IS61LV6432-133PQ [ICSI]

64K x 32 SYNCHRONOUS PIPELINE STATIC RAM; 64K ×32的同步管道静态RAM
IS61LV6432-133PQ
型号: IS61LV6432-133PQ
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

64K x 32 SYNCHRONOUS PIPELINE STATIC RAM
64K ×32的同步管道静态RAM

文件: 总16页 (文件大小:488K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IS61LV6432  
64K x 32 SYNCHRONOUS  
PIPELINE STATIC RAM  
FEATURES  
DESCRIPTION  
The ICSI IS61LV6432 is a high-speed, low-power synchro-  
nous static RAM designed to provide a burstable, high-perfor-  
mance, secondary cache for the Pentium™, 680X0™, and  
PowerPC™ microprocessors. It is organized as 65,536 words  
by 32 bits, fabricated with ICSI's advanced CMOS technology.  
The device integrates a 2-bit burst counter, high-speed SRAM  
core, and high-drive capability outputs into a single monolithic  
circuit. All synchronous inputs pass through registers con-  
trolled by a positive-edge-triggered single clock input.  
• Internal self-timed write cycle  
• Individual Byte Write Control and Global Write  
• Clock controlled, registered address, data and  
control  
• Pentium™ or linear burst sequence control  
using MODE input  
• Three chip enables for simple depth expansion  
and address pipelining  
• Common data inputs and data outputs  
• Power-down control by ZZ input  
• JEDEC 100-Pin LQFP and PQFP package  
• 3.3V VCC and 2.5V VCCQ for 2.5 I/O's  
• Two Clock enables and one Clock disable to  
eliminate multiple bank bus contention.  
• Control pins mode upon power-up:  
– MODE in interleave burst mode  
– ZZ in normal operation mode  
These control pins can be connected to GNDQ  
or VCCQ to alter their power-up state  
• Industrial temperature available  
Write cycles are internally self-timed and are initiated by the  
rising edge of the clock input. Write cycles can be from one to  
four bytes wide as controlled by the write control inputs.  
Separate byte enables allow individual bytes to be written.  
BW1 controls DQ1-DQ8, BW2 controls DQ9-DQ16, BW3  
controls DQ17-DQ24, BW4 controls DQ25-DQ32, conditioned  
by BWE being LOW. A LOW on GW input would cause all bytes  
to be written.  
Bursts can be initiated with either ADSP (Address Status  
Processor) or ADSC (Address Status Cache Controller) input  
pins. Subsequent burst addresses can be generated internally  
by the IS61LV6432 and controlled by the ADV (burst address  
advance) input pin.  
Asynchronous signals include output enable (OE), sleep mode  
input (ZZ), clock (CLK) and burst mode input (MODE). A HIGH  
input on the ZZ pin puts the SRAM in the power-down state.  
When ZZ is pulled LOW (or no connect), the SRAM normally  
operates after three cycles of the wake-up period. A LOW  
input, i.e., GNDQ, on MODE pin selects LINEAR Burst. A VCCQ  
(or no connect) on MODE pin selects INTERLEAVED Burst.  
FAST ACCESS TIME  
Symbol  
tKQ  
Parameter  
CLK Access Time  
-166  
5
-133  
5
-117  
5
-5  
5
-6  
6
-7  
7
-8  
8
Unit  
ns  
tKC  
Cycle Time  
6
7.5  
133  
8.5  
117  
10  
100  
12  
83  
13  
75  
15  
66  
ns  
Frequency  
166  
MHz  
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors  
which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.  
Integrated Circuit Solution Inc.  
1
SSR005-0B  
IS61LV6432  
BLOCK DIAGRAM  
MODE  
A0  
A0’  
A1’  
Q0  
CLK  
CLK  
BINARY  
COUNTER  
Q1  
ADV  
CE  
A1  
64K x 32  
MEMORY  
ARRAY  
ADSC  
ADSP  
CLR  
16  
14  
16  
D
Q
A15-A0  
ADDRESS  
REGISTER  
CE  
CLK  
32  
32  
D
Q
GW  
BWE  
DQ32-DQ25  
BW4  
BYTE WRITE  
REGISTERS  
CLK  
D
Q
DQ24-DQ17  
BYTE WRITE  
REGISTERS  
BW3  
CLK  
D
Q
DQ16-DQ9  
BYTE WRITE  
REGISTERS  
BW2  
BW1  
CLK  
D
Q
DQ8-DQ1  
BYTE WRITE  
REGISTERS  
CLK  
CE1  
CE2  
CE3  
4
32  
INPUT  
REGISTERS  
OUTPUT  
REGISTERS  
D
Q
DATA[32:1]  
ENABLE  
OE  
REGISTER  
CLK  
CLK  
CE  
CLK  
D
Q
ENABLE  
DELAY  
REGISTER  
CLK  
OE  
2
Integrated Circuit Solution Inc.  
SSR005-0B  
IS61LV6432  
PIN CONFIGURATION  
100-Pin LQFP and PQFP (Top View)  
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81  
100  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
NC  
NC  
DQ17  
DQ18  
VCCQ  
GNDQ  
DQ19  
DQ20  
DQ21  
DQ22  
GNDQ  
VCCQ  
DQ23  
DQ24  
VCCQ  
VCC  
DQ16  
DQ15  
VCCQ  
GNDQ  
DQ14  
DQ13  
DQ12  
DQ11  
GNDQ  
VCCQ  
DQ10  
DQ9  
GND  
NC  
VCC  
ZZ  
DQ8  
NC  
GND  
DQ25  
DQ26  
VCCQ  
GNDQ  
DQ27  
DQ28  
DQ29  
DQ30  
GNDQ  
VCCQ  
DQ31  
DQ32  
NC  
DQ7  
VCCQ  
GNDQ  
DQ6  
DQ5  
DQ4  
DQ3  
GNDQ  
VCCQ  
DQ2  
DQ1  
NC  
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50  
PIN DESCRIPTIONS  
A0-A15  
Address Inputs  
DQ1-DQ32  
ZZ  
Data Input/Output  
Sleep Mode  
CLK  
Clock  
ADSP  
ADSC  
ADV  
Processor Address Status  
Controller Address Status  
Burst Address Advance  
Synchronous Byte Write Enable  
Byte Write Enable  
MODE  
VCC  
Burst Sequence Mode  
+3.3V Power Supply  
Ground  
GND  
BW1-BW4  
BWE  
VCCQ  
Isolated Output Buffer Supply:  
+3.3V  
GNDQ  
NC  
Isolated Output Buffer Ground  
No Connect  
GW  
Global Write Enable  
Synchronous Chip Enable  
Output Enable  
CE1, CE2, CE3  
OE  
Integrated Circuit Solution Inc.  
3
SSR005-0B  
IS61LV6432  
TRUTH TABLE  
Operation  
Address  
Used  
CE1  
CE2  
CE3 ADSP ADSC ADV WRITE OE  
DQ  
Deselected, Power-down  
Deselected, Power-down  
Deselected, Power-down  
Deselected, Power-down  
Deselected, Power-down  
Read Cycle, Begin Burst  
Read Cycle, Begin Burst  
Write Cycle, Begin Burst  
Read Cycle, Begin Burst  
Read Cycle, Begin Burst  
Read Cycle, Continue Burst  
Read Cycle, Continue Burst  
Read Cycle, Continue Burst  
Read Cycle, Continue Burst  
Write Cycle, Continue Burst  
Write Cycle, Continue Burst  
None  
None  
None  
None  
None  
External  
External  
External  
External  
External  
Next  
H
L
L
L
L
L
L
L
L
X
L
X
L
X
X
H
X
H
L
L
L
L
L
X
X
X
X
X
X
X
X
X
X
X
X
X
L
L
H
H
L
L
X
X
L
X
X
X
X
X
X
X
X
X
X
L
X
X
X
X
X
X
X
L
H
H
H
H
H
H
L
X
X
X
X
X
L
H
X
L
H
L
H
L
H
X
X
L
H
L
H
X
X
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
Q
High-Z  
D
Q
High-Z  
Q
High-Z  
Q
High-Z  
D
D
Q
High-Z  
Q
High-Z  
D
X
H
H
H
H
H
X
X
X
X
X
X
X
X
X
X
X
X
L
X
X
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
X
X
H
X
H
H
X
X
H
X
L
X
X
H
H
X
H
X
X
H
H
X
H
Next  
Next  
Next  
Next  
L
L
L
L
Next  
L
L
Read Cycle, Suspend Burst Current  
Read Cycle, Suspend Burst Current  
Read Cycle, Suspend Burst Current  
Read Cycle, Suspend Burst Current  
Write Cycle, Suspend Burst Current  
Write Cycle, Suspend Burst Current  
Notes:  
H
H
H
H
H
H
H
H
H
H
L
L
D
1. All inputs except OE must meet setup and hold times for the Low-to-High transition of clock (CLK).  
2. Wait states are inserted by suspending burst.  
3. X means don't care. WRITE=L means any one or more byte write enable signals (BW1-BW4) and BWE are LOW or GW is  
LOW. WRITE=H means all byte write enable signals are HIGH.  
4. For a Write operation following a Read operation, OE must be HIGH before the input data required setup time and held  
HIGH throughout the input data hold time.  
5. ADSP LOW always initiates an internal READ at the Low-to-High edge of clock. A WRITE is performed by setting one or  
more byte write enable signals and BWE LOW or GW LOW for the subsequent L-H edge of clock.  
PARTIAL TRUTH TABLE  
Function  
GW  
BWE BW1 BW2 BW3 BW4  
READ  
READ  
WRITE Byte 1  
WRITE All Bytes  
WRITE All Bytes  
H
H
H
X
L
H
X
L
L
X
X
H
L
L
X
X
H
H
L
X
H
H
L
X
H
H
L
X
X
X
4
Integrated Circuit Solution Inc.  
SSR005-0B  
IS61LV6432  
INTERLEAVED BURST ADDRESS TABLE (MODE = VCCQ or No Connect)  
External Address  
1st Burst Address  
2nd Burst Address  
3rd Burst Address  
A1 A0  
A1 A0  
A1 A0  
A1 A0  
00  
01  
10  
11  
01  
00  
11  
10  
10  
11  
00  
01  
11  
10  
01  
00  
LINEAR BURST ADDRESS TABLE (MODE = GNDQ)  
0,0  
A1, A0= 1,1  
0,1  
1,0  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol Parameter  
Value  
–10 to +85  
–55 to +150  
1.8  
Unit  
°C  
°C  
W
TBIAS  
TSTG  
PD  
Temperature Under Bias  
Storage Temperature  
Power Dissipation  
IOUT  
Output Current (per I/O)  
100  
mA  
V
V
VIN, VOUT Voltage Relative to GND for I/O Pins  
VIN  
–0.5 to VCCQ + 0.3  
–0.5 to 4.6  
Voltage Relative to GND for  
for Address and Control Inputs  
Notes:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause  
permanent damage to the device. This is a stress rating only and functional operation of  
the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect reliability.  
2. This device contains circuity to protect the inputs against damage due to high static  
voltages or electric fields; however, precautions may be taken to avoid application of any  
voltage higher than maximum rated voltages to this high-impedance circuit.  
3. This device contains circuitry that will ensure the output devices are in High-Z at power up.  
Integrated Circuit Solution Inc.  
5
SSR005-0B  
IS61LV6432  
OPERATING RANGE  
Range  
Commercial  
Industrial  
Ambient Temperature  
VCC  
VCCQ  
0°C to +70°C  
3.3V +10%, –5%  
3.3V +10%, –5%  
2.375V min., 3.465 max.  
2.375V min, 3.465V max.  
–40°C to +85°C  
DC ELECTRICAL CHARACTERISTICS(1) (Over Operating Range)  
Symbol Parameter  
Test Conditions  
IOH = –1.0 mA  
IOL = 1.0 mA  
Min.  
2.0  
Max.  
Unit  
V
VOH  
VOL  
VIH  
VIL  
ILI  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage  
Input Leakage Current  
0.4  
V
1.7  
VCCQ + 0.3  
0.7  
V
–0.3  
V
(2)  
GND VIN VCCQ  
Com.  
Ind.  
–5  
–10  
5
10  
µA  
ILO  
Output Leakage Current  
GND VOUT VCCQ, OE = VIH  
Com.  
Ind.  
–5  
–10  
5
10  
µA  
POWER SUPPLY CHARACTERISTICS (Operating Range)  
-166  
-133  
-117  
-5  
-6  
-7  
-8  
Symbol Parameter  
Test Conditions  
Min. Max.  
Min. Max.  
Min. Max.  
Min. Max.  
Min. Max.  
Min. Max.  
Min. Max. Unit  
I
CC  
AC Operating  
Supply Current  
Device Selected,  
Com.  
215  
205  
195  
205  
175  
185  
165  
175  
150  
160  
140 mA  
150  
All Inputs = VIL or VIH Ind.  
OE = VIH  
,
Cycle Time  
tKC min.  
I
I
SB  
ZZ  
Standby Current  
Device Deselected, Com.  
70  
60  
50  
60  
25  
35  
25  
35  
25  
35  
25  
35  
mA  
mA  
V
CC = Max.,  
Ind.  
CLK Cycle Time  
t
KC min.  
Power-Down Mode ZZ = VCCQ  
,
Com.  
Ind.  
5
5
5
10  
5
10  
5
10  
5
10  
5
10  
CLK Running  
Current  
All Inputs GND + 0.2V  
or  
V
CC – 0.2V  
Note:  
1. MODE pin have an internal pullup. ZZ pin has an internal pull-down. These pins may be a No Connect, tied to GND, or tied to  
VCCQ.  
2. MODE pin should be tied to Vcc or GND. They exhibit ±30 µA maximum leakage current when tied to GND + 0.2V or Vcc –  
0.2V.  
6
Integrated Circuit Solution Inc.  
SSR005-0B  
IS61LV6432  
CAPACITANCE(1,2)  
Symbol  
CIN  
Parameter  
Input Capacitance  
Conditions  
VIN = 0V  
Max.  
6
Unit  
pF  
COUT  
Input/Output Capacitance  
VOUT = 0V  
8
pF  
Notes:  
1. Tested initially and after any design or process changes that may affect these parameters.  
2. Test conditions: TA = 25°C, f = 1 MHz, Vcc = 3.3V.  
AC TEST CONDITIONS  
Parameter  
Unit  
Input Pulse Level for Input Pins  
Input Pulse Level for I/O Pins  
Input Rise and Fall Times  
0V to 3.0V  
0V to 2.5V  
1.5 ns  
Input and Output Timing  
and Reference Level  
1.25V  
Output Load  
See Figures 1 and 2  
AC TEST LOADS  
317 Ω  
2.5V  
ZO = 50Ω  
OUTPUT  
Output  
Buffer  
50Ω  
30 pF  
351 Ω  
5 pF  
Including  
jig and  
scope  
1.25V  
Figure 1  
Figure 2  
Integrated Circuit Solution Inc.  
7
SSR005-0B  
IS61LV6432  
READ CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)  
-166  
-133  
-117  
-5  
-6  
-7  
-8  
Symbol Parameter  
Min. Max.  
Min. Max.  
Min. Max  
Min. Max.  
Min. Max.  
Min. Max.  
Min. Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
KC  
KH  
KL  
Cycle Time  
6
5
7.5  
2.8  
2.8  
5
8.5  
3.0  
3.0  
5
10  
3.5  
3.5  
5
12  
6
13  
7
15  
8
Clock High Time  
2.4  
2.4  
4
6
6
Clock Low Time  
4
6
6
KQ  
KQX  
Clock Access Time  
2
2
(2)  
Clock High to Output Invalid  
Clock High to Output Low-Z  
Clock High to Output High-Z  
Output Enable to Output Valid  
Output Disable to Output Invalid  
Output Enable to Output Low-Z  
Output Disable to Output High-Z  
Address Setup Time  
1.5  
0
5
1.5  
0
5
1.5  
0
6
1.5  
0
6
1.5  
0
6
6
6
(2,3)  
KQLZ  
0
0
(2,3)  
KQHZ  
OEQ  
1.5  
1.5  
1.5  
1.5  
1.5  
2
2
5
5
5
5
6
0
6
0
6
(2)  
OEQX  
0
3
0
3
0
4
0
4
0
5
6
6
(2,3)  
OELZ  
0
0
0
0
0
0
0
(2,3)  
OEHZ  
AS  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
66.7  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
80  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
25  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
30  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
35  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
35  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
45  
SS  
Address Status Setup Time  
Write Setup Time  
WS  
CES  
AVS  
AH  
Chip Enable Setup Time  
Address Advance Setup Time  
Address Hold Time  
SH  
Address Status Hold Time  
Write Hold Time  
WH  
CEH  
AVH  
CFG  
Chip Enable Hold Time  
Address Advance Hold Time  
Configuration Setup(1)  
Notes:  
1. Configuration signal MODE is static and must not change during normal operation.  
2. Guaranteed but not 100% tested. This parameter is periodically sampled.  
3. Tested with load in Figure 2.  
8
Integrated Circuit Solution Inc.  
SSR005-0B  
IS61LV6432  
READ CYCLE TIMING: PIPELINE  
t
KC  
CLK  
ADSP  
ADSC  
t
KH  
tKL  
ADSP is blocked by CE1 inactive  
ADSC initiate read  
t
SS  
tSH  
t
SS  
tSH  
t
AVH  
t
AVS  
Suspend Burst  
ADV  
t
AS  
tAH  
A15-A0  
RD1  
RD2  
RD3  
t
t
WS  
WS  
t
t
WH  
GW  
BWE  
WH  
BW4-BW1  
t
CES  
tCEH  
CE1 Masks ADSP  
CE1  
CE2  
CE3  
t
t
CES  
CES  
t
t
CEH  
CEH  
Unselected with CE2  
CE2 and CE3 only sampled with ADSP or ADSC  
t
OEHZ  
t
OEQ  
OE  
t
KQX  
t
OEQX  
t
OELZ  
High-Z  
High-Z  
DATAOUT  
2a  
2b  
2c  
2d  
3a  
1a  
t
KQLZ  
t
KQHZ  
t
KQ  
DATAIN  
Pipelined Read  
Burst Read  
Single Read  
Unselected  
Integrated Circuit Solution Inc.  
9
SSR005-0B  
IS61LV6432  
WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)  
-166  
-133  
-117  
-5  
-6  
-7  
-8  
Symbol Parameter  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tKC  
Cycle Time  
6
7.5  
2.8  
2.8  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
30  
8.5  
3.0  
3.0  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
35  
10  
3.5  
3.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
35  
12  
13  
15  
tKH  
Clock High Time  
2.4  
2.4  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
25  
4
6
6
tKL  
Clock Low Time  
4
6
6
tAS  
Address Setup Time  
Address Status Setup Time  
Write Setup Time  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
45  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
52  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
60  
tSS  
tWS  
tDS  
Data In Setup Time  
Chip Enable Setup Time  
Address Advance Setup Time  
Address Hold Time  
Address Status Hold Time  
Data In Hold Time  
tCES  
tAVS  
tAH  
tSH  
tDH  
tWH  
tCEH  
tAVH  
tCFG  
Notes:  
Write Hold Time  
Chip Enable Hold Time  
Address Advance Hold Time  
Configuration Setup(1)  
1. Configuration signal MODE is static and must not change during normal operation.  
10  
Integrated Circuit Solution Inc.  
SSR005-0B  
IS61LV6432  
WRITE CYCLE TIMING  
t
KC  
CLK  
t
KH  
tKL  
ADSP is blocked by CE1 inactive  
ADSC initiate Write  
t
SS  
tSH  
ADSP  
ADSC  
t
AVH  
t
AVS  
ADV must be inactive for ADSP Write  
ADV  
t
AS  
tAH  
A15-A0  
WR1  
WR2  
WR3  
t
t
WS  
WS  
t
t
WH  
WH  
GW  
BWE  
t
WS  
t
WH  
t
WS  
tWH  
BW4-BW1  
WR1  
WR2  
CE1 Masks ADSP  
WR3  
t
CES  
tCEH  
CE1  
CE2  
CE3  
t
t
CES  
CES  
t
CEH  
CEH  
Unselected with CE2  
CE2 and CE3 only sampled with ADSP or ADSC  
t
OE  
DATAOUT  
DATAIN  
High-Z  
t
DS  
tDH  
BW4-BW1 only are applied to first cycle of WR2  
2a 2b 2c 2d  
High-Z  
3a  
1a  
Burst Write  
Single Write  
Write  
Unselected  
Integrated Circuit Solution Inc.  
11  
SSR005-0B  
IS61LV6432  
READ/WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)  
-166  
-133  
-117  
-5  
-6  
-7  
-8  
Symbol Parameter  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tKC  
tKH  
tKL  
Cycle Time  
6
5
7.5  
2.8  
2.8  
5
8.5  
3.0  
3.0  
5
10  
3.5  
3.5  
5
12  
6
13  
7
15  
8
Clock High Time  
2.4  
2.4  
4
6
6
Clock Low Time  
4
6
6
tKQ  
tKQX  
Clock Access Time  
1.5  
0
2
2
(2)  
Clock High to Output Invalid  
Clock High to Output Low-Z  
Clock High to Output High-Z  
Output Enable to Output Valid  
Output Disable to Output Invalid  
Output Enable to Output Low-Z  
Output Disable to Output High-Z  
Address Setup Time  
1.5  
0
5
1.5  
0
5
1.5  
0
6
1.5  
0
6
6
6
6
(2,3)  
tKQLZ  
0
0
(2,3)  
tKQHZ  
tOEQ  
1.5  
1.5  
1.5  
1.5  
1.5  
0
2
2
5
5
5
5
6
0
6
0
6
(2)  
tOEQX  
0
3
0
3
0
4
0
4
5
6
6
(2,3)  
tOELZ  
0
0
0
0
0
0
0
(2,3)  
tOEHZ  
tAS  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
45  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
52  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
60  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
2.5  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
30  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
35  
2.5  
2.5  
2.5  
2.5  
0.5  
0.5  
0.5  
0.5  
35  
tSS  
Address Status Setup Time  
Write Setup Time  
tWS  
tCES  
tAH  
Chip Enable Setup Time  
Address Hold Time  
tSH  
Address Status Hold Time  
Write Hold Time  
tWH  
tCEH  
tCFG  
Notes:  
Chip Enable Hold Time  
Configuration Setup(1)  
1. Configuration signal MODE is static and must not change during normal operation.  
2. Guaranteed but not 100% tested. This parameter is periodically sampled.  
3. Tested with load in Figure 2.  
12  
Integrated Circuit Solution Inc.  
SSR005-0B  
IS61LV6432  
READ/WRITE CYCLE TIMING: PIPELINE  
t
KC  
CLK  
ADSP  
ADSC  
t
KH  
tKL  
ADSP is blocked by CE1 inactive  
t
SS  
tSH  
t
SS  
tSH  
ADV  
t
AS  
tAH  
A15-A0  
RD1  
WR1  
RD2  
RD3  
t
t
WS  
WS  
t
t
WH  
GW  
BWE  
WH  
t
WS  
tWH  
WR1  
BW4-BW1  
t
CES  
tCEH  
CE1 Masks ADSP  
CE1  
CE2  
CE3  
t
t
CES  
CES  
t
t
CEH  
CEH  
CE2 and CE3 only sampled with ADSP or ADSC  
Unselected with CE3  
t
OEHZ  
t
OEQ  
OE  
t
KQX  
t
OEQX  
t
OELZ  
High-Z  
High-Z  
DATAOUT  
2a  
2b  
2c  
2d  
1a  
t
KQLZ  
t
KQHZ  
t
KQX  
KQHZ  
t
KQ  
t
1a  
DATAIN  
t
DS  
tDH  
Single Write  
Burst Read  
Single Read  
Unselected  
Integrated Circuit Solution Inc.  
13  
SSR005-0B  
IS61LV6432  
SNOOZE AND RECOVERY CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)  
-166  
-133  
-117  
-5  
-6  
-7  
-8  
Symbol Parameter  
Min. Max  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Min.Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
cyc  
cyc  
tKC  
tKH  
tKL  
Cycle Time  
6
5
7.5  
2.8  
2.8  
5
8.5  
3.0  
3.0  
5
10  
3.5  
3.5  
1.5  
0
5
12  
6
13  
7
15  
8
Clock High Time  
2.4  
2.4  
1.5  
0
4
6
6
Clock Low Time  
4
6
6
tKQ  
tKQX  
Clock Access Time  
1.5  
0
2
2
(4)  
Clock High to Output Invalid  
Clock High to Output Low-Z  
Clock High to Output High-Z  
Output Enable to Output Valid  
Output Disable to Output Invalid  
Output Enable to Output Low-Z  
Output Disable to Output High-Z  
Address Setup Time  
5
1.5  
0
5
1.5  
0
6
6
6
6
6
(4,5)  
tKQLZ  
0
0
(4,5)  
tKQHZ  
tOEQ  
1.5  
0
1.5  
1.5  
1.5  
0
1.5  
0
2
2
5
5
5
5
6
0
6
0
6
(4)  
tOEQX  
3
0
3
0
4
4
5
6
6
(4,5)  
tOELZ  
0
0
0
0
0
0
0
(4,5)  
tOEHZ  
tAS  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2
tSS  
Address Status Setup Time  
Chip Enable Setup Time  
Address Hold Time  
tCES  
tAH  
tSH  
Address Status Hold Time  
Chip Enable Hold Time  
ZZ Standby(1)  
tCEH  
tZZS  
tZZREC  
Notes:  
ZZ Recovery(2)  
2
2
2
2
2
2
2
1. The assertion of ZZ allows the SRAM to enter a lower power state than when deselected within the time specified. Data  
retention is guaranteed when ZZ is asserted and clock remains active.  
2. ADSC and ADSP must not be asserted for at least 2 cyc after leaving ZZ state.  
3. Configuration signal MODE is static and must not change during normal operation.  
4. Guaranteed but not 100% tested. This parameter is periodically sampled.  
5. Tested with load in Figure 2.  
14  
Integrated Circuit Solution Inc.  
SSR005-0B  
IS61LV6432  
SNOOZE AND RECOVERY CYCLE TIMING  
t
KC  
CLK  
ADSP  
ADSC  
t
KH  
tKL  
t
SS  
tSH  
ADV  
t
AS  
tAH  
A15-A0  
RD1  
RD2  
GW  
BWE  
BW4-BW1  
t
CES  
tCEH  
CE1  
CE2  
CE3  
t
t
CES  
CES  
t
CEH  
CEH  
t
t
OEHZ  
t
OEQ  
OE  
t
OEQX  
t
OELZ  
High-Z  
High-Z  
DATAOUT  
1a  
t
KQLZ  
t
KQX  
KQHZ  
t
KQ  
t
DATAIN  
ZZ  
t
ZZS  
tZZREC  
Snooze with Data Retention  
Single Read  
Read  
Integrated Circuit Solution Inc.  
15  
SSR005-0B  
IS61LV6432  
ORDERING INFORMATION  
Commercial Range: 0°C to +70°C  
Frequency (MHz) Order Part Number  
Package  
166  
133  
117  
100  
83  
IS61LV6432-166TQ 14*20*1.4mm LQFP  
IS61LV6432-166PQ 14*20*2.7mm PQFP  
IS61LV6432-133TQ 14*20*1.4mm LQFP  
IS61LV6432-133PQ 14*20*2.7mm PQFP  
IS61LV6432-117TQ 14*20*1.4mm LQFP  
IS61LV6432-117PQ 14*20*2.7mm PQFP  
IS61LV6432-5TQ  
IS61LV6432-5PQ  
14*20*1.4mm LQFP  
14*20*2.7mm PQFP  
IS61LV6432-6TQ  
IS61LV6432-6PQ  
14*20*1.4mm LQFP  
14*20*2.7mm PQFP  
75  
IS61LV6432-7TQ  
IS61LV6432-7PQ  
14*20*1.4mm LQFP  
14*20*2.7mm PQFP  
66  
IS61LV6432-8TQ  
IS61LV6432-8PQ  
14*20*1.4mm LQFP  
14*20*2.7mm PQFP  
ORDERING INFORMATION  
Industrial Range: –40°C to +85°C  
Frequency (MHz)  
Order Part Number  
Package  
117  
IS61LV6432-117TQI 14*20*1.4mm LQFP  
IS61LV6432-117PQI 14*20*2.7mm PQFP  
100  
83  
IS61LV6432-5TQI 14*20*1.4mm LQFP  
IS61LV6432-5PQI 14*20*2.7mm PQFP  
IS61LV6432-6TQI 14*20*1.4mm LQFP  
IS61LV6432-6PQI 14*20*2.7mm PQFP  
75  
IS61LV6432-7TQI 14*20*1.4mm LQFP  
IS61LV6432-7PQI 14*20*2.7mm PQFP  
66  
IS61LV6432-8TQI 14*20*1.4mm LQFP  
IS61LV6432-8PQI 14*20*2.7mm PQFP  
Integrated Circuit Solution Inc.  
HEADQUARTER:  
NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,  
HSIN-CHU, TAIWAN, R.O.C.  
TEL: 886-3-5780333  
Fax: 886-3-5783000  
BRANCH OFFICE:  
7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD,  
HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.  
TEL: 886-2-26962140  
FAX: 886-2-26962252  
http://www.icsi.com.tw  
16  
Integrated Circuit Solution Inc.  
SSR005-0B  

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