84329AVT [IDT]
Clock Generator, PQCC28;型号: | 84329AVT |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | Clock Generator, PQCC28 |
文件: | 总19页 (文件大小:279K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ICS84329
Integrated
Circuit
Systems, Inc.
700MH , LOW JITTER, CRYSTAL-TO-3.3V
Z
D
IFFERENTIAL LVPECL FREQUENCY
SYNTHESIZER
GENERAL DESCRIPTION
FEATURES
The ICS84329 is a general purpose, single output • Fully integrated PLL, no external loop filter requirements
ICS
high frequency synthesizer and a member of the
HiPerClockS™ family of High Performance Clock
• Series resonant crystal oscillator interface
Solutions from ICS. The VCO operates at a fre-
• 1 differential 3.3V LVPECL output
HiPerClockS™
• Output frequency range: 25MHz to 700MHz
• VCO range: 200MHz to 700MHz
• Parallel interface for programming counter
and output dividers during power-up
quency range of 200MHz to 700MHz. The VCO
frequency is programmed in steps equal to the value of the
crystal frequency divided by 16.TheVCO and output frequency
can be programmed using the serial or parallel interfaces to the
configuration logic.The output can be configured to divide the
VCO frequency by 1, 2, 4, and 8. Output frequency steps as
small as 125KHz to 1MHz can be achieved using a 16MHz
crystal depending on the output dividers.
• Serial 3 wire interface
• RMS Period jitter: 5.5ps (maximum)
• Cycle-to-cycle jitter: 35ps (maximum)
• 3.3V supply voltage
• 0°C to 70°C ambient operating temperature
• Lead-Free package fully RoHS compliant
• Pin compatible with the MC12429
PIN ASSIGNMENT
BLOCK DIAGRAM
OE
25 24 23 22 21 20 19
S_CLOCK
26
18
N1
N0
M8
M7
M6
M5
M4
XTAL_IN
OSC
XTAL_OUT
S_DATA
S_LOAD
VCCA
27
28
1
17
16
15
14
13
12
ICS84329
28-Lead PLCC
V Package
÷ 16
nc
2
11.6mm x 11.4mm x 4.1mm
TopView
nc
3
4
XTAL_IN
PLL
PHASE DETECTOR
÷1
÷2
÷4
÷8
5
6
7
8
9 10 11
1
0
FOUT
nFOUT
VCO
÷ M
S_LOAD
S_DATA
S_CLOCK
nP_LOAD
CONFIGURATION
INTERFACE
LOGIC
TEST
32 31 30 29 28 27 26 25
24
1
2
3
4
5
6
7
8
S_CLOCK
S_DATA
S_LOAD
VCCA
nc
M0:M8
N0:N1
23
22
21
20
19
18
17
N1
N0
M8
M7
M6
M5
M4
ICS84329
32-Lead LQFP
Y package
VCCA
7mm x 7mm x 1.4mm
TopView
nc
nc
XTAL_IN
9
10 11 12 13 14 15 16
84329AV
www.icst.com/products/hiperclocks.html
REV. D DECEMBER 15, 2004
1
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
FUNCTIONAL DESCRIPTION
latched and the M divider remains loaded until the next LOW
transition on nP_LOAD or until a serial event occurs.The TEST
output is Mode 000 (shift register out) when operating in the
parallel input mode.The relationship between theVCO frequency,
the crystal frequency and the M divider is defined as follows:
NOTE: The functional description that follows describes op-
eration using a 16MHz crystal. Valid PLL loop divider values
for different crystal or input frequencies are defined in the In-
put Frequency Characteristics, Table 6, NOTE 1.
The ICS84329 features a fully integrated PLL and therefore
requires no external components for setting the loop band-
width. A series-resonant, fundamental crystal is used as the
input to the on-chip oscillator. The output of the oscillator is
divided by 16 prior to the phase detector.With a 16MHz crys-
tal this provides a 1MHz reference frequency.The VCO of the
PLL operates over a range of 200MHz to 700MHz.The output
of the M divider is also applied to the phase detector.
fxtal
16
x
fVCO =
M
The M value and the required values of M0 through M8 are
shown in Table 3B, Programmable VCO Frequency Function
Table. Valid M values for which the PLL will achieve lock are
defined as 200 ≤ M ≤ 511. The frequency out is defined as
follows:
fVCO fxtal
M
N
fout
x
=
=
The phase detector and the M divider force the VCO output fre-
quency to be M times the reference frequency by adjusting the
VCO control voltage. Note that for some values of M (either too
high or too low), the PLL will not achieve lock.The output of the
VCO is scaled by a divider prior to being sent to each of the
LVPECL output buffers.The divider provides a 50% output duty
cycle.
N
16
Serial operation occurs when nP_LOAD is HIGH and S_LOAD
is LOW. The shift register is loaded by sampling the S_DATA
bits with the rising edge of S_CLOCK. The contents of the
shift register are loaded into the M divider when S_LOAD tran-
sitions from LOW-to-HIGH.The M divide and N output divide
values are latched on the HIGH-to-LOW transition of S_LOAD.
If S_LOAD is held HIGH, data at the S_DATA input is passed
directly to the M divider on each rising edge of S_CLOCK.
The serial mode can be used to program the M and N bits and
test bitsT2:T0.The internal registers T2:T0 determine the state
of the TEST output as follows:
The programmable features of the ICS84329 support two input
modes to program the M divider and N output divider.The two
input operational modes are parallel and serial. Figure 1 shows
the timing diagram for each mode. In parallel mode the nP_LOAD
input is LOW.The data on inputs M0 through M8 and N0 through
N1 is passed directly to the M divider and N output divider. On
the LOW-to-HIGH transition of the nP_LOAD input, the data is
T2
0
0
T1
0
0
T0
0
1
TEST Output
Shift Register Out
High
fOUT
fOUT
fOUT
0
0
1
1
0
1
PLL Reference Xtal ÷ 16
VCO ÷ M
(non 50% Duty M divider)
fOUT
fOUT
1
0
0
fOUT
fOUT
fOUT
LVCMOS Output Frequency < 200MHz
1
1
0
1
1
0
Low
S_CLOCK ÷ M
(non 50% Duty Cycle M divider)
S_CLOCK ÷ N divider
1
1
1
fOUT ÷ 4
fOUT
SERIAL LOADING
S_CLOCK
T2
T1
T0
N1
N0
M8 M7 M6 M5 M4 M3 M2 M1 M0
S_DATA
S_LOAD
nP_LOAD
t
t
H
S
t
S
PARALLEL LOADING
M, N
M0:M8, N0:N1
nP_LOAD
t
t
H
Time
S
FIGURE 1. PARALLEL & SERIAL LOAD OPERATIONS
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84329AV
REV. D DECEMBER 15, 2004
2
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
TABLE 1. PIN DESCRIPTIONS
Name
Type
Description
VCCA
Power
Analog supply pin.
XTAL_IN,
XTAL_OUT
Input
Crystal oscillator interface. XTAL_IN is the input. XTAL_OUT is the output.
Output enable. When logic HIGH, the outputs are enabled (default).
When logic LOW, the outputs are disabled and drive differential low:
FOUT = LOW, nFOUT = HIGH. LVCMOS / LVTTL interface levels.
Parallel load input. Determines when data present at M8:M0 is loaded into
M divider, and when data present at N1:N0 sets the N output divide value.
LVCMOS / LVTTL interface levels.
M divider inputs. Data latched on LOW-to-HIGH transistion of nP_LOAD input.
LVCMOS / LVTTL interface levels.
Determines N output divider value as defined in Table 3C Function Table.
LVCMOS / LVTTL interface levels.
OE
Input
Pullup
nP_LOAD
Input
Input
Pullup
M0, M1, M2, M3,
M4, M5, M6, M7, M8
Pullup
Pullup
N0, N1
VEE
Input
Power
Output
Negative supply pins.
Test output which is used in the serial mode of operation.
LVCMOS / LVTTL interface levels.
TEST
VCC
Power
Output
Core supply pins.
nFOUT, FOUT
Differential output for the synthesizer. 3.3V LVPECL interface levels.
Clocks the serial data present at S_DATA input into the shift register on the
rising edge of S_CLOCK. LVCMOS / LVTTL interface levels.
Shift register serial input. Data sampled on the rising edge of S_CLOCK.
LVCMOS / LVTTL interface levels.
Controls transition of data from shift register into the M divider.
LVCMOS / LVTTL interface levels.
S_CLOCK
S_DATA
Input
Input
Input
Pulldown
Pulldown
Pulldown
S_LOAD
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
CIN
Parameter
Test Conditions
Minimum Typical Maximum Units
Input Capacitance
Input Pullup Resistor
4
pF
KΩ
KΩ
RPULLUP
51
51
RPULLDOWN Input Pulldown Resistor
84329AV
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REV. D DECEMBER 15, 2004
3
ICS84329
Integrated
Circuit
Systems, Inc.
700MH , LOW JITTER, CRYSTAL-TO-3.3V
Z
D
IFFERENTIAL LVPECL FREQUENCY
SYNTHESIZER
TABLE 3A. PARALLEL AND SERIAL MODE FUNCTION TABLE
Inputs
Conditions
nP_LOAD
M
N
S_LOAD S_CLOCK S_DATA
X
X
X
X
X
X
Reset. M and N bits are all set HIGH.
Data on M and N inputs passed directly to M divider and
N output divider. TEST mode 000.
L
↑
Data Data
Data Data
X
X
X
Data is latched into input registers and remains loaded
until next LOW transition or until a serial event occurs.
Serial input mode. Shift register is loaded with data on
S_DATA on each rising edge of S_CLOCK.
Contents of the shift register are passed to the M divider
and N output divider.
X
L
↑
X
↑
L
X
H
H
X
X
X
X
Data
Data
H
H
X
X
X
X
↓
L
Data
X
M divide and N output divide values are latched.
Parallel or serial input do not affect shift registers.
L
X
NOTE: L = LOW
H = HIGH
X = Don't care
↑ = Rising edge transition
↓= Falling edge transition
TABLE 3B. PROGRAMMABLE VCO FREQUENCY FUNCTION TABLE
256
M8
0
128
M7
1
64
M6
1
32
M5
0
16
M4
0
8
M3
1
4
M2
0
2
M1
0
1
M0
0
VCO Frequency
(MHz)
M Divide
200
201
202
203
•
200
201
202
203
•
0
1
1
0
0
1
0
0
1
0
1
1
0
0
1
0
1
0
0
1
1
0
0
1
0
1
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
509
510
511
509
510
511
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
NOTE 1: These M divide values and the resulting frequencies correspond to a crystal frequency of 16MHz.
TABLE 3C. PROGRAMMABLE OUTPUT DIVIDER FUNCTION TABLE
Inputs
Output Frequency (MHz)
N Divider Value
N1
0
N0
0
Minimum
200
Maximum
700
1
2
4
8
0
1
100
350
1
0
50
175
1
1
25
87.5
84329AV
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REV. D DECEMBER 15, 2004
4
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
ABSOLUTE MAXIMUM RATINGS
SupplyVoltage, V
4.6V
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device.These ratings are stress specifications only.Functional
operation of product at these conditions or any conditions be-
yond those listed in the DC Characteristics or AC Character-
istics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
CC
Inputs, V
-0.5V to VCC + 0.5V
I
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
PackageThermal Impedance, θ
For 28 Lead PLCC
For 32 Lead LQFP
JA
37.8°C/W (0 lfpm)
47.9°C/W (0 lfpm)
StorageTemperature, T
-65°C to 150°C
STG
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VCC
VCCA
ICC
Core Supply Voltage
3.135
3.135
3.3
3.3
3.465
3.465
125
V
Analog Supply Voltage
Power Supply Current
Analog Supply Current
V
mA
mA
ICCA
15
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VIH
VIL
Input High Voltage
2
VCC + 0.3
0.8
V
V
Input Low Voltage
Input High Current
-0.3
M0-M8, N0, N1,
OE, nP_LOAD
S_LOAD,
S_DATA, S_CLOCK
M0-M8, N0, N1,
OE, nP_LOAD
S_LOAD,
V
CC = VIN = 3.465V
VCC = VIN = 3.465V
CC = 3.465V, VIN = 0V
5
µA
µA
µA
µA
IIH
150
V
-150
IIL
Input Low Current
VCC = 3.465V, VIN = 0V
-5
S_DATA, S_CLOCK
VOH
VOL
Output High Voltage; NOTE 1
Output Low Voltage; NOTE 1
2.6
V
V
0.5
NOTE 1: Outputs terminated with 50Ω to VCC/2. See Parameter Measurement Information, "3.3V Output Load Test Circuit".
TABLE 4C. LVPECL DC CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C
Symbol Parameter
Test Conditions
Minimum
VCC - 1.4
VCC - 2.0
0.6
Typical Maximum Units
VOH
Output High Voltage; NOTE 1
VCC - 1.0
VCC - 1.7
0.95
V
V
V
VOL
Output Low Voltage; NOTE 1
VSWING
Peak-to-Peak Output Voltage Swing
NOTE 1: Outputs terminated with 50Ω to VCC - 2V.
84329AV
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REV. D DECEMBER 15, 2004
5
ICS84329
Integrated
Circuit
Systems, Inc.
700MH , LOW JITTER, CRYSTAL-TO-3.3V
Z
D
IFFERENTIAL LVPECL FREQUENCY
SYNTHESIZER
TABLE 5. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum Typical Maximum
Fundamental
Units
Mode of Oscillation
Frequency
10
25
70
7
MHz
Ω
Equivalent Series Resistance (ESR)
Shunt Capacitance
pF
TABLE 6. INPUT FREQUENCY CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
MHz
MHz
MHz
XTAL; NOTE 1
10
17
17
25
50
fIN
Input Frequency XTAL; NOTE 1, 2
S_CLOCK
NOTE 1: For the crystal frequency range the M value must be set to achieve the minimum or maximum VCO frequency
range of 200MHz or 700MHz. Using the minimum frequency of 10MHz valid values of M are 320 ≤ M ≤ 511.
Using the maximum frequency of 25MHz valid values of M are 128 ≤ M ≤ 448.
NOTE 2: For crystal frequencies greater than 17MHz, a series tuning capacitor is required for proper operation.
For more information, please refer to the Application Information, "Crystal Input and Oscillator Interface".
TABLE 7. AC CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum Units
FOUT
Output Frequency
700
5.5
12
MHz
ps
fOUT ≥ 65MHz
fOUT < 65MHz
fOUT ≥ 50MHz
fOUT < 50MHz
20% to 80%
tjit(per)
Period Jitter, RMS; NOTE 1, 2
Cycle-to-Cycle Jitter; NOTE 1, 2
ps
35
ps
tjit(cc)
50
ps
tR / tF
tS
Output Rise/Fall Time
Setup Time
300
5
800
ps
ns
tH
Hold Time
5
ns
tL
PLL Lock Time
Output Duty Cycle
10
55
ms
%
odc
45
50
See Parameter Measurement Information section.
Characterized using a 16MHz XTAL.
NOTE 1: This parameter is defined in accordance with JEDEC Standard 65
NOTE 2: See Applications section.
84329AV
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REV. D DECEMBER 15, 2004
6
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
PARAMETER MEASUREMENT INFORMATION
2V
SCOPE
nFOUT
VCC
VCCA
,
Qx
FOUT
LVPECL
VEE
➤
➤
tcycle n
tcycle n+1
➤
➤
nQx
t
jit(cc) =
t
cycle n –
tcycle n+1
1000 Cycles
-1.3V 0.165V
3.3V OUTPUT LOAD AC TEST CIRCUIT
CYCLE-TO-CYCLE JITTER
VOH
nFOUT
FOUT
VREF
Pulse Width
tPERIOD
VOL
1σ contains 68.26% of all measurements
2σ contains 95.4% of all measurements
3σ contains 99.73% of all measurements
4σ contains 99.99366% of all measurements
6σ contains (100-1.973x10-7)% of all measurements
tPW
odc =
tPERIOD
Histogram
Reference Point
(Trigger Edge)
Mean Period
(First edge after trigger)
PERIOD JITTER
OUTPUT
D
UTY
C
YCLE/PULSE
WIDTH/PERIOD
S_DATA
80%
80%
tHOLD
S_CLOCK
VSWING
20%
tSET-UP
Clock
20%
Outputs
S_LOAD
tF
tR
tSET-UP
M0:M8
N0:N1
tHOLD
nP_LOAD
tSET-UP
OUTPUT RISE/FALL TIME
SETUP AND
H
OLD
84329AV
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REV. D DECEMBER 15, 2004
7
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS84329 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC and VCCA
should be individually connected to the power supply
plane through vias, and bypass capacitors should be
used for each pin. To achieve optimum jitter performance,
power supply isolation is required. Figure 2 illustrates how
a 10Ω resistor along with a 10µF and a .01µF bypass
capacitor should be connected to each VCCA pin.
3.3V
VCC
.01µF
.01µF
10Ω
VCCA
10µF
FIGURE 2. POWER SUPPLY FILTERING
TERMINATION FOR LVPECL OUTPUTS
The clock layout topology shown below is a typical termina- drive 50Ω transmission lines. Matched impedance techniques
tion for LVPECL outputs.The two different layouts mentioned should be used to maximize operating frequency and minimize
are recommended only as guidelines.
signal distortion. Figures 3A and 3B show two different layouts
which are recommended only as guidelines. Other suitable clock
FOUT and nFOUT are low impedance follower outputs that layouts may exist and it would be recommended that the board
generate ECL/LVPECL compatible outputs.Therefore, terminat- designers simulate to guarantee compatibility across all printed
ing resistors (DC current path to ground) or current sources circuit and clock component process variations.
must be used for functionality. These outputs are designed to
3.3V
Zo = 50Ω
125Ω
125Ω
FOUT
FIN
Zo = 50Ω
Zo = 50Ω
Zo = 50Ω
FOUT
FIN
50Ω
50Ω
VCC - 2V
1
RTT =
Zo
RTT
((VOH + VOL) / (VCC – 2)) – 2
84Ω
84Ω
FIGURE 3A. LVPECL OUTPUT TERMINATION
FIGURE 3B. LVPECL OUTPUT TERMINATION
84329AV
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REV. D DECEMBER 15, 2004
8
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
14
12
10
8
6
4
2
0
25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400 425 450 475 500 525
Output Frequency (MHz)
FIGURE 4A. RMS JITTER VS. fOUT (using a 16MHz XTAL)
60
50
40
30
20
10
0
25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400 425 450 475 500 525
Output Frequency (MHz)
FIGURE 4B. CYCLE-TO-CYCLE JITTER VS. fOUT (using a 16MHz XTAL)
84329AV
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REV. D DECEMBER 15, 2004
9
ICS84329
Integrated
Circuit
Systems, Inc.
700MH , LOW JITTER, CRYSTAL-TO-3.3V
Z
D
IFFERENTIAL LVPECL FREQUENCY
SYNTHESIZER
CRYSTAL INPUT AND OSCILLATOR INTERFACE
The ICS84329 features an internal oscillator that uses an external
quartz crystal as the source of its reference frequency. The
oscillator is a series resonant, multi-vibrator type design. This
design provides better stability and eliminates the need for large
on chip capacitors.Though a series resonant crystal is preferred,
a parallel resonant crystal can be used. A parallel resonant mode
crystal used in a series resonant circuit will exhibit a frequency
of oscillation a few hundred ppm lower than specified. A few
hundred ppm translates to KHz inaccuracy.In general computing
applications, this level of inaccuracy is irrelevant. If better ppm
accuracy is required, an external capacitor can be added to a
quartz crystal in series to XTAL_IN. Figure 5A shows how to
interface with a crystal.
ICS84329
XTAL_OUT
XTAL_IN
Figures 5A and 5B show various crystal parameters which are
recommended only as guidelines. Figure 5A shows how to inter-
face a capacitor with a parallel resonant crystal. Figure 5B shows
the capacitor value needed for the optimum ppm performance
over various series resonant crystal frequencies. For IA64/32
platforms which required a Raltron Parallel Resonant Quartz
crystal part #AS-16.66-18-SMD-T-M1, a 7pF series capacitor can
be used to better the ppm accuracy.
FIGURE 5A. CRYSTAL INTERFACE
NOTE:For crystal frequencies higher than 17MHz,
a series tuning capacitor is required for proper operation.
FIGURE 5B. Recommended tuning capacitance for various series
resonant crystals.
30
10.000
25
12.000
20
14.318
15
10
5
16.000
20.000
24.000
0
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
Series Resonant Crystal Frequency (MHz)
84329AV
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REV. D DECEMBER 15, 2004
10
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
LAYOUT GUIDELINE
The schematic of the ICS84329 layout example used in this
layout guideline is shown in Figure6A.The ICS84329 recommended density of the components, the density of the traces, and the stack
actual system will depend on the selected component types, the
up of the P.C.board.
PCB board layout for this example is shown in Figure 6B. This
layout example is used as a general guideline. The layout in the
C3
22p
16MHz,18pF
X1
VCC
VCC=3.3V
C4
22p
R7
10
SP = Space (i.e. not intstalled)
M4
12
4
M4
13
XTALIN
3
M5
M6
M7
M8
N2
N1
M[8:0]= 110010000 (400)
N[1:0] =01 (Divide by 2)
M5
14
nc
2
M6
15
nc
1
VCCA
M7
16
VCCA
28
M8
17
S_LOAD
27
N0
18
S_DATA
26
C11
0.01u
C16
10u
N1
S_CLOCK
U1
84329AV
C1
VCC
0.1uF
Zo = 50 Ohm
Fout = 200 MHz
RU0
SP
RU1
SP
RU7
1K
RU8
1K
RU9
SP
RU10
1K
RU11
SP
RU12
1K
C2
0.1u
Zo = 50 Ohm
R2
50
R1
50
RD0
1K
RD1
1K
RD7
SP
RD8
SP
RD9
1K
RD10
SP
RD6
1K
RD12
SP
R3
50
FIGURE 6A. SCHEMATIC OF RECOMMENDED LAYOUT
84329AV
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REV. D DECEMBER 15, 2004
11
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
• The differential 50Ω output traces should have the
same length.
The following component footprints are used in this layout
example:
• Avoid sharp angles on the clock trace.Sharp angle
turns cause the characteristic impedance to change on
the transmission lines.
All the resistors and capacitors are size 0603.
POWER AND GROUNDING
Place the decoupling capacitors C1, C2 and C3, as close as
possible to the power pins. If space allows, placement of the
decoupling capacitor on the component side is preferred. This
can reduce unwanted inductance between the decoupling
capacitor and the power pin caused by the via.
• Keep the clock traces on the same layer.Whenever pos-
sible, avoid placing vias on the clock traces. Placement
of vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
• To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
Maximize the power and ground pad sizes and number of vias
capacitors.This can reduce the inductance between the power
and ground planes and the component power and ground pins.
The RC filter consisting of R7, C11, and C16 should be placed
as close to the VCCA pin as possible.
• Make sure no other signal traces are routed between the
clock trace pair.
CLOCK TRACES AND TERMINATION
• The matching termination resistors should be located as
close to the receiver input pins as possible.
Poor signal integrity can degrade the system performance or
cause system failure. In synchronous high-speed digital systems,
the clock signal is less tolerant to poor signal integrity than other
signals. Any ringing on the rising or falling edge or excessive ring
back can cause system failure. The shape of the trace and the
trace delay might be restricted by the available space on the board
and the component location.While routing the traces, the clock
signal traces should be routed first and should be locked prior to
routing other signal traces.
CRYSTAL
The crystal X1 should be located as close as possible to the pins
4 (XTAL_IN) and 5 (XTAL_IN).The trace length between the X1
and U1 should be kept to a minimum to avoid unwanted parasitic
inductance and capacitance. Other signal traces should not be
routed near the crystal traces.
X1
U1
GND
VCC
PIN 2
C16
C11
R7
VCCA
VIA
PIN 1
VCCA
Signals
Traces
C1
C2
50 Ohm
Traces
FIGURE 6B. PCB BOARD LAYOUT FOR ICS84329
84329AV
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REV. D DECEMBER 15, 2004
12
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS84329.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS84329 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 140mA = 485mW
Power (outputs)MAX = 30.2mW/Loaded Output pair
If all outputs are loaded, the total power is 1 * 30.2mW = 30.2mW
Total Power_MAX (3.465V, with all outputs switching) = 485mW + 30.2mW = 515.2mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device.The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = JunctionTemperature
θJA = Junction-to-AmbientThermal Resistance
Pd_total =Total Device Power Dissipation (example calculation is in section 1 above)
TA = AmbientTemperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 31.1°C/W perTable 8A below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.515W * 31.1°C/W = 86°C. This is well below the limit of 125°C.
This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 8A. THERMAL RESISTANCE θJA FOR 28-PIN PLCC, FORCED CONVECTION
θJA byVelocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
37.8°C/W
31.1°C/W
28.3°C/W
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.
TABLE 8B. THERMAL RESISTANCE θJA FOR 32-PIN LQFP, FORCED CONVECTION
θJA byVelocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
55.9°C/W
50.1°C/W
47.9°C/W
42.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.
84329AV
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REV. D DECEMBER 15, 2004
13
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in the Figure 7.
VCC
Q1
VOUT
RL
50
VCC - 2V
FIGURE 7. LVPECL DRIVER CIRCUIT AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage ofV - 2V.
CC
•
•
For logic high, VOUT = V
= V
– 1.0V
OH_MAX
CC_MAX
)
= 1.0V
OH_MAX
(V
- V
CC_MAX
For logic low, VOUT = V
= V
– 1.7V
OL_MAX
CC_MAX
)
= 1.7V
OL_MAX
(V
- V
CC_MAX
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
))
Pd_H = [(V
– (V
- 2V))/R ] * (V
- V
) = [(2V - (V
- V
/R ] * (V
- V
) =
OH_MAX
CC_MAX
CC_MAX
OH_MAX
_MAX
OH_MAX
CC_MAX
OH_MAX
L
CC
L
[(2V - 1V)/50Ω] * 1V = 20.0mW
Pd_L = [(V – (V - 2V))/R ] * (V
))
- V
) = [(2V - (V
- V
/R ] * (V
- V
) =
OL_MAX
CC_MAX
CC_MAX
OL_MAX
_MAX
OL_MAX
CC_MAX
OL_MAX
L
CC
L
[(2V - 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30.2mW
84329AV
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REV. D DECEMBER 15, 2004
14
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
RELIABILITY INFORMATION
TABLE 9A. θJAVS. AIR FLOW TABLE FOR 28 LEAD PLCC
θJA byVelocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
37.8°C/W
31.1°C/W
28.3°C/W
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.
TABLE 9B. θJAVS. AIR FLOW TABLE FOR 32 LEAD LQFP
θJA byVelocity (Linear Feet per Minute)
0
200
55.9°C/W
42.1°C/W
500
50.1°C/W
39.4°C/W
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
47.9°C/W
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS84329 is: 4408
84329AV
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REV. D DECEMBER 15, 2004
15
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
PACKAGE OUTLINE - V SUFFIX FOR 28 LEAD PLCC
TABLE 10A. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
SYMBOL
MINIMUM
MAXIMUM
N
A
28
4.19
2.29
4.57
3.05
A1
A2
b
1.57
2.11
0.33
0.53
c
0.19
0.32
D
12.32
11.43
4.85
12.57
11.58
5.56
D1
D2
E
12.32
11.43
4.85
12.57
11.58
5.56
E1
E2
Reference Document: JEDEC Publication 95, MS-018
84329AV
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REV. D DECEMBER 15, 2004
16
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
PACKAGE OUTLINE - Y SUFFIX FOR 32 LEAD LQFP
TABLE 10B. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
BBA
SYMBOL
MINIMUM
NOMINAL
MAXIMUM
N
A
32
--
--
--
1.60
0.15
1.45
0.45
0.20
A1
A2
b
0.05
1.35
0.30
0.09
1.40
0.37
c
--
D
9.00 BASIC
7.00 BASIC
5.60 Ref.
9.00 BASIC
7.00 BASIC
5.60 Ref.
0.80 BASIC
0.60
D1
D2
E
E1
E2
e
L
0.45
0.75
θ
--
0°
7°
ccc
--
--
0.10
Reference Document: JEDEC Publication 95, MS-026
84329AV
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REV. D DECEMBER 15, 2004
17
ICS84329
Integrated
Circuit
Systems, Inc.
700MH
Z
, LOW
J
ITTER, CRYSTAL
-TO-3.3V
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER
S
TABLE 11. ORDERING INFORMATION
Part/Order Number
ICS84329AV
Marking
Package
Count
38 per Tube
500
Temperature
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
ICS84329AV
ICS84329AV
28 Lead PLCC
ICS84329AVT
ICS84329AVLF
ICS84329AVLFT
ICS84329AY
28 Lead PLCC on Tape and Reel
28 Lead "Lead Free" PLCC
ICS84329AVLF
38 per Tube
500
ICS84329AVLF 28 Lead "Lead Free" PLCC on Tape and Reel
ICS84329AY
ICS84329AY
32 Lead LQFP
250 per Tray
1000
ICS84329AYT
32 Lead LQFP on Tape and Reel
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are
not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS
product for use in life support devices or critical medical instruments.
84329AV
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REV. D DECEMBER 15, 2004
18
ICS84329
Integrated
Circuit
Systems, Inc.
700MH , LOW JITTER, CRYSTAL-TO-3.3V
Z
D
IFFERENTIAL LVPECL FREQUENCY
SYNTHESIZER
REVISION HISTORY SHEET
Description of Change
Rev
Table
Page
12
2
Date
A
Added Crystal Input and Oscillator Interface section.
Updated Parallel & Serial Load Operations diagram.
Changed VCC and crystal descriptions.
03/15/02
A
B
T1
3
12/18/02
1/24/03
Updated format.
Figure 1 - switched S_CLOCK and S_DATA labels.
2
5
T4A
Power Supply Table - changed IEE Power Supply Current, 110mA Max. to
ICC Power Supply Current, 125mA Max.
Power Considerations - changed IEE_MAX 110mA to 140mA to correspond with
Table 4A Power Supply Table.
Pin Description Table - added description to OE pin.
Added LVCMOS/LVTTL... to S_DATA pin description.
Block Diagram, replaced ÷N with dividers.
13
3
T1
T6
B
C
1/29/03
4/3/03
1
6
Changed 25MHz max. limit to 17MHz max.
Added extra XTAL line with limits of 17MHz min. to 25MHz max.
Added Note 2.
10
Crystal Input & Oscillator Interface section, added same crystal frequency note.
Changed XTAL1 to XTAL_IN and XTAL2 to XTAL_OUT throughout the data
sheet.
T1
3
5
Pin Characteristics Table - changed CIN from 4pF max. to 4pF typical.
Absolute Maximum Ratings - revised Outputs rating.
Updated LVPECL Output Termination drawings.
D
D
6/15/04
8
11
18
1
Updated Schematic Layout.
Ordering Information Table - add "Lead Free" part numbers.
Features Section - added "Series resonant" to crystal bullet.
12/15/04
84329AV
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REV. D DECEMBER 15, 2004
19
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