71V124SA15Y8 [IDT]

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32;
71V124SA15Y8
型号: 71V124SA15Y8
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32

静态存储器 光电二极管
文件: 总8页 (文件大小:115K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
3.3V CMOS Static RAM  
1 Meg (128K x 8-Bit)  
Center Power &  
IDT71V124SA/HSA  
Ground Pinout  
Features  
Description  
128K x 8 advanced high-speed CMOS static RAM  
JEDEC revolutionary pinout (center power/GND) for  
reduced noise  
TheIDT71V124isa1,048,576-bithigh-speedstaticRAMorganized  
as128Kx8.ItisfabricatedusingIDT’shigh-performance,high-reliability  
CMOStechnology.Thisstate-of-the-arttechnology,combinedwithinno-  
vativecircuitdesigntechniques,providesacost-effectivesolutionforhigh-  
speedmemoryneeds. The JEDECcenterpower/GNDpinoutreduces  
noisegenerationandimprovessystemperformance.  
Equal access and cycle times  
– Commercial:10/12/15/20ns  
Industrial:10/12/15/20ns  
One Chip Select plus one Output Enable pin  
Inputs and outputs are LVTTL-compatible  
Single 3.3V supply  
Low power consumption via chip deselect  
Available in a 32-pin 300- and 400-mil Plastic SOJ, and  
32-pin Type II TSOP packages.  
TheIDT71V124has anoutputenablepinwhichoperates as fastas  
5ns, with address access times as fast as 9ns available. All bidirec-  
tionalinputs andoutputs oftheIDT71V124areLVTTL-compatibleand  
operation is from a single 3.3V supply. Fully static asynchronous  
circuitry is used; no clocks or refreshes are required for operation.  
FunctionalBlockDiagram  
A0  
1,048,576-BIT  
MEMORY ARRAY  
ADDRESS  
DECODER  
A16  
8
8
I/O0 - I/O7  
I/O CONTROL  
.
8
WE  
OE  
CS  
CONTROL  
LOGIC  
3873 drw 01  
OCTOBER 2008  
1
DSC-3873/09  
©2007-IntegratedDeviceTechnology,Inc.  
IDT71V124SA, 3.3V CMOS Static RAM  
1 Meg (128K x 8-Bit) Center Power & Ground Pinout  
Commercial and Industrial Temperature Ranges  
AbsoluteMaximumRatings(1)  
PinConfiguration  
Symbol  
Rating  
Value  
Unit  
A
16  
A
A
A
A
0
1
2
3
4
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
Supply Voltage Relative  
to GND  
-0.5 to +4.6  
V
VDD  
1
2
3
A15  
A14  
A13  
Terminal Voltage Relative  
to GND  
-0.5 to VDD+0.5  
V
VIN, VOUT  
CS  
I/O  
I/O1  
5
6
7
8
OE  
I/O  
I/O  
0
7
SO32-2  
SO32-3  
SO32-4  
Commercial  
Operating Temperature  
6
-0 to +70  
VDD  
GND  
TA  
oC  
VDD  
GND  
I/O  
I/O  
WE  
9
Industrial  
-40 to +85  
2
10  
11  
12  
13  
14  
15  
16  
I/O  
I/O  
5
Operating Temperature  
4
3
.
T
BIAS  
Temperature Under Bias  
Storage Temperature  
Power Dissipation  
-55 to +125  
-55 to +125  
1.25  
oC  
oC  
W
A
A
A
A
A
12  
A4  
A5  
A6  
A7  
11  
10  
9
TSTG  
P
T
8
IOUT  
DC Output Current  
50  
mA  
3873 drw 02  
3873 tbl 02  
NOTE:  
1. StressesgreaterthanthoselistedunderABSOLUTEMAXIMUMRATINGSmaycause  
permanentdamagetothedevice.Thisisastressratingonlyandfunctionaloperation  
ofthedeviceattheseoranyotherconditionsabovethoseindicatedintheoperational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditionsforextendedperiodsmayaffectreliabilty.  
SOJ and TSOP  
Top View  
Truth Table(1)  
RecommendedOperatingTempera-  
ture and Supply Voltage  
I/O  
Function  
CS  
OE  
WE  
L
L
H
DATAOUT Read Data  
DATAIN Write Data  
Grade  
Temperature  
0°C to +70°C  
-40°C to +85°C  
GND  
VDD  
L
X
H
X
L
Commercial  
Industrial  
0V  
See Below  
L
H
High-Z Output Disabled  
0V  
See Below  
H
X
High-Z Deselected – Standby  
3873 tbl 02a  
3873 tbl 01  
NOTE:  
RecommendedDCOperating  
Conditions  
1. H = VIH, L = VIL, X = Don't care.  
Symbol  
Parameter  
Min. Typ.  
Max.  
Unit  
V
Capacitance  
(1)  
V
DD  
Supply Voltage  
3.15  
3.0  
3.3  
3.3  
3.6  
3.6  
0
(TA = +25°C, f = 1.0MHz, SOJ package)  
(2)  
DD  
V
Supply Voltage  
Ground  
V
Symbol  
Parameter(1)  
Input Capacitance  
I/O Capacitance  
Conditions  
IN = 3dV  
OUT = 3dV  
Max. Unit  
V
SS  
IH  
IL  
0
0
V
CIN  
V
6
7
pF  
V
Input High Voltage  
Input Low Voltage  
2.0  
V
DD+0.3(3)  
V
____  
CI/O  
V
pF  
____  
V
–0.5(1)  
0.8  
V
3873 tbl 03  
NOTE:  
3873 tbl 04  
1. Thisparameterisguaranteedbydevicecharacterization,butisnotproductiontested.  
NOTES:  
1. For 71V124SA10 only.  
2. For all speed grades except 71V124SA10.  
3. VIH (max.) = VDD+2V for pulse width less than 5ns, once per cycle.  
4. VIL (min.) = –2V for pulse width less than 5ns, once per cycle.  
DC Electrical Characteristics  
(VDD = Min. to Max., Commercial and Industrial Temperature Ranges)  
Symbol  
|ILI  
|ILO  
Parameter  
Input Leakage Current  
Output Leakage Current  
Output Low Voltage  
Test Conditions  
DD = Max., VIN = GND to VDD  
DD = Max.,CS IH, VOUT = GND to VDD  
OL = 8mA, VDD = Min.  
OH = –4mA, VDD = Min.  
Min.  
Max.  
Unit  
µA  
µA  
V
___  
|
V
5
5
___  
___  
|
V
= V  
VOL  
I
0.4  
___  
VOH  
Output High Voltage  
I
2.4  
V
3873 tbl 05  
2
IDT71V124SA, 3.3V CMOS Static RAM  
1 Meg (128K x 8-Bit) Center Power & Ground Pinout  
Commercial and Industrial Temperature Ranges  
DC Electrical Characteristics(1, 2)  
(VDD = Min. to Max., VLC = 0.2V, VHC = VDD – 0.2V)  
71V124SA10  
71V124SA12  
71V124SA15  
71V124SA20  
Symbol  
Parameter  
Dynamic Operating Current  
Com'l  
Ind  
Com'l  
Ind  
Com'l  
Ind  
Com'l  
Ind  
Unit  
mA  
ICC  
145  
150  
130  
140  
100  
120  
95  
115  
(3)  
CS < VLC, Outputs Open, VDD = Max., f = fMAX  
mA  
I
SB  
Dynamic Standby Power Supply Current  
45  
10  
50  
10  
40  
10  
40  
10  
35  
10  
40  
10  
30  
10  
35  
10  
(3)  
CS > VHC, Outputs Open, VDD = Max., f = fMAX  
mA  
ISB1  
Full Standby Power Supply Current (static)  
CS > VHC, Outputs Open, VDD = Max., f = 0(3)  
3873 tbl 06  
NOTES:  
1. Allvaluesaremaximumguaranteedvalues.  
2. All inputs switch between 0.2V (Low) and VDD–0.2V (High).  
3. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing.  
AC Test Conditions  
Input Pulse Levels  
GND to 3.0V  
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
AC Test Load  
3ns  
1.5V  
1.5V  
See Figure 1 and 2  
3873 tbl 07  
3.3V  
320  
350Ω  
+1.5V  
DATAOUT  
50  
5pF*  
I/O  
Z0 = 50Ω  
30pF  
3873 drw 03  
3873 drw 04  
.
Figure 1. AC Test Load  
*Including jig and scope capacitance.  
Figure 2. AC Test Load  
(for tCLZ, tOLZ, tCHZ, tOHZ, tOW, and tWHZ)  
3
6.42  
IDT71V124SA, 3.3V CMOS Static RAM  
1 Meg (128K x 8-Bit) Center Power & Ground Pinout  
Commercial and Industrial Temperature Ranges  
AC Electrical Characteristics  
(VDD = Min. to Max., Commercial and Industrial Temperature Ranges)  
71V124SA10  
71V124SA12  
71V124SA15  
71V124SA20  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Symbol  
Parameter  
Unit  
READ CYCLE  
____  
____  
____  
____  
t
RC  
AA  
ACS  
Read Cycle Time  
10  
12  
15  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
____  
____  
____  
____  
t
Address Access Time  
10  
12  
15  
20  
____  
____  
____  
____  
t
Chip Select Access Time  
10  
12  
15  
20  
(1)  
CLZ  
____  
____  
____  
____  
t
Chip Select to Output in Low-Z  
Chip Deselect to Output in High-Z  
Output Enable to Output Valid  
Output Enable to Output in Low-Z  
OutputDisable to Output in High-Z  
Output Hold from Address Change  
4
4
4
4
(1)  
tCHZ  
0
5
0
6
0
7
0
8
____  
____  
____  
____  
tOE  
5
6
7
8
(1)  
(1)  
____  
____  
____  
____  
tOLZ  
0
0
4
0
0
4
0
0
4
0
0
4
tOHZ  
5
5
5
7
____  
____  
____  
____  
tOH  
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
AW  
CW  
AS  
WP  
WR  
DW  
DH  
Write Cycle Time  
10  
7
7
0
7
0
5
0
3
0
12  
8
8
0
8
0
6
0
3
0
15  
10  
10  
0
20  
12  
12  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Address Valid to End-of-Write  
Chip Select to End-of-Write  
Address Set-up Time  
t
t
t
Write Pulse Width  
10  
0
12  
0
t
Write Recovery Time  
t
Data Valid to End-of-Write  
Data Hold Time  
7
9
t
0
0
(2)  
OW  
t
Output Active from End-of-Write  
Write Enable to Output in High-Z  
3
4
(2)  
WHZ  
t
5
5
0
5
0
8
ns  
3873 tbl 08  
NOTES:  
1. This parameter guaranteed with the AC load (Figure 2) by device characterization, but is not production tested.  
4
IDT71V124SA, 3.3V CMOS Static RAM  
1 Meg (128K x 8-Bit) Center Power & Ground Pinout  
Commercial and Industrial Temperature Ranges  
Timing Waveform of Read Cycle No. 1(1)  
t
RC  
ADDRESS  
OE  
t
AA  
tOE  
(5)  
t
OLZ  
(5)  
CS  
(3)  
tACS  
(5)  
OHZ  
t
t
CLZ  
(5)  
CHZ  
t
HIGH IMPEDANCE  
.
DATAOUT  
DATAOUT VALID  
3873 drw 05  
Timing Waveform of Read Cycle No. 2(1, 2, 4)  
tRC  
ADDRESS  
tAA  
t
OH  
tOH  
PREVIOUS DATAOUT VALID  
DATAOUT VALID  
DATAOUT  
.
3873 drw 06  
NOTES:  
1. WE is HIGH for Read Cycle.  
2. Device is continuously selected, CS is LOW.  
3. Address must be valid prior to or coincident with the later of CS transition LOW; otherwise tAA is the limiting parameter.  
4. OE is LOW.  
5. Transition is measured ±200mV from steady state.  
5
6.42  
IDT71V124SA, 3.3V CMOS Static RAM  
1 Meg (128K x 8-Bit) Center Power & Ground Pinout  
Commercial and Industrial Temperature Ranges  
Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1,2,4)  
tWC  
ADDRESS  
t
AW  
CS  
(2)  
tWR  
tWP  
t
AS  
WE  
(5)  
(5)  
t
CHZ  
(5)  
tOW  
tWHZ  
HIGH IMPEDANCE  
(3)  
(3)  
DATAOUT  
DATAIN  
t
DW  
tDH  
.
DATAIN VALID  
3873 drw 07  
Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1, 4)  
tWC  
ADDRESS  
t
AW  
CS  
(3)  
WR  
t
tAS  
tCW  
WE  
t
DW  
tDH  
DATAIN  
DATAIN VALID  
.
3873 drw 08  
NOTES:  
1. A write occurs during the overlap of a LOW CS and a LOW WE.  
2. OE is continuously HIGH. During a WE controlled write cycle with OELOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and data to be  
placedonthe bus forthe requiredtDW. IfOEis HIGHduringa WE controlledwrite cycle, this requirementdoes notapplyandthe minimumwrite pulse is the specifiedtWP.  
3. Duringthis period,I/Opins areintheoutputstate,andinputsignals mustnotbeapplied.  
4. IftheCSLOWtransitionoccurssimultaneouslywithoraftertheWELOWtransition,theoutputsremaininahighimpedancestate.CSmustbeactiveduringthetCW writeperiod.  
5. Transitionismeasured±200mVfromsteadystate.  
6
IDT71V124SA, 3.3V CMOS Static RAM  
1 Meg (128K x 8-Bit) Center Power & Ground Pinout  
Commercial and Industrial Temperature Ranges  
OrderingInformation  
71V124  
SA  
XX  
X
X
X
H
Process/  
Temperature  
Range  
Device  
Type  
Power Speed  
Package  
Blank Commercial (0°C to +70°C)  
I
Industrial (-40°C to +85°C)  
G
Restricted hazardous substance device  
TY  
Y
PH  
300-mil SOJ (SO32-2)  
400-mil SOJ (SO32-3)  
TSOP Type II (SO32-4)  
10  
12  
15  
20  
.
Speed in nanoseconds  
Blank  
H
First generation or current die step  
Current generation die step optional  
3873 drw 09  
7
6.42  
IDT71V124SA, 3.3V CMOS Static RAM  
1 Meg (128K x 8-Bit), Center Power & Ground Pinout  
Commercial and IndustrialTemperature Ranges  
DatasheetDocumentHistory  
11/22/99  
Updatedtonewformat  
Pg. 1–4, 7 AddedIndustrialTemperaturerangeofferings  
Pg. 2  
Pg. 6  
Pg. 8  
Pg. 3  
Pg. 4  
Pg. 7  
Pg. 1,3,7  
Pg. 7  
Pg. 7  
Pg.7  
AddedRecommendedOperatingTemperatureandSupplyVoltagetable  
RevisedfootnotesonWriteCycleNo. 1diagram  
AddedDatasheetDocumentHistory  
08/30/00  
Tighten ICC and ISB  
TightenACCharacteristicstOHZ,tOWandtWHZ  
Removed footnote "400-mil SOJ package only offered in 10ns and 12ns speed grade"  
AddedIndustrialtemperatureoffering10nsspeedgrade  
Added"Restrictedhazardoussubstancedevice"toorderinginformation.  
AddedHgenerationdiesteptodatasheetorderinginformation.  
removed"IDT"formtheorderablepartnumber  
08/22/01  
11/30/03  
01/30/04  
2/14/07  
10/13/08  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
ipchelp@idt.com  
800-345-7015  
800-345-7015 or  
408-284-8200  
fax: 408-284-2775  
www.idt.com  
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
8

相关型号:

71V124SA15YI8

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32
IDT

71V124SA20PH8

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, TSOP2-32
IDT

71V124SA20PHG8

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, TSOP2-32
IDT

71V124SA20PHGI

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, TSOP2-32
IDT

71V124SA20PHGI8

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, TSOP2-32
IDT

71V124SA20PHI

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, TSOP2-32
IDT

71V124SA20TY8

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32
IDT

71V124SA20TYI8

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32
IDT

71V124SA20YI

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32
IDT

71V2546S100BG

PBGA-119, Tray
IDT

71V2546S100BGG

3.3V Synchronous ZBT SRAM
IDT

71V2546S100BGG8

3.3V Synchronous ZBT SRAM
IDT