341MI-XXLFT [IDT]

Clock Generator, 200MHz, CMOS, PDSO8, 0.150 INCH, ROHS COMPLIANT, SOIC-8;
341MI-XXLFT
型号: 341MI-XXLFT
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Clock Generator, 200MHz, CMOS, PDSO8, 0.150 INCH, ROHS COMPLIANT, SOIC-8

时钟 光电二极管 外围集成电路 晶体
文件: 总9页 (文件大小:104K)
中文:  中文翻译
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DATASHEET  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
ICS341  
Description  
Features  
The ICS341 is a low cost, single-output, field programmable  
clock synthesizer. The ICS341 can generate an output  
frequency from 250 kHz to 200 MHz and may employ  
Spread Spectrum techniques to reduce system  
electro-magnetic interference (EMI).  
8-pin SOIC package (Pb-free)  
Highly accurate frequency generation  
M/N Multiplier PLL: M = 1...2048, N = 1...1024  
Output clock frequencies up to 200 MHz  
Four ROM locations for frequency and spread selection  
Spread spectrum capability for lower system EMI  
Center or Down Spread up to 4% total  
Using IDT’s VersaClock software to configure the PLL and  
output, the ICS341 contains a One-Time Programmable  
(OTP) ROM to allow field programmability. Programming  
features include 4 selectable configuration registers.  
Selectable 32 kHz or 120 kHz modulation  
The device employs Phase-Locked Loop (PLL) techniques  
to run from a standard fundamental mode, inexpensive  
crystal, or clock. It can replace multiple crystals and  
oscillators, saving board space and cost.  
Input crystal frequency from 5 to 27 MHz  
Input clock frequency from 2 to 50 MHz  
Operating voltage of 3.3 V  
Advanced, low-power CMOS process  
For two output clocks, use the ICS342. For three output  
clocks, see the ICS343. For more than three outputs, see  
the ICS345 or ICS348.  
The device also has a power-down feature that tri-states the  
clock outputs and turns off the PLLs when the PDTS pin is  
taken low.  
The ICS341 is also available in factory programmed custom  
versions for high-volume applications.  
Block Diagram  
VDD  
OTP ROM  
with PLL  
Divider  
2
S1:0  
Values  
PLL Clock Synthesis,  
Spred Spectrum and  
Control Circuitry  
CLK  
Crystal or  
clock input  
X1/ICLK  
Crystal  
Oscillator  
X2  
GND  
External capacitors are  
required with a crystal input.  
PDTS (output and PLL)  
IDT® / ICS™ FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
1
ICS341  
REV M 090613  
ICS341  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
EPROM CLOCK SYNTHESIZER  
Pin Assignment  
Output Clock Selection Table  
S1  
S0  
CLK (MHz)  
Spread  
Percentage  
User  
Configurable  
User  
X1/ I CLK  
VDD  
8
7
6
5
1
2
3
4
X2  
0
0
User  
Configurable  
User  
Configurable  
User  
PDTS  
S1  
GND  
S0  
0
1
Configurable  
User  
CLK  
1
0
Configurable  
User  
Configurable  
Configurable  
User  
Configurable  
1
1
8-pin (150 mil) SOIC  
Pin Descriptions  
Pin  
Number  
Pin  
Name  
Pin  
Type  
Pin Description  
1
2
3
4
5
6
X1/ICLK  
VDD  
GND  
S0  
XI  
Connect this pin to a crystal or external clock input.  
Connect to +3.3 V.  
Power  
Power  
Input  
Connect to ground.  
Select pin 0 for frequency selection on CLK. Internal pull-up resistor.  
CLK  
S1  
Output Clock output. Weak internal pull-down when tri-state.  
Input  
Input  
XO  
Select pin 1 for frequency selection on CLK. Internal pull-up resistor.  
Powers down entire chip. Tri-states CLK outputs when low. Internal pull-up  
resistor.  
7
8
PDTS  
X2  
Connect this pin to a crystal, or float for clock input.  
External Components  
capacitors must be connected from each of the pins X1 and  
X2 to ground.  
Series Termination Resistor  
Clock output traces over one inch should use series  
termination. To series terminate a 50trace (a commonly  
used trace impedance), place a 33resistor in series with  
the clock line, as close to the clock output pin as possible.  
The nominal impedance of the clock output is 20.  
The value (in pF) of these crystal caps should equal (C -6  
L
pF)*2. In this equation, C = crystal load capacitance in pF.  
L
Example: For a crystal with a 16 pF load capacitance, each  
crystal capacitor would be 20 pF [(16-6) x 2] = 20.  
Decoupling Capacitor  
PCB Layout Recommendations  
As with any high-performance mixed-signal IC, the ICS341  
must be isolated from system power supply noise to perform  
optimally.  
For optimum device performance and lowest output phase  
noise, the following guidelines should be observed.  
A decoupling capacitor of 0.01µF must be connected  
between VDD and the PCB ground plane.  
1) The 0.01µF decoupling capacitor should be mounted on  
the component side of the board as close to the VDD pin as  
possible. No vias should be used between the decoupling  
capacitor and VDD pin. The PCB trace to VDD pin should be  
kept as short as possible, as should the PCB trace to the  
ground via. Distance of the ferrite bead and bulk decoupling  
from the device is less critical.  
Crystal Load Capacitors  
The device crystal connections should include pads for  
small capacitors from X1 to ground and from X2 to ground.  
These capacitors are used to adjust the stray capacitance of  
the board to match the nominally required crystal load  
capacitance. Because load capacitance can only be  
increased in this trimming process, it is important to keep  
stray capacitance to a minimum by using very short PCB  
traces (and no vias) between the crystal and device. Crystal  
2) The external crystal should be mounted just next to the  
device with short traces. The X1 and X2 traces should not  
be routed next to each other with minimum spaces, instead  
they should be separated and away from other traces.  
IDT® / ICS™ FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
2
ICS341  
REV M 090613  
ICS341  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
EPROM CLOCK SYNTHESIZER  
3) To minimize EMI, the 33series termination resistor (if  
needed) should be placed close to the clock output.  
The modulation rate is the time from transitioning from a  
minimum frequency to a maximum frequency and then back  
to the minimum.  
4) An optimum layout is one with all components on the  
same side of the board, minimizing vias through other signal  
layers. Other signal traces should be routed away from the  
ICS341. This includes signal traces just underneath the  
device, or on layers adjacent to the ground plane layer used  
by the device.  
Spread Spectrum Modulation can be applied as either  
“center spread” or “down spread”. During center spread  
modulation, the deviation from the target frequency is equal  
in the positive and negative directions. The effective average  
frequency is equal to the target frequency. In applications  
where the clock is driving a component with a maximum  
frequency rating, down spread should be applied. In this  
case, the maximum frequency, including modulation, is the  
target frequency. The effective average frequency is less  
than the target frequency.  
ICS341 Configuration Capabilities  
The architecture of the ICS341 allows the user to easily  
configure the device to a wide range of output frequencies,  
for a given input reference frequency.  
The ICS341 operates in both center spread and down  
spread modes. For center spread, the frequency can be  
modulated between +/- 0.125% to +/-2.0%. For down  
spread, the frequency can be modulated between -0.25% to  
-4.0%.  
The frequency multiplier PLL provides a high degree of  
precision. The M/N values (the multiplier/divide values  
available to generate the target VCO frequency) can be set  
within the range of M = 1 to 2048 and N = 1 to 1024.  
The ICS341 also provides separate output divide values,  
from 2 through 20, to allow the two output clock banks to  
support widely differing frequency values from the same  
PLL.  
Both output frequency banks will utilize identical spread  
spectrum percentage deviations and modulation rates, if a  
common VCO frequency can be identified.  
Spread Spectrum Modulation Rate  
Each output frequency can be represented  
as:  
The spread spectrum modulation frequency applied to the  
output clock frequency may occur at a variety of rates. For  
applications requiring the driving of “down-circuit” PLLs,  
Zero Delay Buffers, or those adhering to PCI standards, the  
spread spectrum modulation rate should be set to 30-33  
kHz. For other applications, a 120 kHz modulation option is  
available.  
REFFreq  
M
N
-------------------------------------- ----  
OutputFreq = OutputDivide   
IDT VersaClock Software  
Using VersaClock Products with an Input Clock  
Source  
IDT applies years of PLL optimization experience into a user  
friendly software that accepts the user’s target reference  
clock and output frequencies and generates the lowest jitter,  
lowest power configuration, with only a press of a button.  
The user does not need to have prior PLL experience or  
determine the optimal VCO frequency to support multiple  
output frequencies.  
In order to ensure proper startup with an input clock rather  
than a crystal, the supply voltage must be within the  
operating range (3.3V 10%) and the input signal must be  
stable and free from glitching. The input clock must provide  
pulses of at least 20ns, and no more than 500ns, for at least  
160 clock cycles without any interruptions to the clock or  
power during this period. It may take up to 4ms for output  
frequencies to reach their target frequency values.  
VersaClock software quickly evaluates accessible VCO  
frequencies with available output divide values and provides  
an easy to understand, bar code rating for the target output  
frequencies. The user may evaluate output accuracy,  
performance trade-off scenarios in seconds.  
An alternative method is to have the PDTS pin asserted low  
while power supplies and clock sources stabilize.Once the  
power supply and input clock source are constant and within  
the acceptable frequency range, bring PDTS high. This  
approach is preferred if the clock source is derived from  
another PLL, or the source oscillator produces  
unpredictable output pulses prior to stabilization. No  
considerations need to be taken when using a crystal input  
source with VersaClock products.  
Spread Spectrum Modulation  
The ICS341 utilizes frequency modulation (FM) to distribute  
energy over a range of frequencies. By modulating the  
output clock frequencies, the device effectively lowers  
energy across a broader range of frequencies; thus,  
lowering a system’s electro-magnetic interference (EMI).  
IDT® / ICS™ FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
3
ICS341  
REV M 090613  
ICS341  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
EPROM CLOCK SYNTHESIZER  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the ICS341. These ratings, which are  
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these  
or any other conditions above those indicated in the operational sections of the specifications is not implied.  
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical  
parameters are guaranteed only over the recommended operating temperature range.  
Parameter  
Condition  
Min.  
-0.5  
-0.5  
-0.5  
-65  
Typ.  
Max.  
7
Units  
V
Supply Voltage, VDD  
Inputs  
Referenced to GND  
Referenced to GND  
Referenced to GND  
VDD+ 0.5  
VDD+ 0.5  
150  
V
Clock Outputs  
V
Storage Temperature  
Soldering Temperature  
Junction Temperature  
C  
C  
C  
Max 10 seconds  
260  
125  
Recommended Operation Conditions  
Parameter  
Min.  
0
Typ.  
Max.  
+70  
+85  
+3.45  
4
Units  
C  
Ambient Operating Temperature (ICS341M)  
Ambient Operating Temperature (ICS341MI)  
Power Supply Voltage (measured in respect to GND)  
Power Supply Ramp Time  
-40  
C  
+3.15  
+3.3  
V
ms  
IDT® / ICS™ FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
4
ICS341  
REV M 090613  
ICS341  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
EPROM CLOCK SYNTHESIZER  
DC Electrical Characteristics  
Unless stated otherwise, VDD = 3.3V ±±5, Ambient Temperature -40 to +85C  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Units  
V
Operating Voltage  
VDD  
3.15  
3.3  
3.45  
Configuration Dependent  
- See VersaClock  
mA  
TM  
33.3333 MHz output,  
PDTS = 1, no load  
Note 1  
11  
20  
mA  
Operating Supply Current  
Input High Voltage  
IDD  
PDTS = 0  
S1:S0  
A  
V
Input High Voltage  
V
2
IH  
Input Low Voltage  
V
S1:S0  
0.4  
0.4  
V
V
V
V
V
V
IL  
Input High Voltage, PDTS  
Input Low Voltage, PDTS  
Input High Voltage  
V
VDD-0.5  
VDD/2+1  
IH  
V
IL  
V
ICLK  
ICLK  
IH  
Input Low Voltage  
V
VDD/2-1  
IL  
Output High Voltage  
(CMOS High)  
V
I
= -4 mA  
VDD-0.4  
2.4  
OH  
OH  
Output High Voltage  
Output Low Voltage  
Short Circuit Current  
V
I
I
= -12 mA  
= 12 mA  
V
V
OH  
OH  
V
0.4  
OL  
OL  
I
70  
20  
mA  
OS  
Nominal Output  
Impedance  
Z
O
Internal pull-up resistor  
Internal pull-up resistor  
Internal pull-down resistor  
Input Capacitance  
R
R
S1:S0  
250  
250  
525  
4
k  
k  
k  
pF  
PUP  
PUP  
PDTS  
R
CLK output  
inputs  
PD  
C
IN  
Note 1: Example with 25 MHz crystal input with output of 33.3 MHz, no load, and VDD = 3.3 V.  
IDT® / ICS™ FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
5
ICS341  
REV M 090613  
ICS341  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
EPROM CLOCK SYNTHESIZER  
AC Electrical Characteristics  
Unless stated otherwise, VDD = 3.3V ±±5, Ambient Temperature -40 to +85C  
Parameter  
Symbol  
Conditions  
Fundamental Crystal  
Input Clock  
Min.  
5
Typ. Max. Units  
Input Frequency  
F
27  
50  
MHz  
MHz  
MHz  
ns  
IN  
2
Output Frequency  
Output Rise Time  
Output Fall Time  
Duty Cycle  
0.25  
200  
t
20% to 80%, Note 1  
80% to 20%, Note 1  
Note 2  
1
1
OR  
t
ns  
OF  
40  
49-51  
TBD  
60  
%
Output Frequency Synthesis  
Error  
Configuration Dependent  
ppm  
Power-up Time  
PLL lock time from  
power-up  
4
10  
2
ms  
ms  
PDTS goes high until  
stable CLK output,  
Spread Spectrum Off  
.2  
PDTS goes high until  
stable CLK output,  
Spread Spectrum On  
4
7
ms  
One Sigma Clock Period Jitter  
Maximum Absolute Jitter  
Configuration Dependent  
50  
ps  
ps  
t
Deviation from Mean.  
+200  
ja  
Configuration Dependent  
Note 1: Measured with 15 pF load.  
Note 2: Duty Cycle is configuration dependent. Most configurations are minimum 45% and maximum 55%.  
Note 3: ICS test mode output occurs for first 170 clock cycles on CLK for each PLL powered up. PDTS transition  
high on select address change.  
Thermal Characteristics  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
Still air  
150  
140  
120  
40  
C/W  
C/W  
C/W  
C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
Thermal Resistance Junction to Case  
IDT® / ICS™ FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
6
ICS341  
REV M 090613  
ICS341  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
EPROM CLOCK SYNTHESIZER  
Package Outline and Package Dimensions (8-pin SOIC, 1±0 Mil. Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
8
Millimeters  
Inches  
Symbol  
Min  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
Max  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
Min  
Max  
A
A1  
B
C
D
E
e
.0532  
.0040  
.013  
.0688  
.0098  
.020  
E
H
INDEX  
AREA  
.0075  
.1890  
.1497  
.0098  
.1968  
.1574  
1.27 BASIC  
0.050 BASIC  
1
2
H
h
5.80  
0.25  
0.40  
0  
6.20  
0.50  
1.27  
8  
.2284  
.010  
.016  
0  
.2440  
.020  
.050  
8  
D
L
A
h x 45  
A1  
C
- C -  
e
SEATING  
PLANE  
B
L
.10 (.004)  
C
Ordering Information  
Part / Order Number  
341MPLF  
Marking  
341MPLF  
341MPLF  
341MIPLF  
341MIPLF  
341MXXLF  
341MXXLF  
341MIXXL  
341MIXXL  
Shipping Packaging  
Tubes  
Package  
8-pin SOIC  
8-pin SOIC  
8-pin SOIC  
8-pin SOIC  
8-pin SOIC  
8-pin SOIC  
8-pin SOIC  
8-pin SOIC  
Temperature  
0 to +70C  
0 to +70C  
-40 to +85C  
-40 to +85C  
0 to +70C  
0 to +70C  
-40 to +85C  
-40 to +85C  
341MPLFT  
341MIPLF  
341MIPLFT  
341M-XXLF  
341M-XXLFT  
341MI-XXLF  
341MI-XXLFT  
Tape and Reel  
Tubes  
Tape and Reel  
Tubes  
Tape and Reel  
Tubes  
Tape and Reel  
“LF” suffix to the part number denotes Pb-Free configuration, RoHS compliant.  
The 341M-XXLF and 341MI-XXLF are factory programmed versions of the 341MPLF and 341MIPLF. A unique “-XX” suffix is  
assigned by the factory for each custom configuration, and a separate data sheet is kept on file. For more information on custom  
part numbers programmed at the factory, please contact your local IDT sales and marketing representative.  
While the information presented herein has been checked for both accuracy and reliability, IDT assumes no responsibility for either its use  
or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses  
are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended  
temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing  
by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product  
for use in life support devices or critical medical instruments.  
IDT® / ICS™ FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
7
ICS341  
REV M 090613  
ICS341  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
EPROM CLOCK SYNTHESIZER  
Revision History  
Rev.  
Date  
Originator Description of Change  
S. Zheng Added brief applications section/verbiage “Using VersaClock Products with an Input Clock  
Source” on page 3.  
M
09/06/13  
IDT® / ICS™ FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
8
ICS341  
REV M 090613  
ICS341  
FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER  
EPROM CLOCK SYNTHESIZER  
Innovate with IDT and accelerate your future networks. Contact:  
www.IDT.com  
For Sales  
800-345-7015  
408-284-8200  
Fax: 408-284-2775  
For Tech Support  
www.idt.com/go/clockhelp  
Corporate Headquarters  
Integrated Device Technology, Inc.  
www.idt.com  
© 2013 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device  
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered  
trademarks used to identify products or services of their respective owners.  
Printed in USA  

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