8P391208 [IDT]
Low Additive Jitter 2:8 Buffer with Universal Differential Outputs;![8P391208](http://pdffile.icpdf.com/pdf2/p00331/img/icpdf/8P391208_2035956_icpdf.jpg)
型号: | 8P391208 |
厂家: | ![]() |
描述: | Low Additive Jitter 2:8 Buffer with Universal Differential Outputs |
文件: | 总41页 (文件大小:919K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Low Additive Jitter 2:8 Buffer with
Universal Differential Outputs
8P391208
Datasheet
General Description
Features
• Two differential inputs support LVPECL, LVDS, HCSL or LVCMOS
reference clocks
8P391208 is intended to take 1 or 2 reference clocks, select
between them, using a pin selection and generate up to 8 outputs
that are the same as the reference frequency.
• Accepts input frequencies ranging from 1PPS (1Hz) to 700MHz
(up to 1GHz when configured into HCSL output mode at 3.3V)
8P391208 supports two output banks, each with its own power
supply. All outputs in one bank would generate the same output
frequency, and each bank can be individually controlled for output
type or output enable.
• Select which of the two input clocks is to be used as the reference
clock for which bank via pin selection
• Generates 8 differential outputs
• Differential outputs selectable as LVPECL, LVDS, CML or HCSL
• CML mode supports two different voltage swings
The device can operate over the -40°C to +85°C temperature range.
• Differential outputs support frequencies from 1PPS to 700MHz
(up to 1GHz when configured into HCSL output mode at 3.3V)
• Outputs arranged in 2 banks of 4 outputs each
• Each bank supports a separate power supply of 3.3V, 2.5V or
1.8V
• Controlled by 3-level input pins
• Input mux selection control pin
• Control inputs are 3.3V-tolerant for all core voltages
• Output noise floor of -153dBc/Hz @ 156.25MHz
• Core voltage supply of 3.3V, 2.5V or 1.8V
• -40°C to +85°C ambient operating temperature
• Lead-free (RoHS 6) packaging
©2016 Integrated Device Technology
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September 1, 2016
8P391208 Datasheet
8P391208 Block Diagram
QA0
nQA0
QA1
nQA1
CLK_SEL
QA2
nQA2
QA3
CLK0
nCLK0
nQA3
QB0
nQB0
CLK1
nCLK1
QB1
nQB1
QB2
nQB2
QB3
nQB3
IOA
2
Logic
IOB
2
Pin Assignment
Figure 1: 8P391208 Pin Assignment for 5mm x 5mm 32-pin VFQFN Package
31 30 29 28 27 26 25
32
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
IOB1
QB0
IOA1
QA0
nQB0
QB1
nQA0
QA1
nQB1
VCCOB
QB2
nQA1
VCCOA
QA2
nQA2
nQB2
10 11 12 13 14 15 16
9
©2016 Integrated Device Technology
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8P391208 Datasheet
Pin Description and Characteristic Tables
Table 1: Pin Description
Number
Name
Type[1]
Description
Pullup /
Pulldown
1
IOA1
Input
Controls output functions for Bank A. 3-level input.
Positive differential clock output. Included in Bank A.
Refer to Output Drivers section for more details.
2
3
4
QA0
nQA0
QA1
Output
Output
Output
Negative differential clock output. Included in Bank A.
Refer to Output Drivers section for more details.
Positive differential clock output. Included in Bank A.
Refer to Output Drivers section for more details.
Negative differential clock output. Included in Bank A.
Refer to Output Drivers section for more details.
5
6
7
nQA1
VCCOA
QA2
Output
Power
Output
Output voltage supply for Output Bank A.
Positive differential clock output. Included in Bank A.
Refer to Output Drivers section for more details.
Negative differential clock output. Included in Bank A.
Refer to Output Drivers section for more details.
8
9
nQA2
QA3
Output
Output
Output
Positive differential clock output. Included in Bank A.
Refer to Output Drivers section for more details.
Negative differential clock output. Included in Bank A.
Refer to Output Drivers section for more details.
10
nQA3
11
12
nc
Unused
Power
Unused. Do not connect.
Core Logic voltage supply.
VCC
Pullup /
Input Clock Selection Control pin. 3-level input. This pin’s function is
13
14
15
CLK_SEL
nc
Input
Unused
Output
Pulldown described in the Input Selection section.
Unused. Do not connect.
Negative differential clock output. Included in Bank B. Refer to
Output Drivers section for more details.
nQB3
Positive differential clock output. Included in Bank B. Refer to
Output Drivers section for more details.
16
17
QB3
Output
Output
Negative differential clock output. Included in Bank B. Refer to
Output Drivers section for more details.
nQB2
Positive differential clock output. Included in Bank B. Refer to
Output Drivers section for more details.
18
19
20
QB2
VCCOB
nQB1
Output
Power
Output
Output voltage supply for Output Bank B.
Negative differential clock output. Included in Bank B. Refer to
Output Drivers section for more details.
Positive differential clock output. Included in Bank B. Refer to
Output Drivers section for more details.
21
QB1
Output
©2016 Integrated Device Technology
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8P391208 Datasheet
Table 1: Pin Description (Continued)
Negative differential clock output. Included in Bank B.
Refer to Output Drivers section for more details.
22
23
nQB0
QB0
Output
Output
Positive differential clock output. Included in Bank B.
Refer to Output Drivers section for more details.
Pullup /
Pulldown
24
25
26
27
28
IOB1
CLK1
nCLK1
VCC
Input
Input
Input
Power
Input
Controls output functions for Bank B. 3-level input.
Pulldown Non-inverting differential clock input.
Pullup / Inverting differential clock input. VCC/2 when left floating (set by the internal
Pulldown pullup and pulldown resistors).
Core Logic voltage supply.
Pullup /
IOB0
Controls output functions for Bank B. 3-level input.
Pulldown
Pullup /
Pulldown
29
30
31
IOA0
VCC
Input
Power
Input
Controls output functions for Bank A. 3-level input.
Core Logic voltage supply.
Pullup /
Inverting differential clock input. VCC/2 when left floating (set by the internal
nCLK0
Pulldown pullup and pulldown resistors).
Pulldown Non-inverting differential clock input.
Exposed pad must be connected to GND.
32
CLK0
VEE
Input
EP
Ground
1. Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2: Pin Characteristics
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
CIN
Input Capacitance
2
pF
pF
pF
pF
pF
pF
pF
pF
pF
k
k
LVPECL
LVDS
VCCOx[1] = 3.465V or 2.625V
2.0
2.5
Power Dissipation
Capacitance
(per output pair)
CML, 400mV
CML, 800mV
LVPECL
CPD
QA[0:3], nQA[0:3];
QB[0:3], nQB[0:3]
LVDS
VCCOx[1] = 1.89V
CML, 400mV
CML, 800mV
RPULLUP
Input Pullup Resistor
51
51
RPULLDOWN Input Pulldown Resistor
1. VCCOx refers to VCCOA for QA[3:0], nQA[3:0] or VCCOB for QB[3:0], nQB[3:0].
©2016 Integrated Device Technology
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8P391208 Datasheet
Principles of Operation
Input Selection
The 8P391208 supports two input references: CLK0 and CLK1 that may be driven with differential or single-ended clock signals. Either may be
used as the source frequency for either or both output banks under control of the CLK_SEL input pin.
Table 3: Input Selection Control
CLK_SEL
Description
High
Middle[1]
Low
Banks A & B Both Driven from CLK1
Bank A Driven from CLK0 & Bank B Driven from CLK1
Banks A & B Both Driven from CLK0
1. A ‘middle’ voltage level is defined in Table 10. Leaving the input pin open will
also generate this level via a weak internal resistor network.
Output Drivers
The QA[0:3] and QB[0:3] clock outputs are provided with pin-controlled output drivers. The following table shows how each bank can be
controlled. Each bank is separately controlled and all outputs within a single bank will behave the same way.
Table 4: Output Mode and Enable Control
IOx[1]
IOx[0]
Output Bank Function
High
High
High
Middle
Low
All outputs in the bank are high-impedance
All outputs in the bank are LVPECL
All outputs in the bank are LVDS
High
Middle
Middle
Middle
Low
High
All outputs in the bank are CML (400mV)
All outputs in the bank are high-impedance
All outputs in the bank are HCSL
Middle
Low
High
All outputs in the bank are CML (800mV)
All outputs in the bank are LVPECL
All outputs in the bank are high-impedance
Low
Middle
Low
Low
CML operation supports both a 400mV (pk-pk) swing and an 800mV (pk-pk) swing selection.
The operating voltage ranges of each output is determined by its independent output power pin (VCCOA or VCCOB) and thus each can have
different output voltage levels. Output voltage levels of 1.8V, 2.5V or 3.3V are supported for differential operation.
©2016 Integrated Device Technology
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8P391208 Datasheet
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are
stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC
Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect product reliability.
Table 5: Absolute Maximum Ratings
Item
Supply Voltage, VCCX[1] to GND
Rating
3.6V
Inputs IOA[1:0], IOB[1:0], CLK_SEL, CLK0, nCLK0, CLK1, nCLK1
-0.5V to 3.6V
Outputs, IO QA[0:3], nQA[0:3]; QB[0:3], nQB[0:3]
Continuous Current
40mA
60mA
Surge Current
Outputs, VO QA[0:3], nQA[0:3]; QB[0:3], nQB[0:3]
Operating Junction Temperature
-0.5V to 3.6V
125°C
Storage Temperature, TSTG
-65°C to 150°C
+260°C
Lead Temperature (Soldering, 10s)
1. VCCX denotes VCC, VCCOA, or VCCOB
.
Supply Voltage Characteristics
[1]
Table 6: Power Supply Characteristics, V
= V
= 3.3V ±5%, V = 0V, T = -40°C to +85°C
CC
CCOx
EE
A
Symbol Parameter
Test Conditions
Minimum Typical
Maximum Units
VCC
Core Supply Voltage
Output Supply Voltage
3.135
3.135
3.3
3.3
3.465
3.465
V
V
VCCOx
All Outputs Configured for LVDS Logic Levels;
Outputs Unloaded
ICC
Core Supply Current
22
25
mA
mA
All Outputs Configured for LVDS Logic Levels;
Outputs Unloaded
Iccox
Output Supply Current[2]
139
157
1. NOTE 1. VCCOx denotes VCCOA, VCCOB
.
2. Internal dynamic switching current at maximum fOUT is included.
[1]
Table 7: Power Supply Characteristics, V
= V
= 2.5V ±5%, V = 0V, T = -40°C to +85°C
CC
CCOx
EE
A
Symbol Parameter
Test Conditions
Minimum Typical Maximum
Units
VCC
Core Supply Voltage
Output Supply Voltage
2.375
2.375
2.5
2.5
2.625
2.625
V
V
VCCOx
All Outputs Configured for LVDS Logic Levels;
Outputs Unloaded
ICC
Core Supply Current
19
22
mA
mA
All Outputs Configured for LVDS Logic Levels;
Outputs Unloaded
Iccox
Output Supply Current[2]
137
154
1. NOTE 1. VCCOx denotes VCCOA, VCCOB
.
2. Internal dynamic switching current at maximum fOUT is included.
©2016 Integrated Device Technology
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8P391208 Datasheet
[1]
Table 8: Power Supply Characteristics, V
= V
= 1.8V ±5%, V = 0V, T = -40°C to +85°C
EE A
CC
CCOx
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VCC
Core Supply Voltage
1.71
1.71
1.8
1.8
1.89
1.89
V
V
VCCOx Output Supply Voltage
All Outputs Configured for LVDS Logic Levels;
Outputs Unloaded
ICC
Core Supply Current
15
17
mA
mA
All Outputs Configured for LVDS Logic Levels;
Outputs Unloaded
Iccox
Output Supply Current[2]
125
141
1. NOTE 1. VCCOx denotes VCCOA, VCCOB
.
2. Internal dynamic switching current at maximum fOUT is included.
Table 9: Typical Output Supply Current, V
= 3.3V, 2.5V or 1.8V, V = 0V, T = 25°C
EE A
CC
VCCOx[2] = 3.3V
VCCOx[2] = 2.5V
VCCOx[2] = 1.8V
Bank A
Output
Supply
Current
Outputs
Unloaded
ICCOA
50 66 41 33 33 49 65 37 31 31 43 28 31 27 27 mA
Bank B
Output
Supply
Current
Outputs
Unloaded
ICCOB
50 66 41 33 33 49 65 37 31 31 43 28 31 27 27 mA
1. Internal dynamic switching current at maximum fOUT is included.
2. VCCOx denotes VCCOA, or VCCOB
.
©2016 Integrated Device Technology
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8P391208 Datasheet
DC Electrical Characteristics
Table 10: LVCMOS/LVTTL Control / Status Signals DC Characteristics for 3-Level Pins, V = 0V,
EE
T = -40°C to +85°C
A
Parameter
Signals
Test Conditions
Minimum Typical
Maximum
Units
VCC = 3.3V
0.85*VCC
0.85*VCC
0.85*VCC
0.45*VCC
0.45*VCC
0.45*VCC
-0.3
3.465
2.625
V
V
V
V
V
V
V
V
V
Input
VIH
CLK_SEL, IOA[1:0], IOB[1:0]
V
V
CC = 2.5V
CC = 1.8V
High Voltage
1.89
VCC = 3.3V
0.55*VCC
0.55*VCC
0.55*VCC
0.15*VCC
0.15*VCC
0.15*VCC
Input
VIM
Middle
CLK_SEL, IOA[1:0], IOB[1:0]
CLK_SEL, IOA[1:0], IOB[1:0],
V
V
CC = 2.5V
CC = 1.8V
Voltage[1]
VCC = 3.3V
Input
Low Voltage
VIL
V
V
CC = 2.5V
CC = 1.8V
-0.3
-0.3
Input
High Current
VCC = VIN = 3.465V or
2.625V or 1.89V
IIH
IIM
IIL
CLK_SEL, IOA[1:0], IOB[1:0]
CLK_SEL, IOA[1:0], IOB[1:0]
CLK_SEL, IOA[1:0], IOB[1:0],
150
A
A
A
V
CC = 3.465V or
Input
Middle Current
2.625V or 1.89V,
VIN = VCC /2
-10
10
Input
Low Current
VCC = 3.465V or
2.625V or 1.89V, VIN = 0V
-150
1. For 3-level input pins, a mid-level voltage is used to select the 3rd state. This voltage will be maintained by a weak internal pull-up /
pull-down network for each pin to select this state if the pin is left open. It is recommended that any external resistor networks used to
select a middle-level input voltage be terminated to the device’s core VCC voltage level.
,
Table 11: Differential Input DC Characteristics, V
A
= 3.3V±5%, 2.5V±5% or 1.8V±5%, V = 0V,
EE
CC
T = -40°C to +85°C
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum Units
CLKx,
IIH
Input High Current
VCC = VIN = 3.465V or 2.625V
150
A
nCLKx[1]
CLKx[1]
VCC = 3.465V or 2.625V, VIN= 0V
VCC= 3.465V or 2.625V, VIN = 0V
-5
A
A
V
IIL
Input Low Current
nCLKx[1]
Peak-to-Peak Voltage[2]
-150
0.2
VPP
1.3
, [3]
VCMR
Common Mode Input Voltage[2]
VEE
VCC -1.2
V
1. CLKx denotes CLK0, CLK1. nCLKx denotes nCLK0, nCLK1.
2. VIL should not be less than -0.3V. VIH should not be higher than VCC.
3. Common mode voltage is defined as the cross-point.
©2016 Integrated Device Technology
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8P391208 Datasheet
Table 12: LVPECL DC Characteristics, V
A
= 3.3V±5%, 2.5V±5% or 1.8V±5%, V = 0V,
EE
CC
T = -40°C to +85°C
VCCOx[1] = 3.3V±5%
Min Typ Max
VCCOx[1] = 2.5V±5%
Min Typ Max
VCCOx[1] = 1.8V±5%
Symbol Parameter
Min
Typ
Max
Units
Output
Qx,
VCCOx
1.3
-
VCCOx
0.8
-
-
VCCOx
1.35
-
-
VCCOx
0.9
-
-
VCCOx
1.50
-
VCCOx
0.9
-
VOH
High
V
nQx[3]
Voltage[2]
Output
VCCOx
1.75
VCCOx
2
VCCOx
1.75
VOL
Qx, nQx[2] VCCOx - 2
VEE
0.25
V
Low Voltage[2]
1. VCCOx denotes VCCOA, VCCOB.
2. Outputs terminated with 50 to VCCOx – 2V when VCCOX = 3.3V±5% or 2.5V±5%. Outputs terminated with 50 to ground when VCCOX
= 1.8V±5%.
3. Qx denotes QA0, QA1, QA2, QA3, QB0, QB1, QB2, QB3. nQx denotes nQA0, nQA1, nQA2, nQA3, nQB0, nQB1, nQB2, nQB3.
[1]
Table 13: LVDS DC Characteristics, V
= 3.3V ±5%, V = 0V, T = -40°C to +85°C[1]
EE A
CCOx
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOD
VOD
VOS
Differential Output Voltage Qx, nQx[2]
195
480
50
mV
mV
V
VOD Magnitude Change
Offset Voltage
Qx, nQx[2]
Terminated 100 across
Qx, nQx[2]
Qx, nQx[2]
1.1
1.375
50
Qx and nQx
VOS
VOS Magnitude Change
mV
1. VCCOx denotes VCCOA, VCCOB
.
2. Qx denotes QA0, QA1, QA2, QA3, QB0, QB1, QB2, QB3.
nQx denotes nQA0, nQA1, nQA2, nQA3, nQB0, nQB1, nQB2, nQB3.
[1]
Table 14: LVDS DC Characteristics, V
= 2.5V ±5%, V = 0V, T = -40°C to +85°C
EE A
CCOx
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOD
VOD
VOS
Differential Output Voltage Qx, nQx[2]
195
470
50
mV
mV
V
VOD Magnitude Change
Offset Voltage
Qx, nQx[2]
Terminated 100 across
Qx, nQx[2]
Qx, nQx[2]
1.1
1.375
50
Qx and nQx
VOS
VOS Magnitude Change
mV
1. VCCOx denotes VCCOA, VCCOB
.
2. Qx denotes QA0, QA1, QA2, QA3, QB0, QB1, QB2, QB3.
nQx denotes nQA0, nQA1, nQA2, nQA3, nQB0, nQB1, nQB2, nQB3.
©2016 Integrated Device Technology
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8P391208 Datasheet
[1]
Table 15: LVDS DC Characteristics, V
= 1.8V ±5%, V = 0V, T = -40°C to +85°C
CCOx
EE
A
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOD
VOD
VOS
Differential Output Voltage Qx, nQx[2]
195
454
50
mV
mV
V
VOD Magnitude Change
Offset Voltage
Qx, nQx[2]
Terminated 100 across
Qx, nQx[2]
Qx, nQx[2]
1.1
1.375
50
Qx and nQx
VOS
VOS Magnitude Change
mV
1. VCCOx denotes VCCOA, VCCOB.
2. Qx denotes QA0, QA1, QA2, QA3, QB0, QB1, QB2, QB3.
nQx denotes nQA0, nQA1, nQA2, nQA3, nQB0, nQB1, nQB2, nQB3.
Table 16: CML (400mV Swing) DC Characteristics, V
CCOx
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%,
CC
[1]
V
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%, V
= 0V, T = -40°C to +85°C
EE A
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOH
VOL
Output High Voltage
Qx, nQx[2]
Qx, nQx[2]
Qx, nQx[2]
VCCOx - 0.1
VCCOx - 0.5
300
VCCOx
VCCOx - 0.3
500
V
V
Terminated with 50 to
Output Low Voltage
VCCOx
VOUT
Output Voltage Swing
mV
1. VCCOx denotes VCCOA, VCCOB.
2. Qx denotes QA0, QA1, QA2, QA3, QB0, QB1, QB2, QB3.
nQx denotes nQA0, nQA1, nQA2, nQA3, nQB0, nQB1, nQB2, nQB3.
Table 17: CML (800mV Swing) DC Characteristics, V
CCOx
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%,
CC
[1]
V
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%, V
= 0V, T = -40°C to +85°C
EE A
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOH
VOL
Output High Voltage
Qx, nQx[2]
VCCOx - 0.1
VCCOx
VCCOx - 0.7
1000
V
V
Output Low Voltage
Qx, nQx[2] Terminated with 50 to VCCOx VCCOx - 0.95
Qx, nQx[2]
575
VOUT
Output Voltage Swing
mV
1. VCCOx denotes VCCOA, VCCOB
.
2. Qx denotes QA0, QA1, QA2, QA3, QB0, QB1, QB2, QB3.
nQx denotes nQA0, nQA1, nQA2, nQA3, nQB0, nQB1, nQB2, nQB3.
[1] [2]
Table 18: HCSL DC Characteristics, V
= V
= V
= 3.3V ±5%, V = 0V, T = 25°C
,
CC
CCOA
CCOB
EE
A
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOH
VOL
Output High Voltage
Output Low Voltage
Output Voltage Swing
Qx, nQx
Qx, nQx
Qx, nQx
475
-100
475
900
mV
mV
mV
VOUT
900
1. Guaranteed by design and Characterization, not 100% tested in production.
2. CL = 2pf, RS = 33.2, RP = 49.9
©2016 Integrated Device Technology
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8P391208 Datasheet
Table 19: Input Frequency Characteristics, V
A
= 3.3V±5%, 2.5V±5% or 1.8V±5%, V = 0V,
EE
CC
T = -40°C to +85°C
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
fIN
Input Frequency
Input Duty Cycle[3]
CLKx, nCLKx[1], [2]
1Hz
700MHz
idc
50
%
1. CLKx denotes CLK0, CLK1. nCLKx denotes nCLK0, nCLK1.
2. Input frequency is up to 1GHz when VCC/VCCOx = 3.3V±5% for HCSL output mode.
3. Any deviation from a 50% duty cycle on the input may be reflected in the output duty cycle.
©2016 Integrated Device Technology
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8P391208 Datasheet
AC Electrical Characteristics
Table 20: LVDS, LVPECL, CML AC Characteristics, V
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%,
CC
[1]
V
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%, V
= 0V, T = -40°C to +85°C
EE A
CCOx
Symbol Parameter[2]
Test Conditions[3]
Minimum
Typical
Maximum Units
Output
fOUT
LVDS,
LVPECL, CML
1PPS
700
MHz
Frequency
LVPECL
LVDS
20% to 80%
20% to 80%, VCCOx = 3.3V
20% to 80%, VCCOx = 2.5V
20% to 80%, VCCOx = 1.8V
20% to 80%
100
150
165
200
100
150
705
530
530
565
625
580
55
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
%
Output Rise and
tR / tF
Fall Times
CML 400mV
CML 800mV
LVPECL[7]
20% to 80%
LVDS[7]
55
Bank Skew[4],
tsk(b)
odc
[5], [6]
CML 400mV[7]
CML 800mV[7]
Output Duty Cycle[8]
55
55
45
50
70
25
55
MUXISOL Mux Isolation
tstartup Startup Time
1. VCCOx denotes VCCOA, VCCOB
dB
ms
.
2. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
3. Tested for the following out frequencies: 100MHz, 156.25MHz, 312.5MHz, 700MHz.
4. This parameter is guaranteed by characterization. Not tested in production.
5. This parameter is defined in accordance with JEDEC Standard 65.
6. Defined as skew within a bank of outputs at the same supply voltage and with equal load conditions.
7. Measured at the output differential crosspoint.
8. Measured using 50% duty cycle on input reference.
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8P391208 Datasheet
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%,
Table 21: HCSL AC Characteristics, f
CCOx
= 100MHz, V
CC
OUT
[1]
V
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%, V
= 0V, T = -40°C to +85°C
EE A
Symbol Parameter[2]
VRB
Ring-back Voltage Margin[3], [4]
tSTABLE Time before VRB is allowed[3] [4]
Test Conditions
Minimum Typical
Maximum
Units
-100
500
100
mV
ps
,
VMAX
VMIN
Absolute Max. Output Voltage[5], [6]
1150
mV
mV
mV
mV
, [7]
Absolute Min. Output Voltage[5]
-300
200
VCROSS Absolute Crossing Voltage[8], [9],
VCROSS Total Variation of VCROSS over all edge[8]
550
140
[5]
, [10],
[5]
1. VCCOx denotes VCCOA, VCCOB
.
2. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
3. Measurement taken from differential waveform.
4. tSTABLE is the time the differential clock must maintain a minimum ±150mV differential voltage after rising/falling edges before it is
allowed to drop back into the VRB ±100mV differential range.
5. Measurement taken from single ended waveform.
6. Defined as the maximum instantaneous voltage including overshoot.
7. Defined as the minimum instantaneous voltage including undershoot.
8. Measured at crossing point where the instantaneous voltage value of the rising edge of Qx equals the falling edge of nQx.
9. Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing
points for this measurement.
10.Defined as the total variation of all crossing voltages of rising Qx and falling nQx, This is the maximum allowed variance in VCROSS for any
particular system.
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Table 22: HCSL Electrical Characteristics, Current Mode Differential Pair, V
= V
= V
= 3.3V±5%,
CCOB
CC
CCOA
[1], [2]
2.5V ±5% or 1.8V ±5%, V = 0V, T = -40°C to +85°C
EE
A
Test Conditions[3] [4]
Minimum Typical Maximum Units
,
Symbol
VOH
Parameter
Output Voltage High
Output Voltage Low
Statistical Measurement on
Single-ended Signal using
Oscilliscope Math Function
300
950
mV
mV
VOL
-100
VMAX
VMIN
Absolute Max. Output Voltage[5], [6]
1150
mV
mV
mV
mV
, [7]
Absolute Min. Output Voltage [5]
-300
150
, [8], [9]
VCROSS
Absolute Crossing Voltage [5]
550
140
,
, [10]
VCROSS Total Variation of VCROSS over all Edges [5] [8]
Edge Rate
Rising Edge Rate[11], [12]
0.3
0.3
4.5
4.5
V/ns
V/ns
Rise
Edge Rate
Fall
,
Falling Edge Rate[11] [12]
1. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
2. Guaranteed by design and Characterization, not 100% tested in production.
3. Test configuration: CL = 2pF, RS = 33.2, RP = 49.9
4. Tested for the following out frequencies: 156.25MHz, 245.76MHz, 312.5MHz, and 625MHz. For other frequencies, contact IDT
Marketing.
5. Measurement taken from a single-ended waveform.
6. Defined as the maximum instantaneous voltage including overshoot.
7. Defined as the minimum instantaneous voltage including undershoot.
8. Measured at crossing point where the instantaneous voltage value of the rising edge of CLK+ equals the falling edge of CLK-.
9. Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing
points for this measurement.
10.Defined as the total variation of all crossing voltages of rising CLK+ and falling CLK-. this is the maximum allowed variance in VCROSS
for any particular system.
11.Measurement taken from a differential waveform.
12.Measured from -150mV on the differential waveform (derived from Q minus nQ). the signal must be monotonic through the measurement
region for rise and fall time. The 300mV measurement window is centered on the differential zero crossing.
[1]
Table 23: Typical Additive Jitter, V
= 3.3V ±5%, 2.5V ±5% or 1.8V ±5%, V
= 3.3V ±5%, 2.5V ±5%,
CC
CCOx
1.8V ±5%, V = 0V, T = -40°C to +85°C
EE
A
Symbol Parameter
Test Conditions[2]
Minimum
Typical
Maximum Units
LVPECL
LVDS
62
82
74
68
65
fs
fs
fs
fs
fs
RMS
f
OUT = 156.25MHz,
tjit(f)
Additive Jitter HCSL
(Random)
Integration Range: 12kHz - 20MHz
CML, 400mV
CML, 400mV
1. VCCOx denotes VCCOA, VCCOB
2. All outputs configured for the specific output type, as shown in the table.
.
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8P391208 Datasheet
Applications Information
Recommendations for Unused Input and Output Pins
Inputs:
CLK/nCLK Inputs
For applications not requiring the use of the differential input, both CLK and nCLK can be left floating. Though not required, but for additional
protection, a 1k resistor can be tied from CLK to ground.
LVCMOS LVTTL Level Control Pins
All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1k
resistor can be used.
LVCMOS 3-Level I/O Control Pins
These pins are 3-level pins and if left unconnected this is interpreted as a valid input selection option (Middle).
Outputs:
Differential Outputs
All unused Differential outputs can be left floating. It is recommended that there is no trace attached.
LVPECL Outputs
All unused LVPECL outputs can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should
either be left floating or terminated.
LVDS Outputs
All unused LVDS output pairs can be either left floating or terminated with 100 across. If they are left floating, there should be no trace
attached.
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8P391208 Datasheet
Wiring the Differential Input to Accept Single-Ended Levels
Figure 2 shows how a differential input can be wired to accept single ended levels. The reference voltage V1= VCC/2 is generated by the bias
resistors R1 and R2. The bypass capacitor (C1) is used to help filter noise on the DC bias. This bias circuit should be located as close to the
input pin as possible. The ratio of R1 and R2 might need to be adjusted to position the V1in the center of the input voltage swing. For example,
if the input clock swing is 2.5V and VCC = 3.3V, R1 and R2 value should be adjusted to set V1 at 1.25V. The values below are for when both the
single ended swing and VCC are at the same voltage. This configuration requires that the sum of the output impedance of the driver (Ro) and
the series resistance (Rs) equals the transmission line impedance. In addition, matched termination at the input will attenuate the signal in
half. This can be done in one of two ways. First, R3 and R4 in parallel should equal the transmission line impedance. For most 50
applications, R3 and R4 can be 100. The values of the resistors can be increased to reduce the loading for slower and weaker LVCMOS
driver. When using single-ended signaling, the noise rejection benefits of differential signaling are reduced. Even though the differential input
can handle full rail LVCMOS signaling, it is recommended that the amplitude be reduced while maintaining an edge rate faster than 1V/ns. The
datasheet specifies a lower differential amplitude, however this only applies to differential signals. For single-ended applications, the swing
can be larger, however VIL cannot be less than -0.3V and VIH cannot be more than VCC + 0.3V. Though some of the recommended
components might not be used, the pads should be placed in the layout. They can be utilized for debugging purposes. The datasheet
specifications are characterized and guaranteed by using a differential signal.
Figure 2: Recommended Schematic for Wiring a Differential Input to Accept Single-ended Levels
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8P391208 Datasheet
3.3V Differential Clock Input Interface
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR
input requirements. Figure 3 to Figure 7 show interface examples for the CLK/nCLK input driven by the most common driver types. The input
interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver termination
requirements. For example, in Figure 3, the input termination applies for IDT open emitter LVHSTL drivers. If you are using an LVHSTL driver
from another vendor, use their termination recommendation.
Figure 3: CLK/nCLK Input Driven by an
Figure 6: CLK/nCLK Input Driven by a
IDT Open Emitter LVHSTL Driver
3.3V LVPECL Driver
3.3V
1.8V
Zo = 50Ω
CLK
Zo = 50Ω
nCLK
Differential
Input
LVHSTL
R1
50Ω
R2
50Ω
IDT
LVHSTL Driver
Figure 4: CLK/nCLK Input Driven by a
Figure 7: CLK/nCLK Input Driven by a
3.3V LVPECL Driver
3.3V HCSL Driver
3.3V
3.3V
*R3
CLK
nCLK
Differential
Input
*R4
HCSL
Figure 5: CLK/nCLK Input Driven by a
3.3V LVDS Driver
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8P391208 Datasheet
2.5V Differential Clock Input Interface
CLKx/nCLKx accepts LVDS, LVPECL, LVHSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR input
requirements. Figure 8 to Figure 12 show interface examples for the CLKx/nCLKx input driven by the most common driver types. The input
interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver termination
requirements. For example, in Figure 8, the input termination applies for IDT open emitter LVHSTL drivers. If you are using an LVHSTL driver
from another vendor, use their termination recommendation.
Figure 8: CLKx/nCLKx Input Driven by an
Figure 11: CLKx/nCLKx Input Driven by a
IDT Open Emitter LVHSTL Driver
2.5V LVPECL Driver
2.5V
1.8V
Zo = 50
CLK
Zo = 50
nCLK
Differential
Input
LVHSTL
R1
50
R2
50
IDT Open Emitter
LVHSTL Driver
Figure 9: CLKx/nCLKx Input Driven by a
Figure 12: CLKx/nCLKx Input Driven by a
2.5V LVPECL Driver
2.5V LVDS Driver
Figure 10: CLKx/nCLKx Input Driven by a
2.5V HCSL Driver
2.5V
2.5V
Zo = 50Ω
Zo = 50Ω
*R3
33Ω
CLK
nCLK
Differential
Input
*R4
33Ω
HCSL
*Optional – R3 and R4 can be 0Ω
R1
50Ω
R2
50Ω
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8P391208 Datasheet
LVDS Driver Termination
For a general LVDS interface, the recommended value for the termination impedance (ZT) is between 90 and 132. The actual value should
be selected to match the differential impedance (Z0) of your transmission line. A typical point-to-point LVDS design uses a 100 parallel
resistor at the receiver and a 100 differential transmission-line environment. In order to avoid any transmission-line reflection issues, the
components should be surface mounted and must be placed as close to the receiver as possible. IDT offers a full line of LVDS compliant
devices with two types of output structures: current source and voltage source. The standard termination schematic as shown in Figure 13 can
be used with either type of output structure. Figure 14, which can also be used with both output types, is an optional termination with center tap
capacitance to help filter common mode noise. The capacitor value should be approximately 50pF. If using a non-standard termination, it is
recommended to contact IDT and confirm if the output structure is current source or voltage source type. In addition, since these outputs are
LVDS compatible, the input receiver’s amplitude and common-mode input range should be verified for compatibility with the output.
Figure 13: Standard LVDS Termination
ZO ZT
LVDS
Driver
LVDS
Receiver
ZT
Figure 14: Optional LVDS Termination
Z
T
T
2
ZO ZT
LVDS
LVDS
Driver
Receiver
C
Z
2
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8P391208 Datasheet
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned are recommended
only as guidelines.
The differential output is a low impedance follower output that generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC
current path to ground) or current sources must be used for functionality. These outputs are designed to drive 50 transmission lines.
Matched impedance techniques should be used to maximize operating frequency and minimize signal distortion. Figure 15 and Figure 16
show two different layouts which are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended
that the board designers simulate to guarantee compatibility across all printed circuit and clock component process variations.
Figure 15: 3.3V LVPECL Output Termination
Figure 16: 3.3V LVPECL Output Termination
3.3V
R3
R4
125
125
3.3V
3.3V
Zo = 50
Zo = 50
+
_
Input
R1
84
R2
84
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8P391208 Datasheet
Termination for 2.5V LVPECL Outputs
Figure 17 and Figure 18 show examples of termination for 2.5V LVPECL driver. These terminations are equivalent to terminating 50 to
VCCO – 2V. For VCCO = 2.5V, the VCCO – 2V is very close to ground level. The R3 in Figure 18 can be eliminated and the termination is shown
in Figure 19.
Figure 17: 2.5V LVPECL Driver Termination Example
2.5V
2.5V
VCCO = 2.5V
R1
R3
250
250
50
50
+
–
2.5V LVPECL Driver
R2
62.5
R4
62.5
Figure 18: 2.5V LVPECL Driver Termination Example
2.5V
VCCO = 2.5V
50
+
50
–
2.5V LVPECL Driver
R1
50
R2
50
Figure 19: 2.5V LVPECL Driver Termination Example
2.5V
VCCO = 2.5V
50
+
50
–
2.5V LVPECL Driver
R1
50
R2
50
R3
18
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8P391208 Datasheet
Recommended Termination for HCSL Outputs
Figure 20 is the recommended source termination for applications where the driver and receiver will be on a separate PCBs. This termination
is the standard for PCI Express™ and HCSL output types. All traces should be 50Ω impedance single-ended or 100Ω differential.
Figure 21 is the recommended termination for applications where a point-to-point connection can be used. A point-to-point connection
contains both the driver and the receiver on the same PCB. With a matched termination at the receiver, transmission-line reflections will be
minimized. In addition, a series resistor (Rs) at the driver offers flexibility and can help dampen unwanted reflections. The optional resistor can
range from 0Ω to 33Ω. All traces should be 50Ω impedance single-ended or 100Ω differential.
Figure 20: Recommended Source Termination (where the driver and receiver will be on separate PCBs)
Rs
0.5" Max
L1
0-0.2"
L2
1-14"
L4
0.5 - 3.5"
L5
22 to 33 +/-5%
L1
L2
L4
L5
PCI Express
Connector
PCI Express
Driver
PCI Express
Add-in Card
0-0.2" L3
L3
49.9 +/- 5%
Rt
Figure 21: Recommended Termination (where a point-to-point connection can be used)
Rs
0.5" Max
L1
0-18"
L2
0-0.2"
L3
0 to 33
0 to 33
L1
L2
L3
PCI Express
Driver
49.9 +/- 5%
Rt
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8P391208 Datasheet
CML Termination
Figure 22 shows an example of the termination for a CML driver. In this example, the transmission line characteristic impedance is 50. The
R1 and R2 50 matched load terminations are pulled up to VDDO. The matched loads are located close to the receiver.
Figure 22: CML Termination Example
VDDO
VDDO
R1
50
R2
50
Zo = 50
Zo = 50
CML Driver
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8P391208 Datasheet
Power Dissipation and Thermal Considerations
The 8P391208 is a multi-functional, high speed device that targets a wide variety of clock frequencies and applications. Since this device is
highly programmable with a broad range of features and functionality, the power consumption will vary as each of these features and functions
is enabled.
The 8P391208 device was designed and characterized to operate within the ambient industrial temperature range of
TA = -40°C to +85°C. The ambient temperature represents the temperature around the device, not the junction temperature. When using the
device in extreme cases, such as maximum operating frequency and high ambient temperature, external air flow may be required in order to
ensure a safe and reliable junction temperature. Extreme care must be taken to avoid exceeding 125°C junction temperature.
The power calculation examples below were generated using a maximum ambient temperature and supply voltage. For many applications, the
power consumption will be much lower. Please contact IDT technical support for any concerns on calculating the power dissipation for your
own specific configuration.
Power Domains
The 8P391208 device has a number of separate power domains that can be independently enabled and disabled via register accesses (all
power supply pins must still be connected to a valid supply voltage). Figure 23 below indicates the individual domains and the associated
power pins.
Figure 23: 8P391208 Power Domains
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8P391208 Datasheet
Power Consumption Calculation
Determining total power consumption involves several steps:
1. Determine the power consumption using maximum current values for core voltage from Table 6, Table 7, Table 8 and Table 9, Page 7 for
the appropriate case of how many banks or outputs are enabled.
2. Determine the nominal power consumption of each enabled output path.
a. This consists of a base amount of power that is independent of operating frequency, as shown in Table 25 through Table 36 (depending
on the chosen output protocol).
b. Then there is a variable amount of power that is related to the output frequency. This can be determined by multiplying the output
frequency by the FQ_Factor shown in Table 25 through Table 36.
3. All of the above totals are then summed.
Thermal Considerations
Once the total power consumption has been determined, it is necessary to calculate the maximum operating junction temperature for the
device under the environmental conditions it will operate in. Thermal conduction paths, air flow rate and ambient air temperature are factors
that can affect this. The thermal conduction path refers to whether heat is to be conducted away via a heat-sink, via airflow or via conduction
into the PCB through the device pads (including the ePAD). Thermal conduction data is provided for typical scenarios in Table 42, Page 36.
Please contact IDT for assistance in calculating results under other scenarios.
Table 24: JA vs. Air Flow Table for a 32-lead 5mm x 5mm VFQFN
JA vs. Air Flow
Meters per Second
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
35.23°C/W
31.6°C/W
30.0°C/W
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8P391208 Datasheet
Current Consumption Data and Equations
Table 25: 3.3V LVDS Output Calculation Table
Table 28: 3.3V LVPECL Output Calculation Table
FQ_Factor
(mA/MHz)
FQ_Factor
(mA/MHz)
LVDS
Base_Current (mA)
LVPECL
Base_Current (mA)
Bank A
Bank B
0.07
0.07
30.0
30.0
Bank A
Bank B
0.04
0.04
22.0
22.0
Table 26: 2.5V LVDS Output Calculation Table
Table 29: 2.5V LVPECL Output Calculation Table
FQ_Factor
(mA/MHz)
FQ_Factor
(mA/MHz)
LVDS
Base_Current (mA)
LVPECL
Base_Current (mA)
Bank A
Bank B
0.07
0.07
26.0
26.0
Bank A
Bank B
0.04
0.04
21.0
21.0
Table 27: 1.8V LVDS Output Calculation Table
Table 30: 1.8V LVPECL Output Calculation Table
FQ_Factor
(mA/MHz)
FQ_Factor
(mA/MHz)
LVDS
Base_Current (mA)
LVPECL
Base_Current (mA)
Bank A
Bank B
0.06
0.06
38.0
38.0
Bank A
Bank B
0.04
0.04
20.0
20.0
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8P391208 Datasheet
Table 31: 3.3V CML Output (400mV) Calculation
Table
Table 34: 3.3V CML Output (800mV) Calculation
Table
CML (400mV)
FQ_Factor (mA/MHz)
Base_Current (mA)
FQ_Factor
(mA/MHz)
CML (800mV)
Base_Current (mA)
Bank A
Bank B
0.02
0.02
19.0
19.0
Bank A
Bank B
0.02
0.02
19.0
19.0
Table 32: 2.5V CML Output (400mV) Calculation
Table
Table 35: 2.5V CML Output (800mV) Calculation
Table
FQ_Factor
CML (400mV)
(mA/MHz)
Base_Current (mA)
CML (800mV) FQ_Factor (mA/MHz)
Base_Current (mA)
Bank A
Bank B
0.02
0.02
16.0
16.0
Bank A
Bank B
0.02
0.02
16.0
16.0
Table 33: 1.8V CML Output (400mV) Calculation
Table
Table 36: 1.8V CML Output (800mV) Calculation
Table
FQ_Factor
(mA/MHz)
CML (800mV) FQ_Factor (mA/MHz)
Base_Current (mA)
CML (400mV)
Base_Current (mA)
Bank A
Bank B
0.02
0.02
15.0
15.0
Bank A
Bank B
0.02
0.02
15.0
15.0
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8P391208 Datasheet
Applying the values to the following equation will yield output current by frequency:
Qx Current (mA) = FQ_Factor * Frequency (MHz) + Base_Current
where:
Qx Current is the specific output current according to output type and frequency
FQ_Factor is used for calculating current increase due to output frequency
Base_Current is the base current for each output path independent of output frequency
The second step is to multiply the power dissipated by the thermal impedance to determine the maximum power gradient, using the following
equation:
TJ = TA + (JA * Pdtotal
where:
)
TJ is the junction temperature (°C)
TA is the ambient temperature (°C)
JA is the thermal resistance value from Table 42, Page 36, dependent on ambient airflow (°C/W)
Pdtotal is the total power dissipation of the 8P391208 under usage conditions, including power dissipated due to loading (W)
Note that for LVPECL outputs the power dissipation through the load is assumed to be 27.95mW).
Example Calculations
Table 37: Example 1 – Common Customer Configuration (3.3V Core Voltage)
Configuration
Frequency (MHz)
VCCO
Bank A
Bank B
LVDS
LVDS
3.3V
3.3V
125
• Core Supply Current, ICC = 25mA (maximum)
Output Supply Current, Bank A Current = 0.07mA x 125MHz + 30mA = 38.75mA
Output Supply Current, Bank B Current = 0.07mA x 125MHz + 30mA = 38.75mA
• Total Device Current = 25mA + 38.75mA + 38.75mA = 102.5mA
• Total Device Power = 3.465V * 102.5mA = 355.2mW or 0.3552W
With an ambient temperature of 85°C and no airflow, the junction temperature is:
TJ = 85°C + 35.23°C/W * 0.3552W = 97.5°C
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8P391208 Datasheet
LVDS Power Considerations
This section provides information on power dissipation and junction temperature for the 8P391208.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 8P391208 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC= 3.3V + 5% = 3.465V, which gives worst case results.
• Power (core)MAX = VCC_MAX * ICC_MAX = 3.465V * 25mA = 86.625mW
• Power (outputs)MAX = VCCO_MAX * ICCO_MAX = 3.465V * 157mA = 544.005mW
• Total Power_MAX = 86.625mW + 544.005mW = 630.63mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the
bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 35.23°C/W per Table 38 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.631W *35.23°C/W = 107.2°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 38: Thermal Resistance for 32-lead 5mm x 5mm VFQFN, Forced Convection
JA
JA by Velocity
Meters per Second
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
35.23°C/W
31.6°C/W
30.0°C/W
©2016 Integrated Device Technology
29
September 1, 2016
8P391208 Datasheet
LVPECL Power Considerations
This section provides information on power dissipation and junction temperature for the 8P391208.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 8P391208 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
• Power (core)MAX = VCC_MAX * ICC_MAX = 3.465V * 128.1mA = 443.9mW
• Power (outputs)MAX = 27.95mW/Loaded Output pair
If all outputs are loaded, the total power is 8 * 27.95mW = 223.6mW
• Total Power_MAX (3.465V, with all outputs switching) = 443.9W + 223.6mW = 667.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the
bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 35.23°C/W per Table 39 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.6675 W * 35.23°C/W = 108.5°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 39: Thermal Resistance for 32-lead 5mm x 5mm VFQFN, Forced Convection
JA
JA by Velocity
Meters per Second
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
35.23°C/W
31.6°C/W
30.0°C/W
©2016 Integrated Device Technology
30
September 1, 2016
8P391208 Datasheet
3. Calculations and Equations.
The purpose of this section is to calculate the power dissipation for the LVPECL output pair.
LVPECL output driver circuit and termination are shown in Figure 24.
Figure 24: LVPECL Driver Circuit and Termination
VCCO
Q1
VOUT
RL
50Ω
VCCO - 2V
To calculate power dissipation per output pair due to loading, use the following equations which assume a 50 load, and a termination voltage
of VCCO – 2V.
•
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.8V
(VCCO_MAX – VOH_MAX) = 0.8V
For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.75V
(VCCO_MAX – VOL_MAX) = 1.75V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MA – (VCCO_MA – 2V))/RL] * (VCCO_MA – VOH_MAX) = [(2V – (VCCO_MAX – VOH_MAX))/RL] * (VCCO_MAX – VOH_MAX) =
[(2V – 0.8V)/50] * 0.8V = 19.2mW
Pd_L = [(VOL_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MA – VOL_MAX) = [(2V – (VCCO_MAX – VOL_MAX))/RL] * (VCCO_MAX – VOL_MAX) =
[(2V – 1.75V)/50] * 1.75V = 8.75mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 27.95mW
©2016 Integrated Device Technology
31
September 1, 2016
8P391208 Datasheet
HCSL Power Considerations
This section provides information on power dissipation and junction temperature for the 8P391208.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 8P391208 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
• Power (core)MAX = VCC_MAX * ICC_MAX = 3.465V * 23.60mA = 81.774mW
• Power (outputs)MAX = 44.5mW/Loaded Output pair
If all outputs are loaded, the total power is 8 * 44.5mW = 356.0mW
• Total Power_MAX = 81.774mW + 356.0mW = 437.77mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the
bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 35.23°C/W per Table 40 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.4378W * 35.23°C/W = 100.42°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 40: Thermal Resistance for 32-lead 5mm x 5mm VFQFN, Forced Convection
JA
JA by Velocity
Meters per Second
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
35.23°C/W
31.6°C/W
30.0°C/W
©2016 Integrated Device Technology
32
September 1, 2016
8P391208 Datasheet
3. Calculations and Equations.
The purpose of this section is to calculate power dissipation on the IC per HCSL output pair.
HCSL output driver circuit and termination are shown in Figure 25.
Figure 25: HCSL Driver Circuit and Termination
VCCO
IOUT = 17mA
VOUT
RREF
=
475: 1ꢀ
RL
50:
IC
HCSL is a current steering output which sources a maximum of 17mA of current per output. To calculate worst case on-chip power dissipation,
use the following equations which assume a 50 load to ground.
The highest power dissipation occurs when VCCO
_
.
MAX
Power= (VCCO_MAX – VOUT) * IOUT, since VOUT – IOUT * RL
= (VCCO_MAX – OUT * RL) * IOUT
I
= (3.465V – 17mA * 50) * 17mA
Total Power Dissipation per output pair = 44.5mW
©2016 Integrated Device Technology
33
September 1, 2016
8P391208 Datasheet
CML Power Considerations (400mV - 800mV)
This section provides information on power dissipation and junction temperature for the 8P391208.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 8P391208 is the sum of the core power plus the power dissipation in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipation in the load.
• Power (core)MAX = VCC_MAX * ICC_MAX = 3.465V * 26.35mA = 91.30mW
• Power (outputs)MAX = VCCO_MAX * ICCO_MAX = 3.465V * 68.66mA = 237.91mW
If all outputs are loaded, the total power is 8 * 56.03mW = 448.24mW
• Total Power_MAX (3.465V, with all outputs switching) = 91.30mW + 237.91mW + 448.24mW = 777.45mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the
bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 35.23°C/W per Table 41 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.777W * 35.23°C/W = 112.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 41: Thermal Resistance for 32-lead 5mm x 5mm VFQFN, Forced Convection
JA
JA by Velocity
Meters per Second
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
35.23°C/W
31.6°C/W
30.0°C/W
©2016 Integrated Device Technology
34
September 1, 2016
8P391208 Datasheet
3. Calculations and Equations.
The purpose of this section is to calculate the power dissipation for the CML driver output pair. The CML output circuit and termination are
shown in Figure 26.
Figure 26: CML Driver (without built-in 50 pullup) Circuit and Termination
VCCO
RL1
50
RL2
50
Q
nQ
V_output
Q1
Q2
I_load
External Loads
IC
To calculate worst case power dissipation due to the load, use the following equations.
Power dissipation when the output driver is logic LOW:
Pd_L = _Load * V_Output
= (VOUT_MAX /RL) * (VCCO_MAX – VOUT_MAX)
= (1000mV/50) * (3.465V – 1000mV)
= 49.3mW
Power dissipation when the output driver is logic HIGH:
Pd_H = I_Load * V_Output
= (0.1V/50) * (3.465V – 0.1V)
= 6.73mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 56.03mW
©2016 Integrated Device Technology
35
September 1, 2016
8P391208 Datasheet
Reliability Information
Table 42: JA vs. Air Flow Table for a 32-lead 5mm x 5mm VFQFN
JA vs. Air Flow
Meters per Second
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
35.23°C/W
31.6°C/W
30.0°C/W
Transistor Count
The 8P391208 transistor count is: 6930
©2016 Integrated Device Technology
36
September 1, 2016
8P391208 Datasheet
32-Lead VFQFN Package Outline and Package Dimensions
©2016 Integrated Device Technology
37
September 1, 2016
8P391208 Datasheet
32-Lead VFQFN Package Outline and Package Dimensions (Continued)
©2016 Integrated Device Technology
38
September 1, 2016
8P391208 Datasheet
Ordering Information
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
8P391208NLGI
IDT8P391208NLGI
IDT8P391208NLGI
32-lead VFQFN, Lead Free
Tray
-40°C to +85°C
Tape & Reel, Pin 1
Orientation: EIA-481-C
8P391208NLGI8
8P391208NLGI/W
32-lead VFQFN, Lead Free
32-lead VFQFN, Lead Free
-40°C to +85°C
-40°C to +85°C
Tape & Reel, Pin 1
Orientation: EIA-481-D
IDT8P391208NLGI
Table 43: Pin 1 Orientation in Tape and Reel Packaging
Part Number Suffix
Pin 1 Orientation
Illustration
CARRIER TAPE TOPSIDE
(Round Sprocket Holes)
Correct Pin 1 ORIENTATION
NLGI8
Quadrant 1 (EIA-481-C)
USER DIRECTION OF FEED
CARRIER TAPE TOPSIDE
(Round Sprocket Holes)
Correct Pin 1 ORIENTATION
NLGI/W
Quadrant 2 (EIA-481-D)
USER DIRECTION OF FEED
©2016 Integrated Device Technology
39
September 1, 2016
8P391208 Datasheet
Revision History
Revision Date
Description of Change
September 1, 2016
Initial Final datasheet release.
©2016 Integrated Device Technology
40
September 1, 2016
8P391208 Datasheet
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