85454AK [IDT]

Low Skew Clock Driver, 85454 Series, 3 True Output(s), 0 Inverted Output(s), 3 X 3 MM, 0.95 MM HEIGHT, MO-220, VFQFN-16;
85454AK
型号: 85454AK
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Low Skew Clock Driver, 85454 Series, 3 True Output(s), 0 Inverted Output(s), 3 X 3 MM, 0.95 MM HEIGHT, MO-220, VFQFN-16

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DUAL 2:1 AND 1:2 DIFFERENTIAL-  
TO-LVDS MULTIPLEXER  
ICS85454  
GENERAL DESCRIPTION  
FEATURES  
The ICS85454 is a dual 2:1 and 1:2 Multiplexer  
Three LVDS outputs  
TM  
and a member of the HiPerClockS family of high  
performance clock solutions from IDT. The 2:1  
Multiplexer allows one of 2 inputs to be selected  
onto one output pin and the 1:2 MUX switches one  
input to one of two outputs. This device is useful  
ICS  
HiPerClockS™  
Three differential clock inputs  
CLKx pair can accept the following differential input levels:  
LVPECL, LVDS, CML  
Maximum output frequency: 2.5GHz  
Additive phase jitter, RMS: 0.11ps (typical)  
Part-to-part skew: 200ps (maximum)  
for multiplexing multi-rate Ethernet PHYs which have 100 M bit  
and 1000 bit transmit/receive pairs onto an optical SFP  
module which has a single trasmit/receive pair. See Application  
Section for further information.  
Propagation delay: 425ps (maximum), QA/nQA  
375ps (maximum), QBx/nQBx  
The ICS85454 is optimized for applications requiring very  
high performance and has a maximum operating frequency  
Full 2.5V operating supply  
of 2.5GHz. The device is packaged in  
3mm x 3mm VFQFN package, making it ideal for use on  
space-constrained boards.  
a small,  
-40°C to 85°C ambient operating temperature  
Available in both standard (RoHS 5) and lead-free (RoHS 6)  
packages  
BLOCK DIAGRAM  
PIN ASSIGNMENT  
Pulldown  
CLK_SELA  
Pulldown  
CLKA0  
nCLKA0  
16 15 14 13  
0
Pullup/Pulldown  
QB0  
1
2
12 CLKA0  
11 nCLKA0  
10 CLKA1  
QA  
nQA  
nQB0  
Pulldown  
CLKA1  
QB1  
3
4
1
Pullup/Pulldown  
nCLKA1  
nQB1  
9
nCLKA1  
5
6
7
8
Pulldown  
CLKB  
QB0  
nQB0  
Pullup/Pulldown  
nCLKB  
ICS85454  
QB1  
nQB1  
16-Lead VFQFN  
Pulldown  
3mm x 3mm x 0.95 package body  
K Package  
CLK_SELB  
Top View  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
TABLE 1. PIN DESCRIPTIONS  
Number  
1, 2  
Name  
Type  
Output  
Description  
QB0, nQB0  
Differential output pair. LVDS interface levels.  
Differential output pair. LVDS interface levels.  
3, 4  
QB1, nQB1 Output  
5
CLKB  
Input  
Input  
Pulldown Non-inverting LVPECL differential clock input.  
Pullup/  
6
nCLKB  
Inverting differential LVPECL clock input. VDD/2 default when left floating.  
Pulldown  
Clock select pin for QBx outputs. When HIGH, selects QB1, nQB1  
Pulldown outputs. When LOW, selects QB0, nQB0 outputs.  
LVCMOS/LVTTL interface levels.  
7
CLK_SELB  
Input  
8
GND  
Power  
Input  
Input  
Input  
Power supply ground.  
Pullup/  
9
nCLKA1  
CLKA1  
nCLKA0  
Inverting differential LVPECL clock input. VDD/2 default when left floating.  
Pulldown  
10  
11  
Pulldown Non-inverting LVPECL differential clock input.  
Pullup/  
Inverting differential LVPECL clock input. VDD/2 default when left floating.  
Pulldown  
12  
13  
CLKA0  
VDD  
Input  
Pulldown Non-inverting LVPECL differential clock input.  
Positive supply pin.  
Power  
Clock select pin for CLKA inputs. When HIGH, selects CLKA1/nCLKA1  
Pulldown inputs. When LOW, selects CLKA0/nCLKA0 inputs. LVCMOS/LVTTL  
interface levels.  
14  
CLK_SELA  
nQA, QA  
Input  
15, 16  
Output  
Differential output pair. LVDS interface levels.  
NOTE: Pulldown and Pullup refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
TABLE 2. PIN CHARACTERISTICS  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum Units  
RPULLDOWN Input Pulldown Resistors  
37.5  
37.5  
k  
kΩ  
RVDD/2  
Pullup/Pulldown Resistors  
TABLE 3A. CONTROL INPUT FUNCTION TABLE, BANK A  
Bank A  
Control Inputs  
Outputs  
CLK_SELA  
QA, nQA  
0
1
Selects CLKA0, nCLKA0  
Selects CLKA1, nCLKA1  
TABLE 3B. CONTROL INPUT FUNCTION TABLE, BANK B  
Bank B  
Control Inputs  
Outputs  
CLK_SELB  
QB0, nQB0  
QB1, nQB1  
Logic Low  
0
1
Follows CLKB input  
Logic Low  
Follows CLKB input  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage, VDD  
Inputs, VI  
NOTE: Stresses beyond those listed under Absolute  
Maximum Ratings may cause permanent damage to  
the device. These ratings are stress specifi-  
cations only. Functional operation of product at  
these conditions or any conditions beyond those listed  
in the DC Characteristics or AC Characteristics is not  
implied. Exposure to absolute maximum rating condi-  
tions for extended periods may affect product reliability.  
4.6V  
-0.5V to VDD + 0.5V  
Outputs, IO  
Continuous Current  
Surge Current  
10mA  
15mA  
Operating Temperature Range, TA -40°C to +85°C  
Storage Temperature, TSTG -65°C to 150°C  
Package Thermal Impedance, θJA 51.5°C/W (0 lfpm)  
(Junction-to-Ambient)  
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 2.5V 5ꢀ, TA = -40°C TO 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum Units  
VDD  
IDD  
Positive Supply Voltage  
Power Supply Current  
2.375  
2.5  
2.625  
94  
V
mA  
TABLE 4B. LVCMOS/LVTTL DC CHARACTERISTICS, VDD = 2.5V 5ꢀ, TA = -40°C TO 85°C  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum Units  
VIH  
VIL  
Input High Voltage  
1.7  
VDD + 0.3  
0.7  
V
V
Input Low Voltage  
Input High Current  
-0.3  
CLK_SELA,  
CLK_SELB  
CLK_SELA,  
CLK_SELB  
IIH  
IIL  
VDD = VIN = 2.625V  
150  
µA  
µA  
Input Low Current  
VDD = 2.625V, VIN = 0  
-10  
TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VDD = 2.5V 5ꢀ, TA = -40°C TO 85°C  
-40°C  
Typ  
25°C  
Typ  
85°C  
Typ  
Symbol Parameter  
Units  
Min  
Max  
Min  
Max  
Min  
Max  
Input  
IIH  
CLKAx, CLKB  
nCLKx, nCLKB  
CLKAx, CLKB  
nCLKx, nCLKB  
150  
150  
150  
µA  
High Current  
Input  
Low Current  
IIL  
-150  
0.15  
1.2  
-150  
0.15  
1.2  
-150  
0.15  
1.2  
µA  
V
VPP  
Peak-to-Peak Input Voltage  
1.2  
VDD  
1.2  
VDD  
1.2  
VDD  
Commond Mode Input Voltage;  
NOTE 1, 2  
VCMR  
V
NOTE 1: Common mode input voltage is defined as VIH.  
NOTE 2: For single ended applications, the maximum input voltage for CLKAx, nCLKAx and CLKB, nCLKB is VDD + 0.3V.  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
TABLE 4D. LVDS DC CHARACTERISTICS, VDD = 2.5V 5ꢀ, TA = -40°C TO 85°C  
-40°C  
Typ  
25°C  
85°C  
Typ  
350  
Symbol Parameter  
Units  
Min  
Max  
450  
30  
Min  
Typ  
Max  
450  
30  
Min  
Max  
450  
30  
VOD  
Differential Output Voltage  
250  
350  
250  
350  
250  
mV  
mV  
V
VOD  
VOS  
VOD Magnitude Change  
Offset Voltage  
0.93  
1.18  
1.43  
10  
0.97  
1.22  
1.47  
10  
1.02  
1.27  
1.52  
10  
VOS  
VOS Magnitude Change  
mV  
NOTE 1: Refer to Parameter Measurement Information, "2.5V Output Load Test Circuit" diagram.  
TABLE 5. AC CHARACTERISTICS, VDD = 2.5V 5ꢀ, TA = -40°C TO 85°C  
Symbol  
Parameter  
Conditions  
Minimum Typical Maximum Units  
fMAX  
Output Frequency  
2.5  
425  
375  
GHz  
ps  
QA, nQA  
250  
200  
Propagation Delay;  
NOTE 1  
tPD  
QBx, nQBx  
ps  
Buffer Additive Phase  
Jitter, RMS; refer to  
Additive Phase Jitter  
Section; NOTE 4  
QA, nQA  
0.11  
0.11  
ps  
ps  
tjit  
QBx, nQBx  
tsk(pp)  
Part-to-Part Skew; NOTE 2, 3  
200  
ps  
dB  
ps  
MUX_ISOLATION MUX Isolation  
55  
tR/tF  
Output Rise/Fall Time  
20ꢀ to 80ꢀ  
100  
47  
200  
53  
QA, nQA  
odc  
Output Duty Cycle  
QBx, nQBx  
48  
52  
All parameters are measured 1.2GHz unless otherwise noted.  
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.  
NOTE 2: Defined as skew between outputs on different devices operating at the same supply voltages  
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured  
at the differential cross points.  
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 4: Measured using clock input at 622MHz.  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
4
ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
PARAMETER MEASUREMENT INFORMATION  
VDD  
VDD  
SCOPE  
Qx  
nCLKA0, nCLKA1  
nCLKB  
2.5V 5ꢀ  
POWER SUPPLY  
LVDS  
+
Float GND  
-
VPP  
VCMR  
Cross Points  
CLKA0, CLKA1  
CLKB  
nQx  
GND  
OUTPUT LOAD 2.5V AC TEST CIRCUIT  
DIFFERENTIAL INPUT LEVEL  
nCLKA0,  
nCLKA1  
nCLKB  
nQx  
PART 1  
Qx  
CLKA0,  
CLKA1  
CLKB  
nQA,  
nQB0,  
nQB1  
nQy  
PART 2  
Qy  
QA,  
QB0,  
QB1  
tPD  
tsk(pp)  
PROPAGATION DELAY  
PART-TO-PART SKEW  
nQA,  
nQB0:nQB1  
80ꢀ  
tF  
80ꢀ  
QA,  
QB0:QB1  
VSWING  
20ꢀ  
tPW  
Clock  
20ꢀ  
tPERIOD  
Outputs  
tR  
tPW  
odc =  
x 100ꢀ  
tPERIOD  
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD  
OUTPUT RISE/FALL TIME  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
APPLICATION INFORMATION  
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS  
Figure 1 shows how the differential input can be wired to accept  
single ended levels. The reference voltage V_REF = V /2 is  
generated by the bias resistors R1, R2 and C1. This bias DcDircuit  
should be located as close as possible to the input pin. The ratio  
of R1 and R2 might need to be adjusted to position the V_REF in  
the center of the input voltage swing. For example, if the input  
clock swing is only 2.5V and V = 3.3V, V_REF should be 1.25V  
DD  
and R2/R1 = 0.609.  
VDD  
R1  
1K  
Single Ended Clock Input  
V_REF  
CLKx  
nCLKx  
C1  
0.1u  
R2  
1K  
FIGURE 1. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT  
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS  
INPUTS:  
OUTPUTS:  
CLK/nCLK INPUT:  
LVDS  
For applications not requiring the use of a differential input, both  
the CLK and nCLK pins can be left floating. Though not required,  
but for additional protection, a 1kresistor can be tied from CLK  
to ground.  
All unused LVDS output pairs can be either left floating or  
terminated with 100across. If they are left floating, we  
recommend that there is no trace attached.  
LVCMOS CONTROL PINS:  
All control pins have internal pull-ups or pull-downs; additional  
resistance is not required but can be added for additional  
protection. A 1kresistor can be used.  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
2.5V LVDS DRIVER TERMINATION  
transmission line environment.For buffer with multiple LVDS driver,  
it is recommended to terminate the unused outputs.  
Figure 2 shows a typical termination for LVDS driver in  
characteristic impedance of 100differential (50single)  
2.5V  
2.5V  
LVDS_Driver  
+
R1  
100  
-
100DifferentialTransmission Line  
FIGURE 2. TYPICAL LVDS DRIVER TERMINATION  
THERMAL RELEASE PATH  
The expose metal pad provides heat transfer from the device to  
the P.C. board. The expose metal pad is ground pad connected  
to ground plane through thermal via. The exposed pad on the  
device to the exposed metal pad on the PCB is contacted through  
solder as shown in Figure 3. For further information, please refer  
to the Application Note on Surface Mount Assembly of Amkor’s  
Thermally /Electrically Enhance Leadframe Base Package, Amkor  
Technology.  
EXPOSED PAD  
SOLDER  
SOLDER MASK  
SIGNAL  
TRACE  
SIGNAL  
TRACE  
GROUND PLANE  
Expose Metal Pad  
(GROUND PAD)  
THERMAL VIA  
FIGURE 3. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
ATYPICAL APPLICATION FOR THE ICS85454  
Used to connect a multi-rate PHY with the Tx/Rx pins of an  
SFP Module.  
Problem Addressed: How to map the 2 Tx/Rx pairs of the multi-  
rate PHY to the single Tx/Rx pair on the SFP Module.  
MULTI-RATE PHY  
SFP MODULE  
Tx  
Rx  
100BaseFX  
1000BaseX  
Rx  
Tx  
?
Tx  
Rx  
MODE 1, 100BASEX CONNECTED TO SFP  
All lines are differential pairs, but drawn as single-ended to sim-  
plify the drawing.  
Bold red lines  
signal path.  
are active connections highlighting the  
CLK_SELA = 0  
M
ULTI-RATE PHY  
SFP MODULE  
CLKA0  
CLKA1  
Tx  
Rx  
0
QA  
Rx  
1
100BaseFX  
CLKB  
Tx  
QB0  
QB1  
CLK_SELB = 0  
Tx  
Rx  
ICS85454  
1000BaseX  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
MODE 2, 100BASEX CONNECTED TO SFP  
All lines are differential pairs, but drawn as single-ended to sim-  
plify the drawing.  
Bold red lines  
signal path.  
are active connections highlighting the  
CLK_SELA = 1  
M
ULTI-RATE PHY  
SFP MODULE  
CLKA0  
CLKA1  
Tx  
Rx  
0
QA  
Rx  
1
100BaseFX  
CLKB  
Tx  
QB0  
QB1  
CLK_SELB = 1  
Tx  
Rx  
ICS85454
1000BaseX  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS85454.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS85454 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for V = 2.5V + 5ꢀ = 2.625V, which gives worst case results.  
DD  
Power_ = V  
* I  
= 2.625V * 94mA = 247mW  
DD_MAX  
MAX  
DD_MAX  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability  
TM  
of the device. The maximum recommended junction temperature for HiPerClockS devices is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = Junction Temperature  
θJA = Junction-to-Ambient Thermal Resistance  
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)  
TA = Ambient Temperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming  
no air flow and a multi-layer board, the appropriate value is 51.5°C/W per Table 6 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.247W * 51.5°C/W = 97.7°C. This is well below the limit of 125°C.  
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air  
flow, and the type of board (single layer or multi-layer).  
TABLE 6. THERMAL RESISTANCE θ FOR 16-PIN VFQFN, FORCED CONVECTION  
JA  
θ vs. 0 Air Flow (Linear Feet per Minute)  
JA  
0
Multi-Layer PCB, JEDEC Standard Test Boards  
51.5°C/W  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
10  
ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
RELIABILITY INFORMATION  
TABLE 7. θ VS. AIR FLOW TABLE FOR 16 LEAD VFQFN  
JA  
θ at 0 Air Flow (Linear Feet per Minute)  
JA  
0
Multi-Layer PCB, JEDEC Standard Test Boards  
51.5°C/W  
TRANSISTOR COUNT  
The transistor count for ICS85454 is: 189  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
PACKAGE OUTLINE - K SUFFIX FOR 16 LEAD VFQFN  
(Ref.)  
N & N  
Even  
Seating Plane  
(N -1)x e  
(Ref.)  
A1  
Index Area  
L
A3  
E2  
N
N
(Typ.)  
e
2
If N & N  
are Even  
1
Anvil  
Singulation  
2
(N -1)x e  
(Ref.)  
OR  
E2  
2
Sawn  
Singulation  
Top View  
b
e
Thermal  
Base  
(Ref.)  
D2  
2
A
D
N & N  
Odd  
D2  
C
0.08  
C
TABLE 8. PACKAGE DIMENSIONS  
JEDEC VARIATION  
ALL DIMENSIONS IN MILLIMETERS  
SYMBOL  
MINIMUM  
MAXIMUM  
N
A
16  
0.80  
0
1.0  
A1  
A3  
b
0.05  
0.25 Reference  
0.18  
0.30  
e
0.50 BASIC  
ND  
NE  
D
4
4
3.0  
D2  
E
1.0  
1.8  
3.0  
E2  
L
1.0  
1.8  
0.30  
0.50  
Reference Document: JEDEC Publication 95, MO-220  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
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ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
TABLE 9. ORDERING INFORMATION  
Part/Order Number  
85454AK  
Marking  
454A  
Package  
Shipping Packaging  
Tube  
Temperature  
-40°C to 85°C  
-40°C to 85°C  
-40°C to 85°C  
-40°C to 85°C  
16 Lead VFQFN  
85454AKT  
454A  
16 Lead VFQFN  
2500 Tape & Reel  
Tube  
85454AKLF  
85454AKLFT  
44AL  
16 Lead "Lead-Free" VFQFN  
16 Lead "Lead-Free" VFQFN  
44AL  
2500 Tape & Reel  
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for  
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and  
industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT  
reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
13  
ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
REVISION HISTORY SHEET  
Description of Change  
Rev  
Table  
Page  
Date  
13  
Ordering Information Table - corrected lead-free marking.  
A
7/20/06  
T4D  
4
7
LVDS DC Characteristics table - corrected VOD, VOD, and VOS.  
Added Thermal Release Path.  
B
12/21/06  
IDT/ ICSDUAL 2:1 AND 1:2 LVDS MULTIPLEXER  
14  
ICS85454 REV. B FEBRUARY 24, 2009  
ICS85454  
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER  
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Integrated Device Technology  
Singapore (1997) Pte. Ltd.  
Reg. No. 199707558G  
435 Orchard Road  
Europe  
IDT Europe, Limited  
321 Kingston Road  
Leatherhead, Surrey  
KT22 7TU  
United States  
800 345 7015  
#20-03 Wisma Atria  
England  
+408 284 8200 (outside U.S.)  
Singapore 238877  
+44 (0) 1372 363 339  
Fax: +44 (0) 1372 378851  
+65 6 887 5505  
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT, the IDT logo, ICS and HiPerClockS are trademarks  
of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be  
trademarks or registered trademarks used to identify products or services of their respective owners.  
Printed in USA  

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