  
SRC  
DIV  
PCIe(6:0)  
Single-ended Terminations (All Single-Ended Outputs)  
Single-ended  
Number of  
Series Resistor for Proper Termination  
Zo = 50 ohms  
Output Strength Loads on Board  
1 Load  
2 Load  
(Default)  
1
1
2
33  
39  
22  
Differential Terminations  
Differential  
Output  
Number of  
Loads on Board  
Series Resistor for Proper Termination  
Zo = 50 ohms  
CPUK8Gx  
PCIe_Lx  
1
1
33  
33  
1276D—10/25/07  
4
ICS932S825  
Frequency Selection Table  
Byte 0  
Bit 4 Bit 3 Bit2 Bit1 Bit0  
CPU  
SRC  
PCI  
Spread OverClock  
SS_EN FS3 FS2 FS1 FS0 (MHz)  
(MHz)  
(MHz)  
%
Amount  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Hi-Z  
X/4  
180.00  
220.00  
100.00  
133.33  
Hi-Z  
X/8  
90.00  
110.00  
100.00  
100.00  
Hi-Z  
x/24  
N/A  
N/A  
0
N/A  
N/A  
0.90  
1.10  
1.00  
1.00  
30.00  
36.67  
33.33  
33.33  
Reserved  
33.33  
30.67  
31.33  
32.00  
32.67  
34.00  
34.67  
35.33  
36.00  
Hi-Z  
0
0
0
0
200.00  
184.00  
188.00  
192.00  
196.00  
204.00  
208.00  
212.00  
216.00  
Hi-Z  
100.00  
92.00  
94.00  
96.00  
98.00  
102.00  
104.00  
106.00  
108.00  
Hi-Z  
1.00  
0.92  
0.94  
0.96  
0.98  
1.02  
1.04  
1.06  
1.08  
N/A  
0
0
0
0
0
0
0
0
N/A  
N/A  
-0.5%  
-0.5%  
-0.5%  
-0.5%  
X/4  
X/8  
x/24  
N/A  
180.00  
220.00  
100.00  
133.33  
90.00  
110.00  
100.00  
100.00  
30.00  
36.67  
33.33  
33.33  
Reserved  
33.33  
30.67  
31.33  
32.00  
32.67  
34.00  
34.67  
35.33  
36.00  
1.00  
1.00  
1.00  
1.00  
-0.5%  
-0.5%  
-0.5%  
-0.5%  
-0.5%  
-0.5%  
-0.5%  
-0.5%  
-0.5%  
200.00  
184.00  
188.00  
192.00  
196.00  
204.00  
208.00  
212.00  
216.00  
100.00  
92.00  
94.00  
96.00  
98.00  
102.00  
104.00  
106.00  
108.00  
1.00  
0.92  
0.94  
0.96  
0.98  
1.02  
1.04  
1.06  
1.08  
1276D—10/25/07  
5
ICS932S825  
CPU Divider Ratios  
Divider (3:2)  
Bit  
00  
01  
10  
11  
00  
0000  
0001  
0010  
0011  
01  
0100  
0101  
0110  
0111  
10  
1000  
1001  
1010  
1011  
11  
1100  
1101  
1110  
1111  
MSB  
16  
24  
40  
120  
Div  
2
3
5
15  
Div  
4
6
10  
30  
Div  
8
12  
20  
60  
Div  
Address  
Address  
Address  
Address  
LSB  
PCI Divider Ratios  
Divider (3:2)  
Bit  
00  
01  
00  
0000  
0001  
01  
0100  
0101  
10  
1000  
1001  
11  
1100  
1101  
MSB  
32  
24  
4
3
8
6
16  
12  
0010  
0011  
Address  
0110  
0111  
Address  
1010  
1011  
Address  
1110  
1111  
Address  
10  
11  
LSB  
5
15  
Div  
10  
30  
Div  
20  
60  
Div  
40  
120  
Div  
SRC Divider Ratios  
Divider (3:2)  
Bit  
00  
01  
10  
11  
00  
0000  
0001  
0010  
0011  
01  
0100  
0101  
0110  
0111  
10  
1000  
1001  
1010  
1011  
11  
1100  
1101  
1110  
1111  
MSB  
16  
24  
40  
56  
2
3
5
7
Div  
4
6
10  
14  
Div  
8
12  
20  
28  
Div  
Address  
Address  
Address  
Address  
Div  
LSB  
1276D—10/25/07  
6
ICS932S825  
Absolute Maximum Ratings  
Parameter  
Symbol  
VDDA  
VDD  
Min  
Max  
GND + 4.5V  
GND +4.5V  
150  
Units Notes  
V
1
3.3V Core Supply Voltage  
3.3V Logic Input Supply Voltage  
Storage Temperature  
V
1
Ts  
-50  
0
°C  
°C  
Tambient  
70  
Ambient Operating Temp  
ESD prot  
2000  
V
1
Input ESD protection human body model  
1Operation at these extremes is neither implied nor guaranteed  
Electrical Characteristics - Input/Supply/Common Output Parameters  
TA = 0 - 70°C; Supply Voltage VDD = 3.3 V +/-5%  
PARAMETER  
Input High Voltage  
Input Low Voltage  
Input High Current  
SYMBOL  
Conditions  
MIN  
TYP  
MAX  
VDD + 0.3  
0.8  
UNITS NOTES  
VIH  
VIL  
IIH  
2
VSS - 0.3  
-5  
V
V
1
1
1
VIN = VDD  
VIN = 0 V; Inputs with no pull-up  
resistors  
VIN = 0 V; Inputs with pull-up  
resistors  
5
uA  
IIL1  
IIL2  
-5  
uA  
uA  
1
1
Input Low Current  
-200  
Operating Current  
Powerdown Current  
Input Frequency3  
Pin Inductance1  
IDD3.3OP  
IDD3.3PD  
Fi  
all outputs driven  
all diff pairs Low/Low  
VDD = 3.3 V  
250  
15  
mA  
mA  
MHz  
nH  
14.318  
3
1
1
1
1
Lpin  
7
5
6
5
CIN  
Logic Inputs  
Output pin capacitance  
X1 & X2 pins  
pF  
Input Capacitance1  
COUT  
CINX  
pF  
pF  
From VDD Power-Up or de-assertion  
of PD# to 1st clock  
Clk Stabilization1,2  
TSTAB  
3
ms  
1,2  
Modulation Frequency  
SMBus Voltage  
Triangular Modulation  
30  
2.7  
33  
5.5  
0.4  
kHz  
V
1
1
1
VDD  
VOL  
Low-level Output Voltage  
Current sinking at  
VOL = 0.4 V  
@ IPULLUP  
V
IPULLUP  
TRI2C  
4
mA  
ns  
1
1
1
SCLK/SDATA  
(Max VIL - 0.15) to  
(Min VIH + 0.15)  
1000  
300  
Clock/Data Rise Time3  
SCLK/SDATA  
(Min VIH + 0.15) to  
(Max VIL - 0.15)  
TFI2C  
ns  
Clock/Data Fall Time3  
1Guaranteed by design and characterization, not 100% tested in production.  
2See timing diagrams for timing requirements.  
3 Input frequency should be measured at the REFOUT pin and tuned to ideal 14.31818MHz to meet  
ppm frequency accuracy on PLL outputs.  
1276D—10/25/07  
7
ICS932S825  
AC Electrical Characteristics - Low Power Differential PCIe Outputs  
TA = 0 - 70°C; VDD = 3.3 V +/-5%; CL =2pF, RS=33.2  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
0.5  
TYP  
MAX  
2
UNITS NOTES  
Rising Edge Slew Rate  
tSLR  
Differential Measurement  
V/ns  
1,2  
Falling Edge Slew Rate  
tFLR  
Differential Measurement  
Single-ended Measurement  
0.5  
2
V/ns  
%
1,2  
1
Slew Rate Variation  
Maximum Output  
Voltage  
tSLVAR  
20  
VHIGH  
VLOW  
Includes overshoot  
Includes undershoot  
1150  
mV  
mV  
mV  
1
1
1
Minimum Output Voltage  
-300  
Differential Voltage  
Swing  
Crossing Point Voltage  
VSWING  
Differential Measurement  
400  
300  
VXABS  
VXABSVAR  
DCYC  
Single-ended Measurement  
Single-ended Measurement  
Differential Measurement  
550  
140  
55  
mV  
mV  
%
1,3,4  
1,3,5  
1
Crossing Point Variation  
Duty Cycle  
45  
PCIe Jitter - Cycle to  
Cycle  
PCIeJC2C  
Differential Measurement  
Differential Measurement  
125  
250  
ps  
ps  
1
1
PCIe[6:0] Skew  
PCIeSKEW  
Notes on Electrical Characteristics:  
1Guaranteed by design and characterization, not 100% tested in production.  
2 Slew rate measured through Vswing centered around differential zero  
3 Vxabs is defined as the voltage where CLK = CLK#  
4 Only applies to the differential rising edge (CLK rising and CLK# falling)  
5 Defined as the total variation of all crossing voltages of CLK rising and CLK# falling.  
6 All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REFOUT is at 14.31818MHz  
PCIe Phase Jitter Impact  
Parameter  
Conditions  
Min  
0
Typical  
Max  
108  
Units  
ps  
Notes  
Output phase jitter  
impact – PCIe* Gen1  
(including PLL BW 1.5-22 MHz, z =  
0.54, Td=10 ns, Ftrk=1.5 MHz )  
θPCIe1  
1,2,3,4  
Output phase jitter  
impact - PCIe Gen2  
(including PLL BW5-16 MHz,  
8 – 16 MHz, z = 0.54, Td=10 ns)  
ps  
RMS  
θPCIe2  
0
3.1  
1,2,3,4  
NOTES:  
Post processed evaluation through Intel supplied Matlab scripts.  
1.  
2.  
3.  
PCIe* Gen2 filter characteristics are subject to final ratification by PC ISIG. Please check the PCI* SIG for the latest specification.  
These jitter numbers are defined for a BER of 1E-12. Measured numbers at a smaller sample size have to be extrapolated to this BER target.  
4. Guaranteed by design and characterization, not 100% tested in production.  
1276D—10/25/07  
8
ICS932S825  
AC Electrical Characteristics - Low Power Differential CPU Outputs  
TA = 0 - 70°C; VDD = 3.3 V +/-5%; CL =AMD64 Processor Test Load  
PARAMETER  
Crossing Point Variation  
Frequency  
SYMBOL  
VCROSS  
f
CONDITIONS  
Single-ended Measurement  
MIN  
TYP  
MAX  
140  
200  
300  
UNITS NOTES  
mV  
MHz  
ppm  
1
2
3
198.8  
-300  
Long Term Accuracy  
ppm  
tSLR  
tFLR  
Rising Edge Slew Rate  
Differential Measurement  
Differential Measurement  
0.5  
0.5  
10  
10  
V/ns  
V/ns  
4,5  
4,5  
Falling Edge Slew Rate  
CPU Jitter - Cycle to  
Cycle  
CPUJC2C  
CPUJACC  
VHIGH  
Differential Measurement  
Over a 10 uS period  
150  
1
ps  
ns  
6
7
1
1
CPU Jitter - Accumulated  
Maximum Output Voltage  
Minimum Output Voltage  
-1  
Includes overshoot, single-ended  
measurement  
Includes undershoot, single-ended  
1150  
mV  
mV  
VLOW  
-300  
400  
measurement  
Differential Voltage Swing  
Peak-to-Peak  
VDPK-PK  
Differential Measurement  
2400  
mV  
8
VD  
Differential Voltage  
Change in VD DC cycle-to-  
cycle  
Differential Measurement  
Single-ended Measurement  
200  
-75  
45  
1200  
75  
mV  
mV  
9
VD  
10  
11  
DCYC  
CPUSKEW10  
Duty Cycle  
CPU[6:0] Skew  
Differential Measurement  
Differential Measurement  
55  
250  
%
ps  
Notes on Electrical Characteristics (Guaranteed by design and characterization, not 100% tested in production):  
1Single-ended measurement at crossing point. Value is max-min over all time. DC value of common mode is not important due to  
the blocking cap.  
2 Minimum frequency results from 0.5% down spread.  
3 Measured with spread spectrum off.  
4 This parameter is intended to give guidance for simulation.  
5 Differential measurement through the range of +/-100mV  
6 Between any two adjacent cycles.  
7 Accumulated over a 10 uS time periode, measured with JIT2 TIE at 50ps interval.  
8 VDPK-PK is the overall magnitude of the differential signal.  
9 VDMIN is the amplitude of the ring-back differential measurement, guaranteed by design, that ring-back will not cross 0V  
VD. VDMAX is the largest amplitude allowed.  
10 The difference in magnitude of two adjacent VDDC measurements. VDDC is the stable post overshoot and ring-back part  
11 Defined as tHIGH/tCYCLE  
1276D—10/25/07  
9
ICS932S825  
Electrical Characteristics - 33 MHz PCICLK, 25MHz Outputs  
TA = 0 - 70°C; VDD=3.3V +/-5%; CL = 5 pF (unless otherwise specified)  
PARAMETER  
PCI Long Accuracy  
SYMBOL  
ppm  
CONDITIONS  
see Tperiod min-max values  
33.33MHz output nominal  
33.33MHz output spread  
see Tperiod min-max values  
25MHz output nominal  
IOH = -1 mA  
MIN  
-300  
29.9910  
29.9910  
-50  
TYP  
40  
MAX  
300  
30.0090  
30.1598  
50  
UNITS Notes  
ppm  
1,2  
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
ns  
ns  
ns  
ns  
Tperiod  
PCI Clock period  
25MHz Long Accuracy  
25MHz Clock period  
Output High Voltage  
Output Low Voltage  
ppm  
Tperiod  
VOH  
2.4  
-33  
30  
V
V
VOL  
IOL = 1 mA  
0.55  
-33  
V
OH @MIN = 1.0 V  
OH@ MAX = 3.135 V  
OL @ MIN = 1.95 V  
mA  
mA  
mA  
mA  
V/ns  
V/ns  
%
IOH  
IOL  
Output High Current  
Output Low Current  
V
V
VOL @ MAX = 0.4 V  
Rising edge rate  
Falling edge rate  
VT = 1.5 V  
38  
4
4
Edge Rate  
Edge Rate  
Duty Cycle  
δVt  
δVt  
dt1  
tsk1  
tsk1  
1
1
45  
55  
VT = 1.5 V  
VT = 1.5 V  
VT = 1.5 V  
PCI Skew  
25MHz Skew  
Jitter, Cycle to cycle  
250  
250  
250  
ps  
ps  
ps  
tjcyc-cyc  
1Guaranteed by design and characterization, not 100% tested in production.  
2 All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is at 14.31818MHz  
Electrical Characteristics - 48MHz  
TA = 0 - 70°C; VDD = 3.3 V +/-5%; CL = 5 pF (unless otherwise specified)  
PARAMETER  
Long Accuracy  
Clock period  
SYMBOL  
ppm  
Tperiod  
CONDITIONS  
see Tperiod min-max values  
48.00MHz output nominal  
IOH = -1 mA  
MIN  
-100  
20.8257  
2.4  
TYP  
MAX  
100  
20.8340  
UNITS Notes  
ppm  
ns  
1,2  
2
VOH  
VOL  
Output High Voltage  
Output Low Voltage  
V
1
IOL = 1 mA  
V OH @ MIN = 1.0 V  
0.55  
-33  
V
1
-33  
30  
mA  
mA  
mA  
mA  
V/ns  
V/ns  
%
1
1
1
1
1
1
1
IOH  
IOL  
Output High Current  
Output Low Current  
V
OH@ MAX = 3.135 V  
V
V
OL @MIN = 1.95 V  
OL @ MAX = 0.4 V  
Rising edge rate  
Falling edge rate  
VT = 1.5 V  
38  
2
2
55  
250  
250  
Edge Rate  
Edge Rate  
Duty Cycle  
δVt  
δVt  
dt1  
tsk1  
tjcyc-cyc  
1
1
45  
VT = 1.5 V  
VT = 1.5 V  
Group Skew  
Jitter, Cycle to cycle  
ps  
1
ps  
1
1Guaranteed by design and characterization, not 100% tested in production.  
2 All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is at 14.31818MHz  
1276D—10/25/07  
10  
ICS932S825  
Electrical Characteristics - REF-14.318MHz  
TA = 0 - 70°C; VDD = 3.3 V +/-5%; CL = 5 pF (unless otherwise specified)  
PARAMETER  
Long Accuracy  
Clock period  
SYMBOL  
ppm  
Tperiod  
CONDITIONS  
see Tperiod min-max values  
14.318MHz output nominal  
IOH = -1 mA  
IOL = 1 mA  
V OH @MIN = 1.0 V,  
MIN  
-300  
69.8270  
2.4  
TYP  
MAX  
300  
69.8550  
UNITS Notes  
ppm  
ns  
V
1
2
1
1
VOH  
VOL  
Output High Voltage  
Output Low Voltage  
0.4  
-23  
V
V
IOH  
IOL  
Output High Current  
Output Low Current  
-29  
29  
mA  
mA  
1
1
OH@MAX = 3.135 V  
VOL @MIN = 1.95 V,  
VOL  
27  
@MAX = 0.4 V  
Edge Rate  
Edge Rate  
Skew  
δVt  
δVt  
tsk1  
dt1  
tjcyc-cyc  
Rising edge rate  
Falling edge rate  
VT = 1.5 V  
1
1
2
2
500  
55  
V/ns  
V/ns  
ps  
%
ps  
1
1
1
1
1
VT = 1.5 V  
VT = 1.5 V  
Duty Cycle  
45  
Jitter, Cycle to cycle  
1000  
1Guaranteed by design and characterization, not 100% tested in production.  
2 All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is at 14.31818MHz  
1276D—10/25/07  
11  
ICS932S825  
General SMBus serial interface information  
How to Read:  
How to Write:  
Controller (host) sends a start bit.  
• Controller (host) sends the write address D2 (H)  
• ICS clock will acknowledge  
• Controller (host) will send start bit.  
• Controller (host) sends the write address D2 (H)  
• ICS clock will acknowledge  
• Controller (host) sends the begining byte location = N  
• ICS clock will acknowledge  
• Controller (host) sends the begining byte  
location = N  
• Controller (host) sends the data byte count = X  
• ICS clock will acknowledge  
• Controller (host) starts sending Byte N through  
Byte N + X -1  
• ICS clock will acknowledge  
• Controller (host) will send a separate start bit.  
• Controller (host) sends the read address D3(H)  
• ICS clock will acknowledge  
(see Note 2)  
• ICS clock will send the data byte count = X  
• ICS clock sends Byte N + X -1  
• ICS clock will acknowledge each byte one at a time  
• ICS clock sends Byte 0 through byte X (if X(H)  
was written to byte 8).  
• Controller (host) sends a Stop bit  
• Controller (host) will need to acknowledge each byte  
• Controllor (host) will send a not acknowledge bit  
• Controller (host) will send a stop bit  
Index Block Read Operation  
Index Block Write Operation  
Controller (Host)  
ICS (Slave/Receiver)  
Controller (Host)  
ICS (Slave/Receiver)  
T
starT bit  
starT bit  
T
Slave Address D2(H)  
Slave Address D2(H)  
WR  
WRite  
WR  
WRite  
ACK  
ACK  
ACK  
ACK  
ACK  
ACK  
Beginning Byte = N  
Beginning Byte = N  
Data Byte Count = X  
Beginning Byte N  
RT  
Repeat starT  
Slave Address D3(H)  
RD  
ReaD  
ACK  
Data Byte Count = X  
Beginning Byte N  
ACK  
ACK  
Byte N + X - 1  
ACK  
P
stoP bit  
Byte N + X - 1  
N
P
Not acknowledge  
stoP bit  
1276D—10/25/07  
12  
ICS932S825  
SMBus Table: Frequency Select and Spread Control Register  
Byte 0  
Bit 7  
Pin #  
Name  
Reserved  
Reserved  
Reserved  
SS_EN  
FS3  
Control Function  
Reserved  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
1
PWD  
0
0
-
-
-
-
-
-
-
-
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
0
Spread Spectrum Enable  
Freq Select Bit 3  
Freq Select Bit 2  
Freq Select Bit 1  
Freq Select Bit 0  
Latched  
0
Latched  
Latched  
Latched  
See CPU Frequency Select  
Table  
FS2  
FS1  
FS0  
SMBus Table: Output Control Register  
Byte 1  
Bit 7  
Pin #  
Name  
REF2  
REF1  
Control Function  
Output Enable  
Output Enable  
Output Enable  
Output Enable  
Output Enable  
Reserved  
Type  
RW  
RW  
RW Disable (Low)  
RW Disable (Low)  
RW Disable (Low)  
0
Hi-Z  
Hi-Z  
1
PWD  
6
5
4
Enable  
Enable  
Enable  
Enable  
Enable  
Reserved  
Enable  
Enable  
1
1
1
1
1
1
1
1
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
REF0_RUN  
PCICLK1  
PCICLK0  
Reserved  
48MHz_1  
48MHz_0  
17  
16  
-
10  
9
RW  
Reserved  
Output Enable  
Output Enable  
RW Disable (Low)  
RW Disable (Low)  
SMBus Table: Output Control Register  
Byte 2  
Bit 7  
Pin #  
Name  
Reserved  
Control Function  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
1
PWD  
-
Reserved  
Reserved  
Disable  
Disable  
Disable  
Disable  
Disable  
Disable  
Disable  
Reserved  
Enable  
Enable  
Enable  
Enable  
Enable  
Enable  
Enable  
0
1
1
1
1
1
1
1
59/58  
57/56  
53/52  
51/50  
47/46  
45/44  
43/42  
CPUK8G_L(6)  
CPUK8G_L(5)  
CPUK8G_L(4)  
CPUK8G_L(3)  
CPUK8G_L(2)  
CPUK8G_L(1)  
CPUK8G_L(0)  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Output Enable  
When Disabled  
CPUK8GT_L = 0  
CPUK8GC_L = 0  
SMBus Table: Output Control Register  
Byte 3  
Bit 7  
Pin #  
Name  
Control Function  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
1
PWD  
-
Reserved  
PCIe_L6  
PCIe_L5  
PCIe_L4  
PCIe_L3  
PCIe_L2  
PCIe_L1  
PCIe_L0  
Reserved  
Reserved  
Disable  
Disable  
Disable  
Disable  
Disable  
Disable  
Disable  
Reserved  
Enable  
Enable  
Enable  
Enable  
Enable  
Enable  
Enable  
0
1
1
1
1
1
1
1
40/39  
38/37  
33/34  
31/32  
29/30  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Output Enable  
When Disabled  
PCIeT_L = 0  
PCIeC_L = 0  
25/26  
23/24  
1276D—10/25/07  
13  
ICS932S825  
SMBus Table: Drive Strength Control Register  
Byte 4  
Bit 7  
Pin #  
Name  
REF2  
REF1  
Control Function  
Drive Strength Select  
Drive Strength Select  
Drive Strength Select  
Drive Strength Select  
Drive Strength Select  
Drive Strength Select  
Drive Strength Select  
Drive Strength Select  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
1
PWD  
6
5
4
1 Load  
1 Load  
1 Load  
1 Load  
1 Load  
1 Load  
1 Load  
1 Load  
2 Loads  
2 Loads  
2 Loads  
2 Loads  
2 Loads  
2 Loads  
2 Loads  
2 Loads  
1
1
1
1
1
1
1
1
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
REF0_RUN  
PCICLK1  
PCICLK0  
48MHz_2  
48MHz_1  
48MHz_0  
17  
16  
11  
10  
9
SMBus Table: Drive Strength Control Register  
Byte 5  
Bit 7  
Pin #  
62  
63  
62  
63  
-
-
-
-
Name  
Control Function  
Output Enable  
Output Enable  
Drive Strength Select  
Drive Strength Select  
Reserved  
VDIFF MSB  
VDIFF Select Bit 0  
VDIFF LSB  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
Low  
Hi-Z  
1
PWD  
25MHz_1  
25MHz_0  
25MHz_1  
25MHz_0  
Reserved  
VDIFF2  
Enable  
Enable  
2 Loads  
2 Loads  
Reserved  
1
1
1
1
0
1
0
1
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
1 Load  
1 Load  
Reserved  
See VDIFF Select Table  
VDIFF1  
VDIFF0  
SMBus Table: Device ID Register  
Byte 6  
Bit 7  
Pin #  
Name  
Control Function  
Device ID MSB  
Device ID 6  
Device ID 5  
Device ID4  
Device ID3  
Device ID2  
Device ID1  
Device ID LSB  
Type  
R
R
R
R
R
R
R
R
0
-
-
-
-
-
-
-
-
1
-
-
-
-
-
-
-
-
PWD  
-
-
-
-
-
-
-
-
DevID 7  
DevID 6  
DevID 5  
DevID 4  
DevID 3  
DevID 2  
DevID 1  
DevID 0  
0
0
1
0
0
1
0
1
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
SMBus Table: Vendor ID Register  
Byte 7  
Bit 7  
Pin #  
Name  
RID3  
RID2  
RID1  
RID0  
VID3  
VID2  
VID1  
VID0  
Control Function  
Type  
R
R
R
R
R
R
R
R
0
-
-
-
-
-
-
-
-
1
-
-
-
-
-
-
-
-
PWD  
-
-
-
-
-
-
-
-
0
0
0
1
0
0
0
1
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Revision ID  
VENDOR ID  
(0001 = ICS)  
1276D—10/25/07  
14  
ICS932S825  
SMBus Table: Byte Count Register  
Byte 8  
Bit 7  
Pin #  
Name  
BC7  
BC6  
BC5  
BC4  
BC3  
BC2  
BC1  
BC0  
Control Function  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
1
PWD  
-
-
-
-
-
-
-
-
0
0
0
0
1
0
0
1
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Writing to this register will  
configure how many bytes  
will be read back, default is  
9 bytes.  
Byte Count Programming  
b(7:0)  
SMBus Table: Reserved Register  
Byte 9  
Bit 7  
Pin #  
Name  
Control Function  
Reserved  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
1
PWD  
-
-
-
-
-
-
-
-
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
0
0
0
0
0
0
0
0
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
SMBus Table: M/N Programming Enable  
Byte 10  
Pin #  
Name  
Control Function  
CPU PLL M/N Programming  
Enable  
Type  
0
1
PWD  
-
M/N_EN  
RW  
Disable  
Enable  
0
Bit 7  
-
-
-
-
-
-
-
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0
0
0
0
0
0
0
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
1276D—10/25/07  
15  
ICS932S825  
Bytes 11:14 are Reserved Registers  
SMBus Table: CPU Frequency Control Register  
Byte 15  
Bit 7  
Pin #  
Name  
N Div8  
Control Function  
N Divider Prog bit 8  
Type  
RW  
0
1
PWD  
X
-
-
-
-
-
-
-
-
The decimal representation  
of M and N Divier in Byte 11  
and 12 will configure the  
CPU VCO frequency.  
Default at power up = latch-  
in or Byte 0 Rom table. VCO  
Frequency = 14.318 x  
N Div9  
M Div5  
M Div4  
M Div3  
M Div2  
M Div1  
M Div0  
N Divider Prog bit 9  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
X
X
X
X
X
X
X
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
M Divider Programming  
bit (5:0)  
[NDiv(9:0)+8] / [MDiv(5:0)+2]  
SMBus Table: CPU Frequency Control Register  
Byte 16  
Bit 7  
Pin #  
Name  
N Div7  
Control Function  
Type  
RW  
0
1
PWD  
X
-
-
-
-
-
-
-
-
The decimal representation  
of M and N Divier in Byte 11  
and 12 will configure the  
CPU VCO frequency.  
Default at power up = latch-  
in or Byte 0 Rom table. VCO  
Frequency = 14.318 x  
N Div6  
N Div5  
N Div4  
N Div3  
N Div2  
N Div1  
N Div0  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
X
X
X
X
X
X
X
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
N Divider Programming  
Byte12 bit(7:0) and Byte11  
bit(7:6)  
[NDiv(9:0)+8] / [MDiv(5:0)+2]  
SMBus Table: CPU Spread Spectrum Control Register  
Byte 17  
Bit 7  
Pin #  
Name  
SSP7  
SSP6  
SSP5  
SSP4  
SSP3  
SSP2  
SSP1  
SSP0  
Control Function  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
1
PWD  
X
X
X
X
X
X
X
X
-
-
-
-
-
-
-
-
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
These Spread Spectrum bits  
in Byte 13 and 14 will  
program the spread  
Spread Spectrum  
Programming bit(7:0)  
pecentage of CPU  
1276D—10/25/07  
16  
ICS932S825  
SMBus Table: CPU Spread Spectrum Control Register  
Byte 18  
Bit 7  
Pin #  
Name  
Reserved  
SSP14  
SSP13  
SSP12  
SSP11  
SSP10  
SSP9  
Control Function  
Type  
R
0
-
1
-
PWD  
0
X
X
X
X
X
X
X
-
-
-
-
-
-
-
-
Reserved  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
These Spread Spectrum bits  
in Byte 13 and 14 will  
program the spread  
Spread Spectrum  
Programming bit(14:8)  
pecentage of CPU  
SSP8  
SMBus Table: Programmable Output Divider Register  
Byte 19  
Bit 7  
Pin #  
Name  
Control Function  
Type  
RW  
RW  
RW  
RW  
R
R
R
R
0
1
PWD  
-
-
-
-
-
-
-
-
CPUDiv3  
CPUDiv2  
CPUDiv1  
CPUDiv0  
Reserved  
Reserved  
Reserved  
Reserved  
X
X
X
X
0
0
0
0
CPU Divider Ratio  
Programming Bits  
See CPU Divider Ratios  
Table  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Reserved  
Reserved  
Reserved  
Reserved  
-
-
-
-
-
-
-
-
SMBus Table: Programmable Output Divider Register  
Byte 20  
Bit 7  
Pin #  
Name  
Control Function  
Type  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0
1
PWD  
X
X
X
X
X
X
X
X
-
-
-
-
-
-
-
-
33MHzDiv3  
33MHzDiv2  
33MHzDiv1  
33MHzDiv0  
SRC_Div3  
SRC_Div2  
SRC_Div1  
SRC_Div0  
33MHz Divider Ratio  
Programming Bits  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
33MHz Divider Ratio Table  
SRC_ Divider Ratio  
Programming Bits  
SRC Divider Ratio Table  
SMBusTable: Reserved Regsiter  
Byte 21 is reserved do not write this register!  
1276D—10/25/07  
17  
ICS932S825  
Shared Pin Operation -  
Input/Output Pins  
Figure 1 shows a means of implementing this function  
when a switch or 2 pin header is used. With no jumper is  
installed the pin will be pulled high. With the jumper in  
place the pin will be pulled low. If programmability is not  
necessary, than only a single resistor is necessary. The  
programming resistors should be located close to the  
series termination resistor to minimize the current loop  
area. It is more important to locate the series termination  
resistor close to the driver than the programming resistor.  
The I/O pins designated by (input/output) on the  
ICS932S825 serve as dual signal functions to the device.  
During initial power-up, they act as input pins. The logic  
level (voltage) that is present on these pins at this time  
is read and stored into a 5-bit internal data latch. At the  
end of Power-On reset, (see AC characteristics for timing  
values), the device changes the mode of operations for  
these pins to an output function. In this mode the pins  
produce the specified buffered clocks to external loads.  
To program (load) the internal configuration register for  
these pins, a resistor is connected to either the VDD  
(logic 1) power supply or the GND (logic 0) voltage  
potential. A 10 Kilohm (10K) resistor is used to provide  
both the solid CMOS programming voltage needed during  
the power-up programming period and to provide an  
insignificant load on the output clock during the subsequent  
operating period.  
Via to  
VDD  
Programming  
Header  
2K W  
Via to Gnd  
Device  
Pad  
8.2K W  
Clock trace to load  
Series Term. Res.  
Fig. 1  
1276D—10/25/07  
18  
ICS932S825  
6.10 mm. Body, 0.50 mm. Pitch TSSOP  
(240 mil) (20 mil)  
In Millimeters  
COMMON DIMENSIONS  
c
N
In Inches  
COMMON DIMENSIONS  
SYMBOL  
L
MIN  
--  
0.05  
0.80  
0.17  
0.09  
MAX  
1.20  
0.15  
1.05  
0.27  
0.20  
MIN  
--  
.002  
.032  
.007  
.0035  
MAX  
.047  
.006  
.041  
.011  
.008  
A
A1  
A2  
b
E1  
E
INDEX  
AREA  
c
D
E
SEE VARIATIONS  
8.10 BASIC  
SEE VARIATIONS  
0.319 BASIC  
1
2
E1  
e
L
6.00  
0.50 BASIC  
0.45  
6.20  
.236  
.244  
0.020 BASIC  
.030  
SEE VARIATIONS  
D
0.75  
.018  
N
SEE VARIATIONS  
0°  
--  
8°  
0.10  
0°  
--  
8°  
.004  
α
aaa  
A
A2  
VARIATIONS  
A1  
D mm.  
D (inch)  
N
- C -  
MIN  
16.90  
MAX  
17.10  
MIN  
.665  
MAX  
.673  
64  
e
SEATING  
PLANE  
b
Reference Doc.: JEDEC Publication 95, MO-153  
10-0039  
aaa  
C
Ordering Information  
ICS932S825yGLFT  
Example:  
ICS XXXX y G - LF T  
Designation for tape and reel packaging  
Lead Free, RoHS Compliant (Optional)  
Package Type  
G = TSSOP  
Revision Designator (will not correlate with datasheet revision)  
Device Type  
Prefix  
ICS = Standard Device  
1276D—10/25/07  
19  
ICS932S825  
Revision History  
Rev.  
Issue Date Description  
Page #  
1. Updated Electrical Characteristics.  
2. Going to Preliminary.  
A
B
C
02/28/07 3. Updated Idd to reflect low power outputs  
09/11/07 1. Updated pin description  
09/12/07 1. Updated quantity of PCIEX outputs listed under "Output Features"  
Various  
2, 3  
1
1. Corrected CPU/SRC/PCI PLL control bytes to B(15:18) from B(11:14)  
2. Changed pin names to indicate default drive strength. NO silicon changes.  
3. Corrected Byte 0 SS_EN and FS3 reference in FS table.  
4. Simplified the Terminations Table..  
1, 2, 3, 4, 5,  
16,17  
D
10/25/07 5. Release to Final  
1276D—10/25/07  
20  

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