251PMLF [IDT]
Field Programmable SS VersaClock Synthesizer;型号: | 251PMLF |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | Field Programmable SS VersaClock Synthesizer 时钟 光电二极管 外围集成电路 晶体 |
文件: | 总10页 (文件大小:90K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Field Programmable SS VersaClock Synthesizer
ICS251
DATASHEET
Description
Features
The ICS251 is a low cost, single-output, field programmable
clock synthesizer. The ICS251 can generate an output
frequency from 314 kHz to 200 MHz and may employ Spread
Spectrum techniques to reduce system electro-magnetic
interference (EMI).
• 8-pin SOIC package
• Four addressable registers
• Input crystal frequency of 5 to 27 MHz
• Clock input frequency of 3 to 150 MHz
• Output clock frequencies up to 200 MHz
• Configurable Spread Spectrum Modulation
• Operating voltage of 3.3 V
™
Using IDT’s VersaClock software to configure the PLL and
output, the ICS251 contains a One-Time Programmable
(OTP) ROM to allow field programmability. Programming
features include 4 selectable configuration registers.
• Replaces multiple crystals and oscillators
• Controllable output drive levels
The device employs Phase-Locked Loop (PLL) techniques to
run from a standard fundamental mode, inexpensive crystal,
or clock. It can replace multiple crystals and oscillators,
saving board space and cost.
• Advanced, low-power CMOS process
• Available in RoHS compliant packaging
The device also has a power-down feature that tri-states the
clock outputs and turns off the PLLs when the PDTS pin is
taken low.
The ICS251 is also available in factory programmed custom
versions for high-volume applications.
Block Diagram
VDD
OTP ROM
2
with PLL
S1:0
Divider
Values
PLL Clock Synthesis,
Spread Spectrum and
Control Circuitry
CLK
Crystal or
clock input
X1/ICLK
Crystal
Oscillator
X2
GND
External capacitors are
required with a crystal input.
PDTS (output and PLL)
ICS251 REVISION E 05/19/14
1
©2014 Integrated Device Technology, Inc.
ICS251 DATASHEET
Pin Assignment
Output Clock Selection Table
S1
S0
CLK (MHz)
Spread
Percentage
User
Configurable
User
Configurable
User
Configurable
User
Configurable
S 0
V D D
1
2
3
4
8
7
6
5
P D T S
G N D
User
Configurable
User
Configurable
User
Configurable
User
Configurable
0
0
1
1
0
1
0
1
X 1 / I C L K
X 2
S 1
C L K
8-pin (150 mil) SOIC
Pin Descriptions
Pin
Pin
Pin
Pin Description
Number
Name
Type
1
2
3
4
5
6
7
S0
VDD
X1/ICLK
X2
Input
Power
XI
Select pin 0 for frequency selection on CLK. Internal pull-up resistor.
Connect to +3.3 V.
Connect this pin to a crystal or external clock input.
Connect this pin to a crystal, or float for clock input.
XO
CLK
S1
Output Clock output. Weak internal pull-down when tri-state.
Input
Select pin 1 for frequency selection on CLK. Internal pull-up resistor.
Connect this to Ground.
GND
Power
Powers down entire chip. Tri-states CLK outputs when low. No internal pull-up
resistor. The pin must be tied either directly or through the external resistor to
VDD or GND. External resistor value must be less than 15kOhm.
8
PDTS
Input
External Components
The ICS251 requires a minimum number of external
components for proper operation.
increased in this trimming process, it is important to keep stray
capacitance to a minimum by using very short PCB traces
(and no vias) been the crystal and device. Crystal capacitors
must be connected from each of the pins X1 and X2 to ground.
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50 trace (a commonly
used trace impedance), place a 33 resistor in series with the
clock line, as close to the clock output pin as possible. The
nominal impedance of the clock output is 20.
The value (in pF) of these crystal caps should equal (C -6
L
pF)*2. In this equation, C = crystal load capacitance in pF.
L
Example: For a crystal with a 16 pF load capacitance, each
crystal capacitor would be 20 pF [(16-6) x 2] = 20.
Decoupling Capacitor
As with any high-performance mixed-signal IC, the ICS251
must be isolated from system power supply noise to perform
optimally.
A decoupling capacitor of 0.01µF must be connected between
VDD and the PCB ground plane.
Crystal Load Capacitors
The device crystal connections should include pads for small
capacitors from X1 to ground and from X2 to ground. These
capacitors are used to adjust the stray capacitance of the
board to match the nominally required crystal load
capacitance. Because load capacitance can only be
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
2
REVISION E 05/19/14
ICS251 DATASHEET
PCB Layout Recommendations
IDT VersaClock Software
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
IDT applies years of PLL optimization experience into a user
friendly software that accepts the user’s target reference clock
and output frequencies and generates the lowest jitter, lowest
power configuration, with only a press of a button. The user
does not need to have prior PLL experience or determine the
optimal VCO frequency to support multiple output
frequencies.
1) The 0.01µF decoupling capacitor should be mounted on the
component side of the board as close to the VDD pin as
possible. No vias should be used between the decoupling
capacitor and VDD pin. The PCB trace to VDD pin should be
kept as short as possible, as should the PCB trace to the
ground via. Distance of the ferrite bead and bulk decoupling
from the device is less critical.
VersaClock software quickly evaluates accessible VCO
frequencies with available output divide values and provides
an easy to understand, bar code rating for the target output
frequencies. The user may evaluate output accuracy,
performance trade-off scenarios in seconds.
2) The external crystal should be mounted just next to the
device with short traces. The X1 and X2 traces should not be
routed next to each other with minimum spaces, instead they
should be separated and away from other traces.
Spread Spectrum Modulation
The ICS251 utilizes frequency modulation (FM) to distribute
energy over a range of frequencies. By modulating the output
clock frequencies, the device effectively lowers energy across
a broader range of frequencies; thus, lowering a system’s
electro-magnetic interference (EMI). The modulation rate is
the time from transitioning from a minimum frequency to a
maximum frequency and then back to the minimum.
3) To minimize EMI, the 33 series termination resistor (if
needed) should be placed close to the clock output.
4) An optimum layout is one with all components on the same
side of the board, minimizing vias through other signal layers.
Other signal traces should be routed away from the ICS251.
This includes signal traces just underneath the device, or on
layers adjacent to the ground plane layer used by the device.
Spread Spectrum Modulation can be applied as either “center
spread” or “down spread”. During center spread modulation,
the deviation from the target frequency is equal in the positive
and negative directions. The effective average frequency is
equal to the target frequency. In applications where the clock
is driving a component with a maximum frequency rating,
down spread should be applied. In this case, the maximum
frequency, including modulation, is the target frequency. The
effective average frequency is less than the target frequency.
ICS251 Configuration Capabilities
The architecture of the ICS251 allows the user to easily
configure the device to a wide range of output frequencies, for
a given input reference frequency.
The frequency multiplier PLL provides a high degree of
precision. The M/N values (the multiplier/divide values
available to generate the target VCO frequency) can be set
within the range of M = 1 to 2048 and N = 1 to 1024.
The ICS251 operates in both center spread and down spread
modes. For center spread, the frequency can be modulated
between +/- 0.125% to +/-2.0%. For down spread, the
frequency can be modulated between -0.25% to -4.0%.
The ICS251 also provides separate output divide values, from
2 through 20, to allow the two output clock banks to support
widely differing frequency values from the same PLL.
Both output frequency banks will utilize identical spread
spectrum percentage deviations and modulation rates, if a
common VCO frequency can be identified.
Each output frequency can be represented
as:
Spread Spectrum Modulation Rate
REFFreq
M
N
-------------------------------------- ----
OutputFreq = OutputDivide
The spread spectrum modulation frequency applied to the
output clock frequency may occur at a variety of rates. For
applications requiring the driving of “down-circuit” PLLs, Zero
Delay Buffers, or those adhering to PCI standards, the spread
spectrum modulation rate should be set to 30-33 kHz. For
other applications, a 120 kHz modulation option is available.
Output Drive Control
The ICS251 has two output drive settings. Low drive should
be selected when outputs are less than 100 MHz. High drive
should be selected when outputs are greater than 100 MHz.
(Consult the AC Electrical Characteristics for output rise and
fall times for each drive option.)
REVISION E 05/19/14
3
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
ICS251 DATASHEET
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS251. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or
any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are
guaranteed only over the recommended operating temperature range.
Parameter
Condition
Min.
-0.5
-0.5
-0.5
-65
Typ.
Max.
4.6
Units
V
Supply Voltage, VDD
Inputs
Referenced to GND
Referenced to GND
Referenced to GND
VDD+ 0.5
VDD+ 0.5
150
V
Clock Outputs
V
Storage Temperature
Soldering Temperature
Junction Temperature
C
C
C
Max 10 seconds
260
125
Recommended Operation Conditions
Parameter
Min.
0
Typ.
Max.
+70
+85
+3.45
4
Units
C
Ambient Operating Temperature (ICS251M)
Ambient Operating Temperature (ICS251MI)
Power Supply Voltage (measured in respect to GND)
Power Supply Ramp Time
-40
C
+3.15
+3.3
V
ms
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
4
REVISION E 05/19/14
ICS251 DATASHEET
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85C
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Operating Voltage
VDD
3.15
3.3
3.45
V
Configuration Dependent -
See VersaClockTM
mA
33.3333 MHz output, PDTS
= 1, no load
Note 1
14
mA
Operating Supply Current
Input High Voltage
IDD
PDTS = 0
S1:S0
500
A
V
Input High Voltage
VIH
VIL
VIH
VIL
VIH
VIL
VDD/2+1
VDD-0.5
VDD/2+1
Input Low Voltage
S1:S0
0.4
0.4
V
Input High Voltage, PDTS
Input Low Voltage, PDTS
Input High Voltage
V
V
ICLK
ICLK
V
Input Low Voltage
VDD/2-1
V
Output High Voltage (CMOS
High)
VOH
VOH
VOL
IOH = -4 mA
VDD-0.4
V
V
V
IOH = -8 mA (Low Drive); IOH
= -12 mA (High Drive)
2.4
VDD-0.4
Output High Voltage
Output Low Voltage
IOL = 8 mA (Low Drive);
IOL = 12 mA (High Drive)
0.4
Short Circuit Current
IOS
ZO
±70
20
mA
Nominal Output Impedance
Internal pull-up resistor
Internal pull-down resistor
Input Capacitance
RPUP
RPD
CIN
S1:S0, PDTS
CLK output
inputs
190
120
4
k
k
pF
Note 1: Example with 25 MHz crystal input with output of 33.3 MHz, no load, and VDD = 3.3 V.
REVISION E 05/19/14
5
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
ICS251 DATASHEET
AC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85C
Parameter
Symbol
Conditions
Fundamental Crystal
Input Clock
Min.
5
Typ. Max. Units
27
MHz
MHz
MHz
ns
Input Frequency
FIN
3
150
200
Output Frequency
Output Rise Time
Output Fall Time
Duty Cycle
0.314
tOR
tOF
20% to 80%, Note 1
80% to 20%, Note 1
Note 2
1
1
ns
40
49-51
60
10
%
PLL lock time from
power-up
4
ms
PDTS goes high until stable
CLK output, Spread
Spectrum Off
.6
2
7
ms
Power-up time
PDTS goes high until stable
CLK output, Spread
Spectrum On
4
ms
ms
PDTS goes high until
spread spectrum is stable,
Spread Spectrum On
10
50
One Sigma Clock Period Jitter
Maximum Absolute Jitter
Configuration Dependent
50
ps
ps
Deviation from Mean.
Configuration Dependent
tja
+200
Note 1: Measured with 15 pF load.
Note 2: Duty Cycle is configuration dependent. Most configurations are minimum 45% and maximum 55%.
Thermal Characteristics
Parameter
Symbol
JA
Conditions
Min.
Typ. Max. Units
C/W
C/W
C/W
C/W
Still air
150
140
120
40
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
JA
1 m/s air flow
3 m/s air flow
JA
JC
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
6
REVISION E 05/19/14
ICS251 DATASHEET
Marking Diagram
Marking Diagram (Pb free)
8
5
8
5
251PML
######
YYWW
251PM
######
YYWW
1
4
1
8
4
8
5
5
251PMIL
######
YYWW
251PMI
######
YYWW
1
4
1
4
Notes:
1. ###### is the lot number.
2. YYWW is the last two digits of the year and week that the part was assembled.
3. “I” denotes industrial temp. range (if applicable).
4. “L” denotes RoHS compliant package.
5. Bottom marking: country of origin.
REVISION E 05/19/14
7
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
ICS251 DATASHEET
Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Inches
Min
8
Symbol
Min
1.35
0.10
0.33
0.19
4.80
3.80
Max
1.75
0.25
0.51
0.25
5.00
4.00
Max
.0688
.0098
.020
A
A1
B
C
D
E
e
.0532
.0040
.013
E
H
.0075
.1890
.1497
.0098
.1968
.1574
INDEX
AREA
1.27 BASIC
0.050 BASIC
H
h
5.80
0.25
0.40
0
6.20
0.50
1.27
8
.2284
.010
.016
0
.2440
.020
.050
8
1
2
L
D
A
h x 45
A1
C
- C -
e
SEATING
PLANE
B
L
.10 (.004)
C
Ordering Information
Part / Order Number
Marking
Shipping Packaging
Tubes
Package
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
Temperature
0 to +70 C
-40 to +85 C
0 to +70 C
-40 to +85 C
0 to +70 C
-40 to +85 C
0 to +70 C
-40 to +85 C
0 to +70 C
-40 to +85 C
0 to +70 C
251PM
251PMI
251PMLF
251PMILF
251M-XX
251MI-XX
251M-XXLF
251MI-XXLF
251M-XXT
251MI-XXT
251M-XXLFT
251MI-XXLFT
See Page 7 Above
Tubes
Tubes
Tubes
Tubes
251M-XX
251MIXX
251MXXL
251MIXXL
251M-XX
251MIXX
251MXXL
251MIXXL
Tubes
Tubes
Tubes
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
-40 to +85 C
Parts that are ordered with a “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant.
The 251M-XX, 251M-XXLF, 251MI-XX, and 251MI-XXLF are factory programmed versions of the ICS251PM, ICS251PMLF, ICS251PMI,
and ICS251PMILF. A unique “-XX” suffix is assigned by the factory for each custom configuration, and a separate data sheet is kept
on file. For more information on custom part numbers programmed at the factory, please contact your local IDT sales and marketing
representative.
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
8
REVISION E 05/19/14
ICS251 DATASHEET
Revision History
Rev.
Date
Originator Description of Change
J. Chao 1. Updated Supply Voltage max rating from 7V to 4.6V
E
05/19/14
2. Updated datasheet with latest version of template.
REVISION E 05/19/14
9
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138 USA
Sales
Tech Support
email: clocks@idt.com
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in
this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined
in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether
express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This
document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Product specification subject to change without notice. Other trademarks and service marks used herein, including protected
names, logos and designs, are the property of IDT or their respective third party owners.
Copyright ©2014 Integrated Device Technology, Inc.. All rights reserved.
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