7008L20G [IDT]
Dual-Port SRAM, 64KX8, 20ns, CMOS, CPGA84, 1.120 X 1.120 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-84;型号: | 7008L20G |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | Dual-Port SRAM, 64KX8, 20ns, CMOS, CPGA84, 1.120 X 1.120 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-84 静态存储器 |
文件: | 总19页 (文件大小:158K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HIGH-SPEED
IDT7008S/L
64K x 8 DUAL-PORT
STATIC RAM
Features
◆
◆
IDT7008 easily expands data bus width to 16 bits or
more using the Master/Slave select when cascading more
than one device
M/S = VIH for BUSY output flag on Master,
M/S = VIL for BUSY input on Slave
Interrupt Flag
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
TTL-compatible, single 5V (±10%) power supply
Available in 84-pin PGA, 84-pin PLCC, and a 100-pin TQFP
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
◆
◆
– Commercial:15/20/25/35/55ns(max.)
– Industrial:20/55ns (max.)
– Military:25/35/55ns(max.)
Low-power operation
◆
◆
◆
◆
– IDT7008S
Active:750mW(typ.)
Standby: 5mW (typ.)
– IDT7008L
◆
◆
◆
◆
Active:750mW(typ.)
Standby: 1mW (typ.)
Dual chip enables allow for depth expansion without
external logic
◆
◆
Green parts available, see ordering information
FunctionalBlockDiagram
L
R/W
R
R/W
CE0L
CE1L
CE0R
CE
1
R
OEL
OER
I/O
Control
I/O
Control
I/O0-7L
I/O0-7R
(1,2)
BUSYL
(1,2)
BUSYR
64Kx8
MEMORY
ARRAY
7008
15R
A
15L
A
Address
Decoder
Address
Decoder
0R
A
A
0L
16
16
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE0L
CE0R
1L
CE
1R
CE
L
L
OE
R/W
OER
R
R/W
SEM
INTL
L
R
SEM
(2)
(2)
R
INT
M/S(1)
3198 drw 01
NOTES:
1. BUSY is an input as a Slave (M/S = VIL) and an output when it is a Master (M/S = VIH).
2. BUSY and INT are non-tri-state totem-pole outputs (push-pull).
OCTOBER 2008
1
DSC 3198/9
©2008IntegratedDeviceTechnology,Inc.
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Description
The IDT7008 is a high-speed 64K x 8 Dual-Port Static RAM. The reads or writes to any location in memory. An automatic power down
IDT7008isdesignedtobeusedasastand-alone512K-bitDual-PortRAM featurecontrolledbythe chipenables(CE0andCE1)permittheon-chip
orasacombinationMASTER/SLAVEDual-PortRAMfor16-bit-or-more circuitry of each port to enter a very low standby power mode.
wordsystems.UsingtheIDTMASTER/SLAVEDual-PortRAMapproach
FabricatedusingIDT’sCMOShigh-performancetechnology,these
in16-bitorwidermemorysystemapplicationsresultsinfull-speed,error- devices typicallyoperate ononly750mWofpower.
freeoperationwithouttheneedforadditionaldiscretelogic.
TheIDT7008ispackagedina84-pinCeramicPinGridArray(PGA),
This device provides two independent ports with separate control, a84-pinPlasticLeadlessChipCarrier(PLCC)anda100-pinThinQuad
address,andI/Opinsthatpermitindependent,asynchronousaccessfor Flatpack(TQFP).
PinConfigurations(1,2,3)
07/16/04
INDEX
11 10 9
12
8
7
6
5
4
3
2
1 84 83 82 81 80 79 78 77 76 75
74
A
A
A
A
A
A
A
6R
5R
4R
3R
2R
1R
0R
NC
I/O7R
I/O6R
I/O5R
I/O4R
I/O3R
Vcc
73
72
71
70
69
68
67
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
INT
R
R
I/O2R
I/O1R
I/O0R
GND
Vcc
IDT7008J
BUSY
(4)
66
65
64
63
62
61
J84-1
M/S
84-Pin PLCC
Top View
GND
(5)
BUSY
L
L
INT
I/O0L
NC
I/O1
L
A
A
A
A
A
A
A
0L
1L
2L
3L
4L
5L
6L
GND
I/O2L
I/O3L
I/O4L
I/O5L
I/O6L
I/O7L
60
59
58
57
56
55
54
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
,
3198 drw 02
NOTES:
1. This text does not indicate orientation of the actual part marking.
2. All Vcc pins must be connected to power supply.
3. Package body is approximately 1.15 in x 1.15 in x .17 in.
4. This package code is used to reference the package diagram.
5. All GND pins must be connected to ground supply.
2
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations(1,2,3) (con't.)
07/16/04
Index
10099 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
1
NC
NC
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
NC
NC
2
3
A
A
A
7L
8L
9L
A
A
A
A
A
A
A
A
A
7R
4
8R
5
9R
6
A
A
A
A
A
A
10L
11L
12L
13L
14L
15L
10R
11R
12R
13R
14R
15R
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
IDT7008PF
PN100-1
(
4)
NC
Vcc
NC
NC
NC
NC
CE0L
CE1L
NC
GND
NC
NC
NC
NC
CE0R
CE1R
SEM
R/W
OE
GND
GND
NC
100-Pin TQFP
(
5)
Top View
SEM
R/W
OE
L
L
L
R
R
R
GND
NC
NC
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
,
3198 drw 03
NOTES:
1. This text does not indicate orientation of the actual part marking.
2. All Vcc pins must be connected to power supply.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. All GND pins must be connected to ground supply.
3
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations(1,2,3) (con't)
07/16/04
63
66
67
69
72
61
64
65
68
71
60
58
55
54
49
51
50
48
46
45
42
40
11
10
09
08
A
7R
A
9R
A
10R
A
12R
11R
A
15R
NC
GND
NC
NC SEM
R
OER
62
59
56
47
44
43
A
A
A
4R
3R
1R
A
A
A
6R
5R
2R
A
8R
A
A
14R
CE0R R/W
R
GND
NC
I/O6R
CE1R
57
53
52
41
39
A
13R GND
NC
I/O7R I/O5R
38
37
I/O4R I/O3R
73
33
35
34
I/O0R
I/O2R I/O1R
M
INT
R
/S
BUSY
R
07
06
IDT7008G
G84-3
(4)
75
70
74
32
31
36
30
BUSY
L
GND
GND
A0R
Vcc
Vcc
84-PIN PGA
(5)
TOP VIEW
76
77
78
28
29
NC
A
0L
INT
L
1L
3L
GND I/O1
L
I/O0L
05
04
79
80
83
1
26
27
A
A
A
A
A
2L
I/O3L I/O2L
81
82
84
7
8
9
11
12
14
23
25
03
02
01
NC
5L
7L
A
A
A
13L
Vcc
NC
I/O6L I/O4L
2
4
5
6
10
17
20
22
24
A
4L
6L
A
8L
A
11L
14L
15L
CE0L R/W
L
GND I/O7L I/O5L
3
15
13
16
18
19
21
GND
A
A9L
A10L
A12L
NC
G
OE
L
NC
L
SEM
L
CE1L
F
.
A
B
C
D
E
H
J
K
3198 drw 04
INDEX
NOTES:
1. All Vcc pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. Package body is approximately 1.12 in x 1.12 in x .16 in.
PinNames
Left Port
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part marking.
Right Port
Names
Chip Enables
Read/Write Enable
Output Enable
Address
CE0L, CE1L
CE0R, CE1R
R/W
OE
R/WL
R
OEL
R
A0L - A15L
A0R - A15R
I/O0L - I/O7L
SEM
INT
BUSY
I/O0R - I/O7R
Data Input/Output
Semaphore Enable
Interrupt Flag
Busy Flag
L
SEM
INT
BUSY
M/S
R
L
R
L
R
Master or Slave Select
Power
V
CC
GND
Ground
3198 tbl 01
4
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Truth Table I: Chip Enable(1)
CE1
Mode
CE
CE0
VIL
VIH
Port Selected (TTL Active)
L
< 0.2V
>VCC -0.2V
X
Port Selected (CMOS Active)
Port Deselected (TTL Inactive)
Port Deselected (TTL Inactive)
Port Deselected (CMOS Inactive)
Port Deselected (CMOS Inactive)
VIH
X
VIL
H
>VCC -0.2V
X
X
<0.2V
3198 tbl 02
NOTES:
1. Chip Enable references are shown above with the actual CE0 and CE1 levels, CE is a reference only.
Truth Table II: Non-Contention Read/Write Control
Inputs(1)
Outputs
CE(2 )
H
OE
SEM
H
R/W
X
I/O0-7
Mode
X
X
L
High-Z
DATAIN
Deselected: Power-Down
Write to memory
L
L
H
L
H
H
DATAOUT Read memory
High-Z Outputs Disabled
X
X
H
X
3198 tbl 03
NOTES:
1. A0L – A15L ≠ A0R – A15R.
2. Refer to Chip Enable Truth Table.
Truth Table III: Semaphore Read/Write Control(1)
Inputs
Outputs
(2)
R/W
I/O0-7
Mode
CE
OE
SEM
H
H
↑
X
L
L
DATAOUT Read Semaphore Flag Data Out
H
L
X
X
L
L
DATAIN
Write I/O0 into Semaphore Flag
______
Not Allowed
3198 tbl 04
NOTES:
1. There are eight semaphore flags written to via I/O0 and read from all the I/Os (I/O0-I/O7). These eight semaphore flags are addressed by A0-A2.
2. Refer to Chip Enable Truth Table.
5
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AbsoluteMaximumRatings(1)
RecommendedDCOperating
Conditions
Symbol
Rating
Commercial
& Industrial
Military
Unit
Symbol
Parameter
Supply Voltage
GND Ground
Min.
Typ.
Max. Unit
(2)
V
TERM
Terminal Voltage
with Respect
to GND
-0.5 to +7.0
-0.5 to +7.0
V
VCC
4.5
5.0
5.5
0
V
V
V
0
0
T
BIAS
Temperature
Under Bias
-55 to +125
-65 to +150
50
-65 to +135
-65 to +150
50
oC
oC
V
IH
Input High Voltage
Input Low Voltage
2.2
6.0(2)
0.8
____
Storage
Temperature
VIL
-0.5(1)
V
TSTG
____
3198 tbl 07
IOUT
DC Output Current
mA
NOTES:
1. VIL > -1.5V for pulse width less than 10ns.
2. VTERM must not exceed Vcc + 10%.
3198 tbl 05
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect
reliability.
Capacitance
2. VTERM must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of VTERM > Vcc + 10%.
(TA = +25°C, f = 1.0mhz) (TQFP Only)
Symbol
Parameter
Input Capacitance
Output Capacitance
Conditions
Max. Unit
CIN
VIN = 0V
9
pF
(2)
OUT
C
VOUT = 0V
10
pF
3198 tbl 08
MaximumOperatingTemperature
andSupplyVoltage(1)
Ambient
NOTES:
1. This parameter is determined by device characterization but is not production
tested.
2. COUT also references CI/O.
Grade
Temperature
-55OC to+125OC
0OC to +70OC
-40OC to +85OC
GND
Vcc
Military
0V
5.0V
+
+
+
10%
Commercial
Industrial
0V
5.0V
5.0V
10%
10%
0V
3198 tbl 06
NOTES:
1. This is the parameter TA. This is the "instant on" case tempreature.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(2) (VCC = 5.0V ± 10%)
7008S
7008L
Symbol
|ILI
|ILO
Parameter
Test Conditions
VCC = 5.5V, VIN = 0V to VCC
Min.
Max.
10
Min.
Max.
5
Unit
µA
µA
V
(1)
___
___
|
Input Leakage Current
___
___
___
___
|
Output Leakage Current
Output Low Voltage
Output High Voltage
10
5
CE = VIH, VOUT = 0V to VCC
OL = 4mA
OH = -4mA
VOL
I
0.4
0.4
___
___
VOH
I
2.4
2.4
V
3198 tbl 09
NOTES:
1. At Vcc < 2.0V, input leakages are undefined.
2. Refer to Chip Enable Truth Table.
6
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(1,6) (VCC = 5.0V ± 10%)
7008X15
7008X20
Com'l
7008X25
Com'l &
Military
Com'l Only
& Ind
Symbol
Parameter
Dynamic Operating
Current
(Both Ports Active)
Test Condition
Version
COM'L
Typ.(2)
Max.
Typ.(2)
Max.
Typ.(2)
Max.
Unit
ICC
S
L
205
200
365
325
190
180
325
285
180
170
305
265
mA
CE = VIL, Outputs Disabled
SEM = VIH
(3)
f = fMAX
___
___
___
___
___
___
MIL &
IND
S
L
170
170
345
305
180
335
I
SB1
Standby Current
(Both Ports - TTL Level
Inputs)
COM'L
S
L
65
65
110
90
50
50
90
70
40
40
85
60
mA
mA
CE
SEM
f = fMAX
L
= CE
R
= VIH
= VIH
R
= SEM
L
(3)
___
___
___
___
___
___
MIL &
IND
S
L
40
40
100
80
50
85
(5)
ISB2
Standby Current
(One Port - TTL Level
Inputs)
COM'L
S
L
130
130
245
215
115
115
215
185
105
105
200
170
CE"A" = VIL and CE"B" = VIH
Active Port Outputs Disabled,
(3)
f=fMAX
___
___
___
___
___
___
MIL &
IND
S
L
105
105
230
200
SEMR = SEML = VIH
115
220
I
SB3
Full Standby Current
(Both Ports - All CMOS
Level Inputs)
Both Ports CE
CE > VCC - 0.2V
IN > VCC - 0.2V or
IN < 0.2V, f = 0(4)
SEM = SEM > VCC - 0.2V
L
and
COM'L
S
L
1.0
0.2
15
5
1.0
0.2
15
5
1.0
0.2
15
5
mA
mA
R
V
V
___
___
___
___
___
___
MIL &
IND
S
L
1.0
0.2
30
10
0.2
10
R
L
ISB4
Full Standby Current
(One Port - All CMOS
Level Inputs)
COM'L
S
L
120
120
220
190
110
110
190
160
100
100
170
145
CE"A" < 0.2V and
(5)
CE"B" > VCC - 0.2V
SEM = SEM > VCC - 0.2V
R
L
___
___
___
___
___
___
MIL &
IND
S
L
100
100
200
175
V
IN > VCC - 0.2V or VIN < 0.2V
110
195
Active Port Outputs Disabled
(3)
f = fMAX
3198 tbl 10a
7008X35
Com'l &
Military
7008X55
Com'l, Ind
& Military
Symbol
Parameter
Test Condition
Version
COM'L
Typ.(2)
Max.
Typ.(2)
Max.
Unit
ICC
Dynamic Operating Current
(Both Ports Active)
S
L
160
160
295
255
150
150
270
230
mA
CE = VIL, Outputs Disabled
SEM = VIH
(3)
f = fMAX
MIL &
IND
S
L
160
160
335
295
150
150
310
270
I
SB1
Standby Current
(Both Ports - TTL Level
Inputs)
COM'L
S
L
30
30
85
60
20
20
85
60
mA
mA
CE
L
SEM
= CE
R
= VIH
= VIH
R
= SEM
L
MIL &
IND
S
L
20
20
100
80
13
13
100
80
(5)
ISB2
Standby Current
(One Port - TTL Level
Inputs)
COM'L
S
L
95
95
185
155
85
85
165
135
CE"A" = VIL and CE"B" = VIH
Active Port Outputs Disabled,
f=fMAX
SEM
(3)
MIL &
IND
S
L
95
95
215
185
85
85
195
165
R
= SEM
L
= VIH
and
ISB3
Full Standby Current
(Both Ports - All CMOS
Level Inputs)
Both Ports CE
CE > VCC - 0.2V
IN > VCC - 0.2V or
IN < 0.2V, f = 0(4)
SEM = SEM > VCC - 0.2V
L
COM'L
S
L
1.0
0.2
15
5
1.0
0.2
15
5
mA
mA
R
V
V
MIL &
IND
S
L
1.0
0.2
30
10
1.0
0.2
30
10
R
L
ISB4
Full Standby Current
(One Port - All CMOS
Level Inputs)
COM'L
S
L
90
90
160
135
80
80
135
110
CE"A" < 0.2V and
(5)
CE"B" > VCC - 0.2V
SEM = SEM > VCC - 0.2V
R
L
MIL &
IND
S
L
90
90
190
165
80
80
175
150
V
IN > VCC - 0.2V or VIN < 0.2V
Active Port Outputs Disabled
(3)
f = fMAX
3198 tbl 10b
NOTES:
1. 'X' in part numbers indicates power rating (S or L)
2. VCC = 5V, TA = +25°C, and are not production tested. ICCDC = 120mA (Typ.)
3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/ tRC, and using “AC Test Conditions” of input
levels of GND to 3V.
4. f = 0 means no address or control lines change.
5. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
6. Refer to Chip Enable Truth Table.
7
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
5V
5V
AC Test Conditions
Input Pulse Levels
GND to 3.0V
5ns Max.
1.5V
893Ω
893Ω
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
DATAOUT
BUSY
INT
DATAOUT
1.5V
30pF
5pF*
347Ω
347Ω
Figures 1 and 2
3198 tbl 11
,
3198 drw 05
3198 drw 06
Figure 2. Output Test Load
(for tLZ, tHZ, tWZ, tOW)
Figure 1. AC Output Test Load
* Including scope and jig.
Waveform of Read Cycles(5)
tRC
ADDR
(4)
tAA
(4)
CE(6)
tACE
(4)
tAOE
OE
R/W
(1)
tOH
tLZ
VALID DATA(4)
DATAOUT
(2)
t
HZ
BUSYOUT
(3,4)
3198 drw 07
t
BDD
Timing of Power-Up Power-Down
CE(6)
t
PU
tPD
ICC
ISB
,
3198 drw 08
NOTES:
1. Timing depends on which signal is asserted last, OE or CE.
2. Timing depends on which signal is de-asserted first CE or OE.
3. tBDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY
has no relation to valid output data.
4. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA or tBDD.
5. SEM = VIH.
6. Refer to Chip Enable Truth Table.
8
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(6)
7008X15
7008X20
Com'l
7008X25
Com'l &
Military
7008X35
Com'l &
Military
7008X55
Com'l, Ind
& Military
Com'l Only
& Ind
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
READ CYCLE
____
____
____
____
____
t
RC
AA
ACE
AOE
OH
LZ
HZ
PU
PD
SOP
SAA
Read Cycle Time
15
20
25
35
55
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
____
____
____
____
____
t
Address Access Time
15
15
20
20
25
25
35
35
55
55
Chip Enable Access Time(4)
Output Enable Access Time
Output Hold from Address Change
Output Low-Z Time(1,2)
____
____
____
____
____
____
____
____
____
____
t
t
10
12
13
20
30
____
____
____
____
____
t
3
3
3
3
3
____
____
____
____
____
t
3
3
3
3
3
Output High-Z Time(1,2)
10
12
15
15
25
____
____
____
____
____
t
t
Chip Enable to Power Up Time(2)
Chip Disable to Power Down Time(2)
Semaphore Flag Update Pulse (OE or SEM)
Semaphore Address Access Time
0
0
0
0
0
____
____
____
____
____
____
____
____
____
____
t
15
20
25
35
50
____
____
____
____
____
t
10
10
12
15
15
____
____
____
____
____
t
15
20
25
35
55
ns
3198 tbl 12
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltage(6)
7008X15
7008X20
Com'l
7008X25
Com'l &
Military
7008X35
Com'l &
Military
7008X55
Com'l, Ind
& Military
Com'l Only
& Ind
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
WRITE CYCLE
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
t
WC
EW
AW
AS
WP
WR
DW
HZ
DH
WZ
OW
SWRD
SPS
Write Cycle Time
15
12
12
0
20
15
15
0
25
20
20
0
35
30
30
0
55
45
45
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
Chip Enable to End-of-Write(3)
Address Valid to End-of-Write
Address Set-up Time(3)
Write Pulse Width
t
t
t
12
0
15
0
20
0
25
0
40
0
t
Write Recovery Time
t
Data Valid to End-of-Write
Output High-Z Time(1,2)
Data Hold Time(5)
10
15
15
15
30
____
____
____
____
____
t
10
12
15
15
25
____
____
____
____
____
t
0
0
0
0
0
(1,2)
____
____
____
____
____
t
Write Enable to Output in High-Z
Output Active from End-of-Write(1,2,5)
SEM Flag Write to Read Time
SEM Flag Contention Window
10
12
15
15
25
____
____
____
____
____
t
0
5
5
0
5
5
0
5
5
0
5
5
0
5
5
____
____
____
____
____
____
____
____
____
____
t
t
ns
3198 tbl 13
NOTES:
1. Transition is measured 0mV from Low- or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranted by device characterization, but is not production tested.
3. To access RAM, CE= VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. Either condition must be valid for the entire tEW time.
4. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE= VIH and SEM = VIL.
5. The specification for tDH must be met by the device supplying write data to the RAM under all operating conditions. Although tDH and tOW values will vary over voltage
and temperature, the actual tDH will always be smaller than the actual tOW.
6. 'X' in part numbers indicates power rating (s or L).
9
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8)
t
WC
ADDRESS
(7)
t
HZ
OE
tAW
CE or SEM(9,10)
(3)
(2)
(6)
AS
tWP
tWR
t
R/W
DATAOUT
DATAIN
(7)
t
WZ
tOW
(4)
(4)
tDW
t
DH
3198 drw 09
Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,5)
t
WC
ADDRESS
t
AW
CE or SEM(9,10)
(3)
WR
(6)
(2)
t
t
EW
tAS
R/W
t
DW
tDH
DATAIN
3198 drw 10
NOTES:
1. R/W or CE must be HIGH during all address transitions.
2. A write occurs during the overlap (tEW or tWP) of a LOW CE and a LOW R/W for memory array writing cycle.
3. tWR is measured from the earlier of CE or R/W (or SEM or R/W) going HIGH to the end of write cycle.
4. During this period, the I/O pins are in the output state and input signals must not be applied.
5. If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal is asserted last, CE or R/W.
7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load (Figure
2).
8. If OE is LOW during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be
placed on the bus for the required tDW. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as
the specified tWP.
9. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition.
10. Refer to Chip Enable Truth Table.
10
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Semaphore Read after Write Timing, Either Side(1)
tSAA
tOH
A0-A2
VALID ADDRESS
VALID ADDRESS
tAW
tWR
tACE
t
t
EW
SEM
tDW
tSOP
DATAOUT
VALID(2)
DATAIN VALID
DATA
0
t
AS
WP
tDH
R/W
tSWRD
tAOE
OE
tSOP
Write Cycle
Read Cycle
3198 drw 11
NOTES:
1. CE = VIH for the duration of the above timing (both write and read cycle) (Refer to Chip Enable Truth Table).
2. "DATAOUT VALID" represents all I/O's (I/O0 - I/O15) equal to the semaphore value.
Timing Waveform of Semaphore Write Contention(1,3,4)
A
0"A"-A2"A"
MATCH
(2)
SIDE "A"
R/W"A"
SEM"A"
tSPS
A
0"B"-A2"B"
MATCH
(2)
SIDE
R/W"B"
SEM"B"
"B"
3198 drw 12
NOTES:
1. DOR = DOL = VIL, CEL = CER = VIH (Refer to Chip Enable Truth Table).
2. All timing is the same for left and right ports. Port "A" may be either left or right port. "B" is the opposite from port "A".
3. This parameter is measured from R/W"A" or SEM"A" going HIGH to R/W"B" or SEM"B" going HIGH.
4. If tSPS is not satisfied, the semaphore will fall positively to one side or the other, but there is no guarantee which side will obtain the flag.
11
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(6)
7008X15
7008X20
Com'l
7008X25
Com'l &
Military
7008X35
Com'l &
Military
7008X55
Com'l, Ind &
Military
Com'l Only
& Ind
Symbol
BUSY TIMING (M/S=VIH
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max. Unit
)
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
t
BAA
BDA
BAC
BDC
APS
BDD
WH
15
15
15
20
20
20
20
20
20
20
20
20
45
40
40
ns
ns
ns
ns
ns
ns
ns
BUSY Access Time from Address Match
BUSY Disable Time from Address Not Matched
BUSY Access Time from Chip Enable Low
BUSY Access Time from Chip Enable High
Arbitration Priority Set-up Time(2)
t
t
t
15
17
17
20
35
____
____
____
____
____
t
5
5
5
5
5
____
____
____
____
____
BUSY Disable to Valid Data(3)
t
15
20
25
35
55
t
Write Hold After BUSY(5)
12
15
17
25
25
____
____
____
____
____
BUSY TIMING (M/S=VIL
)
____
____
____
____
____
____
____
____
____
____
BUSY Input to Write(4)
Write Hold After BUSY(5)
t
WB
0
0
0
0
0
ns
ns
tWH
12
15
17
25
25
PORT-TO-PORT DELAY TIMING
____
____
____
____
____
____
____
____
____
____
t
WDD
Write Pulse to Data Delay(1)
30
25
45
30
50
35
60
45
80
65
ns
tDDD
Write Data Valid to Read Data Delay(1)
ns
3198 tbl 14
NOTES:
1. Port-to-port delay through RAM cells from writing port to reading port, refer to "Timing Waveform of Write with Port-to-Port Read and BUSY (M/S = VIH)".
2. To ensure that the earlier of the two ports wins.
3. tBDD is a calculated parameter and is the greater of 0, tWDD – tWP (actual) or tDDD – tDW (actual).
4. To ensure that the write cycle is inhibited on port "B" during contention on port "A".
5. To ensure that a write cycle is completed on port "B" after contention on port "A".
6. 'X' in part numbers indicates power rating (S or L).
12
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
TimingWaveformof WritewithPort-to-PortReadandBUSY(2,5)(M/S =VIH)(4)
tWC
ADDR"A"
MATCH
tWP
R/W"A"
tDH
tDW
DATAIN "A"
VALID
(1)
tAPS
ADDR"B"
MATCH
tBDA
t
BDD
BUSY"B"
tWDD
DATAOUT "B"
VALID
(3)
tDDD
NOTES:
3198 drw 13
1. To ensure that the earlier of the two ports wins. tAPS is ignored for M/S = VIL (SLAVE).
2. CEL = CER = VIL, refer to Chip Enable Truth Table.
3. OE = VIL for the reading port.
4. If M/S = VIL (SLAVE), then BUSY is an input (BUSY"A" = VIH and BUSY"B" = "don't care", for this example).
5. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from port "A".
Timing Waveform of Write with BUSY (M/S = VIL)
tWP
R/W"A"
(3)
tWB
BUSY"B"
(1)
tWH
R/W"B"
(2)
,
3198 drw 14
NOTES:
1. tWH must be met for both BUSY input (SLAVE) and output (MASTER).
2. BUSY is asserted on port "B" blocking R/W"B", until BUSY"B" goes HIGH.
3. tWB is only for the 'Slave' version.
13
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Waveform of BUSY Arbitration Controlled by CE Timing(1,3) (M/S = VIH)
ADDR"A"
ADDRESSES MATCH
and "B"
CE"A"
(2)
tAPS
CE"B"
tBAC
tBDC
BUSY"B"
3198 drw 15
Waveform of BUSY Arbitration Cycle Controlled by Address Match
Timing(1) (M/S = VIH)
ADDR"A"
ADDR"B"
BUSY"B"
ADDRESS "N"
(2)
t
APS
MATCHING ADDRESS "N"
t
BAA
tBDA
3198 drw 16
NOTES:
1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from port “A”.
2. If tAPS is not satisfied, the BUSY signal will be asserted on one side or another but there is no guarantee on which side BUSY will be asserted.
3. Refer to Chip Enable Truth Table.
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(1)
7008X15
7008X20
Com'l
7008X25
Com'l &
Military
7008X35
Com'l &
Military
7008X55
Com'l, Ind
& Military
Com'l Only
& Ind
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
INTERRUPT TIMING
____
____
____
____
____
____
____
____
____
____
t
AS
WR
INS
INR
Address Set-up Time
0
0
0
0
0
ns
ns
ns
t
Write Recovery Time
Interrupt Set Time
0
0
0
0
0
____
____
____
____
____
t
15
15
20
20
20
20
25
25
40
40
____
____
____
____
____
t
Interrupt Reset Time
ns
3198 tbl 15
NOTES:
1. 'X' in part numbers indicates power rating (S or L).
14
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Waveform of Interrupt Timing(1,5)
t
WC
INTERRUPT SET ADDRESS(2)
ADDR"A"
(3)
(4)
tAS
tWR
CE"A"
R/W"A"
INT"B"
(3)
tINS
3198 drw 17
tRC
INTERRUPT CLEAR ADDRESS(2)
ADDR"B"
CE"B"
(3)
t
AS
OE"B"
(3)
tINR
INT"B"
3198 drw 18
NOTES:
1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from port “A”.
2. See Interrupt Truth Table.
3. Timing depends on which enable signal (CE or R/W) is asserted last.
4. Timing depends on which enable signal (CE or R/W) is de-asserted first.
5. Refer to Chip Enable Truth Table.
Truth Table IV — Interrupt Flag(1,4,5)
Left Port
Right Port
OE
R/W
L
A
15L-A0L
R/W
R
A15R-A0R
Function
CE
L
OE
L
INT
L
CE
X
L
R
INTR
(2)
L
X
X
X
L
FFFF
X
X
X
X
L
X
L
Set Right INT
Reset Right INT
Set Left INT Flag
Reset Left INT Flag
R
Flag
(3
)
X
X
X
L
X
X
FFFF
FFFE
X
H
R
Flag
(3)
X
X
L
L
L
X
X
X
L
(2)
X
FFFE
H
X
X
X
L
3198 tbl 16
NOTES:
1. Assumes BUSYL = BUSYR =VIH.
2. If BUSYL = VIL, then no change.
3. If BUSYR = VIL, then no change.
4. INTL and INTR must be initialized at power-up.
5. Refer to Chip Enable Truth Table.
15
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Truth Table V —Address BUSY
Arbitration(4)
Inputs
Outputs
A
OL-A15L
(1)
A
OR-A15R
Function
Normal
Normal
Normal
Write
CE
L
CE
R
BUSY (1)
L
BUSY
R
X
H
X
X
X
H
NO MATCH
MATCH
H
H
H
H
H
MATCH
H
L
L
MATCH
(2)
(2)
(3)
Inhibit
3198 tbl 17
NOTES:
1. Pins BUSYL and BUSYR are both outputs when the part is configured as a master. Both are inputs when configured as a slave. BUSY outputs on the IDT7008 are
push-pull, not open drain outputs. On slaves the BUSY input internally inhibits writes.
2. "L" if the inputs to the opposite port were stable prior to the address and enable inputs of this port. "H" if the inputs to the opposite port became stable after the address
and enable inputs of this port. If tAPS is not met, either BUSYL or BUSYR = LOW will result. BUSYL and BUSYR outputs can not be LOW simultaneously.
3. Writes to the left port are internally ignored when BUSYL outputs are driving LOW regardless of actual logic level on the pin. Writes to the right port are internally ignored
when BUSYR outputs are driving LOW regardless of actual logic level on the pin.
4. Refer to Chip Enable Truth Table.
Truth Table VI — Example of Semaphore Procurement Sequence(1,2,3)
Functions
D0
- D7
Left
D0
- D7
Right
Status
No Action
1
0
0
1
1
0
1
1
1
0
1
1
1
1
0
0
1
1
0
1
1
1
Semaphore free
Left Port Writes "0" to Semaphore
Right Port Writes "0" to Semaphore
Left Port Writes "1" to Semaphore
Left Port Writes "0" to Semaphore
Right Port Writes "1" to Semaphore
Left Port Writes "1" to Semaphore
Right Port Writes "0" to Semaphore
Right Port Writes "1" to Semaphore
Left Port Writes "0" to Semaphore
Left Port Writes "1" to Semaphore
Left port has semaphore token
No change. Right side has no write access to semaphore
Right port obtains semaphore token
No change. Left port has no write access to semaphore
Left port obtains semaphore token
Semaphore free
Right port has semaphore token
Semaphore free
Left port has semaphore token
Semaphore free
3198 tbl 18
NOTES:
1. This table denotes a sequence of events for only one of the eight semaphores on the IDT7008.
2. There are eight semaphore flags written to via I/O0 and read from all I/O's (I/O0-I/O7). These eight semaphores are addressed by A0-A2.
3. CE = VIH, SEM = VIL to access the semaphores. Refer to the Semaphore Read/Write Control Truth Table.
FunctionalDescription
TheIDT7008providestwoportswithseparatecontrol,addressand (INTL) is asserted when the right port writes to memory location FFFE
I/Opinsthatpermitindependentaccessforreadsorwritestoanylocation (HEX),whereawriteisdefinedasCER=R/WR=VILpertheTruthTable.
inmemory.TheIDT7008hasanautomaticpowerdownfeaturecontrolled TheleftportclearstheinterruptthroughaccessofaddresslocationFFFE
byCE. TheCE0and CE1 control the on-chip power down circuitry that when CEL = OEL = VIL, R/W is a "don't care". Likewise, the right port
permitstherespectiveporttogointoastandbymodewhennotselected interruptflag(INTR)isassertedwhentheleftportwritestomemorylocation
(CEHIGH).Whenaportis enabled,access totheentirememoryarray FFFF(HEX)andtocleartheinterruptflag(INTR),therightportmustread
ispermitted.
thememorylocationFFFF. Themessage(8bits)atFFFEorFFFFisuser-
definedsinceitisanaddressableSRAMlocation.Iftheinterruptfunction
isnotused,addresslocationsFFFEandFFFFarenotusedasmailboxes,
butaspartoftherandomaccessmemory.RefertoTableIVfortheinterrupt
operation.
Interrupts
Iftheuserchoosestheinterruptfunction,amemorylocation(mailbox
ormessagecenter)is assignedtoeachport. Theleftportinterruptflag
16
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
resultina glitchedinternalwrite inhibitsignalandcorrupteddata inthe
slave.
BusyLogic
BusyLogicprovidesahardwareindicationthatbothportsoftheRAM
haveaccessedthesamelocationatthesametime.Italsoallowsoneofthe
twoaccessestoproceedandsignalstheothersidethattheRAMis“busy”.
TheBUSYpincanthenbeusedtostalltheaccessuntiltheoperationon
theothersideiscompleted.Ifawriteoperationhasbeenattemptedfrom
thesidethatreceivesaBUSYindication,thewritesignalisgatedinternally
topreventthewritefromproceeding.
Semaphores
TheIDT7008isanextremelyfastDual-Port64Kx8CMOSStaticRAM
withanadditional8addresslocationsdedicatedtobinarysemaphoreflags.
TheseflagsalloweitherprocessorontheleftorrightsideoftheDual-Port
RAMtoclaimaprivilegeovertheotherprocessorforfunctionsdefinedby
thesystemdesigner’ssoftware.Asanexample,thesemaphorecanbe
usedbyoneprocessortoinhibittheotherfromaccessingaportionofthe
Dual-Port RAM or any other shared resource.
TheuseofBUSYlogicisnotrequiredordesirableforallapplications.
InsomecasesitmaybeusefultologicallyORtheBUSYoutputstogether
anduse anyBUSYindicationas aninterruptsource toflagthe eventof
anillegalorillogicaloperation.IfthewriteinhibitfunctionofBUSYlogicis
notdesirable,theBUSYlogiccanbedisabledbyplacingthepartinslave
modewiththeM/Spin.OnceinslavemodetheBUSYpinoperatessolely
asawriteinhibitinputpin.Normaloperationcanbeprogrammedbytying
the BUSY pins HIGH. If desired, unintended write operations can be
prevented to a port by tying the BUSY pin for that port LOW.
TheBUSYoutputsontheIDT7008RAMinmastermode,arepush-
pulltypeoutputsanddonotrequirepullupresistorstooperate.Ifthese
RAMs are being expanded in depth, then the BUSY indication for the
resulting array requires the use of an external AND gate.
The Dual-PortRAMfeatures a fastaccess time, andbothports are
completelyindependentofeachother.Thismeansthattheactivityonthe
leftportinnowayslows theaccess timeoftherightport.Bothports are
identicalinfunctiontostandardCMOSStaticRAMandcanbereadfrom,
orwrittento,atthesametimewiththeonlypossibleconflictarisingfromthe
simultaneous writing of, or a simultaneous READ/WRITE of, a non-
semaphorelocation.Semaphoresareprotectedagainstsuchambiguous
situationsandmaybeusedbythesystemprogramtoavoidanyconflicts
inthenon-semaphoreportionoftheDual-PortRAM.Thesedeviceshave
anautomaticpower-downfeaturecontrolledbyCE,theDual-PortRAM
enable,andSEM,thesemaphoreenable.TheCEandSEMpinscontrol
on-chippowerdowncircuitrythatpermits the respective porttogointo
standbymodewhennotselected. Thisistheconditionwhichisshownin
Truth Table II where CE and SEM are both HIGH.
A
16
CE0
CE0
MASTER
Dual Port RAM
SLAVE
Dual Port RAM
BUSY (L) BUSY (R)
BUSY (L) BUSY (R)
SystemswhichcanbestusetheIDT7008containmultipleprocessors
or controllers and are typically very high-speed systems which are
softwarecontrolledorsoftwareintensive.Thesesystemscanbenefitfrom
aperformanceincreaseofferedbytheIDT7008shardwaresemaphores,
whichprovidealockoutmechanismwithoutrequiringcomplexprogram-
ming.
CE
1
CE1
MASTER
Dual Port RAM
SLAVE
Dual Port RAM
BUSY (L) BUSY (R)
BUSY (L) BUSY (R)
,
3198 drw 19
Softwarehandshakingbetweenprocessors offers themaximumin
systemflexibilitybypermittingsharedresourcestobeallocatedinvarying
configurations.TheIDT7008doesnotuseitssemaphoreflagstocontrol
anyresourcesthroughhardware,thusallowingthesystemdesignertotal
flexibilityinsystemarchitecture.
An advantage of using semaphores rather than the more common
methodsofhardwarearbitrationisthatwaitstatesareneverincurredin
either processor. This can prove to be a major advantage in very high-
speedsystems.
Figure 3. Busy and chip enable routing for both width and depth
expansion with IDT7008 RAMs.
WidthExpansionBusyLogic
Master/SlaveArrays
WhenexpandinganIDT7008RAMarrayinwidthwhileusingBUSY
logic,onemasterpartisusedtodecidewhichsideoftheRAMsarraywill
receivea BUSYindication,andtooutputthatindication.Anynumberof
slaves to be addressed in the same address range as the master, use
the BUSYsignalasawriteinhibitsignal.ThusontheIDT7008RAMthe
How the Semaphore Flags Work
Thesemaphorelogicisasetofeightlatcheswhichareindependent
BUSYpinisanoutputifthepartisusedasamaster(M/Spin=VIH),and oftheDual-PortRAM.Theselatchescanbeusedtopassaflag,ortoken,
theBUSYpinisaninputifthepartusedasaslave(M/Spin=VIL)as shown fromoneporttotheothertoindicatethatasharedresourceisinuse.The
in Figure 3.
semaphores provide a hardware assist for a use assignment method
Iftwoormoremasterpartswereusedwhenexpandinginwidth,asplit called“TokenPassingAllocation.”Inthismethod,thestateofasemaphore
decisioncouldresultwithonemasterindicatingBUSYononesideofthe latchisusedasatokenindicatingthatsharedresourceisinuse.Iftheleft
arrayandanothermasterindicatingBUSYononeothersideofthearray. processorwantstousethisresource,itrequeststhetokenbysettingthe
Thiswouldinhibitthewriteoperationsfromoneportforpartofawordand latch.Thisprocessorthenverifiesitssuccessinsettingthelatchbyreading
inhibitthewriteoperationsfromtheotherportfortheotherpartoftheword. it. If it was successful, it proceeds to assume control over the shared
TheBUSYarbitration,onamaster,is basedonthechipenableand resource.Ifitwasnotsuccessfulinsettingthelatch,itdeterminesthatthe
address signals only. Itignores whetheranaccess is a readorwrite. In rightsideprocessorhassetthelatchfirst, hasthetokenandisusingthe
a master/slave array, both address and chip enable must be valid long sharedresource. Theleftprocessorcantheneitherrepeatedlyrequest
enoughforaBUSYflagtobeoutputfromthemasterbeforetheactualwrite thatsemaphore’sstatusorremoveitsrequestforthatsemaphoretoperform
pulsecanbeinitiatedwiththeR/Wsignal.Failuretoobservethistimingcan anothertaskandoccasionallyattemptagaintogaincontrolofthetokenvia
17
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
thesetandtestsequence.Oncetherightsidehasrelinquishedthetoken, side during subsequent read. Had a sequence of READ/WRITE been
theleftsideshouldsucceedingainingcontrol. usedinstead,systemcontentionproblemscouldhaveoccurredduringthe
ThesemaphoreflagsareactiveLOW.Atokenisrequestedbywriting gap between the read and write cycles.
azerointoasemaphorelatchandisreleasedwhenthesamesidewrites
aonetothatlatch.
Itisimportanttonotethatafailedsemaphorerequestmustbefollowed
byeitherrepeatedreadsorbywritingaoneintothesamelocation.The
The eightsemaphore flags reside withinthe IDT7008ina separate reasonforthisiseasilyunderstoodbylookingatthesimplelogicdiagram
memoryspacefromtheDual-PortRAM.This addressspaceisaccessed ofthesemaphoreflaginFigure4.Twosemaphorerequestlatchesfeed
byplacingaLOWinputontheSEMpin(whichactsasachipselectforthe into a semaphore flag. Whichever latch is first to present a zero to the
semaphore flags) and using the other control pins (Address, CE, and semaphoreflagwillforceitssideofthesemaphoreflagLOWandtheother
R/W)as theywouldbeusedinaccessingastandardStaticRAM.Each sideHIGH.Thisconditionwillcontinueuntilaoneiswrittentothesame
oftheflagshasauniqueaddresswhichcanbeaccessedbyeitherside semaphorerequestlatch.Shouldtheotherside’ssemaphorerequestlatch
throughaddresspinsA0–A2.Whenaccessingthesemaphores,noneof havebeenwrittentoazerointhemeantime,thesemaphoreflagwillflip
theotheraddresspinshasanyeffect.
Whenwritingtoasemaphore,onlydatapinD0isused.IfaLOWlevel
L PORT
R PORT
iswrittenintoanunusedsemaphorelocation,thatflagwillbesettoazero
onthatsideandaoneontheotherside(seeTableVI).Thatsemaphore
can now only be modified by the side showing the zero. When a one is
writtenintothesamelocationfromthesameside,theflagwillbesettoa
one for both sides (unless a semaphore request from the other side is
pending)andthencanbewrittentobybothsides.Thefactthattheside
whichisabletowriteazerointoasemaphoresubsequentlylocksoutwrites
fromtheothersideiswhatmakessemaphoreflagsusefulininterprocessor
communications.(Athoroughdiscussionontheuseofthisfeaturefollows
shortly.)Azerowrittenintothesamelocationfromtheothersidewillbe
storedinthesemaphorerequestlatchforthatsideuntilthesemaphoreis
freedbythefirstside.
Whenasemaphoreflagisread,itsvalueisspreadintoalldatabitsso
thataflagthatisaonereadsasaoneinalldatabitsandaflagcontaining
azeroreadsasallzeros.Thereadvalueislatchedintooneside’soutput
registerwhenthatside'ssemaphoreselect(SEM)andoutputenable(OE)
signalsgoactive.Thisservestodisallowthesemaphorefromchanging
stateinthemiddleofareadcycleduetoawritecyclefromtheotherside.
Becauseofthislatch,arepeatedreadofasemaphoreinatestloopmust
cause either signal (SEM or OE) to go inactive or the output will never
change.
AsequenceWRITE/READmustbeusedbythesemaphoreinorder
to guarantee that no system level contention will occur. A processor
requestsaccesstosharedresourcesbyattemptingtowriteazerointoa
semaphorelocation.Ifthesemaphoreisalreadyinuse,thesemaphore
requestlatchwillcontainazero,yetthesemaphoreflagwillappearasone,
afactwhichtheprocessorwillverifybythesubsequentread(seeTable
VI). As anexample, assume a processorwrites a zerotothe leftportat
afreesemaphorelocation.Onasubsequentread,theprocessorwillverify
thatithaswrittensuccessfullytothatlocationandwillassumecontrolover
the resource in question. Meanwhile, if a processor on the right side
attempts towriteazerotothesamesemaphoreflagitwillfail,as willbe
verifiedbythefactthataonewillbereadfromthatsemaphoreontheright
SEMAPHORE
REQUEST FLIP FLOP
SEMAPHORE
REQUEST FLIP FLOP
0
0
D
D
D
D
Q
Q
WRITE
WRITE
SEMAPHORE
READ
SEMAPHORE
,
READ
3198 drw 20
Figure 4. IDT7008 Semaphore Logic
overtotheothersideassoonasaoneiswrittenintothefirstside’srequest
latch.Thesecondside’sflagwillnowstayLOWuntilitssemaphorerequest
latchiswrittentoaone.Fromthisitiseasytounderstandthat,ifasemaphore
is requestedandthe processorwhichrequesteditnolongerneeds the
resource, the entire system can hang up until a one is written into that
semaphorerequestlatch.
The criticalcase ofsemaphore timingis whenbothsides requesta
single token by attempting to write a zero into it at the same time. The
semaphorelogicisspeciallydesignedtoresolvethisproblem.Ifsimulta-
neousrequestsaremade,thelogicguaranteesthatonlyonesidereceives
thetoken.Ifonesideisearlierthantheotherinmakingtherequest,thefirst
sidetomaketherequestwillreceivethetoken.Ifbothrequestsarriveat
thesametime,theassignmentwillbearbitrarilymadetooneportorthe
other.
One caution that should be noted when using semaphores is that
semaphoresalonedonotguaranteethataccesstoaresourceissecure.
Aswithanypowerfulprogrammingtechnique,ifsemaphoresaremisused
ormisinterpreted, a software errorcaneasilyhappen.
Initializationofthesemaphoresisnotautomaticandmustbehandled
viatheinitializationprogramatpower-up.Sinceanysemaphorerequest
flagwhichcontainsazeromustberesettoaone,allsemaphoresonboth
sidesshouldhaveaonewrittenintothematinitializationfrombothsides
to assure that they will be free when needed.
18
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
OrderingInformation
XXXXX
A
999
A
A
Device
Type
Power
Speed
Package
Process/
Temperature
Range
Blank
I(1)
B
Commercial (0°C to +70°C)
Industrial (-40°C to + 85°C)
Military (-55°C to +125°C)
Compliant to MIL-PRF-38535 QML
PF
G
J
100-pin TQFP (PN100-1)
108-pin PGA (G108-1)
84-pin PLCC (J84-1)
Commercial Only
Commercial & Industrial
Commercial & Military
Commercial & Military
15
20
25
35
55
Speed in nanoseconds
Commercial, Industrial & Military
S
L
Standard Power
Low Power
512K (64K x 8) Dual-Port RAM
7008
NOTES:
3198 drw 21
1. IndustrialtemperaturerangeisavailableonselectedTQFPpackagesinstandardpower.
Forotherspeeds,packagesandpowerscontactyoursalesoffice.
2. Greenpartsavailable.Forspecificspeeds,packagesandpowerscontactyourlocalsalesoffice.
DatasheetDocumentHistory
01/06/99:
Initiateddatasheetdocumenthistory
Convertedtonewformat
Cosmeticandtypographicalcorrections
Addedadditionalnotestopinconfigurations
Changeddrawingformat
Replaced IDT logo
Increasedstoragetemperatureparameter
ClarifiedTAparameter
DCElectricalparamters–changedwordingfrom"open"to"disabled"
Changed±200mVto0mVinnotes
Addeddaterevisionforpinconfigurations
UpdatedCapacitancetable
Pages 2 and 3
06/03/99:
11/10/99:
05/08/99:
Page 6
Page 7
07/26/04:
Page 2 - 4
Page 6
Page 7
Added15nscommercialspeedgradetotheDCElectricalCharacteristics
Added 20nsIndustrialtempforlowpower toDCElectricalCharacteristics
Page 9, 12 & 14 Added15nscommercialspeedgrade toACElectricalCharacteristics
Added20nsIndustrialtempforlowpowertoACElectricalCharacteristicsforRead,Write,BusyandInterrupt
AddedCommercialfor15nsandIndustrialtempto20nsinorderinginformation
Replaced old TM logo with new TM logo
Page 19
Page 1 & 19
Page 1
04/03/06:
10/21/08:
Addedgreenavailabilitytofeatures
Page 19
Page 19
Addedgreenindicatortoorderinginformation
Removed "IDT" from orderable part number
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fax: 408-284-2775
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19
6.42
相关型号:
7008L20GI
Dual-Port SRAM, 64KX8, 20ns, CMOS, CPGA84, 1.120 X 1.120 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-84
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